CN109254852B - Data processing equipment and method - Google Patents
Data processing equipment and method Download PDFInfo
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- CN109254852B CN109254852B CN201811546270.7A CN201811546270A CN109254852B CN 109254852 B CN109254852 B CN 109254852B CN 201811546270 A CN201811546270 A CN 201811546270A CN 109254852 B CN109254852 B CN 109254852B
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- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F9/00—Arrangements for program control, e.g. control units
- G06F9/06—Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
- G06F9/46—Multiprogramming arrangements
- G06F9/50—Allocation of resources, e.g. of the central processing unit [CPU]
- G06F9/5094—Allocation of resources, e.g. of the central processing unit [CPU] where the allocation takes into account power or heat criteria
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Abstract
This disclosure relates to data processing equipment and method, which includes concatenated multiple processing chips and control chip, is provided with temperature sensing component in each processing chip；Control chip is connected to the first order processing chip in multiple processing chips.The control chip is configured as: according to the temperature data of corresponding relationship and target processing chip between preset multiple temperature ranges and target frequency, determining the first temperature range and corresponding first object frequency that multiple processing chips are currently located；According to multiple processing chips current working frequency and first object frequency, judge whether to meet frequency control condition；When meeting frequency control condition, frequency regulating strategy corresponding with frequency control condition is executed.The embodiment of the present disclosure can carry out real-time monitoring to each chip of chain road, adjust the working frequency of each chip in time, improve the performance of entire link, guarantee that whole link safety is effectively run.
Description
Technical field
This disclosure relates to electronic technology field more particularly to a kind of data processing equipment and method.
Background technique
The origin of heat that semiconductor devices generates is in the power consumption of chip, after the temperature of chip is more than node temperature, function
Consumption can correspondingly increase.Supply voltage under the same conditions, the working frequency of chip is higher, and temperature is also higher.When in link
When having one single chip, the main control module in semiconductor devices can be with the working condition of direct regulation and control chip.In the related technology, more
When chip cascade, the working condition of each chip is different, the chip that cannot go to adjustment chain road all by the way of single, this
Sample will cause efficiency waste, or even the case where wafer damage occurs, so that the safety of whole link is poor.
Summary of the invention
In view of this, the work of each chip can be adjusted in time the present disclosure proposes a kind of data processing equipment and method
Working frequency makes the Performance optimization of whole link.
According to the one side of the disclosure, a kind of data processing equipment is provided.Described device includes:
Concatenated multiple processing chips are provided with temperature sensing component in each processing chip；
Chip is controlled, the first order processing chip being connected in the multiple processing chip, the control chip is configured
Are as follows:
The temperature data of the temperature sensing component sensing of target processing chip is obtained, the target processing chip is described more
At least one of a processing chip；
According to the corresponding relationship and the temperature data between preset multiple temperature ranges and target frequency, institute is determined
State the first temperature range and the corresponding first object frequency of first temperature range that multiple processing chips are currently located；
According to the multiple processing chip current working frequency and the first object frequency, judge whether to meet frequency
Rate control condition；
When meeting frequency control condition, frequency regulating strategy corresponding with the frequency control condition is executed.
In one possible implementation, the control chip is also configured to
According to preset multiple working frequencies, each group of the multiple processing chip under each working frequency is obtained respectively
Temperature data；
According to multiple groups temperature data, multiple second temperature sections of the multiple processing chip are determined respectively；
The multiple second temperature section is merged and division is handled, obtains the multiple temperature range,
Wherein, the temperature deviation of each temperature range is greater than or equal to the temperature deviation in each second temperature section.
In one possible implementation, the control chip is also configured to
According to the multiple temperature values chosen from target temperature section, each processing chip is obtained respectively in each temperature value
Under the second target frequency；
According to the second target frequency under the multiple temperature value, determine the multiple processing chip in target temperature section
Interior third target frequency；
According to the multiple temperature range and multiple third target frequencies, pair of multiple temperature ranges and target frequency is determined
It should be related to,
Wherein, the target temperature section is any one in the multiple temperature range, and the multiple temperature value is extremely
It less include temperature maximum, minimum value and the median in the target temperature section.
