CN109305654A - A kind of silicon substrate waterproof membrane and its preparation process and microphone packaging scheme - Google Patents
A kind of silicon substrate waterproof membrane and its preparation process and microphone packaging scheme Download PDFInfo
- Publication number
- CN109305654A CN109305654A CN201710624930.8A CN201710624930A CN109305654A CN 109305654 A CN109305654 A CN 109305654A CN 201710624930 A CN201710624930 A CN 201710624930A CN 109305654 A CN109305654 A CN 109305654A
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- China
- Prior art keywords
- laminate
- waterproof membrane
- silicon substrate
- silicon
- silicon chip
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00349—Creating layers of material on a substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
- B81C2201/0176—Chemical vapour Deposition
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Computer Hardware Design (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The invention discloses a kind of silicon substrate waterproof membrane and its preparation process and microphone packaging schemes, comprising the following steps: the silicon chip to be formed with a thickness of 100~150 μm step S1, is performed etching to silicon wafer；Step S2, silicon chip progress dry etching is formed into multiple diameters and is 0.8~1.2 μm of hole, and be passed through SF6 and carry out chemical vapor deposition, form a waterproof layer on the silicon chip.Above-mentioned technical proposal has the following advantages that or the utility model has the advantages that multiple holes is made up of semiconductor technology on waterproof membrane, reduces the cost of manufacture of waterproof membrane, and improve the consistency of hole size, improves the leakproofness of waterproof membrane.
Description
Technical field
The present invention relates to waterproof technical field of membrane more particularly to a kind of silicon substrate waterproof membrane and its preparation processes and microphone to seal
Assembling structure.
Background technique
With the development of smart electronics product (such as mobile phone, camera, wrist mobile phone etc.), people export electronic product
The requirement of the quality of sound and the influence that whether can resist Environmental Water is increasingly increased, in addition to wishing that electronic product is waterproof
Outside, the electronic product of part on the market is even more to brag about the waterproof that can reach high-grade as attraction.Therefore, many electronic products are
The influence that Environmental Water can be resisted, other than must be reduced as far as contact in design, it will usually lead at acoustic aperture
Waterproof membrane can often be added.
Currently, there are mainly two types of the waterproof membranes being arranged in electronic product；One is two are pasted at the acoustic aperture of electronic product
Face is non-porous, air-locked pressure balance film, although acoustic aperture can be made totally-enclosed, this kind of pressure balance film is not withstand pressure, and makes
It is at high cost；Another kind be at the acoustic aperture of electronic product patch fabric waterproof film, but the hole size of the fabric waterproof film surface without
Method effectively controls, and hole can not be made consistency that is small, therefore cannot keep hole size, and waterproof effect is bad.
Summary of the invention
The present invention is directed to the limitation of the prior art, provides a kind of silicon substrate waterproof membrane and its preparation process and microphone package
Structure, it is intended to which the cost of manufacture for reducing waterproof membrane improves the consistency of hole size, improves the leakproofness of waterproof membrane.
Above-mentioned technical proposal specifically includes:
A kind of preparation method of silicon substrate waterproof membrane, comprising the following steps:
Step S1, the silicon chip to be formed with a thickness of 100~10 μm is performed etching to silicon wafer；
Step S2, silicon chip progress dry etching is formed into multiple diameters and is 0.8~1.2 μm of hole, and be passed through
SF6 carries out chemical vapor deposition, and a waterproof layer is formed on the silicon chip.
A kind of silicon substrate waterproof membrane, including a silicon chip, the silicon chip are equipped with the hole that multiple diameters are 0.8~1.2um
Hole.
Preferably, being additionally provided with waterproof layer on the silicon chip in above-mentioned silicon substrate waterproof membrane.
Preferably, multiple described holes are made up of semiconductor technology in above-mentioned silicon substrate waterproof membrane.
Preferably, the waterproof layer is formed by being passed through SF6 gas progress chemical vapor deposition in above-mentioned silicon substrate waterproof membrane
In on the silicon chip.
A kind of microphone packaging scheme, which is characterized in that the lid including one first laminate and on first laminate
Body, is arranged an Acoustic sensor on first laminate, a dedicated IC chip, the Acoustic sensor and described dedicated
The connection of IC chip signal；
Acoustic aperture is set on the first laminate described in the bottom of the Acoustic sensor, and the acoustic aperture is close on first laminate
It is equipped with groove at the bottom of the Acoustic sensor, silicon substrate waterproof membrane is set in the groove.
