CN109275309B - Heat dissipation module and host board assembly comprising same - Google Patents

Abstract

A heat dissipation module and a motherboard component including the same, the motherboard component including a circuit board, an expansion card and a heat dissipation module. The circuit board includes a substrate and an electrical connector, and the electrical connector is disposed on the substrate. The expansion card is connected to the electrical connector. The heat dissipation module includes a heat sink, a shield and a fan. The heat sink is in thermal contact with the expansion card. The shield is stacked on the heat sink, and the shield and the heat sink together form a heat dissipation chamber. The shield has a corresponding first through hole and a second through hole. The fan is disposed on the shield, and the fan is located in the heat dissipation chamber. The present invention can improve the heat dissipation performance of the heat dissipation module for the expansion card, thereby maintaining the working efficiency of the expansion card and extending the service life of the expansion card.

Description

Thermal Module and Motherboard Assembly Containing The Same

technical field

The present invention relates to a heat dissipation module and a mainboard assembly including the same, in particular to a heat dissipation module capable of blocking waste heat and a mainboard assembly including the same.

Background technique

As technology in the electronic field continues to evolve, the performance of electronic devices also continues to improve. Among them, the M.2 connector specification is a new-generation interface standard developed in recent years. It adopts a more flexible specification, allows more types of module specifications to be connected, and can be matched with higher-level interfaces. For example, it is applicable to channels such as Serial ATA (Serial Advanced Technology Attachment, SATA) and Mini Peripheral Component Interconnect Express (Mini PCIe). Therefore, it can have better convenience and higher performance in use. In addition, as the technology of related products becomes more and more mature and the price becomes more and more affordable, expansion devices adopting the M.2 connector specification have become more and more popular and popular in recent years.

Generally speaking, as the performance of electronic components increases, the heat generated by them increases. This heat will continue to accumulate on the electronic components and cause the temperature of the components themselves to rise. Failure to effectively cool electronic components may result in component failure and damage reducing their useful life. Therefore, on these high-efficiency electronic components that are prone to generate a large amount of heat, a heat-dissipating device such as a heat-dissipating fin is usually provided to dissipate heat. However, the waste heat dissipated by the heat sink to dissipate heat from the electronic components often also affects the surrounding electronic components. For example, when the heat sink dissipates heat from the display adapter, the waste heat will be spread around, so that the adjacent expansion devices such as M.2 solid state drives are affected by this waste heat and reduce their own heat dissipation performance, thereby affecting the work efficiency of the expansion device. Increases the chance of damage to the expansion unit. Therefore, how to provide a heat dissipation device that can effectively block the waste heat of the peripheral electronic components and can remove the heat of the expansion device itself is one of the problems to be solved by researchers.

SUMMARY OF THE INVENTION

The present invention is to provide a heat dissipation module and a motherboard assembly including the same, so as to solve the problem that the expansion device is affected by the waste heat of peripheral electronic components and reduces its own heat dissipation performance and work efficiency in the prior art.

A mainboard assembly disclosed in an embodiment of the present invention includes a circuit board, an expansion card and a heat dissipation module. The circuit board includes a substrate and an electrical connector, and the electrical connector is arranged on the substrate. The expansion card is connected to the electrical connector. The heat dissipation module includes a heat sink, a cover and a fan. The heat sink thermally contacts the expansion card. The shield is stacked on the heat sink, and the shield and the heat sink together form a heat dissipation chamber. The shield has a corresponding first through hole and a second through hole. The fan is arranged on the cover, and the fan is located in the heat dissipation chamber.

In the motherboard assembly of the present invention, wherein the circuit board further comprises a stud and a screw, the stud is disposed on the substrate and keeps a distance from the electrical connector, the cover, the heat sink and the extension Each card has an opening corresponding to the stud, and the screw passes through the opening and is fastened to the stud.

In the motherboard assembly of the present invention, the cover has a first side away from the electrical connector and a second side close to the electrical connector, the first through hole is located on the first side, the first side Two through holes are located on the second side surface.

In the motherboard assembly of the present invention, the cover has a first side face away from the electrical connector, and both the first through hole and the second through hole are located on the first side face.

In the motherboard assembly of the present invention, wherein the cover has a first side surface away from the electrical connector and a second side surface close to the electrical connector, and the distance between the fan and the first side surface is smaller than the distance between the fan and the first side surface. the distance of the second side.

In the motherboard assembly of the present invention, the heat sink includes a board body and a plurality of protruding structures, and the protruding structures are located on a side of the board body away from the expansion card.