In one possible implementation, the working frequency and first current according to the multiple processing chip
Target frequency judges whether to meet frequency control condition, comprising:
Difference between the multiple processing chip current working frequency and the first object frequency is greater than or waits
When first threshold, judgement meets first frequency control condition,
Wherein, when meeting frequency control condition, frequency regulating strategy corresponding with the frequency control condition, packet are executed
It includes:
When meeting the first frequency control condition, the working frequency of the multiple processing chip is reduced to described the
One target frequency.
In one possible implementation, the working frequency and first current according to the multiple processing chip
Target frequency judges whether to meet frequency control condition, comprising:
Difference between the current working frequency of the first object frequency and the multiple processing chip is greater than or waits
When second threshold, judgement meets second frequency control condition,
Wherein, when meeting frequency control condition, frequency regulating strategy corresponding with the frequency control condition, packet are executed
It includes:
When meeting the second frequency control condition, the working frequency of the multiple processing chip is increased to described the
One target frequency.
In one possible implementation, the target processing chip is configured as:
When the temperature of target processing chip is greater than or equal to the first preset temperature, the first pre-warning signal is generated；
First pre-warning signal is sent to the control chip.
In one possible implementation, the target processing chip is configured as:
When the temperature of target processing chip is less than or equal to the second preset temperature, the second pre-warning signal is generated；
Second pre-warning signal is sent to the control chip.
In one possible implementation, the temperature range of the multiple temperature range is continuous and is not overlapped.
In another aspect of the present disclosure, a kind of data control method is provided.The method is applied to data processing equipment
Control chip, the data processing equipment further includes concatenated multiple processing chips, and the control chip is connected to described more
The first order in a processing chip handles chip,
The described method includes:
The temperature data of the temperature sensing component sensing of target processing chip is obtained, the target processing chip is described more
At least one of a processing chip；
According to the corresponding relationship and the temperature data between preset multiple temperature ranges and target frequency, institute is determined
State the first temperature range and the corresponding first object frequency of first temperature range that multiple processing chips are currently located；
According to the multiple processing chip current working frequency and the first object frequency, judge whether to meet frequency
Rate control condition；
When meeting frequency control condition, frequency regulating strategy corresponding with the frequency control condition is executed.
In one possible implementation, the method also includes:
According to preset multiple working frequencies, each group of the multiple processing chip under each working frequency is obtained respectively
Temperature data；
According to multiple groups temperature data, multiple second temperature sections of the multiple processing chip are determined respectively；
The multiple second temperature section is merged and division is handled, obtains the multiple temperature range,
Wherein, the temperature deviation of each temperature range is greater than or equal to the temperature deviation in each second temperature section.
It include concatenated multiple processing chips according to a kind of data processing equipment of the embodiment of the present disclosure and method, the device
With control chip, it is provided with temperature sensing component in each processing chip, controls chip, is connected to multiple the handled in chips
Coagulation chip.Control chip is configured as: obtaining the temperature data of the temperature sensing component sensing of target processing chip, mesh
Mark processing chip is at least one of multiple processing chips；According to pair between preset multiple temperature ranges and target frequency
It should be related to and temperature data, determine that the first temperature range that multiple processing chips are currently located and the first temperature range are corresponding
First object frequency；According to multiple processing chips current working frequency and first object frequency, judge whether to meet frequency
Control condition；When meeting frequency control condition, frequency regulating strategy corresponding with frequency control condition is executed.The disclosure is implemented
Example can carry out real-time monitoring to each chip of chain road, adjust the working frequency of each chip in time, improve entire link
Performance, while can find chip operation abnormal state in time, guarantee that whole link safety is effectively run.
According to below with reference to the accompanying drawings to detailed description of illustrative embodiments, the other feature and aspect of the disclosure will become
It is clear.
Detailed description of the invention
Comprising in the description and constituting the attached drawing of part of specification and specification together illustrates the disclosure
Exemplary embodiment, feature and aspect, and for explaining the principles of this disclosure.
