CN109273981B - A kind of cooling device and laser module for semiconductor laser - Google Patents

Abstract

The present invention provides a heat dissipation device for a semiconductor laser and a laser module using the heat dissipation device. The heat dissipation device includes a heat dissipation base, and the heat dissipation base is an integral heat sink with a layered structure, and specifically includes a bottom-to-bottom heat sink. The mechanical assembly layer, buffer layer, liquid inlet layer, separation layer, liquid outlet layer, and heat dissipation layer on the upper part make the cooling liquid first cool the middle part with serious thermal crosstalk and high junction temperature, and then cool the lower junction temperature after the temperature rises. On both sides of the chip, the junction temperature uniformity of each laser chip of the horizontal array of semiconductor lasers is improved.

Description

A kind of cooling device and laser module for semiconductor laser

technical field

The invention belongs to the field of semiconductor device packaging, in particular to a heat dissipation device for a semiconductor laser and a laser module using the heat dissipation device.

Background technique

The horizontal array semiconductor laser has a wide range of applications in the field of pumping and industrial processing. The structure is such as a horizontal array high-power semiconductor laser disclosed in the patent CN201520603725.X. Generally, several laser bar chips are arranged horizontally in sequence, so that the output laser is a linear spot. The semiconductor laser bar chip is composed of multiple light-emitting points. When performing QCW long pulse width or CW high-power output, the thermal crosstalk between light-emitting points is very obvious, resulting in inconsistent junction temperature of different light-emitting points, generally the junction temperature in the middle area of the chip. Higher than the junction temperature on both sides of the chip; for horizontal array semiconductor lasers, the thermal crosstalk between different chips is more obvious, especially for chips located in the middle of the horizontal array, the junction temperature is significantly higher than both sides, and the difference in junction temperature will cause The following problems: 1) The life of each light-emitting point or chip is different; 2) Thermal stress is generated inside the chip, resulting in a decrease in parameters such as polarization; 3) The output power and center wavelength of each light-emitting point or chip are different, resulting in the overall chip or array product. The spectrum is very broad, and the range of applications is very limited.

At present, the main ways to solve the inconsistent junction temperature of chips are: (1) Use a micro-channel structure with smaller channels for a single chip to improve the overall heat dissipation capability of the chip or array to reduce the junction temperature difference. This method will lead to micro-channel and heat sink processing. (2) Adjust the size or structure of the cooling channels in different positions of the chip or array product, so that the pressure drop of each channel can be controlled to achieve uniformity of heat dissipation. This method has very strict requirements on the shape of the water inlet channel. It is difficult to achieve the results required by the design with the machining capability.

SUMMARY OF THE INVENTION

In order to solve the above problems, the present invention proposes a heat dissipation device for a semiconductor laser and a laser module using the heat dissipation device, which improves the junction temperature uniformity of each chip of a horizontal array of semiconductor lasers. The specific technical solutions are:

A heat dissipation device for a semiconductor laser is characterized in that: it includes a heat dissipation base; one end of the heat dissipation base is a chip mounting area, which is a bonding area of the laser chip; There are liquid inflow channels and liquid outflow channels; the liquid inflow channel corresponds to the middle of the installation position of the laser chip, and the liquid outflow channel is located on both sides of the liquid inflow channel, so that the cooling liquid is first used to cool the light-emitting point in the middle of the laser chip, and then used for cooling Light-emitting points on both sides of the laser chip.

Specifically, the heat dissipation base is an integral heat sink with a layered structure, and specifically includes a bottom-up mechanical assembly layer, a buffer layer, a liquid inlet layer, a separation layer, a liquid outlet layer, and a heat dissipation layer; the chip mounting area is located in the thermal one end of the whole body; the mechanical assembly layer is provided with screw holes for installation, as well as liquid inlet holes and liquid outlet holes.

The buffer layer is provided with a liquid inlet cavity communicating with the liquid inlet hole and a liquid outlet cavity communicating with the liquid outlet hole, so as to ensure the pressure stability of the refrigerant liquid in the heat dissipation device.

The liquid inlet layer is provided with a liquid inflow channel and a liquid outflow channel, the inlet of the liquid inflow channel is located in the middle of the installation position of the laser chip, and communicates with the liquid inlet cavity; the liquid outflow channel is divided into two independent parts located in the liquid Both sides of the inflow channel are communicated with the liquid outlet cavity.