In the motherboard assembly of the present invention, the heat dissipation module further includes a heat dissipation glue, and the heat dissipation glue is located between the expansion card and the heat sink.

In the motherboard assembly of the present invention, the expansion card is an expansion device conforming to the M.2 connector specification.

In the mainboard assembly of the present invention, the expansion card is an expansion device suitable for the standard channel of mini express peripheral interconnection. The heat dissipation module disclosed in another embodiment of the present invention is suitable for being installed in an expansion card. The expansion card is connected to an electrical connector of a circuit board. The heat dissipation module includes a heat sink, a cover and a fan. The heat sink is used to thermally contact the expansion card. The cover is stacked on the heat sink, and the cover and the heat sink together form a heat dissipation chamber. The mask has a corresponding first through hole and a second through hole. The fan is arranged on the cover, and the fan is located in the heat dissipation chamber.

Beneficial effects of the present invention:

According to the heat dissipation module and the motherboard assembly including the heat dissipation module disclosed in the above-mentioned embodiments, by disposing the cover on the expansion card, it helps to block the waste heat of the surrounding electronic components; Avoid the diffusion path of waste heat from surrounding electronic components, and cooperate with the setting of the fan to enhance the air convection between the heat dissipation chamber and the external space. Therefore, the heat dissipation performance of the heat dissipation module to the expansion card can be improved, thereby maintaining the working efficiency of the expansion card and prolonging the service life of the expansion card.

Description of drawings

FIG. 1 is a schematic perspective view of a motherboard assembly according to a first embodiment of the present invention.

FIG. 2 is an exploded schematic view of the motherboard assembly of FIG. 1 .

FIG. 3 is a side cross-sectional view of the motherboard assembly of FIG. 1 .

4 is a side cross-sectional view of a motherboard assembly according to a second embodiment of the present invention.

Among them, reference numerals:

1. 1a Motherboard Components

10 circuit boards

110 substrate

130 Electrical Connectors

131 Connection surface

133 slots

150 Studs

170 screws

30 Expansion Cards

31 semicircular opening

50 Cooling module

510 heat sink

511 Board body

513 Protruding structure

515 First opening

530 Thermal glue

550, 550a mask

551, 551a cooling chamber

552 Extension Plate

553, 553a First side

555, 555a second side

556a third through hole

557, 557a First through hole

558, 558a Second through hole

559 Second opening

560 Gasket

570, 570a fans

D1 first distance

D2 second distance

Detailed ways

The following examples further illustrate the concepts of the present invention in further detail, but are not intended to limit the scope of the present invention in any way.

See Figures 1 through 3. FIG. 1 is a schematic perspective view of a motherboard assembly according to a first embodiment of the present invention. FIG. 2 is an exploded schematic view of the motherboard assembly of FIG. 1 . FIG. 3 is a side cross-sectional view of the motherboard assembly of FIG. 1 .

The motherboard assembly 1 of this embodiment includes a circuit board 10 , an expansion card 30 and a heat dissipation module 50 .

The circuit board 10 includes a substrate 110 , an electrical connector 130 , a stud 150 and a screw 170 . The electrical connector 130 and the stud 150 are both disposed on the substrate 110 , and the electrical connector 130 and the stud 150 keep a distance. In this embodiment, the expansion card 30 and the heat dissipation module 50 can be fastened to the studs 150 through the screws 170 .

The electrical connector 130 has a connecting surface 131 and a slot 133 , the connecting surface 131 faces the direction of the stud 150 , and the slot 133 opens on the connecting surface 131 .

The expansion card 30 is inserted into the slot 133 of the electrical connector 130 , and one end of the expansion card 30 away from the electrical connector 130 has a semicircular opening 31 . The screw 170 can pass through the semi-circular opening 31 and be fastened to the stud 150 so as to fix the expansion card 30 .

In this embodiment, the electrical connector 130 is an M.2 socket connector, and the expansion card 30 is an M.2 connector specification and a Mini Peripheral Component Interconnect Express (Mini PCIe) channel. An M.2 solid-state hard disk device is taken as an example, but the present invention is not limited to this. In other embodiments, the electrical connector may be, for example, a mSATA (mini Serial advanced technology attachment) standard connector; the expansion card may be, for example, a suitable Serial ATA (Serial Advanced Technology Attachment, SATA) or Universal Serial Bus (Universal Serial Bus) , USB) channel M.2 expansion unit or mSATA expansion unit.

The heat dissipation module 50 includes a heat dissipation fin 510 , a heat dissipation glue 530 , a cover 550 and a fan 570 .

