CN109243986B - Multi-chip packaging process - Google Patents
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- CN109243986B CN109243986B CN201810946809.1A CN201810946809A CN109243986B CN 109243986 B CN109243986 B CN 109243986B CN 201810946809 A CN201810946809 A CN 201810946809A CN 109243986 B CN109243986 B CN 109243986B
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 21
- 238000009713 electroplating Methods 0.000 claims abstract description 15
- 238000003466 welding Methods 0.000 claims abstract description 12
- 238000005520 cutting process Methods 0.000 claims abstract description 11
- 238000007639 printing Methods 0.000 claims abstract description 8
- 238000004080 punching Methods 0.000 claims abstract description 8
- 238000000465 moulding Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 54
- 238000003860 storage Methods 0.000 claims description 51
- 238000002360 preparation method Methods 0.000 claims description 36
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 30
- 230000001502 supplementing effect Effects 0.000 claims description 27
- 238000000227 grinding Methods 0.000 claims description 26
- 239000002994 raw material Substances 0.000 claims description 22
- 239000003292 glue Substances 0.000 claims description 20
- 230000007246 mechanism Effects 0.000 claims description 19
- 239000011265 semifinished product Substances 0.000 claims description 18
- 239000000047 product Substances 0.000 claims description 17
- 229910052757 nitrogen Inorganic materials 0.000 claims description 15
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- 238000003756 stirring Methods 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 6
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000005022 packaging material Substances 0.000 claims description 4
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims description 3
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- 230000001070 adhesive effect Effects 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Basic Packing Technique (AREA)
Abstract
The invention provides a multi-chip packaging process. The multi-chip packaging piece solves the technical problems that an existing multi-chip packaging piece does not have a corresponding packaging process, cannot be produced in batches, is low in production speed and the like. The multi-chip packaging process comprises the following steps: a. thinning; b. scribing; c. pasting for one time; d. primary curing; e. secondary pasting; f. secondary curing; g. pressure welding; h. plastic packaging; i. punching and molding; j. removing flash; k. electroplating; l, printing; m, cutting ribs and forming; and n, detecting. The invention has the advantage of rapid production.
Description
Technical Field
The invention belongs to the technical field of chip packaging, relates to a packaging process, and particularly relates to a multi-chip packaging process.
Background
For decades, the integrated circuit packaging technology has been developed following the development of chips, and the packaging density has been continuously increased from single chip packaging to multi-chip packaging, so as to strongly promote the miniaturization and functionalization of electronic information products. The multi-chip display package has many significant advantages such as high density integration and multiple functions, and is the mainstream of the packaging technology of communication semiconductor devices, and is particularly suitable for the fields of flash control, mobile communication, mobile multimedia and the like.
Through retrieval, as disclosed in chinese patent literature, a multi-chip package [ application No.: 201710945679.5, respectively; publication No.: CN 107978581a ]. Such a multi-chip package, the multi-chip package comprising: a package substrate including a first substrate pad; a first group of semiconductor chips stacked on the package substrate, each of the semiconductor chips in the first group including at least one bonding pad; a first stud bump arranged on the bonding pad of the first group of semiconductor chips except for the lowermost semiconductor chip in the first group; a first conductive wiring extending downward from at least one bonding pad of the lowermost semiconductor chip in the first group and connected to the first base pad; and a second conductive wiring extending upward from at least one of the bonding pads of the lowermost semiconductor chip in the first group and sequentially connected to the first stud bump.
Although the multi-chip package disclosed in the patent can reduce the production cost, the multi-chip package does not have a corresponding packaging process, cannot be mass-produced, and has a slow production speed, so it is necessary to design a multi-chip packaging process.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides a multi-chip packaging process which has the characteristic of high production speed.