Fig. 1 shows the block diagram of the data processing equipment according to one embodiment of the disclosure；
Fig. 2 shows the block diagrams for handling chip according to one embodiment of the disclosure；
Fig. 3 shows the flow chart of the data processing method according to one embodiment of the disclosure.
Specific embodiment
Various exemplary embodiments, feature and the aspect of the disclosure are described in detail below with reference to attached drawing.It is identical in attached drawing
Appended drawing reference indicate element functionally identical or similar.Although the various aspects of embodiment are shown in the attached drawings, remove
It non-specifically points out, it is not necessary to attached drawing drawn to scale.
Dedicated word " exemplary " means " being used as example, embodiment or illustrative " herein.Here as " exemplary "
Illustrated any embodiment should not necessarily be construed as preferred or advantageous over other embodiments.
In addition, giving numerous details in specific embodiment below to better illustrate the disclosure.
It will be appreciated by those skilled in the art that without certain details, the disclosure equally be can be implemented.In some instances, for
Method, means, element and circuit well known to those skilled in the art are not described in detail, in order to highlight the purport of the disclosure.
Fig. 1 shows the block diagram of the data processing equipment according to one embodiment of the disclosure.
As shown in Figure 1, data processing equipment includes concatenated multiple processing chips 1 and control chip 2, each processing chip
Temperature sensor (not shown) is provided in 1, control chip 2 is connected to the first order processing chip of multiple processing chips 1, control
Chip is configured as: obtaining the temperature data of the temperature sensing component sensing of target processing chip, it is multiple that target, which handles chip,
Handle at least one of chip 1；According to the corresponding relationship and temperature between preset multiple temperature ranges and target frequency
Data determine the first temperature range and the corresponding first object frequency of the first temperature range that multiple processing chips are currently located；
According to multiple processing chips current working frequency and first object frequency, judge whether to meet frequency control condition；Full
When sufficient frequency control condition, frequency regulating strategy corresponding with frequency control condition is executed.
In accordance with an embodiment of the present disclosure, data processing equipment can carry out real-time monitoring to each chip of chain road, and
When adjust the working frequency of each chip, improve the performance of entire link, while can find chip operation abnormal state in time,
Guarantee that whole link safety is effectively run.
In the present embodiment, multiple processing chips can be big calculation power chip, be applied to the cascade processing system of multi-chip.
Multiple processing chips for example can be applied in cloud computing and artificial intelligence (AI), and the disclosure does not make the concrete type of processing chip
Limitation.
Fig. 2 shows the block diagrams for handling chip according to one embodiment of the disclosure.As shown in Fig. 2, being arranged inside processing chip 1
There is temperature sensing component 3.Temperature sensing component 3 can be temperature sensor, can also be the device of other sensing temperatures, this public affairs
It opens to this with no restriction.
In one possible implementation, control chip 2 manages multiple processing chips 1 for controlling.During operation,
Real-time monitoring can be carried out to each chip in chain road by controlling chip 2, adjust the working frequency of each chip.
In one possible implementation, control chip is configured as:
According to preset multiple working frequencies, each group temperature of multiple processing chips under each working frequency is obtained respectively
Data；
According to multiple groups temperature data, multiple second temperature sections of multiple processing chips are determined respectively；
Multiple second temperature sections are merged and division is handled, obtain multiple temperature ranges,
Wherein, the temperature deviation of each temperature range is greater than or equal to the temperature deviation in each second temperature section.
In this implementation, there is different chips (Chip) on link (chain), since many reasons such as chip is raw
At otherness, internal data overturning rate (toggle rate), the distance of discrete Hot-air fan etc. can all lead to their work temperature
It spends different.Chain road has deviation from preceding face to subsequent chip temperature, needs to go to adjust according to this temperature deviation range
The working frequency of link.
For example, have n chip on link as shown in Figure 1 (chain), respectively with Chip1, Chip2,
Chip3 ... Chipn is indicated, can configure initial operating frequency, is obtained temperature value of the n chip under initial operating frequency, is obtained
A temperature difference range out；Increase working frequency, obtains the temperature value of the chip of chain road n under the working frequency, then obtain one
Deviation range；And so on, increase frequency step by step, the temperature deviation model for the vertical n chip in whole chain road that can test and assess
It encloses.