The heat sink 510 is disposed on the expansion card 30 , and the heat dissipation glue 530 is located between the expansion card 30 and the heat sink 510 . Further, the heat sink 510 thermally contacts the expansion card 30 through the heat dissipation glue 530 . The heat sink 510 includes a board body 511 and a plurality of protruding structures 513 . The protruding structures 513 are located on a side of the board body 511 away from the expansion card 30 . Therefore, the contact area between the heat sink 510 and the air can be increased through the protruding structure 513 , so that the flowing air can take away more heat from the heat sink 510 at the same time, so as to achieve a better heat dissipation effect. In addition, the heat sink 510 further has a first opening 515 corresponding to the stud 150 , and the screw 170 can pass through the first opening 515 and be fastened to the stud 150 to fix the heat sink 510 .

In this embodiment, the heat dissipation module 50 includes the heat dissipation glue 530, but the invention is not limited to this. In other embodiments, the heat dissipation module may not include heat dissipation glue, and the heat dissipation fins directly contact the expansion card. In addition, in this embodiment, the heat sink 510 includes a plurality of protruding structures 513 as an example, but the invention is not limited to this. In other embodiments, the heat sink may not include protruding structures.

The cover 550 is stacked on the heat sink 510 , and the cover 550 and the heat sink 510 together form a heat dissipation chamber 551 . The cover 550 has a first side 553 away from the electrical connector 130 and a second side 555 close to the electrical connector 130 , and the cover 550 has a plurality of first through holes 557 and a second through hole 558 . The first through holes 557 of the mask 550 are located on the first side 553 , and the second through holes 558 are located on the second side 555 . The heat dissipation chamber 551 communicates with the external space through the first through holes 557 and the second through holes 558 , so that the air inside and outside the cover 550 can communicate with each other. Generally speaking, the electronic components (not shown) around the expansion card 30 are disposed on the left and right sides of the expansion card 30 , so the first through holes 557 and the second through holes 558 are respectively opened on the front and rear sides of the cover 550 . (that is, the first side 553 and the second side 555) to prevent the waste heat of the surrounding electronic components from directly flowing to the through holes and entering the heat dissipation chamber 551; thus, the cover 550 can effectively block the waste heat of the surrounding electronic components, and can The function of ventilation and heat dissipation is achieved through the first through holes 557 and the second through holes 558 on the first side surface 553 and the second side surface 555 . In addition, the cover 550 further includes an extension plate 552 and a second opening 559 . The extension plate 552 is adjacent to the first side surface 553 and extends away from the electrical connector 130 along the normal line of the first side surface 553 . The second opening 559 is opened at the position of the extension plate 552 corresponding to the stud 150 , and the screw 170 can pass through the second opening 559 and be fastened to the stud 150 to fix the cover 550 .

In this embodiment, the material of the mask 550 is plastic, but the present invention is not limited thereto. In other embodiments, the mask can be made of other materials with low thermal conductivity.

The fan 570 is disposed on the cover 550 and located in the heat dissipation chamber 551 , and a first distance D1 between the fan 570 and the first side surface 553 is smaller than a second distance D2 between the fan 570 and the second side surface 555 . In addition, a plurality of spacers 560 may be disposed between the fan 570 and the cover 550 , so as to maintain a distance between the fan 570 and the cover 550 , so that air can flow into the fan 570 . As shown in FIG. 3 , in the present embodiment, the connecting surface 131 of the electrical connector 130 blocks part of the second through holes 558 , so that the area of the second through holes 558 that can allow airflow to pass through is smaller than the area that the first through holes 557 can allow airflow to pass through. area passed. Therefore, arranging the fan 570 adjacent to the first side surface 553 of the cover 550 can increase the flow rate of the air entering the heat dissipation chamber 551 from the first through hole 557 to achieve a better heat dissipation effect.

In this embodiment, the fan 570 is taken as an example where the fan 570 is disposed near the first side surface 553 of the cover 550 , but the invention is not limited to this. In other embodiments, the position of the fan disposed in the cover may be adjusted according to actual needs.

In addition, in this embodiment, the air enters the heat dissipation chamber 551 from the first side 553 of the cover 550 and flows out from the second side 555 to form an airflow path, but the invention is not limited to this. In other embodiments, air can enter and exit on the same side of the shield.