The purpose of the invention can be realized by the following technical scheme: a multi-chip packaging process is characterized by comprising the following steps: a. thinning: thinning the wafer in a mechanical grinding mode, wherein the final thickness of thinned wafer is 250 and 280 microns; b. scribing: scribing the thinned wafer by a scribing machine; c. once pasting: sticking the first layer of single chip to a base of a lead frame by a chip mounter, wherein the used glue is conductive glue; d. primary curing: putting the semi-finished product after the primary pasting into curing equipment to cure the conductive adhesive; e. secondary pasting: respectively sticking the second layer of the plurality of chips to a bracket of the lead frame by a chip mounter, wherein the used glue is insulating glue; f. secondary curing: putting the semi-finished product after secondary pasting into curing equipment to cure the insulating glue; g. pressure welding: bonding wires to the first layer of chip and the second layer of chip through a wire bonding machine; h. plastic packaging: preparing a plastic packaging material through a preparation device, and plastically packaging the pressure welded semi-finished product through a plastic packaging machine; i. punching and molding; j. removing flash; removing residual glue on the half-finished product after the plastic punching through flash removing equipment; k. electroplating: electroplating the pin of the semi-finished product after the flash is removed by an electroplating device; l, printing; printing the information of the product on the electroplated semi-finished product by a marking machine; m, cutting ribs and forming: cutting the electroplated semi-finished product according to a specified size by a shearing machine to obtain a finished product; n, detection: and (5) carrying out electrical property detection on the finished product through a testing machine.
The mechanical grinding in the step a is divided into two stages: front-section coarse grinding and rear-section fine grinding.
The front section coarse grinding uses a carborundum grinding wheel with the particle diameter of 30-40 mu m, and the rear section fine grinding uses a carborundum grinding wheel with the particle diameter of 4-6 mu m.
And the dicing machine in the step b adopts a DAD651 dicing machine, and the cutting speed is 20-25 mm/s.
The primary curing conditions in the step d are as follows: nitrogen is filled for protection, the curing temperature is 190-210 ℃, and the curing time is 40-80 min.
The secondary curing conditions in the step f are as follows: nitrogen is filled for protection, the curing temperature is 140-160 ℃, and the curing time is 40-80 min.
And g, adopting a low-radian pressure welding process and a high-low arc positive and negative routing mode for pressure welding in the step g, wherein the material of the bonding wire is a gold wire, and the temperature of the bonding wire is 180-210 ℃.
And the plastic package in the step h is glue pouring type plastic package.
And in the step k, electroplating a layer of 6-12 mu m copper, and then electroplating a layer of 12-16 mu m tin.
The curing equipment comprises a base, a curing box is connected to the base through supporting legs, a taking and placing opening is formed in one side of the curing box, a box door capable of sealing the taking and placing opening is hinged to the curing box, an air outlet and a nitrogen input opening are formed in the other side of the curing box, a first electromagnetic valve is arranged at the air outlet, a second electromagnetic valve is arranged at the nitrogen input opening, an electric heating pipe is arranged at the bottom of the curing box, a rotating shaft is vertically arranged in the curing box, the lower end of the rotating shaft extends out of the curing box and is connected with a power mechanism capable of driving the curing box to rotate, a spiral sheet is fixed at the upper end of the rotating shaft, a plurality of placing seats are fixed on the spiral sheet, placing grooves for placing turnover frames are formed in the placing seats, a flow guide mechanism is further arranged on the base and comprises an air conveying pump and an annular, the side part of the air inlet pipe is communicated with one end of the air delivery pump through a first connecting pipe, the other end of the air delivery pump is communicated with the cavity inside the rotating shaft through a second connecting pipe, the second connecting pipe is positioned below the curing box, and the side part at the upper end of the rotating shaft is also provided with a plurality of air outlet holes communicated with the cavity.
The working principle of the curing equipment is as follows: put into the turnover basket with the semi-manufactured goods that need the solidification, put into the turnover frame and place on the seat, open electric heating pipe, it rotates to drive the pivot through power unit, the pivot drives the flight and slowly rotates, and simultaneously, open the gas transmission pump, the cavity department of pivot is carried to the high-temperature gas of solidification bottom of the case portion through the intake pipe, and from gas outlet department from bottom to top horizontal output, and the effect of cooperation flight, make it form the ascending air current of spiral, can make the temperature in the solidification case evenly rise fast, can ensure the solidification quality of product, the solidification is effectual.
And the second connecting pipe is also provided with a one-way valve.
The power mechanism comprises a speed reducing motor, a driving gear and a driven gear, the speed reducing motor is fixed on the base, an output shaft of the speed reducing motor vertically faces upwards, the driving gear is fixed on the output shaft of the speed reducing motor vertically faces upwards, the driven gear is fixed at the lower end of the rotating shaft, and the driven gear is meshed with the driving gear.
By adopting the structure, the speed reduction motor is controlled to drive the driving gear to slowly rotate, the driving gear drives the driven gear to slowly rotate, and the driven gear drives the rotating shaft to slowly rotate.
The curing box is also provided with an insulating layer outside.
