CN109273392A - Wafer transfer device - Google Patents
Wafer transfer device Download PDFInfo
- Publication number
- CN109273392A CN109273392A CN201811046820.9A CN201811046820A CN109273392A CN 109273392 A CN109273392 A CN 109273392A CN 201811046820 A CN201811046820 A CN 201811046820A CN 109273392 A CN109273392 A CN 109273392A
- Authority
- CN
- China
- Prior art keywords
- wafer
- cavity
- wafer transfer
- chip
- loading
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000006243 chemical reaction Methods 0.000 claims abstract description 17
- 238000005229 chemical vapour deposition Methods 0.000 claims abstract description 8
- 238000007789 sealing Methods 0.000 claims description 24
- 230000033001 locomotion Effects 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 abstract description 59
- 239000000463 material Substances 0.000 abstract description 36
- 230000005540 biological transmission Effects 0.000 abstract description 22
- 238000000034 method Methods 0.000 abstract description 14
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 10
- 238000005516 engineering process Methods 0.000 abstract description 5
- 239000003344 environmental pollutant Substances 0.000 abstract description 5
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 5
- 231100000719 pollutant Toxicity 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 230000001737 promoting effect Effects 0.000 abstract description 2
- 238000010926 purge Methods 0.000 abstract description 2
- 239000007789 gas Substances 0.000 description 5
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000012864 cross contamination Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to semiconductor equipment manufacturing technology fields, it is desirable to provide a kind of wafer transfer device.The device includes upper left material locking device, upper right material locking device and reaction chamber；It further include chip transmission main body, upper left material locking device and upper right material locking device pass through gate valve and transmit the same side of main body set on chip；Opposite side connects reaction chamber by gate valve, for carrying out chemical vapor deposition process to chip.This product is reloaded the waiting time using double feeding locking devices, reduction；The nonpollution environment that carrying wafers chamber is kept using nitrogen purging avoids chip from bringing pollutant into reaction chamber handling process, so that promoting chip carries out chemical vapor deposition process efficiency.
Description
Technical field
The present invention relates to semiconductor equipment manufacturing technology field, especially a kind of wafer transfer device.
Background technique
In current semiconductor fabrication process, carrying out chemical vapor deposition process in wafer surface has had long-term
Practical application.Chemical vapor deposition process is that the reactant gas containing deposit is made to flow through chip table at high temperature with substitution gas
Face simultaneously reacts, and deposition obtains the monocrystalline of higher purity.
In chemical vapor deposition unit, extensive application was once obtained in wafer batch treatment process, however its presence is as follows
Disadvantage: reactant gas concentration can be gradually reduced with the progress of deposition reaction；Lead to the inconsistent of deposition rate；Multi-wafer
It handles simultaneously and needs bigger space, and this often means that so that temperature is controlled consistent purpose is more difficult to realize.This
A little disadvantages will lead to same chip difference or different chips deposit thickness it is inconsistent.
Especially after large-sized wafer (200~300mm of diameter) is increasingly favored, single wafer deposition technique start by
To wider concern.Most targetedly technology is to be gone up and down during chip loading and unloading using wafer casket to the technique at present
Machine come realize chip it is independent extraction and storage.It is in vacuum state inside wafer coffin hoist, atmosphere can be prevented from wafer
Coffin hoist internal interstices enter chip feeding locking device.Wafer casket is placed on wafer coffin hoist by wafer casket microscope carrier,
In the case where feeding locks operating condition, chip is successively moved into be aligned with pick-and-place material mouth.
It is completed when last block chip in wafer casket is handled, if only waited until using single feeding locking device
The wafer casket that another is loaded with untreated wafer is placed into the chamber of feeding locking device, and the chamber warp of feeding locking device
After cleaning up, it could continue to produce.It is readily apparent that this can bring the reduction of production efficiency.
The problem of pollution brought into chip feeding locking process is a highly significant in chip transmit process.These are dirty
Dye includes oxygen, and vapor, micro dust particle etc. is such can be caused chip to be oxidized, deposit qualification rate reduction, chip circle
The problems such as face integrality is destroyed.
Summary of the invention
The technical problem to be solved by the present invention is to overcome deficiency in the prior art, provide a kind of wafer transfer device.