For example, control chip can be with predeterminated frequency f1=100M、f2=300M、f3=500M.It is false in link as shown in Figure 1
If the chain road chip number is 3, i.e. n=3, then processing chip Chip can be obtained1、Chip2、Chip3In each working frequency f1、
f2、f3Each group temperature data when work.For example, processing chip Chip1、Chip2、Chip3In f1Temperature data is distinguished when work
Correspond to T1 1=25℃、T1 2=28℃、T1 3=26 DEG C, T1 1、T1 2、T1 3Constitute T1Temperature data group；In f2Temperature data point when work
T is not corresponded to2 1=37℃、T2 2=40℃、T2 3=45 DEG C, T2 1、T2 2、T2 3Constitute T2Temperature data group；In f3Temperature data when work
It respectively corresponds as T3 1=43℃、T3 2=47℃、T3 3=52 DEG C, T3 1、T3 2、T3 3Constitute T3Temperature data group.It can be according to actual circuit
Functional requirement is to number of links, and the quantity and preset multiple working frequencies of chip are configured in each of the links, the disclosure pair
This is with no restriction.
In this implementation, according to multiple groups temperature data T1、T2、T3, multiple the of multiple processing chips can be determined respectively
Two temperature ranges, such as temperature data group T1Determining second temperature section is [25 DEG C, 28 DEG C], temperature data group T2Determining
Second temperature section is [37 DEG C, 45 DEG C], temperature data group T3Determining second temperature section is [43 DEG C, 52 DEG C].It is multiple
Second temperature might have lap between section, it is also possible to have a discontinuous part, such as second temperature section [25 DEG C,
28 DEG C] and [35 DEG C, 45 DEG C] are discontinuously, and [35 DEG C, 45 DEG C] and [43 DEG C, 52 DEG C] have lap.
In this implementation, can to multiple second temperature sections [25 DEG C, 28 DEG C], [37 DEG C, 45 DEG C] and [43 DEG C,
52 DEG C] processing is merged, it obtains overall temperature range [25 DEG C, 52 DEG C], and overall temperature range divide and is obtained
Multiple temperature ranges [25 DEG C, 34 DEG C), [34 DEG C, 43 DEG C) and [43 DEG C, 52 DEG C].It can be according to chip work in physical link
Need to divide second temperature section, the disclosure to this with no restriction.
In one possible implementation, the temperature range of multiple temperature ranges is continuous and is not overlapped.
In this implementation, multiple temperature ranges [25 DEG C, 34 DEG C), [34 DEG C, 43 DEG C) and [43 DEG C, 52 DEG C] even
Continue and be not overlapped, and the temperature deviation of multiple temperature ranges is greater than or equal to the temperature deviation in each second temperature section, it is multiple
The temperature deviation of temperature range is 9 DEG C, second temperature section [25 DEG C, 28 DEG C], [37 DEG C, 45 DEG C] and [43 DEG C, 52 DEG C]
Temperature deviation is respectively 3 DEG C, 8 DEG C and 9 DEG C.
It is further evaluation link bulk temperature feelings by the above-mentioned means, multiple temperature ranges (temperature gear) can be obtained
Condition and execution frequency regulating strategy provide data reference.
In one possible implementation, after determining multiple temperature ranges (temperature gear), control chip can pass through
The temperature data of one or several chips in multiple processing chips of chain road is obtained, only to assess the bulk temperature feelings of link
Condition.
For example, control chip can obtain the temperature data of the target processing chip in multiple processing chips.The target
Handling chip is at least one of multiple processing chips.If target processing chip is some in multiple processing chips
The temperature data of the chip then can be read directly in chip；If target processing chip is that certain multiple handled in chips are several
Chip (segment chip), then can temperature data averaged to these chips, using the average value as obtained temperature
Data.The disclosure seeks mode to the temperature data when quantity and target processing chip of target processing chip are multiple
With no restriction.