The base is fixedly provided with a water tank, one end of the water tank is provided with a water replenishing opening, the other end of the water tank is provided with a water outlet, a first partition plate and a second partition plate are arranged in the water tank, the first partition plate is close to the water replenishing opening, the second partition plate is close to the water outlet, the height of the first partition plate is larger than that of the second partition plate, the first partition plate and the second partition plate separate the water tank into a first water storage part, a second water storage part and a third water storage part, a heat exchange pipe is horizontally arranged in the water tank, the heat exchange pipe penetrates into the water tank from one end of the water tank and penetrates out.
By adopting the structure, water in the water tank can flow along the first water storage part, the second water storage part and the third water storage part in sequence, and high-temperature waste gas in the heat exchange pipe flows along the third water storage part, the second water storage part and the first water storage part in sequence, so that the heat exchange pipe and the water tank can exchange heat better, and heat in the waste gas of the curing box can be fully recovered.
The heat exchange tube is also provided with a radiating fin.
Still have the temperature indication subassembly on the base, the temperature indication subassembly includes controller, temperature sensor and display screen, and the controller is fixed on the base, and temperature sensor sets up in the curing box, and the display screen passes through the mounting panel to be fixed on the curing box, and temperature sensor and display screen pass through the circuit and all link to each other with this controller.
Structure more than adopting, through the temperature in the temperature sensor detectable curing box to give the controller with signal transmission, the temperature in the controller control display screen demonstration curing box, intelligent degree is high.
The device of preparing includes the base, be fixed with the case of preparing on the base, the vertical main shaft that is provided with in case upper portion of preparing, main shaft upper end and one can drive its pivoted power structure and link to each other, the main shaft lower extreme stretches into and prepares the incasement and link to each other with the carousel, be fixed with a plurality of stirring vane on the carousel, the main shaft upper end still is fixed with the mounting disc, be fixed with a plurality of storage hoppers that are used for placing the raw materials on the mounting disc, and the storage hopper is evenly distributed, the storage hopper upper end has the input port, the storage hopper lower extreme has the delivery outlet, delivery outlet department is provided with solenoid valve three, the delivery outlet still is linked together with the inlet pipe upper end, the inlet pipe lower extreme is located and prepares the incasement, the.
The working principle of the preparation device is as follows: the plastic packaging material is prepared by respectively putting various raw materials into corresponding storage hoppers, driving the main shaft to rotate through the power structure, driving the rotary table to rotate through the main shaft, driving the feeding pipe to rotate through the rotary table, opening the third electromagnetic valve, conveying the raw materials in the storage hoppers to all positions of the preparation box from the feeding pipe, and driving the stirring blades to rotate through the rotary table.
The power structure comprises a support, a power motor, a driving wheel, a driven wheel and a belt, wherein the support is fixed on the base, the power motor is fixed on the support, an output shaft of the power motor is vertically downward, the driving wheel is fixed at the end part of the output shaft of the power motor, the driven wheel is fixed at the upper end of the main shaft and is positioned above the storage hopper, and the belt is sleeved between the driving wheel and the driven wheel.
By adopting the structure, the power motor is controlled to drive the driving wheel to rotate, the driving wheel drives the driven wheel to rotate through the belt, and the driven wheel drives the main shaft to rotate.
The base is also provided with a material supplementing mechanism capable of supplementing raw materials into the storage hopper, the material supplementing mechanism comprises a bottom plate, a material supplementing pipe, a first telescopic pipe, a second telescopic pipe and a delivery pump, the bottom plate is fixed on the base, a plurality of placing frames are fixed on the bottom plate, hooks capable of positioning bag openings are arranged on the placing frames, the material supplementing pipe is obliquely fixed on the base through a connecting frame and is positioned between the bottom plate and the configuration box, the lower end of the material supplementing pipe is communicated with the upper end of the first telescopic pipe, the lower end of the first telescopic pipe is connected with a weighting ring, the upper end of the material supplementing pipe is communicated with the upper end of the second telescopic pipe, the lower end of the second telescopic pipe is connected with a lifting ring, the lifting ring can be positioned right above the storage hopper, the lifting ring is also connected with a moving structure capable of driving the lifting ring.
By adopting the structure, various material bags are respectively positioned on the corresponding placing racks, the lower end of the first telescopic pipe is placed into the required material bag, the corresponding storage hopper is positioned under the lifting ring, the lifting ring is driven to move up and down through the moving structure, the lower end of the second telescopic pipe is positioned in the storage hopper, the conveying pump is started, raw materials in the material belt are supplemented into the storage hopper through the material supplementing pipe, and the material supplementing is rapid.
