CN109256634A - High speed connector mould group and its manufacturing method thereof - Google Patents
High speed connector mould group and its manufacturing method thereof Download PDFInfo
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- CN109256634A CN109256634A CN201811320704.1A CN201811320704A CN109256634A CN 109256634 A CN109256634 A CN 109256634A CN 201811320704 A CN201811320704 A CN 201811320704A CN 109256634 A CN109256634 A CN 109256634A
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- 238000009413 insulation Methods 0.000 claims description 22
- 238000001746 injection moulding Methods 0.000 claims description 15
- 239000011810 insulating material Substances 0.000 claims description 14
- 238000000465 moulding Methods 0.000 claims description 14
- 230000000712 assembly Effects 0.000 claims description 12
- 238000000429 assembly Methods 0.000 claims description 12
- 238000003780 insertion Methods 0.000 claims description 5
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- 238000010586 diagram Methods 0.000 description 10
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- 235000003140 Panax quinquefolius Nutrition 0.000 description 8
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- 239000012943 hotmelt Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
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- 230000017525 heat dissipation Effects 0.000 description 4
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- 238000011161 development Methods 0.000 description 2
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- 230000006978 adaptation Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
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- 230000009351 contact transmission Effects 0.000 description 1
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- 230000005611 electricity Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/514—Bases; Cases composed as a modular blocks or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/516—Means for holding or embracing insulating body, e.g. casing, hoods
- H01R13/518—Means for holding or embracing insulating body, e.g. casing, hoods for holding or embracing several coupling parts, e.g. frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R25/00—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits
- H01R25/006—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits the coupling part being secured to apparatus or structure, e.g. duplex wall receptacle
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/24—Assembling by moulding on contact members
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Abstract
The design discloses high speed connector mould group and its manufacturing method thereof, the high speed connector mould group includes at least a connector assembly, the connector assembly includes insulating body, and the first end submodule group fixed with the insulating body, second end submodule group and third terminal mould group, first end submodule group and second end submodule group are formed by stacked on top, third terminal mould group is stacked by left and right and is formed, first end submodule group, second end submodule group and third terminal mould group are inserted in insulating body by assembling, connector assembly overall structure is stablized, cooperation is close, processing procedure is simple, it is easy to produce in batches.
Description
Technical field
The invention relates to communication transfer field more particularly to a kind of high speed connector mould group and its manufacturing method thereofs.
Background technique
QSFP (Quad Small Form-factor Pluggable) in the prior art, SFP (Small Form-
Factor Pluggable) equipped with socket connector, the socket connector includes insulator and is contained in insulator mould group
Two rows of terminals.
At on February 21st, 2017, TaiWan, China TW M537332U patent disclosed a kind of connector system, tool
There are first shell and second shell.Comprising there are two high frequency contact mould group and positioned at two high frequency contacts inside the first shell
The low frequency contact mould group in mould group middle position, each contact mould group includes several contacts.The first shell and
Two closure peripheries are arranged with box body, and the box body is used for earth shield effect.The high frequency contact mould group is corresponding to be turned by cable
It is connected to a circuit substrate, the low frequency contact mould group is connected directly to the circuit substrate.
With the development of QSFP connector, the continuous promotion of contact transmission speed, shielding properties, high frequency between docking point
The requirements such as characteristic, characteristic impedance, cross talk resistance energy are also higher and higher, furthermore want to the packaging technology of connector and overall stability
Sample of seeking common ground is higher and higher.Therefore existing structure can no longer meet demand in above-mentioned characteristic.
In consideration of it, needing to design one kind new high speed connector mould group and its manufacturing method thereof to meet growth requirement.
Summary of the invention
The design's is designed to provide a kind of high speed connector mould group and its manufacturing method thereof, with stable structure, system
Journey is easy and is easy to large-scale serial production.
To achieve the above object, the design provides a kind of manufacturing method thereof of high speed connector mould group, includes the following steps:
A, insulating body is made by insulating materials,
The insulating body is formed with the grafting space for one docking connector of grafting and forms interface, institute in front end
It states insulating body rear end and forms adapted space, the adapted space front end is connected to grafting space, and the adapted space rear end is passed through
Wear the rear end face of insulating body；
B, several pairs of non-high-speed terminals are made by metal plate, each pair of non-high-speed end is molded in by insulating materials
Insulation sheet body and composition third terminal component is formed on son, by jig by several described third terminal components in left-right direction
Stacking forms third terminal mould group；
C, the upper high-speed terminal and lower high-speed terminal that several are in row setting are made by metal plate；
A, a row is molded in by insulating materials and forms upper insulating part on several on high-speed terminal, and formed
High-speed terminal component, a row include at least a ground terminal on several in high-speed terminal；
B, it is molded on several lower high-speed terminals of a row by insulating materials and forms lower insulating part, and under formation
High-speed terminal component, a row several descend to include at least a ground terminal in high-speed terminals；
C, it will be stacked along the vertical direction by the upper high-speed terminal component, the lower high-speed terminal component that are formed in step a, b, and
First end submodule group is formed,
D, second end submodule group is made in the C that repeats the above steps；
E, third terminal mould group made of step B is inserted into from the front to the back in the adapted space of insulating body, by step C system
At first end submodule group be inserted into the adapted space of insulating body from the front to the back, by second end submodule group made of step D by
It is forwardly inserted in the adapted space of insulating body afterwards.
It further, further include step F on the basis of step E, earthing member is made by metal plate in step F, and by two
The earthing member respectively corresponds insertion first end submodule group and second end submodule group back-end location,
The earthing member is held in high-speed terminal component in the correspondence of the first end submodule group and second end submodule group
Between lower high-speed terminal component, the earthing member is directly or indirectly overlapped with corresponding ground terminal, and the earthing member prolongs
Stretch the inserting foot being formed with for docking circuit board contacts with one.
It further, further include providing cable and by cable and a row high-speed terminal on several in the step a of step C
Rear end is welded and fixed, and forms upper interior module, the upper insulating part, one through injection molding or encapsulating in the upper insulating part rear end
Arrange the step of high-speed terminal component is collectively formed in high-speed terminal on several, corresponding cable and upper interior module.