In order to solve the technical problem, solution of the invention is:
A kind of wafer transfer device, including upper left material locking device, upper right material locking device and reaction chamber are provided；Further include
Chip transmits main body, and upper left material locking device and upper right material locking device pass through gate valve and transmit main body the same side set on chip
Portion；Opposite side connects reaction chamber by gate valve, for carrying out chemical vapor deposition process to chip；
It is that the cavity shape structure of the chip transmission cover board composition of cavity and top is transmitted by chip that chip, which transmits main body,；It is described
Mechanical arm is equipped in chip transmission cavity body, mechanical arm end is connected with sucker, and the movement of the mechanical arm is transmitted by being set to chip
The manipulator of bottom part body is controlled；Where the upper left material locking device and upper right material locking device of the chip transmission cavity
Pick-and-place material mouth is provided on the side wall at place；
Upper left expects that locking device is identical with upper right material locking device structure, includes by feeding cavity under feeding cavity
The cavity shape structure surrounded；It is equipped on rear side of feeding cavity through gate composed by inner brake door-plate and external brake door-plate, front side is equipped with
Aperture, when gate valve is opened, for being connected to chip transmission main body；Lower blanking inside cavity bottom surface is equipped with by wafer casket
Upper support plate and wafer casket downloading board group at wafer casket microscope carrier, for placing wafer casket；Lower blanking cavity bottom connects wafer casket
Elevator；The lifting shaft end of wafer coffin hoist is connected with wafer casket microscope carrier.
As an improvement being respectively provided with exhaust outlet and air inlet on chip transmission cavity bottom surface and chip transmission cover board.
As an improvement being respectively equipped with air inlet and row on the bottom surface of the upper and lower feeding cavity in the top surface of feeding cavity
Port.
As an improvement being equipped with sealing device on air inlet and exhaust outlet, including it is set to air inlet and exhaust ports
Sealing ring be set to sealing ring outside sealed jacket, by adjust sealed jacket make sealing ring touch gas pipeline surface come reality
The sealing of existing inlet and outlet mouth.
As an improvement chip transmission cavity and chip transmission cover board and feeding cavity and lower feeding cavity pass through
Multiple holes are connected, and contact surface is realized by O-ring seal and sealed.
As an improvement wafer casket is fixed on wafer casket microscope carrier by the wafer casket fixed plate of bottom.
As an improvement wafer coffin hoist and lower feeding cavity bottom surface, inner brake door-plate and external brake door-plate, gate valve and crystalline substance
Contact surface between piece transmission main body, gate valve and upper left material locking device and gate valve and upper right material locking device passes through O-shaped close
Sealing is realized in seal.
Compared with prior art, the beneficial effects of the present invention are:
Using double feeding locking devices, reduction is reloaded the waiting time；Carrying wafers chamber is kept using nitrogen purging
Nonpollution environment avoids chip from bringing pollutant into reaction chamber handling process, so that promoting chip carries out chemical vapor deposition
Product treatment effeciency.
Detailed description of the invention
Fig. 1 is the main structure top view of apparatus of the present invention.
Fig. 2 is that Fig. 1 conceals the A-A after reaction chamber and coupled gate valve to sectional view.
Fig. 3 is the inlet and outlet mouth sealing structure in apparatus of the present invention.
Wherein, the upper left 1- expect locking device, 2- upper right material locking device, 5- chip transmit main body, 11- reaction chamber, 3,4,
9- gate valve；21- feeding cavity；Feeding cavity under 22-；23- wafer coffin hoist；24- external brake door-plate；25- inner brake door-plate；
26a, 40a- air inlet；26b, 40b, 40c-- exhaust outlet；27- first environment；28- wafer casket；29- picks and places material mouth；30a,30b,
30c, 30d, 30e, 30f-O type sealing ring；The top 31- baffle；32- rear side wall panel；33- right shell body；34- wafer casket fixed plate；
Support plate on 35- wafer casket；Support plate under 36- wafer casket；37- lifting shaft；38- second environment；39- chip transmits cavity；45- sealing
Collet；46- sealing ring, 47- chip transmit cover board.
Specific embodiment
One of the present embodiment wafer transfer device, as shown in Figure 1, including upper left material locking device 1, the locking of upper right material
Device 2 and reaction chamber 11.It further include chip transmission main body 5, upper left material locking device 1 and upper right material locking device 2 pass through gate valve
3,4 it is set to the chip transmission same side of main body 5.Opposite side connects reaction chamber 11 by gate valve 9.When all gate valves 3,4,9 are opened,
It is homogeneous intercommunicated that chip transmits main body 5, upper left material locking device 1, upper right material locking device 2 and reaction chamber 11.