The moving structure comprises an upright post, a guide rail, a sliding block and a push rod motor, the upright post is fixed on the support, the guide rail is vertically fixed on the upright post, the sliding block is arranged on the guide rail, the push rod motor is fixed on the upright post, a push rod of the push rod motor is vertically downward, the end part of the push rod motor is connected with the sliding block, and the lifting ring is connected with the sliding block through a connecting rod.
By adopting the structure, the push rod motor is controlled to drive the sliding block to move up and down, and the sliding block drives the lifting ring to move up and down through the connecting rod.
And a vibration motor is also fixed on the weighting ring.
The preparation box is provided with an observation port, and a transparent observation plate is arranged at the observation port.
By adopting the structure, the abnormity in the preparation box can be rapidly observed through the observation plate, and the observation is visual.
Still be provided with guide mechanism in the preparation incasement, guide mechanism includes a plurality of passage, passage one end is linked together through elasticity pipe and inlet pipe lower extreme, the passage other end is the guide end, and the passage is the level and arranges, the passage lateral part still links to each other with the guide arm lower extreme, guide arm upper end and stopper link to each other, be connected with drive roller on the stopper, the cover is equipped with the guide pin bushing in the middle part of the guide arm, the guide pin bushing passes through the bracing piece and links to each other with the carousel, it is equipped with the spring still to overlap on the guide arm, spring upper end and stopper link to each other, spring lower extreme and guide pin bushing link to each other, preparation case upper portion still has and is irregular wavy guide ring.
By adopting the structure, in the rotating process of the turntable, the driving roller is abutted against different positions of the guide ring, so that the guide rod floats up and down, the guide rod drives the material guide pipe to float up and down, various raw materials in the storage hopper can be conveyed to different height positions of the preparation box, and the auxiliary mixing effect is achieved in the feeding process, so that the required time for preparation can be greatly reduced, and the material guide effect is good.
The guide rod is also fixed with a plurality of pushing pieces which are horizontally arranged.
By adopting the structure, the guide rod drives the pushing piece to float up and down, and the pushing piece can push the raw materials in the preparation box up and down and mix the raw materials.
The cross section of the material guide pipe is in a diamond shape.
By adopting the structure, the raw materials in the preparation box can be pushed to two sides when the material guide pipe floats up and down or rotates.
Compared with the prior art, the multi-chip packaging process has the advantages that: through steps of thinning, scribing, primary pasting, primary curing, secondary pasting, secondary curing, pressure welding, plastic packaging, plastic punching, flash removing, electroplating, printing, rib cutting forming, detecting and the like, the packaging operation of multiple chips can be realized, continuous packaging can be realized, and the production is rapid.
Drawings
Fig. 1 is a schematic step diagram of a packaging process.
Fig. 2 is a schematic plan view of the curing apparatus.
FIG. 3 is a schematic plan view of a curing apparatus with portions broken away.
Fig. 4 is a schematic plan view of the dispensing device.
FIG. 5 is a schematic plan view of a dispensing apparatus with portions broken away.
In the figure, 1, a base; 2. supporting legs; 3. a first connecting pipe; 4. an air delivery pump; 5. a second connecting pipe; 6. a one-way valve; 7. a driven gear; 8. a reduction motor; 9. a driving gear; 10. a controller; 11. a curing box; 11a, a taking and placing port; 11b, an exhaust port; 11c, a nitrogen input port; 12. a placing seat; 12a, placing grooves; 13. a temperature sensor; 14. a second electromagnetic valve; 15. a first electromagnetic valve; 16. a spiral sheet; 17. mounting a plate; 18. a display screen; 19. a rotating shaft; 19a, an air outlet; 20. an air inlet pipe; 20a, an air inlet hole; 21. an electric heating tube; 22. an exhaust fan; 23. a second connecting pipe; 24. a water tank; 24a, a water replenishing port; 24b, a water outlet; 25. a heat exchange tube; 26. a first clapboard; 27. a heat dissipating fin; 28. a second clapboard; 29. connecting a pipe I; 31. a base; 32. preparing a box; 32a, a viewing port; 33. a turntable; 34. a stirring blade; 35. a support; 36. an observation plate; 37. fixing the rod; 38. a feed pipe; 39. a third electromagnetic valve; 40. mounting a disc; 41. a storage hopper; 42. a driving wheel; 43. a power motor; 44. a belt; 45. a driven wheel; 46. a main shaft; 47. a column; 48. a push rod motor; 49. a guide rail; 50. a slider; 51. a connecting rod; 52. a second telescopic pipe; 53. a lifting ring; 54. a delivery pump; 55. a material supplementing pipe; 56. a first telescopic pipe; 57. hooking; 58. a base plate; 59. placing a rack; 60. a weighting ring; 61. a vibration motor; 62. a connecting frame; 63. a discharge pipe; 64. a fourth electromagnetic valve; 65. a guide ring; 66. driving the roller; 67. a limiting block; 68. a spring; 69. a guide sleeve; 70. a support bar; 71. pushing the sheet; 72. a guide bar; 73. an elastic tube; 74. a material guide pipe.