It further, further include providing cable and by several time high-speed terminals of cable and a row in the step b of step C
Rear end is welded and fixed, and forms core insert part, the lower insulating part, one through injection molding or encapsulating in the lower insulating part rear end
Arrange the step of lower high-speed terminal component is collectively formed in several lower high-speed terminals, corresponding cable and core insert part.
Further, in the step c of step C, further include by metal plate formed ground strip, and with the upper high-speed terminal
Component and lower high-speed terminal component stack along the vertical direction, are from top to bottom followed successively by high-speed terminal component, ground strip and lower height
Fast terminal assemblies, and form first end submodule group, the ground strip in the corresponding upper high-speed terminal and lower high-speed terminal
Ground terminal contact.
Further, it further includes passing through in the step c of step C that the ground strip, which includes upper ground strip and lower ground strip,
Conductive plastic formed conductive plate, and with the upper high-speed terminal component, lower high-speed terminal component, upper ground strip and lower ground strip edge
Up and down direction stacks, and is from top to bottom followed successively by high-speed terminal component, upper ground strip, conductive plate, lower ground strip and lower speed end
Sub-component, and form first end submodule group, the upper ground strip and lower ground strip and corresponding conductive plate are in electrical contact, described to connect
Ground part is held between described two ground strips and is located at conductive plate rear position.
It further, further include step G, step G is that front pedestal is made by powder metallurgy, by institute on the basis of step F
It states front pedestal and is assembled to insulating body from the front to the back, be molded by being molded in be formed between the insulating body and front pedestal
Part, and form connector assembly.
It further, further include step G, step H for metal cap is made by metalwork, by the metal on the basis of G
Cover, which is assembled to, connects device assembly periphery.
It further, further include step I on the basis of H, step I is that metal base plate is made by metalwork, by the gold
Belong to bottom plate and be assembled to the lower surface of the connector assembly, several pins are provided, by the pin by metal cap, front pedestal,
Metal base plate and insulating body are integrally fixed, provide radiating module, the radiating module is assembled on metal cap.
To achieve the above object, the design provides a kind of by high speed connector mould group described in any one as above
High speed connector mould group made of manufacturing method thereof, each non-high-speed terminal in the third terminal component includes to extend downwardly out
Each insulating trip is external and the terminal docking section that is exposed to outside the lower surface of the insulating body, the terminal docking section be used for it is right
Circuit board is connect to be directly connected to.
Compared with prior art, the embodiment of the present application has the advantages that first end submodule group and second end submodule
Group is formed by stacked on top, and third terminal mould group is stacked by left and right and formed, first end submodule group, second end submodule group and the
Three Terminals Die groups are inserted in insulating body by assembling, and connector assembly overall structure is stablized, and cooperation is close, and processing procedure is simple,
It is easy to produce in batches.
Detailed description of the invention
Attached drawing described herein is used to provide to further understand the embodiment of the present application, constitutes the embodiment of the present application
A part, the schematic application embodiment of the embodiment of the present application and its explanation are not constituted pair for explaining the embodiment of the present application
The improper restriction of the embodiment of the present application, in the accompanying drawings:
Fig. 1 is to use schematic diagram on the design high speed connector module group assembling a to circuit substrate, is specifically illustrated
Four high speed connector Mo Zu are corresponding up and down respectively to be installed to opposite two surfaces of a circuit substrate；
Fig. 2 is the part isometric exploded view of the design high speed connector mould group, specifically illustrates two connector assemblies
Stereoscopic schematic diagram when being combined with corresponding metal cap, while illustrating the perspective view after radiating module is separated with metal cap；
Fig. 3 is that two connector assemblies shown in Fig. 2 show when combining with corresponding metal cap from the solid that another angle is seen
It is intended to；
Fig. 4 is the stereoscopic schematic diagram after separating metal base plate with connector assembly in the group of high speed connector mould shown in Fig. 3；
Fig. 5 is the part isometric exploded view of the design high speed connector mould group, specifically illustrates two connector assemblies
Stereoscopic schematic diagram after separating with corresponding metal cap further illustrates the stereogram exploded view of metal cap；
Fig. 6 is the perspective view that the group of high speed connector mould shown in Fig. 5 is seen from another angle；
Fig. 7 is the part isometric exploded view of the connector assembly of the design high speed connector mould group, and which show mouldings
Stereoscopic schematic diagram after being separated from connector assembly；
Fig. 8 is the stereoscopic schematic diagram that connector assembly shown in Fig. 7 is seen from another angle；
Fig. 9 is the part isometric exploded view of the connector assembly of the design high speed connector mould group, which show moulding,
Front pedestal separated from connector assembly after stereoscopic schematic diagram；
Figure 10 is the stereoscopic schematic diagram that connector assembly shown in Fig. 9 is seen from another angle；
Figure 11 is that the connector assembly of the design high speed connector mould group removes the part isometric point after moulding, front pedestal
Xie Tu is specifically illustrated after two speed end submodule groups, a non-high-speed Terminals Die group and metalwork separate with insulating body
Stereoscopic schematic diagram；
Figure 12 is the further stereogram exploded view of connector assembly shown in Figure 11；
Figure 13 is the rearview of the connector assembly of the design high speed connector mould group；
Figure 14 is that the connector assembly of the design high speed connector mould group removes moulding, front pedestal, insulating body and interior
Rearview after module；
Figure 15 is that the connector assembly of the design high speed connector mould group removes moulding, front pedestal, insulating body and each
Part isometric exploded view after interior module, wherein specifically illustrating the schematic diagram after a cable is separated with corresponding terminal；
Figure 16 is that the connector assembly of the design high speed connector mould group removes moulding, front pedestal, insulating body and each
Side view after interior module；
Figure 17 be specifically illustrated from the cross-sectional view of line A-A shown in Fig. 1 the terminal docking section of non-high-speed Terminals Die group with
The position matching of docking pin on corresponding circuits substrate；
Figure 18 is magnified partial view shown in Figure 17, the enlarged drawing of structure specially in dashed circle；
Figure 19 is the top view of two connector assemblies being disposed adjacent of the design high speed connector mould group, emphasis exhibition
Show the arrangement situation of the terminal docking section of non-high-speed Terminals Die group.