Preferably, the silicon substrate waterproof membrane is set to the groove by a connection piece in above-mentioned microphone packaging scheme
In.
A kind of microphone packaging scheme, including an acoustics cavity, the acoustics cavity include the first laminate and described first
The second vertical laminate of laminate, the third laminate for being covered on second laminate, are arranged acoustic aperture on the third laminate, and described the
The corresponding inside of the acoustic aperture is equipped with groove on three ply board, and silicon substrate waterproof membrane is arranged in the groove.
Preferably, an acoustics is arranged at the corresponding acoustic aperture on the inside of the third laminate in above-mentioned microphone packaging scheme
Inductor；
One dedicated IC chip is set on the inside of the third laminate, is connect with the acoustics inductor signal.
Preferably, the silicon substrate waterproof membrane is set to the groove by a connection piece in above-mentioned microphone packaging scheme
In.
Above-mentioned technical proposal has the following advantages that or the utility model has the advantages that multiple holes pass through semiconductor technology system on waterproof membrane
At reducing the cost of manufacture of waterproof membrane, and improve the consistency of hole size, improve the leakproofness of waterproof membrane.
Detailed description of the invention
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, the present invention and its feature, outer
Shape and advantage will become more apparent.It should be noted that associated components are not drawn to scale in attached drawing, it is preferred that emphasis is
It shows the gist of the present invention.
Fig. 1 is a kind of flow chart of the preparation process of silicon substrate waterproof membrane in preferred embodiment of the invention；
Fig. 2 is a kind of structural schematic diagram of microphone packaging scheme in preferred embodiment of the invention；
Fig. 3 is a kind of structural schematic diagram of microphone packaging scheme in another preferred embodiment of the invention.
Specific embodiment
The present invention is further illustrated with specific embodiment with reference to the accompanying drawing, but not as limit of the invention
It is fixed.
Embodiment one:
As shown in Figure 1, a kind of preparation method of silicon substrate waterproof membrane, which comprises the following steps:
Step S1, the silicon chip to be formed with a thickness of 100~10 μm is performed etching to silicon wafer；
Step S2, silicon chip progress dry etching is formed multiple diameters is 0.8~1.2 μm of hole, and be passed through SF6 into
Row chemical vapor deposition forms a waterproof layer on a silicon substrate.
A kind of silicon substrate waterproof membrane, including a silicon chip, silicon chip are equipped with the hole that multiple diameters are 0.8~1.2um.It is excellent
The diameter for selecting hole is 1um.
The effect of hole: small hole has tension, can obstruct hydrone and foreign matter but also lead sound.
In preferred embodiment of the invention, waterproof layer is additionally provided on silicon chip, the effect of waterproof layer is can be into one
Step ground achievees the effect that waterproof.
In preferred embodiment of the invention, multiple holes are made up of semiconductor technology, due to semiconductor technology
Low manufacture cost, therefore the cost of waterproof membrane is reduced, improve economic benefit.
In preferred embodiment of the invention, waterproof layer is formed in by being passed through SF6 gas progress chemical vapor deposition
On silicon chip.
SF6 gas is colourless, tasteless, nontoxic, nonflammable inert gas, has excellent insulation performance, and will not be old
Change insulating materials that is rotten, therefore being used as waterproof layer in the present embodiment.
As shown in Fig. 2, a kind of microphone packaging scheme, the lid 1 including one first laminate 2 and on the first laminate 2,
One Acoustic sensor 3, a dedicated IC chip 8, Acoustic sensor 3 and specific integrated circuit core are set on the first laminate 2
The connection of 8 signal of piece；
Acoustic aperture 7 is set on the bottom first layer plate 2 of Acoustic sensor 3, and acoustic aperture 7 is close to Acoustic sensor 3 on the first laminate 2
Bottom at be equipped with groove 12, silicon substrate waterproof membrane 6 is set in groove 12.
In preferred embodiment of the invention, silicon substrate waterproof membrane 6 is set in groove 12 by a connection piece.