Detailed Description
The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.
As shown in fig. 1, the multi-chip packaging process includes the following steps: a. thinning: thinning the wafer in a mechanical grinding mode, wherein the final thickness of thinned wafer is 250 and 280 microns; in this embodiment, the final thickness of the wafer thinning is 260 μm; b. scribing: scribing the thinned wafer by a scribing machine; c. once pasting: sticking the first layer of single chip to a base of a lead frame by a chip mounter, wherein the used glue is conductive glue; d. primary curing: putting the semi-finished product after the primary pasting into curing equipment to cure the conductive adhesive; e. secondary pasting: respectively sticking the second layer of the plurality of chips to a bracket of the lead frame by a chip mounter, wherein the used glue is insulating glue; in this embodiment, the number of chips in the second layer is four; f. secondary curing: putting the semi-finished product after secondary pasting into curing equipment to cure the insulating glue; g. pressure welding: bonding wires to the first layer of chip and the second layer of chip through a wire bonding machine; h. plastic packaging: preparing a plastic packaging material through a preparation device, and plastically packaging the pressure welded semi-finished product through a plastic packaging machine; in this embodiment, the plastic package material is prepared from commercially available raw materials by a preparation device; i. punching and molding; j. removing flash; removing residual glue on the half-finished product after the plastic punching through flash removing equipment; k. electroplating: electroplating the pin of the semi-finished product after the flash is removed by an electroplating device; l, printing; printing the information of the product on the electroplated semi-finished product by a marking machine; m, cutting ribs and forming: cutting the electroplated semi-finished product according to a specified size by a shearing machine to obtain a finished product; n, detection: and (5) carrying out electrical property detection on the finished product through a testing machine.
The mechanical grinding in step a is divided into two stages: front-section coarse grinding and rear-section fine grinding.
The front section coarse grinding uses a carborundum wheel with the particle diameter of 30-40 mu m, and the rear section fine grinding uses a carborundum wheel with the particle diameter of 4-6 mu m; in this embodiment, the diamond grinding wheel with a particle diameter of 35 μm is used for the front-stage coarse grinding, and the diamond grinding wheel with a particle diameter of 5 μm is used for the rear-stage fine grinding.
The dicing saw in the step b adopts a DAD651 dicing saw, and the cutting speed is 20-25 mm/s; in this example, the cutting speed was 22 mm/s.
The primary curing conditions in step d are as follows: nitrogen is filled for protection, the curing temperature is 190 ℃ and 210 ℃, and the curing time is 40-80 min; in this example, the curing temperature was 200 ℃ and the curing time was 60 min.
The secondary curing conditions in step f are as follows: nitrogen is filled for protection, the curing temperature is 140-; in this example, the curing temperature was 150 ℃ and the curing time was 60 min.
The pressure welding in the step g adopts a low-radian pressure welding process and a high-low arc positive and negative routing mode, the material of the bonding wire is a gold wire, and the temperature of the bonding wire is 180-210 ℃; in the present embodiment, the bonding wire temperature is 190 ℃.
And d, performing plastic packaging in the step h by using glue pouring type plastic packaging.
Electroplating a layer of copper of 6-12 mu m in step k, and then electroplating a layer of tin of 12-16 mu m; in this embodiment, a layer of 8 μm copper is electroplated first, and a layer of 14 μm tin is electroplated later in step k.
The advantages of the invention can be summarized as follows: 1) the multifunctional function is achieved; 2) low power consumption; 3) better performance; 4) lower cost; 5) smaller volume, lighter weight; 6) shorter development cycles.