In one possible implementation, control chip is configured as:
According to the multiple temperature values chosen from target temperature section, each processing chip is obtained respectively in each temperature value
Under the second target frequency；
According to the second target frequency under multiple temperature values, third of multiple processing chips in target temperature section is determined
Target frequency；
According to multiple temperature ranges and multiple third target frequencies, determines that multiple temperature ranges are corresponding with target frequency and close
System,
Wherein, target temperature section is any one in multiple temperature ranges, and multiple temperature values include at least target temperature
Spend temperature maximum, minimum value and the median in section.
In this implementation, select arbitrary temp section as target temperature section from multiple temperature ranges, such as
The target temperature section of selection is [25 DEG C, 34 DEG C].Multiple temperature values are selected from the section, multiple temperature values include at least
Temperature maximum, minimum value and the median in the target temperature section, such as 25 DEG C, 29 DEG C and 34 DEG C three temperature values of selection,
Temperature value is chosen according to physical link need of work, the disclosure to this with no restriction.
In this implementation, the second target frequency can indicate highest energy efficiency of the processing chip under some temperature value than frequency
Rate, wherein Energy Efficiency Ratio is the working frequency of link or chip and the ratio of power.Can measured in advance chain road multiple processing cores
The second target frequency of piece at different temperatures, the disclosure to the specific mensuration mode of the second target frequency with no restriction.
In this implementation, it can for example inquire and obtain Chip1、Chip2、Chip3In 25 DEG C of temperature value of the second target frequency
Rate is respectively 100M, 120M and 150M；Inquiry obtains Chip1、Chip2、Chip3In 29 DEG C of second target frequency difference of temperature value
For 200M, 230M and 250M；Inquiry obtains Chip1、Chip2、Chip3It is 230M, 250M in 34 DEG C of second target frequency of temperature value
And 270M.
In one possible implementation, according to the second target frequency under multiple temperature values, multiple processing cores are determined
Piece is in target temperature section ([25 DEG C, 34 DEG C)) in third target frequency.For example, can be by multiple processing chips in target
Temperature range ([25 DEG C, 34 DEG C)) in all third target frequencies be averaged, obtain third target frequency 200M.It can be with
Third target frequency is obtained by calculation methods such as average values, third target frequency can also directly be estimated by practical experience,
The disclosure to this with no restriction.
In one possible implementation, using the above method to other target temperature sections ([34 DEG C, 43 DEG C)
[43 DEG C, 52 DEG C]) similarly operated, it obtains third target frequency (such as 350M and 450M).
In one possible implementation, according to temperature range ([25 DEG C, 34 DEG C), [34 DEG C, 43 DEG C) and [43 DEG C,
52 DEG C]) and its corresponding third target frequency (200M, 350M and 450M), determine pair of multiple temperature ranges and target frequency
It should be related to, it be 200M that corresponding relationship, which can be the corresponding target frequency of temperature range ([25 DEG C, 34 DEG C), [34 DEG C, 43 DEG C) correspondence mesh
Mark frequency is 350M, and [43 DEG C, 52 DEG C] corresponding target frequencies are 450M.
By the above-mentioned means, the corresponding target frequency in different temperatures section where obtaining multiple processing chip temperature data
Rate, to adjust the frequency values of multiple processing chips so that whole link reaches target Energy Efficiency Ratio and provides data reference.Wherein efficiency
Than being the working frequency of link or chip and the ratio of power.
In one possible implementation, control chip can be according between preset multiple temperature ranges and target frequency
Corresponding relationship and temperature data, determine multiple processing chips the first temperature ranges and the first temperature range pair that are currently located
The first object frequency answered.
In this implementation, if the working frequency of multiple processing chips is 150M, the temperature data for obtaining Chip1 is
27 DEG C, then can determine it is multiple processing chips where the first temperature range be [25 DEG C, 34 DEG C).According to the first temperature range
With the corresponding relationship of target frequency, it can determine that the first object frequency of multiple processing chips is 200M.It can be according to practical chain
Road situation selection chip be monitored, the disclosure to this with no restriction.