The liquid outlet layer is provided with a return cavity as a transition channel between the liquid inflow channel and the liquid outflow channel, so that the refrigeration liquid flows from the liquid inflow channel of the liquid entry layer back to the liquid outflow channel of the liquid entry layer through the return cavity.

The separation layer is provided with small holes for communicating with the liquid, which are used for the communication between the liquid inflow channel, the liquid outflow channel and the refrigerant liquid in the reflux chamber.

The heat dissipation layer is used to place the laser chip and realize heat dissipation.

A barrier layer is further arranged between the mechanical assembly layer and the buffer layer, which is used to isolate the screw holes of the mechanical assembly layer and the liquid inlet cavity and the liquid outlet cavity of the buffer layer.

The chip mounting area is provided with independent refrigeration partitions arranged horizontally in sequence, and each refrigeration partition is provided with a liquid inflow channel and a liquid outflow channel; the liquid inflow channels of each refrigeration partition are independent of each other and communicate with the liquid inlet cavity together. The liquid outflow channels of the refrigeration partition are independent of each other and communicate with the liquid outlet cavity together.

The liquid inlet layer also includes a liquid inlet extension cavity communicated with the liquid inlet cavity and a liquid outlet extension cavity communicated with the liquid outlet cavity. match the position, so that the refrigerant liquid flows from the liquid inlet cavity through the liquid inlet extension cavity to the inlet of the liquid inflow channel; the position of the liquid outlet extension cavity matches the position of the buffer layer liquid outlet cavity, so that the refrigerant liquid flows from the liquid outflow channel It flows out from the liquid outlet extending cavity to the liquid outlet cavity.

The liquid inflow channel and/or the liquid outflow channel and/or the return cavity are provided with strip-shaped cooling fins arranged in sequence, and the aforementioned liquid inflow channel and/or the liquid outflow channel and/or the return cavity are divided into a plurality of juxtaposed ones. aisle.

The length of the cooling fins in the liquid inflow channel and/or the return cavity decreases from the middle to both sides.

The liquid inlet chamber and the liquid outlet chamber are rectangular parallelepipeds parallel to the chip mounting area, and the position of the liquid inlet chamber is farther from the chip mounting area than the position of the liquid outlet chamber.

The liquid passage holes of the separation layer are divided into three parts arranged in a line. The width of the liquid passage holes in the middle matches the width of the liquid inflow channel, which is used for the cooling liquid to flow into the liquid outlet layer from the liquid inlet layer; The liquid passage holes are respectively matched with the widths of the liquid outflow passages on both sides, and are used for the refrigerant liquid to return from the liquid outlet layer to the liquid outflow passages of the liquid inlet layer.

A laser module using the heat dissipation device of the present invention includes a plurality of laser chips and a heat dissipation base, one end of the heat dissipation base is a chip mounting area, and a plurality of laser chips are arranged and bonded to the chip mounting area in sequence along the slow axis direction thereof. superior.

Beneficial effects of the present invention:

(1) Compared with the traditional micro-channel heat sink, the number of channels through which the refrigerant flows is reduced, the flow rate of each channel increases under the same flow rate, and the heat dissipation capacity is improved;

(2) For a single chip, the cooling liquid first cools the middle part with severe thermal crosstalk and high junction temperature, and then cools the two sides of the chip with lower junction temperature after the temperature rises to ensure that the junction temperature of each part on a single chip is more uniform ;

(3) For a horizontal array composed of multiple chips, the cooling liquid inlet is located in the middle of the array, that is, the middle position where thermal crosstalk is very serious. The flow rate in this area is slightly higher than that on both sides of the array, and the heat dissipation capacity is better than both sides. The junction temperature difference between them is small.

Description of drawings

FIG. 1 is an overall schematic diagram of the heat dissipation device of the present invention.

2-8 are schematic diagrams of each layer of the mechanical assembly layer, barrier layer, buffer layer, liquid inlet layer, separation layer, liquid outlet layer, and heat dissipation layer of the heat dissipation device of the present invention.

Description of reference numerals: 1- heat dissipation base, 2- mechanical assembly layer, 3- barrier layer, 4- buffer layer, 5- liquid inlet layer, 6- separation layer, 7- liquid outlet layer, 8- heat dissipation layer, 9- Inlet hole, 10-outlet hole, 401-inlet cavity, 402-outlet cavity, 501-liquid inflow channel, 502-inlet extension cavity, 503-liquid outflow channel, 601-liquid through hole , 11-chip mounting area, 12-cooling partition, 13-threaded hole, 701-return cavity, 504-extension cavity.