Specific embodiment
To keep the purposes, technical schemes and advantages of the application clearer, below in conjunction with the specific embodiment of the application
And technical scheme is clearly and completely described in corresponding attached drawing.Obviously, described embodiment is only the application
A part of the embodiment, instead of all the embodiments.Based on the embodiment in the application, those of ordinary skill in the art are not having
Every other embodiment obtained under the premise of creative work is made, shall fall in the protection scope of this application.
Here, it should also be noted that, in order to avoid having obscured the application because of unnecessary details, in the accompanying drawings only
The structure and/or processing step closely related with the section Example of the application are shown, and the part with the application is omitted
The little other details of embodiment relationship.
In addition, it should also be noted that, the terms "include", "comprise", " having " or its any other variant are intended to contain
Lid non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.
For the accuracy of description, herein it is all be related to direction please without exception using Fig. 1 as reference, the wherein extension side of X-axis
To for left and right directions (wherein X-axis forward direction be right), the extending direction of Y-axis is front-rear direction (wherein Y-axis forward direction is rear), Z axis
Extending direction is up and down direction (wherein Z axis forward direction is upper).For convenience, the top to bottom, left and right, front and rear orientation in the application
For relative position, does not constitute a limitation realization and limit.
It please refers to shown in Fig. 1 to Figure 19, the design discloses a kind of high speed connector mould group 100, including connector assembly
1, the metal cap 2 of 1 periphery of connector assembly is covered at, the metal base plate 3 of 1 lower surface of connector assembly is covered in and is mounted on gold
Belong to the radiating module 4 on cover 2.In the design, one high speed connector mould group 100 includes that there are two arranged side by side in left-right direction
The connector assembly 1 of setting, described two connector assemblies 1 share a metal cap 2 (shown in ginseng Fig. 3 to Fig. 5), one
The partition of metal cap 2 is at corresponding two spaces.Certainly in other embodiments, one high speed connector mould group 100 also may be used
Only one connector assembly 1 of setting, corresponding 2 size of metal cap, which does adaptation change and corresponds to only one space of formation, also may be used.
It please referring to shown in Fig. 6 to Figure 12, in the design, the practical connector assembly 1 is a kind of socket connector, including
Insulating body 10, first end submodule group 11, second end submodule group 12, third terminal mould group 13, positioned at 10 rear end of insulating body
Front pedestal 14, moulding 15 and earthing member 114.The first end submodule group 11, second end submodule group 12 and third terminal mould group
13 is fixed with insulating body 10 by assembling.In on left and right directions, the third terminal mould group 13 is located at first end submodule group 11
Between second end submodule group 12.The front pedestal 14 is by metal material processing procedure, in the design, especially by powder metallurgical technique
Processing procedure.The moulding 15 is formed by hot melt insulating materials by injection molding.
It please refers to shown in Fig. 6 to Figure 12, the insulating body 10 is formed by hot melt insulating materials by injection molding, including position
In front end substantially in cuboid tubulose to interpolating unit 101 and positioned at the mounting portion 102 to 101 rear end of interpolating unit.It is described to interpolating unit
The grafting space (not labeled) for accommodating docking connector (not shown) is formed among 101 and forms interface in front end
1010.The mounting portion 102 is described to interpolating unit 101 along being greater than perpendicular to cross section profile in the front-back direction.In the mounting portion 102
Between be formed with adapted space 1021.1021 front end of adapted space is connected to grafting space, 1021 rear end of adapted space
Through 102 rear end face of mounting portion.102 lower surface of mounting portion is formed with resigning mouthful 1022, the resigning close to back-end location
Mouth 1022 is connected to adapted space 1021.The back-end location upper surface of the mounting portion 102, which is recessed downwards, is formed with mating groove
1022, the mating groove 1022 is generally formed into tapered from the front to the back and backwards face into ringent dove tail.
Please refer to shown in Fig. 6 to Figure 10, the front pedestal 14 include plate-like body plate 141, by the main board 141 before
It lateral margin forward horizontal extends to form on end face epipleural 142 and is extended to form forward by 141 front end face lower lip of main board
Two limiting sections 143.Described two limiting sections 143 are located at the left and right sides position of 141 lower lip of main board.The epipleural
142 are formed through corresponding groove 1421 in up and down direction and 1022 corresponding position of mating groove.In the design, the corresponding groove 1421
It is greater than 1022 section of mating groove, the corresponding groove 1421 and 1022 periphery of mating groove along the section perpendicular to face where up and down direction
Outline position forms step-like structure (shown in ginseng Fig. 7).The limiting section 143 is corresponding solid with the limit of 10 back-end location of insulating body
Fixed, fixing groove 1023 (ginseng Figure 10) cooperation specifically formed with 10 rear end corresponding position of insulating body limits.Each limiting section
143 are formed through recessing groove 1431 along the vertical direction, and 1431 forward end of recessing groove runs through limiting section 143.The main body
Plate 141 is formed through eight cable holes 1411 passed through for cable 5 (ginseng Figure 10) along the longitudinal direction.114 part of earthing member is embedding
Enter in the recessing groove 1431 and realizes limit with the front pedestal 14 and overlap (earthing member 114 specially described below
Connecting plate 1142 partially protrudes into recessing groove 1431).
In the design, the front pedestal 14 assembles with insulating body 10 fix from the front to the back, and the epipleural 142 is covered in
The upper surface of the mounting portion 102 is formed with 1422 (fit clearance of fit clearance between the front pedestal 14 and insulating body 10
1422 be specially to be formed between interior modules and main board 141 described below), the fit clearance 1422 and mating groove 1022 and
Corresponding groove 1421 is connected to.It is formed by thermoplastic cement through injection molding in the fit clearance 1422, mating groove 1022 and corresponding groove 1421
The moulding 15, the moulding 15 includes the filling mating groove 1022 and corresponding groove 1421 and outer peripheral surface is in step-like
Retaining lugs 151 (ginseng Fig. 8).The moulding 15 is closer for combining front pedestal 14 with insulating body 10.It is described right
The dovetail configuration design of the step-like structure design and mating groove 1022 of answering slot 1421 and mating groove 1022 to be formed in order to enable
It is tightly combined between insulating body 10, front pedestal 14 and moulding 15.