As shown in fig. 2-3, the curing apparatus includes a base 1, the base 1 is connected with a curing box 11 through a supporting foot 2, one side of the curing box 11 is provided with a taking and placing port 11a, the curing box 11 is hinged with a box door capable of sealing the taking and placing port 11a, the other side of the curing box 11 is provided with an exhaust port 11b and a nitrogen input port 11c, the exhaust port 11b is provided with a first electromagnetic valve 15, the nitrogen input port 11c is provided with a second electromagnetic valve 14, an external nitrogen source can be input into the curing box 11 through the nitrogen input port 11c, and the structure that the nitrogen input port 11c is connected with the nitrogen source adopts the prior art; the bottom of the curing box 11 is provided with an electric heating tube 21, a rotating shaft 19 is vertically arranged in the curing box 11, the lower end of the rotating shaft 19 extends out of the curing box 11 and is connected with a power mechanism capable of driving the curing box to rotate, the upper end of the rotating shaft 19 is fixed with a spiral sheet 16, and in the embodiment, the upper end of the rotating shaft 19 is fixed with the spiral sheet 16 in a welding mode; a plurality of placing seats 12 are fixed on the spiral sheet 16, and in the embodiment, the number of the placing seats 12 is six; the placing seat 12 is provided with a placing groove 12a for placing the turnover frame, the base 1 is further provided with a flow guide mechanism, the flow guide mechanism comprises an air delivery pump 4 and an annular air inlet pipe 20, the air inlet pipe 20 is fixed at the bottom of the curing box 11, the air inlet pipe 20 is positioned above the electric heating pipe 21, the air inlet pipe 20 is provided with a plurality of air inlet holes 20a, and in the embodiment, the number of the air inlet holes 20a is twenty; the lateral part of the air inlet pipe 20 is communicated with one end of the air delivery pump 4 through a first connecting pipe 3, the other end of the air delivery pump 4 is communicated with the cavity inside the rotating shaft 19 through a second connecting pipe 5, the second connecting pipe 5 is positioned below the curing box 11, the lateral part of the upper end of the rotating shaft 19 is further provided with a plurality of air outlet holes 19a communicated with the cavity, and in the embodiment, the number of the air outlet holes 19a is twenty.
The second connecting pipe 5 is also provided with a one-way valve 6.
The power mechanism comprises a speed reducing motor 8, a driving gear 9 and a driven gear 7, wherein the speed reducing motor 8 is fixed on the base 1, and in the embodiment, the speed reducing motor 8 is fixed on the base 1 in a bolt connection mode; the output shaft of the gear motor 8 is vertically upward, the driving gear 9 is fixed on the output shaft of the gear motor 8 and vertically upward, the driven gear 7 is fixed at the lower end of the rotating shaft 19, and the driven gear 7 is meshed with the driving gear 9.
The curing box 11 is also provided with an insulating layer, and in the embodiment, the insulating layer is made of the existing products available in the market.
A water tank 24 is fixed on the base 1, and in the embodiment, the water tank 24 is fixed on the base 1 in a bolt connection mode; one end of the water tank 24 is provided with a water replenishing opening 24a, the other end of the water tank 24 is provided with a water outlet 24b, a first partition plate 26 and a second partition plate 28 are arranged in the water tank 24, the first partition plate 26 is close to the water replenishing opening 24a, the second partition plate 28 is close to the water outlet 24b, the height of the first partition plate 26 is larger than that of the second partition plate 28, the first partition plate 26 and the second partition plate 28 divide the water tank 24 into a first water storage part, a second water storage part and a third water storage part, a heat exchange pipe 25 is horizontally arranged in the water tank 24, the heat exchange pipe 25 penetrates into the water tank 24 from one end and penetrates out of the other end of the water tank 24, one end of the heat.
By adopting the structure, the water in the water tank 24 can flow along the first water storage part, the second water storage part and the third water storage part in sequence, and the high-temperature waste gas in the heat exchange pipe 25 flows along the third water storage part, the second water storage part and the first water storage part in sequence, so that the heat exchange pipe 25 and the water tank 24 can exchange heat better, and the heat in the waste gas of the curing box 11 can be fully recovered.
The heat exchange tubes 25 also have heat radiating fins 27 thereon.