It is second environment 38 in main body 5 that chip, which transmits, and it is to transmit cavity 39 and top by chip that chip, which transmits main body 5,
Chip transmits the cavity shape structure that cover board 47 forms, and chip transmits cavity 39 and is connected with chip transmission cover board 47 by multiple holes, and
Contact surface is realized by O-ring seal 30f and is sealed.Chip, which transmits, is equipped with mechanical arm in cavity 39, mechanical arm end is connected with sucker,
The movement of mechanical arm is controlled by the manipulator for being set to chip transmission 5 bottom of main body.Expect lock in the upper left that chip transmits cavity 39
Determine to be provided on the side wall where device 1 and upper right material locking device 2 and pick and place material mouth 29 (another is not marked)；
Exhaust outlet 40b, 40c and air inlet 40a are respectively provided on chip transmission 39 bottom surface of cavity and chip transmission cover board 47.Into
It is equipped with sealing device on port 40a and exhaust outlet 40b, 40c, including sealing ring 46 and the sealed jacket outside sealing ring 46
45, so that sealing ring 46 is touched gas pipeline surface by adjusting sealed jacket 45 to realize the sealing of inlet and outlet mouth.
Upper left expects that locking device 1 is identical with upper right material 2 structures of locking device, states to be simple, below then with a left side shown in Fig. 2
For feeding locking device 1, illustrate the structure of upper left material locking device 1 and upper right material locking device 2, including passes through feeding chamber
The chamber shape first environment 27 that the lower feeding cavity 22 of body 21 surrounds, for clean nitrogen from source nitrogen (not shown) through special feed channel
It is (not shown) to enter first environment 27, and it is cleaned, pollutant is discharged from exhaust outlet 26b.In first environment 27
Pollutant is mainly included in oxygen, vapor and micronic dust particle contained in the atmosphere entered when loading or unloading wafer casket 28
Son.The opening and closing for picking and placing material mouth 29 is controlled by gate valve 3.When gate valve 3 is opened, between first environment 27 and second environment 38 mutually
Connection, wafer casket 28 can be moved into or be moved out to wafer W via material mouth 29 is picked and placed at this time；Conversely, then first environment 27 and the second ring
Border 38 is isolated, and prevents cross contamination.The lower feeding cavity 22 of feeding cavity 21 is connected by multiple holes, and contact surface by
O-ring seal realizes sealing.Air inlet 26a is respectively equipped on the bottom surface of the upper and lower feeding cavity 22 in the top surface of feeding cavity 21
With exhaust outlet 26b.It is equipped on rear side of feeding cavity 21 through gate composed by inner brake door-plate 25 and external brake door-plate 24, front side is set
There is aperture, for being connected to chip transmission main body 5.Lower 22 inner bottom surface of blanking cavity is equipped with by support plate 35 on wafer casket
The wafer casket microscope carrier formed with support plate 36 under wafer casket, for placing wafer casket 28, wafer casket 28 is solid by the wafer casket of bottom
Fixed board 34 is fixed on wafer casket microscope carrier.Wafer W in wafer casket 28 is sequentially stacked on by layer by rear side wall panel 32, top gear
On the shelf that plate 31, return panels (not shown) and top cover 37 form, right shell body 33 can prevent wafer W from skidding off wafer casket 28.
Lower 22 bottom of blanking cavity connects wafer coffin hoist 23.37 end of lifting shaft of wafer coffin hoist 23 and wafer
Casket microscope carrier is connected.Wafer coffin hoist 23 and lower 22 bottom surface of feeding cavity, inner brake door-plate 25 and external brake door-plate 24, gate valve 3 and crystalline substance
Contact surface between piece transmission main body 5, gate valve 3 and upper left material locking device 1 and gate valve 4 and upper right material locking device 2 respectively passes through
O-ring seal 30c, 30a, 30e, 30d and (O-ring between gate valve 4 and upper right material locking device 2 does not mark), which are realized, to be sealed.
A working cycles of the invention can sum up as follows: 6 port of conveying robot (right side) feeding locking device 1 (2)
Pick-and-place material mouth.Gate valve 3 (4) automatically turns on.Mechanical arm 7 stretches, and enters sucker 8 in left (right side) feeding locking device 1 (2) simultaneously
It is moved to above chip to be processed and adsorbs chip to be processed.Mechanical arm 7 is shunk, and makes the sucker 8 for adsorbing chip to be handled
It returns in chip transmission main body 5.Gate valve 3 (4) is automatically closed.Conveying robot is rotated towards reaction chamber 11.Gate valve 9 is beaten automatically
It opens.Mechanical arm 7 stretches, and so that the sucker for adsorbing chip to be handled 8 is entered reaction chamber and puts down chip.Mechanical arm 7 is shunk, and makes to inhale
Disk 8 returns in chip transmission main body 5.Gate valve 9 is automatically closed.After the completion of chip processing, gate valve 9 is automatically opened.Mechanical arm 7
Stretching, extension makes sucker 8 enter reaction chamber 11 and adsorbs chip.Mechanical arm 7 is shunk, and sucker 8 is made to return to chip transmission main body 5
It is interior.Gate valve 9 is automatically closed.The pick-and-place material mouth of conveying robot 6 port (right side) feeding locking device 1 (2).Gate valve 3 (4) is automatic
It opens.Mechanical arm 7 stretches, and so that sucker 8 is entered in left (right side) feeding locking device 1 (2) and is moved to lower material position and puts down chip.Machine
Tool arm 7 is shunk, and returns to sucker 8 in chip transmission main body 5.23 setting in motion of wafer coffin hoist, until next piece of chip arrives
Up to feeding position.