It please refers to shown in Figure 11 to Figure 16, the first end submodule group 11 is roughly the same with second end submodule 12 structures of group.
By taking first end submodule group 11 as an example, the first end submodule group 11 includes the conductive plate of substantially plate-like and conductive energy
111, the upper ground strip 1121 and lower ground strip 1122 that are bonded with 111 upper and lower surface of conductive plate and upper 1121 upper surface of ground strip
It the upper high-speed terminal component 1131 of fitting, the lower high-speed terminal component 1132 that is bonded with lower 1122 lower surface of ground strip and is held on
Earthing member 114 between the upper ground strip 1121 and lower 1122 rear end of ground strip.In the design, the conductive plate 111 is by leading
Electric plastic cement is formed.
The upper high-speed terminal component 1131 includes seven in the upper high-speed terminal 1151 of row setting and upper speed end
Sub 1151 middle positions by injection molding integrally fixed upper insulating part 1161, be connected with each upper 1151 rear end of high-speed terminal
Cable 5 and the upper interior module 1171 integrally fixed with upper 1151 back-end location of high-speed terminal by injection molding.The lower high speed
Terminal assemblies 1132 include seven and pass through in the lower high-speed terminal 1152 of row setting, with lower 1152 middle position of high-speed terminal
Injection molding integrally fixed lower insulating part 1162, the cable 5 that is connected with each lower 1152 rear end of high-speed terminal and with lower speed end
Sub 1152 back-end locations pass through the core insert part 1172 that injection molding is integrally fixed.
Please refer to shown in Figure 15 combination Figure 11 and Figure 12, the upper high-speed terminal 1151 of a row of the first end submodule group 11 with
High-speed terminal 1152 is shifted to install in left and right directions under a corresponding row, and the upper high-speed terminal 1151 of a row is biased to where insulation division
Side.Each upper high-speed terminal 1151 shifts to install one by one respectively in left-right direction with lower high-speed terminal 1152.The upper high-speed terminal of one row
1151 and one high-speed terminal 1152 under row respectively include the three of each high-speed-differential terminal pair of two couples of high-speed-differential terminal A and interval
Root ground terminal B.Each of each upper high-speed terminal 1151 and lower high-speed terminal 1152 terminal include to be fixed on
It corresponds to the terminal fixing part 1101 in insulating part 1161,1162, corresponding insulating part is protruded out by 1101 front end of terminal fixing part
1161, the 1162 outer and terminal contact portions 1102 that protrude into grafting space and correspondence is protruded out by 1101 rear end of terminal fixing part
Terminal docking section 1103 outside insulating part 1161,1162.
It please refers to shown in Figure 15 combination Figure 12, in the design, the same row goes up high under high-speed terminal 1151 and same row
Fast terminal 1152 is formed by the stamped bending of piece of metal plate (by metal plate in the plate thickness direction of up and down direction through bending shape
At).The same row goes up the terminal docking section 1103 of high-speed terminal 1152 under high-speed terminal 1151 and same row in right and left
It is arranged to flushing, and the same row goes up the terminal of the ground terminal B of high-speed terminal 1152 under high-speed terminal 1151 and same row
Docking section 1103 along the longitudinal direction on development length be not less than high-speed-differential terminal A 1103 length of terminal docking section, so
Can guarantee each couple of high-speed-differential terminal A in the left and right sides of entire length by ground terminal B Isolated Shield so that connector group
Part 1 has better high frequency characteristics, while having stronger resistance to crosstalk ability.The upper high-speed terminal 1151 or same of the same row
Arrange 1103 rear end of terminal docking section of each ground terminal B of lower high-speed terminal 1152 respectively to 111 place side bending of conductive plate simultaneously
Extend rearwardly to form the lapping plate 1104 for being connected as one three ground terminal B.The 1104 side table of lapping plate
It shows out module 1171,1172 in corresponding (ginseng Figure 12) and is realized altogether with corresponding ground strip 1121,1122 overlap joint.Certainly,
In other embodiments, the lapping plate 1104 of each ground terminal B can also be designed in mutually indepedent.
In the design, each terminal in the first end submodule group 11 and second end submodule group 12 is connected with corresponding cable 5,
Specifically, the corresponding signal wire with cable 5 in the terminal docking section 1103 of each high-speed-differential terminal A is welded and fixed, each ground terminal B
Terminal docking section 1103 is corresponding and the ground line of cable 5 is welded and fixed.It should be noted that the high speed connector in the design
In the connector assembly 1 of mould group 100, the terminal fixing part of each upper high-speed terminal 1151 in same speed end submodule group 11,12
Pitch requirements between 1101 and the terminal fixing part 1101 of each lower high-speed terminal 1152 are particular value, are guaranteeing upper and lower terminal
Terminal fixing part 1101 between spacing accomplish in the smallest situation, the wrap direction of the lapping plate 1104 in the design
Corresponding cable 5 can be made to be carried on 1104 surface of lapping plate, can so borrow the segment thickness for sponging cable 5, with to the greatest extent
Connector assembly 1 may be reduced in the integral thickness in up and down direction.In addition, the bending shape of the lapping plate 1104, favorably
It is shielded (namely in the two sides that high-speed-differential terminal A is designed to overall length in the longitudinal direction by the interval ground terminal B
It says, the high-speed-differential terminal A is be overlapped in the lateral direction with ground terminal B on overall length).Such earth shield effect is more
It is good.
It please referring to shown in Figure 10 to Figure 16, the upper ground strip 1121 and 1122 shape of lower ground strip are identical, by
The stamped bending of metal plate is formed, including plate-shaped bar body piece 1001, is formed by the stamped bending of 1001 front position of body sheet
Several elastic connecting haptic elements 1002 and from 1001 end edge of body sheet to 111 place side of conductive plate and inflection is formed forward bullet
Property dististyle 1003.The elastic connecting haptic element 1002 is from body sheet 1001 to far from 111 place side bending of conductive plate extension and in bullet
Property outstanding wall-like structure.In the design, three row's elastic connectings of left and right directions arrangement are provided on one ground strip 1121,1122
Haptic element 1002 respectively corresponds and ground terminal B bullet wherein every row's elastic connecting haptic element 1002 is provided with three of front-rear direction interval
Property contact, be used for earthing effect.Multiple and plurality of rows of elastic connecting haptic element 1002 is designed for guaranteeing between each ground terminal B
Contact stabilization, while guaranteeing that the different parts of each ground terminal B are in zero potential state.