Detailed ways

The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

The technical scheme of the present invention will be described below in conjunction with the accompanying drawings:

The heat dissipation device for a semiconductor laser proposed by the present invention includes a heat dissipation base 1; as shown in FIG. 1 , one end of the heat dissipation base 1 is a chip mounting area 11, which is a bonding area of the laser chip. Specifically, the above heat dissipation The base body 1 is specifically a heat sink, and the material is copper, or steel, or aluminum, or graphite metal composite material, or diamond metal composite material.

A liquid inflow channel and a liquid outflow channel are provided inside the heat dissipation base 1 at the position corresponding to the chip mounting area; the liquid inflow channel corresponds to the middle of the laser chip installation position, and the liquid outflow channel is located on both sides of the liquid inflow channel, so that the cooling liquid first Used to cool the light-emitting point in the middle of the laser chip, and then used to cool the light-emitting point on both sides of the laser chip.

The heat dissipation base 1 is also provided with a liquid inlet hole and a liquid outlet hole which communicate with the outside, the liquid inflow channel is communicated with the liquid inlet hole, and the liquid outflow channel is communicated with the liquid outlet hole.

Specifically, in a horizontal array type semiconductor laser, as shown in FIG. 1 or FIG. 8 , the chip mounting area 11 is provided with independent cooling partitions 12 arranged horizontally in sequence, each cooling partition corresponds to a laser chip, and each cooling partition There are liquid inflow channels and liquid outflow channels inside. The refrigerant flows in from the liquid inlet holes and then divides into the liquid inflow channels of each refrigeration zone. After cooling, it flows out from the liquid outflow channels to the liquid outlet holes.

It should be noted that the relative positions of the above-mentioned liquid inflow channel and liquid outflow channel are based on the installation position of the laser chip. For example, when only one laser chip is installed in the chip installation area, the position of the liquid inflow channel is understood as the corresponding chip installation area. When the chip mounting area includes multiple independent cooling zones, the position of the liquid inflow channel is understood as the middle of the corresponding cooling zone.

Specifically, the heat dissipation base 1 is an integral heat sink with a layered structure, and the foregoing layered structure is welded into the whole heat sink by brazing, pressure welding, diffusion welding, or hard solder.

The layered structure of the heat dissipation substrate is specifically described below by taking the horizontal array semiconductor laser as an example. FIG. 1 is an exploded schematic diagram of each layer of the heat dissipation substrate 1, and FIG. 2 to FIG. 8 show the structure diagrams of each layer of the heat dissipation substrate 1:

The heat dissipation base 1 specifically includes a bottom-up mechanical assembly layer 2 , a barrier layer 3 , a buffer layer 4 , a liquid inlet layer 5 , a separation layer 6 , a liquid outlet layer 7 , and a seven-layer structure of a heat dissipation layer 8 . The chip mounting area 11 is located at one end of the whole heat sink formed by the aforementioned seven-layer layered structure.

As shown in FIG. 2 , the mechanical assembly layer 2 is provided with screw holes 13 for installation, as well as a liquid inlet hole 9 and a liquid outlet hole 10 ; the position of the liquid inlet hole 9 is farther from the chip mounting area 11 than the position of the liquid outlet hole 10 . .

As shown in FIG. 4 , the buffer layer 4 is provided with a liquid inlet cavity 401 communicating with the liquid inlet hole 9 and a liquid outlet cavity 402 communicating with the liquid outlet hole 10, so as to ensure the pressure stability of the refrigerant liquid in the cooling device; Specifically, the liquid inlet chamber 401 and the liquid outlet chamber 402 are rectangular parallelepipeds parallel to the chip mounting area, the position of the liquid inlet chamber 401 corresponds to the liquid inlet hole 9, and the position of the liquid outlet chamber 402 corresponds to the liquid outlet Hole 10 (the position of the liquid inlet cavity is farther from the chip mounting area than the position of the liquid outlet cavity). It should be noted that, in the application of the horizontal array semiconductor laser, the chip mounting area 11 includes a plurality of cooling partitions arranged horizontally in sequence, and it can be understood that the chip mounting area 11 is a rectangular parallelepiped.