The base 1 is also provided with a temperature indicating assembly, the temperature indicating assembly comprises a controller 10, a temperature sensor 13 and a display screen 18, the controller 10 is fixed on the base 1, the temperature sensor 13 is arranged in the curing box 11, the display screen 18 is fixed on the curing box 11 through an installation plate 17, and the temperature sensor 13 and the display screen 18 are both connected with the controller 10 through circuits; in this embodiment, the controller 10 is a commercially available single chip microcomputer, and the program for controlling the display screen and the sensor by the single chip microcomputer is available, and the program does not need to be edited again.
Adopt this structure, through the temperature in temperature sensor 13 detectable curing box 11 to transmit the signal to controller 10, controller 10 control display screen 18 shows the temperature in curing box 11, and intelligent degree is high.
The working principle of the curing equipment is as follows: put into the turnover basket with the semi-manufactured goods that need the solidification, put into the turnover frame and place on the seat 12, open electric heating pipe 21, control gear motor 8 drives driving gear 9 and slowly rotates, driving gear 9 drives driven gear 7 and slowly rotates, driven gear 7 drives pivot 19 and slowly rotates, pivot 19 drives flight 16 and slowly rotates, and simultaneously, open gas transmission pump 4, carry the cavity department of pivot 19 through intake pipe 20 with the high-temperature gas of solidification box 11 bottom, and from lower to upper horizontal output in venthole 19a department, and cooperate the effect of flight 16, make it form the ascending air current of spiral, can make the temperature in the solidification box 11 rise evenly fast, can ensure the solidification quality of product, the solidification is effectual.
As shown in fig. 4-5, the dispensing device includes a base 31, a dispensing box 32 is fixed on the base 31, and in this embodiment, the dispensing box 32 is fixed on the base 31 by means of bolts; a main shaft 46 is vertically arranged at the upper part of the preparation box 32, the upper end of the main shaft 46 is connected with a power structure capable of driving the main shaft 46 to rotate, the lower end of the main shaft 46 extends into the preparation box 32 and is connected with the turntable 33, a plurality of stirring blades 34 are fixed on the turntable 33, and in the embodiment, the number of the stirring blades 34 is four; the upper end of the main shaft 46 is further fixed with a mounting disc 40, and in the embodiment, the upper end of the main shaft 46 is further fixed with the mounting disc 40 in a welding manner; a plurality of storage hoppers 41 for placing raw materials are fixed on the mounting plate 40, and in the present embodiment, the number of the storage hoppers 41 is six; the storage hoppers 41 are uniformly distributed, the upper ends of the storage hoppers 41 are provided with input ports, the lower ends of the storage hoppers 41 are provided with output ports, the output ports are provided with three electromagnetic valves 39, the output ports are also communicated with the upper ends of the feeding pipes 38, the lower ends of the feeding pipes 38 are positioned in the preparation box 32, the middle parts of the feeding pipes 38 are connected with the rotary table 33 through fixing rods 37, the lower part of the preparation box 32 is connected with a discharging pipe 63, and the discharging pipe 63 is provided with four electromagnetic valves 64.
The power structure comprises a bracket 35, a power motor 43, a driving wheel 42, a driven wheel 45 and a belt 44, wherein the bracket 35 is fixed on the base 31, and in the embodiment, the bracket 35 is fixed on the base 31 in a bolt connection manner; the power motor 43 is fixed on the bracket 35, in the embodiment, the power motor 43 is fixed on the bracket 35 by means of bolt connection; the output shaft of the power motor 43 is vertically downward, the driving wheel 42 is fixed at the end part of the output shaft of the power motor 43, the driven wheel 45 is fixed at the upper end of the main shaft 46, the driven wheel 45 is positioned above the storage hopper 41, and the belt 44 is sleeved between the driving wheel 42 and the driven wheel 45.
The base 31 is further provided with a material supplementing mechanism capable of supplementing raw materials into the storage hopper 41, the material supplementing mechanism comprises a bottom plate 58, a material supplementing pipe 55, a first telescopic pipe 56, a second telescopic pipe 52 and a delivery pump 54, the bottom plate 58 is fixed on the base 31, and in the embodiment, the bottom plate 58 is fixed on the base 31 in a welding manner; a plurality of placing racks 59 are fixed on the bottom plate 58, and in the embodiment, the number of the placing racks 59 is six; the placing frame 59 is provided with a hook 57 capable of positioning the opening of the material bag, the material supplementing pipe 55 is obliquely fixed on the base 31 through a connecting frame 62, the material supplementing pipe 55 is positioned between the bottom plate 58 and the configuration box, the lower end of the material supplementing pipe 55 is communicated with the upper end of a first telescopic pipe 56, the lower end of the first telescopic pipe 56 is connected with a weighting ring 60, the upper end of the material supplementing pipe 55 is communicated with the upper end of a second telescopic pipe 52, the lower end of the second telescopic pipe 52 is connected with a lifting ring 53, the lifting ring 53 can be positioned right above the material storage hopper 41, the lifting ring 53 is also connected with a moving structure capable of driving the lifting ring to move up and down, and the conveying pump 54 is arranged on the.