It please refers to shown in Figure 12,15 and 16, in the design, in the first end submodule group 11 and second end submodule group 12,
In in up and down direction, under the upper high-speed terminal 1151 of a row or a row between high-speed terminal 1152 except terminal contact portion 1102 with
Outer region is equipped with ground strip 1121,1122 (that is, the extension area of the ground strip 1121,1122 is more than to correspond to
One row goes up the region under high-speed terminal 1151 or a row between high-speed terminal 1152 in addition to terminal contact portion 1102).So may be used
So that ground strip 1121,1122 has function of shielding, further improve high frequency characteristics.
In the design, a ground strip also can be only set in the first end submodule group 11 and/or second end submodule group 12
1121,1122, in this embodiment, a ground strip 1121,1122 is formed into several Elastic Contacts to the equal bending in two sides
Foot 1002, corresponding contact with the ground terminal B in upper high-speed terminal 1151 and lower high-speed terminal 1152 are grounded effect.At it
111 structure of conductive plate can even be cancelled in his embodiment.It only needs to realize by a ground strip 1121,1122 and corresponding upper height
Ground terminal B contact in fast terminal 1151 and lower high-speed terminal 1152 is grounded effect.
It please refers to shown in Figure 10 to Figure 16, the earthing member 114 is made of metal plate and substantially L-shaped shape.Including correspondence
The contact being held between the elastic tip 1003 of the upper ground strip 1121 and the elastic tip 1003 of lower ground strip 1122
Plate 1141 and it is connected with the contact plate 1141 and connecting plate 1142 that side in left-right direction is downwardly extending.The company
Fishplate bar 1142 has further extended to form downwards inserting foot 1143.In the design, the inserting foot 1143 is specifically via insulation sheet
Two side positions of the lower surface of body 10, which extend downwardly out, to be used for outside entire connector assembly 1 and docks the docking of circuit board 6.
In the design, the first end submodule group 11 and second end submodule 12 structures of group are essentially identical, can also compare in detail
Shown in Figure 11 to Figure 14, therefore the detailed construction of second end submodule group 12 is repeated no more.
It please refers to shown in Figure 10 to Figure 16, the third terminal mould group 13 includes there are five third terminal component 131 each the
Three terminal assemblies 131 include an insulation sheet body 1311 and are fixed in the insulation sheet body 1311 by injection molding part
Two non-high-speed terminals 130.Each non-high-speed terminal 130, which is formed by metal plate through blanking, forms (i.e. described each non-high-speed
Terminal 130 is by metal plate in the stamped formation in plate thickness direction of left and right directions).The substantially L-shaped shape of each non-high-speed terminal 130,
Extend forward including the corresponding terminal fixing part 1301 being embedded in the insulation sheet body 1311, by 1301 front end of terminal fixing end
The suspended wall shape terminal contact portion 1302 of formation and it is connected with 1301 rear end of terminal fixing end and extends downwardly out the sheet body that insulate
Terminal docking section 1303 outside 1311.Docking pin 61 of the terminal docking section 1303 for corresponding insertion docking circuit board 6
In, the preferred flake leg structure in the terminal docking section 1303 (the flake terminal structure of i.e. intermediate oval through-hole) is described right
The docking pin 61 for connecing circuit board is the through-hole structure with golden finger.Certainly, in other embodiments, the terminal docking section
1303 can also design in other forms, it is only necessary to meet 1303 structure on two sides of terminal docking section can to middle spring deformation,
It can occur effectively to connect with 61 inner wall of pin that docks when i.e. terminal docking section 1303 is in the docking pin 61 for being inserted into circuit board 6
Touching.
It please refers to shown in Figure 12 to Figure 19, in the design, five third terminal components 131 stack in left-right direction to be set
It sets and (stacks limit especially by five insulation sheet bodies 1311 to be formed).Described ten non-high-speed terminals 130 are in two along the vertical direction
Row's setting.In left-right direction, the terminal contact portion 1302 of described ten non-high-speed terminals 130 shifts to install (specific one by one respectively
Join Figure 19), specifically by the terminal fixing end of five non-high-speed terminals 130 of upper row or five non-high-speed terminals 130 of lower row
1301 in left-right direction one segment difference of bending form (specific not shown).Two terminals pair of one third terminal component 131
Socket part 1303 is aligned along the longitudinal direction.The end for five non-high-speed terminals 130 of row that the terminal contact portion 1302 is located above
Sub- docking section 1303 is integrally located at the terminal docking section that terminal contact portion 1302 is located below five non-high-speed terminals 130 of a row
1303 rear position.
It please refers to shown in Figure 17 to Figure 19.Five non-high-speed terminals 130 of five non-high-speed terminals 130 of the upper row and lower row
Terminal docking section 1303 in left and right directions in five rows be arranged, five non-height of described five non-high-speed terminals 130 of upper row and lower row
Fast terminal 130 in left and right directions be located in the middle butt be power supply terminal C, described five non-high-speed terminals 130 of upper row and
The terminal docking section 1303 of four butts other than power supply terminal C is removed in five non-high-speed terminals 130 of lower row in front-rear direction
It is arranged in four rows.
When two high speed connector mould groups 100 in the design are inserted along the upper and lower surfaces opposite direction of docking circuit board 6
It connects after being assembled to docking circuit board 6, in the non-high-speed terminal 130 of each high speed connector mould group 100, only two opposite electricity
The terminal docking section 1303 of source terminal C shares the docking pin 61 of docking circuit board 6, other non-height in addition to power supply terminal C
The terminal docking section 1303 of fast terminal 130 does not share docking pin 61.It is designed in this way the docking that can simplify to docking circuit board
The structure of pin 61 designs, it is only necessary to which ordinary circuit board achieves that function, does not need because other in addition to power supply terminal C are non-
The terminal docking section 1303 of high-speed terminal 130 share docking pin 61 and specially treated docking pin 61 (specially treated refers to herein
Be to it is same docking 61 upper and lower surfaces of pin golden finger do disconnection process) structure.Can so save docking circuit board at
This investment.And power supply terminal C can be concatenated, power supply terminal C does not need to do special place to docking pin 61 when sharing docking pin 61
Reason.Be designed in this way but also dock 6 winding displacement of circuit board it is relatively simple rationally.In the design, each ground terminal B altogether and with
Power supply terminal C in non-high-speed terminal 130 forms circuit.