As shown in FIG. 3 , the barrier layer 3 is used to isolate the screw holes 13 of the mechanical assembly layer and the liquid inlet cavity 401 and the liquid outlet cavity 402 of the buffer layer. The specific structure of the barrier layer 3 is that it is provided with a liquid inlet hole 9 and a liquid outlet hole 10 matching the mechanical assembly layer 2, so that the liquid inlet hole 9 is connected from the mechanical assembly layer to the liquid inlet cavity of the buffer layer, and the liquid outlet hole 10 It is connected from the mechanical assembly layer to the liquid outlet chamber of the buffer layer, and the barrier layer 3 blocks the liquid inlet chamber 401 and the liquid outlet chamber 402 of the buffer layer and the threaded holes of the mechanical assembly layer 2 to ensure the liquid inlet chamber. The body 401 and the liquid outlet cavity 402 are sealed. It should be noted that, when the threaded hole of the mechanical assembly layer 2 does not overlap with the liquid inlet cavity or the liquid outlet cavity, this layer structure can also be omitted.

As shown in FIG. 5 , the liquid inlet layer 5 is provided with a liquid inflow channel 501 and a liquid outflow channel 503 . The liquid inflow channel 501 corresponds to each refrigeration partition one-to-one, and the inlet of the liquid inflow channel 501 is located in the middle of the refrigeration partition 12 (ie, the laser chip installation position), and communicates with the liquid entry cavity 502 . The liquid outflow channel 503 is divided into two independent parts located on both sides of the liquid inflow channel (ie, corresponding to the two sides in the refrigeration partition) and communicated with the liquid outlet cavity.

Specifically, the liquid inlet layer 5 further includes a liquid inlet extension cavity 502 communicated with the liquid inlet cavity 401 and a liquid outlet extension cavity 504 communicated with the liquid outlet cavity. The liquid inlet extension cavity 502 is connected to the liquid inlet extension cavity 502. The liquid cavity 401 is matched in size and position, so that the refrigerant liquid extends from the liquid inlet cavity through the liquid inlet extension cavity 502 to the inlet of the liquid inflow channel. The position of the liquid outlet extension cavity 504 is matched with the position of the liquid outlet cavity 402 of the buffer layer, so that the refrigerant flows out from the liquid outflow channel 503 through the liquid outlet extension cavity 504 to the liquid outlet cavity.

It should be noted that the liquid inflow channel 501 and the liquid outflow channel 503 of the liquid inlet layer 5 are isolated from each other on the liquid inlet layer. The above-mentioned liquid inlet extension cavity 502 matches the liquid inlet cavity 401 in size and position, which can be understood as the liquid inlet extension cavity 502 and the liquid inlet cavity 401 in the superposition direction of each layer of the heat dissipation substrate 1. The same, so that the liquid inlet extension cavity and the liquid inlet cavity are superimposed to form a cavity. The positions of the liquid outlet extension cavity 504 and the buffer layer liquid outlet cavity 402 match. It can be understood that the liquid outlet extension cavity 504 and the liquid outlet cavity 402 overlap each other in the superposition direction of each layer of the heat dissipation substrate 1, and the outlet The liquid extension cavity 504 is divided into a plurality of independent cavities matching the number of liquid outflow channels, and adjacent liquid outflow channels 503 share one liquid outflow extension cavity 504 .

Further, the liquid inflow channel 501 is provided with strip-shaped cooling fins arranged in sequence, and the liquid inflow channel is divided into a plurality of parallel channels; further, the length of the cooling fins of the liquid inflow channel 501 decreases from the middle to both sides, so that cooling The flow velocity of the liquid in each parallel channel of the liquid inflow channel is uniform.

The liquid outflow channel 503 is provided with strip-shaped cooling fins arranged in sequence, the liquid outflow channel is divided into a plurality of parallel channels, and the cooling fins and the cooling fins in the liquid inflow channel are parallel to each other.

As shown in FIG. 7 , the liquid outlet layer is provided with a return chamber 701 as a transition channel between the liquid inflow channel and the liquid outflow channel, so that the refrigerant flows from the liquid inflow channel of the liquid inlet layer to the liquid outflow channel of the liquid inlet layer through the return chamber. Specifically, the recirculation chambers of each refrigeration subarea are independent of each other, and the recirculation chambers are provided with radiating fins arranged in strips, and the radiating fins cut the recirculation chamber into a plurality of parallel channels. Specifically, the length of the cooling fins located in the middle of the cooling partition is longer than that of the cooling fins on both sides, and the length of the aforementioned cooling fins decreases from the middle of the cooling partition to the two sides.