It, can be embedding by silica gel waterproof membrane 6 in such a way that structure combines since the size of acoustic aperture 7 is inconsistent
It covers in a connection piece, then carries out surface-pasted mode setting recessed by way of epoxy resin gluing or through tin
At slot 12, keeps silica gel waterproof membrane 6 close and be securely disposed in groove 12, play the effect of leading sound blocking foreign body, improve
The consistency of hole size, improves the leakproofness of waterproof membrane.
Embodiment two:
As shown in Figure 1, a kind of preparation method of silicon substrate waterproof membrane, which comprises the following steps:
Step S1, the silicon chip to be formed with a thickness of 100~10 μm is performed etching to silicon wafer；
Step S2, silicon chip progress dry etching is formed multiple diameters is 0.8~1.2 μm of hole, and be passed through SF6 into
Row chemical vapor deposition forms a waterproof layer on a silicon substrate.
A kind of silicon substrate waterproof membrane, including a silicon chip, silicon chip are equipped with the hole that multiple diameters are 0.8~1.2um.It is excellent
The diameter for selecting hole is 1um.
The effect of hole: small hole has tension, can obstruct hydrone and foreign matter but also lead sound.
In preferred embodiment of the invention, waterproof layer is additionally provided on silicon chip, the effect of waterproof layer is can be into one
Step ground achievees the effect that waterproof.
In preferred embodiment of the invention, multiple holes are made up of semiconductor technology, due to semiconductor technology
Low manufacture cost, therefore the cost of waterproof membrane is reduced, improve economic benefit.
In preferred embodiment of the invention, waterproof layer is formed in by being passed through SF6 gas progress chemical vapor deposition
On silicon chip.
SF6 gas is colourless, tasteless, nontoxic, nonflammable inert gas, has excellent insulation performance, and will not be old
Change insulating materials that is rotten, therefore being used as waterproof layer in the present embodiment.
As shown in figure 3, a kind of microphone packaging scheme, including an acoustics cavity 13, acoustics cavity 13 include the first laminate
11, second laminate 10 vertical with the first laminate 11, be covered on the third laminate 9 of the second laminate 10, setting sound on third laminate 9
Hole 7, the corresponding inside of acoustic aperture 7 is equipped with groove 12 on third laminate 9, and silicon substrate waterproof membrane 6 is arranged in groove 12.
In preferred embodiment of the invention, one acoustics inductor 3 of setting at acoustic aperture 7 is corresponded on the inside of third laminate 9；
One dedicated IC chip 8 is set on the inside of third laminate 9, is connect with 3 signal of acoustics inductor.
In preferred embodiment of the invention, silicon substrate waterproof membrane 6 is set in groove 12 by a connection piece.
It, can be embedding by silica gel waterproof membrane 6 in such a way that structure combines since the size of acoustic aperture 7 is inconsistent
It covers in a connection piece, then carries out surface-pasted mode setting recessed by way of epoxy resin gluing or through tin
At slot 12, keeps silica gel waterproof membrane 6 close and be securely disposed in groove 12, play the effect of leading sound blocking foreign body, improve
The consistency of hole size, improves the leakproofness of waterproof membrane.
It should be appreciated by those skilled in the art that those skilled in the art are combining the prior art and above-described embodiment can be with
Realize that various change example, such change case do not affect the essence of the present invention, it will not be described here.
Presently preferred embodiments of the present invention is described above.It is to be appreciated that the invention is not limited to above-mentioned
Particular implementation, devices and structures not described in detail herein should be understood as gives reality with the common mode in this field
It applies；Anyone skilled in the art, without departing from the scope of the technical proposal of the invention, all using the disclosure above
Methods and technical content many possible changes and modifications are made to technical solution of the present invention, or be revised as equivalent variations etc.
Embodiment is imitated, this is not affected the essence of the present invention.Therefore, anything that does not depart from the technical scheme of the invention, foundation
Technical spirit of the invention any simple modifications, equivalents, and modifications made to the above embodiment, still fall within the present invention
In the range of technical solution protection.
Claims (10)
1. a kind of preparation method of silicon substrate waterproof membrane, which comprises the following steps:
Step S1, the silicon chip to be formed with a thickness of 100~150 μm is performed etching to silicon wafer；
Step S2, silicon chip progress dry etching is formed multiple diameters is 0.8~1.2 μm of hole, and be passed through SF6 into
Row chemical vapor deposition forms a waterproof layer on the silicon chip.