It please refers to shown in Figure 11 to Figure 16, five insulation sheet bodies 1311 of the third terminal mould group 13 are passed through in left and right directions
Assembling superposition forms an insulation division (not labeled).The end of the two rows terminal of high speed connector mould group 100 in the design
Sub- contact portion 1102,1302 shifts to install one by one respectively in left-right direction, cooperates each terminal of such high speed connector mould group 100
Between small spacing form so that spacing is non-between part high-speed terminal 1151,1152 and the insulation division of third terminal mould group 13
It is often small, in the design, close to a ground terminal of insulation division especially in the lower high-speed terminal 1152 of first end submodule group 11
A ground terminal B in B and the upper high-speed terminal 1151 of second end submodule group 12 close to insulation division (can specifically join figure
14).Therefore the corresponding position in the design in insulation division left and right sides, which is recessed inwardly, is formed with bit-avoiding slot 1300, so that right
Answering has enough gaps between the ground terminal B of position and insulation division side wall.So that first end submodule group 11 and second
Having enough encapsulated thickness on the outside of the correspondence ground terminal B of Terminals Die group 12, (namely ground terminal B left and right directions is close to absolutely
The side of edge has sufficiently thick plastic cement), with guarantee corresponding ground terminal B and insulating part 1161,1162 and interior module 1171,
Stability maintenance between 1172.In the design, the bit-avoiding slot 1300 is in the overall length for being located at the insulation division on front-rear direction
It is extended to form on degree.
It please refers to shown in Figure 11 to Figure 14, the lower edge difference of the insulation division left and right sides of the third terminal mould group 13
Protrude outward and be formed with pillar 1304, the pillar 1304 it is corresponding with first end submodule group 11 and second end submodule group 12 it is lower in
Module 1172 supports limit.The upper surface of the upper insulating part 1161 of the first end submodule group 11 and second end submodule group 12, under
The lower surface of insulating part 1162 and the upper surface of insulation division are prominent respectively to be formed with limited post 1011, the insulating body 10 it is interior
Fluted structure 1024 is correspondingly formed on wall surface, the fin shape limited post 1011 is corresponding solid with the groove structure 1024 limit
It is fixed, to realize first end submodule group 11 and second end submodule group 12 and insulating body 1 in fixing in the front-back direction and third end
Submodule group 13 and insulating body 1 are in the fixation on left and right directions and up and down direction.In the design, the first end submodule group 11 and
Limited post 1011 in second end submodule group 12 is to protrude outward the inversed hook like boss structure to be formed, the third terminal mould group 13
On limited post 1011 be to protrude outward the dovetail shaped rib structures to be formed.
Please refer to shown in Fig. 1 to Fig. 6, the metal cap 2 by metal plate processing procedure and be formed with front-rear direction extension docking
Space 20 is simultaneously formed in front end to interface 201 (ginseng Fig. 2).The metal cap 2 includes upper outlet body 21, lower cover 22 and intermediate barrier
23, the corresponding peace for from top to bottom covering at 1 top of connector assembly and being posted by insulating body 10 of the upper outlet body 22
The upper surface in dress portion 102.The intermediate barrier 23 is installed on 22 middle position of upper outlet body from the bottom to top and backward.The lower cover
Body 22 is covered on 21 lower section of upper outlet body from the bottom to top.Lower cover 22 described in the design cover insulating body 10 to insert
The portion lower surface in portion 101.1172 lower surface of core insert part of the first end submodule group 11 and second end submodule group 12 and by
Five insulation sheet bodies 1311 are superimposed the downward exposing (ginseng of resigning mouthful 1022 for forming lower surface from the mounting portion 102 of insulation division
Fig. 6), the metal base plate 3 is covered on the lower surface position of insulating body 10.The terminal of the third terminal component 131 docks
The inserting foot 1143 of portion 1303 and earthing member 114 passes through the metal base plate 3 and protrudes out to 3 lower position of metal base plate.Originally it sets
In meter, since each terminal of first end submodule group 11 and second end submodule group 12 is designed to connect with cable 5.Therefore it is connecting
The lower surface of device assembly 1 is only laid out inserting for the terminal docking section 1303 and earthing member 114 for having each terminal of third terminal component 131
Pin 1143, and position Relatively centralized, therefore other positions of the lower surface of connector assembly 1 are shielded by metal base plate 3
Ground connection is covered, shield effectiveness can be further ensured that and be promoted, is conducive to improve high frequency performance.
Certainly, in other embodiments, the metal base plate 3, which can also design, is in and 22 one of lower cover.
It please refers to shown in Fig. 3 and Fig. 4, the two sides of the metal base plate 3 and metal cap 2, which buckle, to be fixed.The high speed connection
The back-end location of device mould group 100 is from top to bottom formed through several pin holes 1004.The pin hole 1004 includes upper and lower
To through 21 back-end location of upper outlet body, front pedestal 14 and metal base plate 3 rear pin hole and up and down direction through upper outlet body 21, absolutely
Edge ontology 10,142 front position of epipleural of front pedestal 14 and the preceding pin hole of metal base plate 3.The high speed connector mould group
100 further include having several pins 7 (or rivet).The pin 7 pass through pin hole 1004 and by metal cap 2, front pedestal 14, metal
Bottom plate 3 and 10 one of insulating body are fixed, to guarantee the overall structure stability of high speed connector mould group 100.So that high
It is that will not damage deformation that fast connector mould group 100, which is able to bear bigger contact engaging and separating force,.In the design, the pin hole 1004 is specific
Positioned at the rear end sides position of connector assembly 1.