As shown in FIG. 6 , the separation layer is provided with small liquid holes 601, which are used for the communication of the refrigerating liquid in the liquid inflow channel and the liquid outflow channel; specifically, the liquid flow holes are located at the end of the chip mounting area; further The liquid passage holes are divided into three parts in a linear arrangement in each refrigeration zone. The liquid passage holes in the middle match the width of the liquid inflow channel, and are used for the cooling liquid to flow from the liquid inlet layer to the liquid outlet layer; located on both sides The small liquid-passing holes are respectively matched with the liquid outflow channels on both sides of the aforementioned refrigeration partition, and are used for the refrigeration liquid to flow back from the liquid outlet layer to the liquid outflow channels of the liquid inlet layer.

It should be noted that the above-mentioned three-part liquid-passing orifice refers to being divided into three parts according to functions. In fact, each part can be a liquid-passing orifice or a plurality of arranged liquid-passing holes. combination.

As shown in FIG. 8 , the heat dissipation layer 8 is used for placing the laser chip and realizing heat dissipation, or for placing a carrier on which the laser chip is mounted, such as a conductive and heat-conducting substrate on which the laser BAR bar is mounted.

The flow direction of the refrigerant liquid in the above-mentioned seven-layer layered structure is explained as follows: the refrigerant liquid flows into the liquid inlet hole 9 of the mechanical assembly layer 2 and the barrier layer 3, accumulates in the liquid inlet cavity 401 of the buffer layer 4, and enters the liquid inlet cavity 401 of the buffer layer 4. The liquid inlet extends into the cavity 502 of the liquid inlet layer, and flows from the back to the front of each liquid inflow channel 501 to each refrigeration partition 12 in turn. Since the liquid outflow channel is located in the middle of the refrigeration partition 12, the cooling liquid is preferentially completed to the middle of the laser chip. At the end of each refrigeration partition, it enters the liquid outlet layer 7 through the liquid passage hole 601 in the middle of each refrigeration partition of the separation layer 6, and at the rear end of the reflux cavity 701 of the liquid outlet layer 7 to both sides of the refrigeration partition The shunt flows back to the liquid outflow channel 503 of the liquid inlet layer through the liquid passage holes located on both sides of the refrigeration partition of the separation layer, and the refrigerant liquid extends from the front to the back in the liquid outflow channel through the liquid outlet extension cavity 504 to the liquid outlet chamber of the buffer layer. The body 402 finally flows out through the liquid outlet.

It should be noted that the above embodiment takes a heat dissipation substrate with multiple cooling partitions as an example, the present invention is not limited to a horizontal array semiconductor laser with multiple chips, but is also applicable to a semiconductor laser with a single BAR bar (the structure is equivalent to the chip mounting area being one cooling zone).

Specifically, the refrigeration liquid is water, or ethanol, or ethylene glycol, or propylene glycol.

A laser module using the above heat dissipation device includes a plurality of laser chips and a heat dissipation base, one end of the heat dissipation base is a chip mounting area, and a plurality of laser chips are arranged and bonded to the chip mounting area in sequence along the slow axis direction thereof.

Claims (9)