By the above-mentioned means, determining that target frequency provides reference data for adjustment antenna efficiency frequency, to reach target
Efficiency improves Energy Efficiency Ratio.
In one possible implementation, according to the current working frequency of multiple processing chips and first object frequency
Rate judges whether to meet frequency control condition, comprising:
Difference between multiple processing chips current working frequency and first object frequency is greater than or equal to the first threshold
When value, judgement meets first frequency control condition,
Wherein, when meeting frequency control condition, frequency regulating strategy corresponding with frequency control condition is executed, comprising:
When meeting first frequency control condition, the working frequency of multiple processing chips is reduced to first object frequency.
In this implementation, if multiple current working frequencies of chip that handle are 230M, the temperature number of Chip3 is obtained
According to being 33 DEG C, then can determine it is multiple processing chips where the first temperature range be [25 DEG C, 34 DEG C).According to the first temperature
The corresponding relationship in section and target frequency can determine that the first object frequency of multiple processing chips is 200M.If multiple places
The first threshold for managing the difference between chip current working frequency and first object frequency is 10M, then multiple processing chips
When difference (30M) between current working frequency (230M) and first object frequency (200M) is greater than first threshold (10M).This
When, determination meets first frequency control condition, the working frequency of multiple processing chips can be reduced to first object frequency
(200M).
In that case, working frequency is higher than first object frequency, and current Energy Efficiency Ratio is lower than target Energy Efficiency Ratio, can make
It is wasted at efficiency, efficiency can be saved by the way of the working efficiency for reducing multiple processing chips, while guaranteeing entire chain
The safety on road.
Can determine first threshold according to the performance of actual chips and the demand of link, the disclosure to this with no restriction.
In one possible implementation, according to the current working frequency of multiple processing chips and first object frequency
Rate judges whether to meet frequency control condition, comprising:
Difference between the current working frequency of first object frequency and multiple processing chips is greater than or equal to the second threshold
When value, judgement meets second frequency control condition,
Wherein, when meeting frequency control condition, frequency regulating strategy corresponding with frequency control condition is executed, comprising:
When meeting second frequency control condition, the working frequency of multiple processing chips is increased to first object frequency.
In this implementation, if multiple current working frequencies of chip that handle are 150M, the temperature number of Chip1 is obtained
According to being 27 DEG C, then can determine it is multiple processing chips where the first temperature range be [25 DEG C, 34 DEG C).According to the first temperature
The corresponding relationship in section and target frequency can determine that the first object frequency of multiple processing chips is 200M.If multiple places
The first threshold for managing the difference between chip current working frequency and first object frequency is 10M, then first object frequency
When difference (50M) between the current working frequency (150M) of (200M) and multiple processing chips is greater than second threshold (10M).This
When, determination meets second frequency control condition, the working frequency of multiple processing chips can be increased to first object frequency
(200M).
In this case, working frequency is lower than first object frequency, and current Energy Efficiency Ratio is less than target Energy Efficiency Ratio, can adopt
Efficiency is saved with the mode for the working efficiency for improving multiple processing chips, while guaranteeing the safety of entire link.
It should be appreciated that can determine second threshold according to the performance of actual chips and the demand of link, the disclosure to this not
It is restricted.
In accordance with an embodiment of the present disclosure, each processing chip of chain road may make to support the function of high-low temperature pre-warning.
In one possible implementation, target processing chip is configured as:
When the temperature of target processing chip is greater than or equal to the first preset temperature, the first pre-warning signal is generated；
The first pre-warning signal is sent to control chip.
In this implementation, each processing chip can be supported to be greater than or equal to first in advance when the temperature of processing chip
If when temperature, generating and issuing the first pre-warning signal (high temperature warning interrupt) to control chip, avoiding chip temperature is more than temperature
Tolerance value is burned out.Wherein, the first pre-warning signal can be preset Serial No..First preset temperature can such as value
Be 60 DEG C, the disclosure to the specific value of the first preset temperature with no restriction.