2. a kind of silicon substrate waterproof membrane, which is characterized in that including a silicon chip, the silicon chip be equipped with multiple diameters be 0.8~
The hole of 1.2um.
3. silicon substrate waterproof membrane as claimed in claim 2, which is characterized in that be additionally provided with waterproof layer on the silicon chip.
4. silicon substrate waterproof membrane as claimed in claim 2, which is characterized in that multiple described holes are made up of semiconductor technology.
5. silicon substrate waterproof membrane as claimed in claim 3, which is characterized in that the waterproof layer is by being passed through SF6 gas
Vapor deposition is learned to be formed on the silicon chip.
6. a kind of microphone packaging scheme, which is characterized in that the lid including one first laminate and on first laminate,
One Acoustic sensor, a dedicated IC chip, the Acoustic sensor and the dedicated collection are set on first laminate
It is connected at die signal；
Acoustic aperture is set on the first laminate described in the bottom of the Acoustic sensor, and the acoustic aperture is close to described on first laminate
It is equipped with groove at the bottom of Acoustic sensor, silicon substrate waterproof membrane is set in the groove.
7. microphone packaging scheme as claimed in claim 6, which is characterized in that the silicon substrate waterproof membrane is set by a connection piece
It is placed in the groove.
8. a kind of microphone packaging scheme, which is characterized in that including an acoustics cavity, the acoustics cavity include the first laminate,
Second laminate vertical with first laminate, the third laminate for being covered on second laminate are arranged on the third laminate
Acoustic aperture, the corresponding inside of the acoustic aperture is equipped with groove on the third laminate, and silicon substrate waterproof membrane is arranged in the groove.
9. microphone packaging scheme as claimed in claim 8, which is characterized in that the corresponding acoustic aperture on the inside of the third laminate
One acoustics inductor of place's setting；
One dedicated IC chip is set on the inside of the third laminate, is connect with the acoustics inductor signal.
10. microphone packaging scheme as claimed in claim 8, which is characterized in that the silicon substrate waterproof membrane passes through a connection piece
It is set in the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710624930.8A CN109305654A (en) | 2017-07-27 | 2017-07-27 | A kind of silicon substrate waterproof membrane and its preparation process and microphone packaging scheme |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710624930.8A CN109305654A (en) | 2017-07-27 | 2017-07-27 | A kind of silicon substrate waterproof membrane and its preparation process and microphone packaging scheme |
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| Publication Number | Publication Date |
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| CN109305654A true CN109305654A (en) | 2019-02-05 |
Family
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710624930.8A Pending CN109305654A (en) | 2017-07-27 | 2017-07-27 | A kind of silicon substrate waterproof membrane and its preparation process and microphone packaging scheme |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110191409A (en) * | 2019-05-23 | 2019-08-30 | 深圳市伊声声学科技有限公司 | A kind of manufacturing method of waterproof ventilated membrane |
| CN110275575A (en) * | 2019-05-23 | 2019-09-24 | 深圳市伊声声学科技有限公司 | The manufacturing method of waterproof ventilated membrane |
| CN110271119A (en) * | 2019-05-23 | 2019-09-24 | 深圳市伊声声学科技有限公司 | A method of waterproof ventilated membrane is manufactured using mold |
| US12191219B2 (en) | 2021-11-22 | 2025-01-07 | Industrial Technology Research Institute | Gas-permeable package lid of chip package structure and manufacturing method thereof |
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| CN103391502A (en) * | 2013-06-25 | 2013-11-13 | 歌尔声学股份有限公司 | Method for manufacturing waterproof sheets of microphones |
| CN104760924A (en) * | 2015-04-20 | 2015-07-08 | 歌尔声学股份有限公司 | MEMS microphone chip and package structure and manufacture method thereof |
| CN208062024U (en) * | 2017-07-27 | 2018-11-06 | 钰太芯微电子科技（上海）有限公司 | A kind of silicon substrate waterproof membrane and microphone packaging scheme |
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| US12191219B2 (en) | 2021-11-22 | 2025-01-07 | Industrial Technology Research Institute | Gas-permeable package lid of chip package structure and manufacturing method thereof |
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