It please refers to shown in Fig. 1 and Fig. 2, the radiating module 4 includes heat sink 41 and heat dissipation guide post 42.The heat sink 41
Assembling is fixed to 21 top position of upper outlet body, and 42 rear end of heat dissipation guide post is connected to 14 rear end face of front pedestal, and radiate guide post 42
Front end with the specific structure of electronic equipment for connecting.In the design, 21 table of upper outlet body of the heat dissipation guide post 42 and metal cap 2
Face paste is closed.The heat dissipation guide post 42 is used for the heat derives in front pedestal 14, and passes through the specific structure with electronic equipment
The heat sinking function of multichannel is realized in connection.
It should be noted that being in by metal plate in the plate of left and right directions by the design of several non-high-speed terminals 130 in the design
The thick stamped formation (blanking type terminal) in direction, and several high-speed terminals 1151,1152 are designed to by metal plate in upper and lower
To plate thickness direction formed through bending.It can so make have the combination of more Design of Signal (between such as between each terminal group
Away from, thickness etc.), the characteristic impedance between terminal pair can be made to regulate and control to become to be more easier and diversification.In addition, can disappear
Except stub effect.Be conducive to the whole high frequency characteristics of high speed connector mould group 100.
The manufacturing method thereof of the design high speed connector mould group 100 is described in detail below with reference to Fig. 1 to Figure 19, including walks as follows
It is rapid:
A, insulating body 1 is formed through injection molding by hot melt insulating materials；
B, several pairs of non-high-speed terminals 130 are formed by metal plate blanking bending, by hot melt insulating materials through being molded
It, will be described in five by jig in forming insulation sheet body 1311 on each pair of non-high-speed terminal 130 and forming third terminal component 131
Third terminal component 131 stacks form third terminal mould group 13 in left-right direction；
C, high-speed terminal 1151 and several lower high-speed terminals 1152 on several are made by the stamped bending of metal plate；
A, it is molded by hot melt insulating materials in the upper insulating part 1161 of formation on a row seven upper high-speed terminals 1151,
Cable 5 is provided and cable 5 and a row seven upper 1151 rear ends of high-speed terminal are welded and fixed, in upper 1161 rear of insulating part
Injection molding forms module 1171 in upper and forms upper high-speed terminal component 1131；
B, the insulating part 1162 under being formed on seven lower high-speed terminals 1152 of a row is molded by hot melt insulating materials,
Cable 5 is provided and cable 5 and a row seven lower 1152 rear ends of high-speed terminal are welded and fixed, in lower 1162 rear of insulating part
Injection molding forms core insert part 1172 and forms lower high-speed terminal component 1132；
C, by conductive plastic formed conductive plate 111, by the stamped bending of metal plate formed upper ground strip 1121 and under
Ground strip 1122.
D, by the upper high-speed terminal component 1131 formed in step a, b, c, lower high-speed terminal component 1132, conductive plate 111,
Upper ground strip 1121 and lower ground strip 1122 stack along the vertical direction, from top to bottom successively are as follows: upper high-speed terminal component 1131, on
Ground strip 1121, conductive plate 111, lower ground strip 1122 and lower high-speed terminal component 1132, and form first end submodule group 11.
D, second end submodule group 12 is made in the C that repeats the above steps.
E, the third terminal mould group 13 made of step B is inserted into insulating body 1 from the front to the back.
F, the first end submodule group 11 made of step C is inserted into insulating body 1 from the front to the back.
G, the second end submodule group 12 made of step D is inserted into insulating body 1 from the front to the back.
H, earthing member 114 is made by the stamped bending of metal plate, and two earthing members 114 is respectively corresponded into insertion
12 back-end location of first end submodule group 11 and second end submodule group.
I, front pedestal 14 is made by powder metallurgy, on the basis of step H, the front pedestal 14 is assembled from the front to the back
To insulating body 1, moulding 15 is formed by being molded between the insulating body 1 and front pedestal 14, and the company of being formed
Connect device assembly 1.
J, formed by step I two connector assemblies 1 are arranged side by side, pressing and bending shape is passed through by metalwork
At upper outlet body 21, lower cover 22 and intermediate barrier 23, upper outlet body 21, lower cover 22 and intermediate barrier 23 are assembled to two respectively
The connector assembly 1.
K, metal base plate 3 is formed by pressing and bending by metalwork, on the basis of step J, by the metal base plate 3
It is assembled to the lower surface of two connector assemblies 1.
L, radiating module 4 is provided the radiating module 4 is assembled on metal cap 2 on the basis of step K.
M, several pins 7 are provided, on the basis of step K or step L, by the pin 7 by metal cap 2, back seat
Body 14, metal base plate 3 and 10 one of insulating body are fixed, form final high speed connector mould group 100.
It should be noted that third terminal mould group 13 or so, which stacks, to be formed, 11 He of first end submodule group in the design
Second end submodule group 12 stacks to be formed through up and down direction.So that first end submodule group 11, second end submodule group 12 and third terminal
Structure cooperation between mould group 13 is respective is more stable, while also having dispersed to insulating body 10 with combined stress.Furthermore also advantageous
The assembling of first end submodule group 11, second end submodule group 12 and third terminal mould group 13 is positioned in jig.
The above examples are only used to illustrate the technical scheme of the present invention and are not limiting, although referring to preferred embodiment to this hair
It is bright to be described in detail, those skilled in the art should understand that, it can modify to technical solution of the present invention
Or equivalent replacement, without departing from the spirit and scope of the technical solution of the present invention.