In one possible implementation, target processing chip is configured as:
When the temperature of target processing chip is less than or equal to the second preset temperature, the second pre-warning signal is generated；
The second pre-warning signal is sent to control chip.
In this implementation, each processing chip can be supported to be less than or equal to second in advance when the temperature of processing chip
If when temperature, generating and sending the second pre-warning signal (low temperature warning interrupt) to control chip.Second pre-warning signal can be pre-
The Serial No. first set.Second preset temperature can for example value be 10 DEG C, specific value of the disclosure to the second preset temperature
With no restriction.
By the above-mentioned means, control chip can not have to the temperature for removing to monitor each chip in real time, it only need to be pre- according to first
Alert signal or the second pre-warning signal carry out the work of interrupt processing chip, substantially increase control efficiency and safety.
According to the data processing equipment and method of the embodiment of the present disclosure, in multiple chip cascades, to whole link
Carry out the temperature deviation assessment of temperature monitoring and link；A balanced working frequency is adapted to each chip again, reaches whole
The optimization efficiency ratio of a link；Each chip setting high temperature early warning and low temperature modes of warning, carry out each chip of automatic feedback
Working condition improves the job security and stability of whole link.
Fig. 3 shows the flow chart of the data processing method according to one embodiment of the disclosure.
In one possible implementation, this method is applied to the control chip of data processing equipment, data processing dress
Setting further includes concatenated multiple processing chips, and control chip is connected to the first order processing chip in multiple processing chips,
The method comprising the steps of S11 to step S14:
In step s 11, the temperature data of the temperature sensing component sensing of target processing chip is obtained, target handles chip
It is at least one of multiple processing chips；
In step s 12, according to the corresponding relationship and temperature number between preset multiple temperature ranges and target frequency
According to determining multiple processing chips the first temperature ranges and the corresponding first object frequency of the first temperature range that are currently located；
In step s 13, the working frequency and first object frequency current according to multiple processing chips, judge whether full
Sufficient frequency control condition；
In step S14, when meeting frequency control condition, executes frequency corresponding with frequency control condition and regulate and control plan
Slightly.
In one possible implementation, this method further include:
According to preset multiple working frequencies, each group temperature of multiple processing chips under each working frequency is obtained respectively
Data；
According to multiple groups temperature data, multiple second temperature sections of multiple processing chips are determined respectively；
Multiple second temperature sections are merged and division is handled, obtain multiple temperature ranges,
Wherein, the temperature deviation of each temperature range is greater than or equal to the temperature deviation in each second temperature section.
In this way, timely monitor can be carried out to each chip on cascaded link, adjusts each chip in time
Working frequency, so that the performance of entire link is reached target value.
It should be noted that although describing data processing equipment and method, ability using above-described embodiment as example
Field technique personnel it is understood that the disclosure answer it is without being limited thereto.In fact, user can answer completely according to personal preference and/or actually
Each step is flexibly set with scene, as long as meeting the technical solution of the disclosure.
The presently disclosed embodiments is described above, above description is exemplary, and non-exclusive, and
It is not limited to disclosed each embodiment.Without departing from the scope and spirit of illustrated each embodiment, for this skill
Many modifications and changes are obvious for the those of ordinary skill in art field.The selection of term used herein, purport
In the principle, practical application or technological improvement to the technology in market for best explaining each embodiment, or lead this technology
Other those of ordinary skill in domain can understand each embodiment disclosed herein.
Claims (8)
1. a kind of data processing equipment, which is characterized in that described device includes:
Concatenated multiple processing chips are provided with temperature sensing component in each processing chip；
Chip is controlled, the first order processing chip being connected in the multiple processing chip, the control chip is configured as:
The temperature data of the temperature sensing component sensing of target processing chip is obtained, the target processing chip is the multiple place
Manage at least one of chip；
According to the corresponding relationship and the temperature data between preset multiple temperature ranges and target frequency, determine described more
The first temperature range and the corresponding first object frequency of first temperature range that a processing chip is currently located；
According to the multiple processing chip current working frequency and the first object frequency, judge whether to meet frequency tune
Control condition；
When meeting frequency control condition, frequency regulating strategy corresponding with the frequency control condition is executed,
Wherein, the control chip is also configured to
According to preset multiple working frequencies, each group temperature of the multiple processing chip under each working frequency is obtained respectively
Data；
According to multiple groups temperature data, multiple second temperature sections of the multiple processing chip are determined respectively；
The multiple second temperature section is merged and division is handled, obtains the multiple temperature range,
Wherein, the temperature deviation of each temperature range is greater than or equal to the temperature deviation in each second temperature section.