Please refer to FIG. 4 , which is a side cross-sectional view of the motherboard assembly according to the second embodiment of the present invention. The motherboard assembly 1a of this embodiment is similar to the motherboard assembly 1 of the first embodiment, the difference is that the fan 570a of this embodiment is disposed adjacent to the first side surface 553a of the cover 550a, and the first through hole 557a and the second through hole 557a The holes 558a are all located on the first side surface 553a of the cover 550a. The first through hole 557a and the second through hole 558a are an air inlet hole and an air outlet hole, respectively. In addition, the cover 550a further has a third through hole 556a, and the third through hole 556a is located on the second side surface 555a of the cover 550a. In this way, when the fan 570a is running, the air enters the heat dissipation chamber 551a from the first through hole 557a and flows out through the second through hole 558a to form an air flow path; Another airflow path is formed, so that the waste heat can be dispersed and discharged out of the cover 550a to meet the heat dissipation requirements of different models.

In this embodiment, it is taken as an example that the mask 550a has the third through hole 556a on the second side surface 555a, but the invention is not limited to this. In other embodiments, the second side of the cover may not have through holes, but only have through holes on the first side for air circulation.

According to the heat dissipating module and the motherboard assembly including the heat dissipation module according to the above-mentioned embodiments, by arranging the cover on the expansion card, it helps to block the waste heat of the peripheral electronic components; in addition, since the electronic components around the expansion card are generally arranged on the left and right sides of the expansion card Therefore, through holes are opened on the front and rear sides of the cover to avoid the diffusion path of the waste heat of the surrounding electronic components, and with the setting of the fan, the air convection between the heat dissipation chamber and the external space can be enhanced; Through the protruding structure on the heat sink, the contact area between the heat sink and the air can be increased, so that the flowing air can take away more heat on the heat sink at the same time. Therefore, the heat dissipation performance of the heat dissipation module to the expansion card can be improved, thereby maintaining the working efficiency of the expansion card and prolonging the service life of the expansion card.

In addition, through the feature of disposing the fan on the cover, and the feature that the expansion card, the heat sink and the cover can be fastened to the stud by the same screw, the convenience of disassembly and assembly of the expansion card can be improved.

Of course, the present invention can also have other various embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding changes and deformation should belong to the protection scope of the claims of the present invention.

Claims (8)

1. A motherboard assembly, comprising:

a circuit board, including a substrate and an electrical connector, the electrical connector being disposed on the substrate;

an expansion card connected to the electric connector; and

a heat dissipation module, comprising:

a heat sink in thermal contact with the expansion card;

the shielding cover is stacked on the radiating fin, forms a radiating cavity together with the radiating fin and is provided with a first through hole and a second through hole which correspond to each other; and

a fan, which is arranged in the shade and is positioned in the heat dissipation chamber;

the mask is provided with a first side surface far away from the electric connector and a second side surface close to the electric connector, the first through hole is positioned on the first side surface, and the second through hole is positioned on the second side surface;

the electronic elements around the expansion card are arranged on the left side and the right side of the expansion card, and the first side face and the second side face are the front side face and the rear side face of the shade.

2. The assembly as claimed in claim 1, wherein the circuit board further includes a stud disposed on the substrate and spaced apart from the electrical connector, the mask, the heat sink and the expansion card each having an opening corresponding to the stud, and a screw passing through the opening and fastened to the stud.

3. The motherboard assembly as recited in claim 1 wherein the shield has a first side remote from the electrical connector and a second side proximate to the electrical connector, the fan being spaced from the first side less than the fan is spaced from the second side.

4. The motherboard assembly as recited in claim 1 wherein the heat sink comprises a board body and a plurality of protruding structures, the protruding structures being located on a side of the board body away from the expansion card.

5. The motherboard assembly as recited in claim 1 wherein the heat sink module further comprises a heat sink adhesive, the heat sink adhesive being disposed between the expansion card and the heat sink.

6. The motherboard assembly as recited in claim 1 wherein the expansion card is an expansion device adapted to the m.2 connector specification.

7. The motherboard assembly as recited in claim 1 wherein the expansion card is an expansion device adapted to mini peripheral component interconnect express channels.

8. A heat dissipation module is suitable for being arranged on an expansion card, and the expansion card is connected with an electric connector of a circuit board, and is characterized by comprising:

a heat sink for thermally contacting the expansion card;

the shielding cover is stacked on the radiating fin, forms a radiating cavity together with the radiating fin and is provided with a first through hole and a second through hole which correspond to each other; and

a fan, which is arranged in the shade and is positioned in the heat dissipation chamber;

the mask is provided with a first side surface far away from the electric connector and a second side surface close to the electric connector, the first through hole is positioned on the first side surface, and the second through hole is positioned on the second side surface;

the electronic elements around the expansion card are arranged on the left side and the right side of the expansion card, and the first side face and the second side face are the front side face and the rear side face of the shade.

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