Claims (10)
1. a kind of manufacturing method thereof of high speed connector mould group, characterized by the following steps:
A, insulating body is made by insulating materials,
The insulating body is formed with the grafting space for one docking connector of grafting and forms interface in front end, described exhausted
Edge ontology rear end forms adapted space, and the adapted space front end is connected to grafting space, and the adapted space rear end is through exhausted
The rear end face of edge ontology；
B, several pairs of non-high-speed terminals are made by metal plate, are molded on each pair of non-high-speed terminal by insulating materials
Insulation sheet body and composition third terminal component are formed, is stacked several described third terminal components in left-right direction by jig
Form third terminal mould group；
C, the upper high-speed terminal and lower high-speed terminal that several are in row setting are made by metal plate；
A, a row is molded in by insulating materials and forms upper insulating part on several on high-speed terminal, and form upper high speed
Terminal assemblies, a row include at least a ground terminal on several in high-speed terminal；
B, it is molded on several lower high-speed terminals of a row by insulating materials and forms lower insulating part, and form lower high speed
Terminal assemblies, a row several descend to include at least a ground terminal in high-speed terminals；
C, it will be stacked along the vertical direction by formed in step a, b upper high-speed terminal component, lower high-speed terminal component, and formed
First end submodule group；
D, second end submodule group is made in the C that repeats the above steps；
E, third terminal mould group made of step B is inserted into from the front to the back in the adapted space of insulating body, it will be made of step C
First end submodule group is inserted into from the front to the back in the adapted space of insulating body, by second end submodule group made of step D by backward
In the adapted space of preceding insertion insulating body.
2. a kind of manufacturing method thereof of high speed connector mould group as described in claim 1, it is characterised in that: in the basis of step E
On, it further include step F, earthing member is made by metal plate in step F, and two earthing members are respectively corresponded insertion first end
Submodule group and second end submodule group back-end location,
The earthing member be held in the correspondence of the first end submodule group and second end submodule group high-speed terminal component and under
Between high-speed terminal component, the earthing member is directly or indirectly overlapped with corresponding ground terminal, and the earthing member extends shape
At the inserting foot having for docking circuit board contacts with one.
3. a kind of manufacturing method thereof of high speed connector mould group as described in claim 1, it is characterised in that: in the step a of step C
In, it further include that cable is provided and cable and a row are welded and fixed high-speed terminal rear end on several, after the upper insulating part
End forms upper interior module through injection molding or encapsulating, the upper insulating part, a row several upper high-speed terminals, correspondence cable and
The step of high-speed terminal component is collectively formed in module in upper.
4. a kind of manufacturing method thereof of high speed connector mould group as described in claim 1, it is characterised in that: in the step b of step C
In, further include offer cable and several lower high-speed terminal rear ends are welded and fixed by cable and a row, after the lower insulating part
End forms core insert part through injection molding or encapsulating, the lower insulating part, a row several lower high-speed terminals, corresponding cable and
The step of lower high-speed terminal component is collectively formed in core insert part.
5. a kind of manufacturing method thereof of high speed connector mould group as described in claim 1, it is characterised in that: in the step c of step C
In, further include by metal plate formed ground strip, and with the upper high-speed terminal component and lower high-speed terminal component vertically side
To stacking, it is from top to bottom followed successively by high-speed terminal component, ground strip and lower high-speed terminal component, and form first end submodule
Group, the ground strip and the ground terminal contact in the corresponding upper high-speed terminal and lower high-speed terminal.
6. a kind of manufacturing method thereof of high speed connector mould group as claimed in claim 5, it is characterised in that: the ground strip includes
Have upper ground strip and lower ground strip, in the step c of step C, further include by conductive plastic formed conductive plate, and with it is described on
High-speed terminal component, lower high-speed terminal component, upper ground strip and lower ground strip stack along the vertical direction, are from top to bottom followed successively by
High-speed terminal component, upper ground strip, conductive plate, lower ground strip and lower high-speed terminal component, and form first end submodule group, institute
It states ground strip and lower ground strip and corresponding conductive plate is in electrical contact, the earthing member is held between described two ground strips
And it is located at conductive plate rear position.
7. a kind of manufacturing method thereof of high speed connector mould group as claimed in claim 2, it is characterised in that: in the basis of step F
On, it further include step G, step G is that front pedestal is made by powder metallurgy, and the front pedestal is assembled to insulation from the front to the back originally
Body forms moulding by being molded between the insulating body and front pedestal, and forms connector assembly.
8. a kind of manufacturing method thereof of high speed connector mould group as claimed in claim 7, it is characterised in that: on the basis of G, also
It is that metal cap is made by metalwork including step H, step H, the metal cap is assembled to and connects device assembly periphery.
9. a kind of manufacturing method thereof of high speed connector mould group as claimed in claim 8, it is characterised in that: on the basis of H also
Including step I, step I is that metal base plate is made by metalwork, and the metal base plate is assembled to the connector assembly
Lower surface provides several pins, by the pin that metal cap, front pedestal, metal base plate and insulating body is integrally fixed, mentions
For radiating module, the radiating module is assembled on metal cap.
10. a kind of high speed connector mould group, it is characterised in that: including by described in any one of claim 1 to 9 as above
High speed connector mould group manufacturing method thereof made of high speed connector mould group, each non-high-speed end in the third terminal component
Attached bag includes the terminal docking section for extending that each insulating trip is external and is exposed to outside the lower surface of the insulating body downwards, described
Terminal docking section is used for and docks circuit board and be directly connected to.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811320704.1A CN109256634B (en) | 2018-11-07 | 2018-11-07 | High-speed connector module and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811320704.1A CN109256634B (en) | 2018-11-07 | 2018-11-07 | High-speed connector module and manufacturing method thereof |
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| CN109256634B CN109256634B (en) | 2023-11-14 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4202519A1 (en) * | 2021-12-27 | 2023-06-28 | James Cheng Lee | High-frequency high-speed transmission cable module and upper cover of the cover body thereof |
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| CN203660181U (en) * | 2013-12-12 | 2014-06-18 | 凡甲电子(苏州)有限公司 | Electric connector combination |
| CN206532912U (en) * | 2016-12-08 | 2017-09-29 | 番禺得意精密电子工业有限公司 | Electric connector |
| CN106450909A (en) * | 2016-12-14 | 2017-02-22 | 昆山嘉华电子有限公司 | Electrical connector |
| CN207124312U (en) * | 2017-01-24 | 2018-03-20 | 番禺得意精密电子工业有限公司 | Micro coaxial cable connector assembly |
| CN207925746U (en) * | 2017-12-25 | 2018-09-28 | 富誉电子科技（淮安）有限公司 | Electric connector |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4202519A1 (en) * | 2021-12-27 | 2023-06-28 | James Cheng Lee | High-frequency high-speed transmission cable module and upper cover of the cover body thereof |
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| CN109256634B (en) | 2023-11-14 |
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