The loading and unloading process of wafer casket of the invention is as follows: the gate of left (right side) feeding locking device 1 (2) is opened.It takes out
It is loaded with the wafer casket that processing chip is completed.It is put into the wafer casket for being loaded with untreated wafer.Closing gate.Nitrogen is from air inlet
26a, which is blown into, cleans first environment 27, and pollutant is drained from exhaust outlet 26b.
More than, it is only a case study on implementation of the invention, limitation in any form not is done to the present invention, although
The present invention is disclosed as above with preferable case study on implementation, and however, it is not intended to limit the invention, any technology people for being familiar with this profession
Member, without departing from the scope of the present invention, when making certain changes using the structure and technology contents of the disclosure above
Or modify and become the equivalence enforcement case of equivalent variations.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811046820.9A CN109273392A (en) | 2018-09-08 | 2018-09-08 | Wafer transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811046820.9A CN109273392A (en) | 2018-09-08 | 2018-09-08 | Wafer transfer device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109273392A true CN109273392A (en) | 2019-01-25 |
Family
ID=65187488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811046820.9A Pending CN109273392A (en) | 2018-09-08 | 2018-09-08 | Wafer transfer device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109273392A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111599715A (en) * | 2020-04-30 | 2020-08-28 | 北京北方华创微电子装备有限公司 | Wafer transmission control method |
| CN117976510A (en) * | 2024-04-02 | 2024-05-03 | 浙江求是创芯半导体设备有限公司 | Wafer driving structure and workpiece taking and adjusting method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6053686A (en) * | 1998-02-09 | 2000-04-25 | Asm Japan K.K. | Device and method for load locking for semiconductor processing |
| KR20120039890A (en) * | 2010-10-18 | 2012-04-26 | 주식회사 엘지실트론 | Load lock chamber, single crystal film deposition apparatus having the same and method for depositing single crystal film on wafer |
| CN106558520A (en) * | 2015-09-29 | 2017-04-05 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Wafer transmission system and chip transmission method |
| CN208903985U (en) * | 2018-09-08 | 2019-05-24 | 浙江求是半导体设备有限公司 | Wafer transfer device |
-
2018
- 2018-09-08 CN CN201811046820.9A patent/CN109273392A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6053686A (en) * | 1998-02-09 | 2000-04-25 | Asm Japan K.K. | Device and method for load locking for semiconductor processing |
| KR20120039890A (en) * | 2010-10-18 | 2012-04-26 | 주식회사 엘지실트론 | Load lock chamber, single crystal film deposition apparatus having the same and method for depositing single crystal film on wafer |
| CN106558520A (en) * | 2015-09-29 | 2017-04-05 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Wafer transmission system and chip transmission method |
| CN208903985U (en) * | 2018-09-08 | 2019-05-24 | 浙江求是半导体设备有限公司 | Wafer transfer device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111599715A (en) * | 2020-04-30 | 2020-08-28 | 北京北方华创微电子装备有限公司 | Wafer transmission control method |
| CN111599715B (en) * | 2020-04-30 | 2023-11-14 | 北京北方华创微电子装备有限公司 | Wafer transmission control method |
| CN117976510A (en) * | 2024-04-02 | 2024-05-03 | 浙江求是创芯半导体设备有限公司 | Wafer driving structure and workpiece taking and adjusting method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20231115 Address after: Room 103, Building 1, No. 500 Shunda Road, Yuhang Economic and Technological Development Zone, Linping District, Hangzhou City, Zhejiang Province, 311103 Applicant after: Zhejiang Qiushi Chuangxin Semiconductor Equipment Co.,Ltd. Applicant after: ZHEJIANG JINGSHENG M&E Co.,Ltd. Address before: 311100 Zhejiang Province Hangzhou Yuhang District East Lake Street Qianjiang Economic Development Zone, No. 96 Longchuanwu Road, Building 2, 3 Floors Applicant before: ZHEJIANG QIUSHI SEMICONDUCTOR EQUIPMENT Co.,Ltd. Applicant before: ZHEJIANG JINGSHENG M&E Co.,Ltd. |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190125 |