1. A heat dissipation device for a semiconductor laser, characterized in that: comprising a heat dissipation base; One end of the heat dissipation base is the chip mounting area, which is the bonding area of the laser chip; A liquid inflow channel and a liquid outflow channel are arranged inside the heat dissipation base at a position corresponding to the chip mounting area; the chip mounting area is provided with independent refrigeration sub-areas arranged horizontally in sequence, each refrigeration sub-area corresponds to a laser chip, and each refrigeration sub-area corresponds to a laser chip. Each partition has a liquid inflow channel and a liquid outflow channel; the liquid inflow channel corresponds to the middle of the installation position of the laser chip, and the liquid outflow channel is located on both sides of the liquid inflow channel, so that the cooling liquid is used to cool the light-emitting point in the middle of the laser chip first, and then Used to cool the light-emitting points on both sides of the laser chip; The heat dissipation base is an integral heat sink with a layered structure, and specifically includes a bottom-up mechanical assembly layer, a buffer layer, a liquid inlet layer, a separation layer, a liquid outlet layer, and a heat dissipation layer; the chip mounting area is located in the overall heat sink. one end; The mechanical assembly layer is provided with threaded holes for installation, as well as liquid inlet holes and liquid outlet holes; The buffer layer is provided with a liquid inlet cavity communicated with the liquid inlet hole and a liquid outlet cavity communicated with the liquid outlet hole, so as to ensure the stability of the pressure of the refrigerant in the cooling device; The liquid inlet layer is provided with a liquid inflow channel and a liquid outflow channel, the inlet of the liquid inflow channel is located in the middle of the installation position of the laser chip, and communicates with the liquid inlet cavity; the liquid outflow channel is divided into two independent parts located in the liquid Both sides of the inflow channel, and communicate with the liquid outlet cavity; The liquid outlet layer is provided with a return cavity, which is used as a transition channel between the liquid inflow channel and the liquid outflow channel, so that the refrigeration liquid flows from the liquid inflow channel of the liquid entry layer back to the liquid outflow channel of the liquid entry layer through the return cavity; The separation layer is provided with small holes for liquid passage, which are used for the communication between the liquid inflow channel, the liquid outflow channel and the refrigerant liquid in the reflux chamber; The heat dissipation layer is used to place the laser chip and realize heat dissipation. 2. The heat dissipation device for semiconductor lasers according to claim 1, wherein a barrier layer is further provided between the mechanical assembly layer and the buffer layer for isolating the screw holes of the mechanical assembly layer and the buffer layer. Into the liquid cavity, out of the liquid cavity. 3 . The heat sink for semiconductor lasers according to claim 2 , wherein the liquid inflow channels of the refrigeration subregions are independent of each other and communicate with the liquid inlet cavity together, and the liquid outflow channels of the refrigeration subregions are independent of each other. 4 . and communicate with the liquid outlet cavity together. 4 . The heat sink for semiconductor lasers according to claim 3 , wherein the liquid inlet layer further comprises a liquid inlet extension cavity communicating with the liquid inlet cavity and a liquid outlet communicating with the liquid outlet cavity. 5 . an extension cavity, the liquid inlet extension cavity is matched in size and position with the liquid inlet cavity of the buffer layer, so that the refrigerant liquid flows from the liquid inlet cavity through the liquid inlet extension cavity to the inlet of the liquid inflow channel; the liquid outlet The position of the extension cavity matches the position of the liquid outlet cavity of the buffer layer, so that the refrigerant liquid flows out from the liquid outflow channel through the liquid outlet extension cavity to the liquid outlet cavity. 5. The heat dissipation device for a semiconductor laser according to claim 4, wherein the liquid inflow channel and/or the liquid outflow channel and/or the return cavity are provided with strip-shaped heat sinks, and the aforementioned The liquid inflow channel and/or the liquid outflow channel and/or the return chamber are subdivided into a plurality of parallel channels. 6 . The heat dissipation device for a semiconductor laser according to claim 5 , wherein the length of the heat dissipation fins in the liquid inflow channel and/or the return cavity decreases from the middle to both sides. 7 . 7 . The heat sink for semiconductor lasers according to claim 3 , wherein the liquid inlet cavity and the liquid outlet cavity are rectangular parallelepipeds parallel to the chip mounting area, and the positions of the liquid inlet cavity are compared with those of the liquid inlet cavity. 8 . The position of the liquid outlet cavity is far from the chip mounting area. 8. The heat dissipation device for semiconductor lasers according to claim 1, wherein the liquid-passing holes of the separation layer are divided into three parts arranged in a line, and the liquid-passing holes located in the middle have a width and a liquid inflow hole. The width of the channel is matched, which is used for the refrigerant liquid to flow from the liquid inlet layer into the liquid outlet layer; the liquid passage holes located on both sides match the width of the liquid outflow channel on both sides respectively, and are used for the refrigerant liquid to flow back from the liquid outlet layer to the liquid inlet layer. The liquid flows out of the channel. 9. A laser module using the heat dissipation device according to any one of claims 1 to 8, characterized in that it comprises a plurality of laser chips and a heat dissipation base, one end of the heat dissipation base is a chip mounting area, and a plurality of laser chips They are arranged and bonded on the chip mounting area in sequence along the slow axis direction.

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