2. the apparatus according to claim 1, which is characterized in that the control chip is also configured to
According to the multiple temperature values chosen from target temperature section, each processing chip is obtained respectively under each temperature value
Second target frequency；
According to the second target frequency under the multiple temperature value, determine the multiple processing chip in target temperature section
Third target frequency；
According to the multiple temperature range and multiple third target frequencies, determines that multiple temperature ranges are corresponding with target frequency and close
System,
Wherein, the target temperature section is any one in the multiple temperature range, and the multiple temperature value at least wraps
Include temperature maximum, minimum value and the median in the target temperature section.
3. the apparatus according to claim 1, which is characterized in that the work frequency current according to the multiple processing chip
Rate and the first object frequency, judge whether to meet frequency control condition, comprising:
Difference between the current working frequency and the first object frequency of the multiple processing chip is greater than or equal to the
When one threshold value, judgement meets first frequency control condition,
Wherein, when meeting frequency control condition, frequency regulating strategy corresponding with the frequency control condition is executed, comprising:
When meeting the first frequency control condition, the working frequency of the multiple processing chip is reduced to first mesh
Mark frequency.
4. the apparatus according to claim 1, which is characterized in that the work frequency current according to the multiple processing chip
Rate and the first object frequency, judge whether to meet frequency control condition, comprising:
Difference between the first object frequency and the current working frequency of the multiple processing chip is greater than or equal to the
When two threshold values, judgement meets second frequency control condition,
Wherein, when meeting frequency control condition, frequency regulating strategy corresponding with the frequency control condition is executed, comprising:
When meeting the second frequency control condition, the working frequency of the multiple processing chip is increased to first mesh
Mark frequency.
5. the apparatus according to claim 1, which is characterized in that the target processing chip is configured as:
When the temperature of target processing chip is greater than or equal to the first preset temperature, the first pre-warning signal is generated；
First pre-warning signal is sent to the control chip.
6. the apparatus according to claim 1, which is characterized in that the target processing chip is configured as:
When the temperature of target processing chip is less than or equal to the second preset temperature, the second pre-warning signal is generated；
Second pre-warning signal is sent to the control chip.
7. the apparatus according to claim 1, which is characterized in that the temperature range of the multiple temperature range is continuous and does not weigh
It is folded.
8. a kind of data processing method, which is characterized in that the method is applied to the control chip of data processing equipment, the number
It further include concatenated multiple processing chips according to processing unit, the control chip is connected to first in the multiple processing chip
Grade processing chip,
The described method includes:
The temperature data of the temperature sensing component sensing of target processing chip is obtained, the target processing chip is the multiple place
Manage at least one of chip；
According to the corresponding relationship and the temperature data between preset multiple temperature ranges and target frequency, determine described more
The first temperature range and the corresponding first object frequency of first temperature range that a processing chip is currently located；
According to the multiple processing chip current working frequency and the first object frequency, judge whether to meet frequency tune
Control condition；
When meeting frequency control condition, frequency regulating strategy corresponding with the frequency control condition is executed,
Wherein, the method also includes:
According to preset multiple working frequencies, each group temperature of the multiple processing chip under each working frequency is obtained respectively
Data；
According to multiple groups temperature data, multiple second temperature sections of the multiple processing chip are determined respectively；
The multiple second temperature section is merged and division is handled, obtains the multiple temperature range,
Wherein, the temperature deviation of each temperature range is greater than or equal to the temperature deviation in each second temperature section.
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| CN114822607B (en) * | 2022-04-01 | 2023-12-12 | 长鑫存储技术有限公司 | Heat dissipation device and computer system |
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