By adopting the structure, various material bags are respectively positioned on the corresponding placing frames 59, the lower end of the first extension tube 56 is placed into the required material bag, the corresponding storage hopper 41 is positioned under the lifting ring 53, the push rod motor 48 is controlled to drive the slide block 50 to move up and down, the slide block 50 drives the lifting ring 53 to move up and down through the connecting rod 51, the lower end of the second extension tube 52 is positioned in the storage hopper 41, the conveying pump 54 is started, raw materials in the material band are supplemented into the storage hopper 41 through the material supplementing tube 55, and the material supplementing is rapid.
The moving structure comprises a vertical column 47, a guide rail 49, a sliding block 50 and a push rod motor 48, wherein the vertical column 47 is fixed on the bracket 35, and in the embodiment, the vertical column 47 is fixed on the bracket 35 in a bolt connection mode; the guide rail 49 is vertically fixed on the upright post 47, the slide block 50 is arranged on the guide rail 49, the push rod motor 48 is fixed on the upright post 47, the push rod of the push rod motor 48 is vertically downward, the end part of the push rod motor 48 is connected with the slide block 50, and the lifting ring 53 is connected with the slide block 50 through the connecting rod 51.
The weight ring 60 is further fixed with a vibration motor 61, and in the embodiment, the weight ring 60 is further fixed with the vibration motor 61 through a bolt connection mode.
The preparation box 32 is provided with an observation port 32a, and a transparent observation plate 36 is provided at the observation port 32 a.
With this structure, the abnormality in the preparation tank 32 can be quickly observed through the observation plate 36, and the observation is intuitive.
A material guiding mechanism is further arranged in the preparation box 32, the material guiding mechanism comprises a plurality of material guiding pipes 74, one end of each material guiding pipe 74 is communicated with the lower end of the feeding pipe 38 through an elastic pipe 73, in the embodiment, the elastic pipe 73 is an existing product available in the market; the other end of the material guide pipe 74 is a material guide end, the material guide pipe 74 is horizontally arranged, the side portion of the material guide pipe 74 is further connected with the lower end of the guide rod 72, the upper end of the guide rod 72 is connected with the limiting block 67, the driving roller 66 is connected to the limiting block 67, the guide sleeve 69 is sleeved in the middle of the guide rod 72 and is connected with the turntable 33 through the support rod 70, the spring 68 is further sleeved on the guide rod 72, the upper end of the spring 68 is connected with the limiting block 67, the lower end of the spring 68 is connected with the guide sleeve 69, the upper portion of the preparation box 32 is further provided with the irregular wave-shaped guide ring 65, the material guide ring is located.
By adopting the structure, in the rotating process of the turntable 33, the driving roller 66 abuts against different positions of the guide ring 65, so that the guide rod 72 floats up and down, the guide rod 72 drives the material guide pipe 74 to float up and down, various raw materials in the storage hopper 41 can be conveyed to different height positions of the preparation box 32, and the auxiliary mixing effect is achieved in the feeding process, so that the time required by preparation can be greatly reduced, and the material guide effect is good.
The guide rods 72 are also fixed with a plurality of pushing pieces 71, and in the embodiment, each guide rod 72 is also fixed with three pushing pieces 71; and the pushing piece 71 is arranged horizontally.
With the structure, the guide rod 72 drives the pushing piece 71 to float up and down, and the pushing piece 71 can push the raw materials in the preparation box 32 up and down and mix the raw materials.
The guide tube 74 has a diamond-shaped cross-section.
With this structure, the raw material in the preparation tank 32 can be pushed to both sides when the material guiding pipe 74 floats up and down or rotates.
The working principle of the preparation device is as follows: the method comprises the steps of respectively putting various raw materials into corresponding storage hoppers 41, controlling a power motor 43 to drive a driving wheel 42 to rotate, driving the driving wheel 42 to drive a driven wheel 45 to rotate through a belt 44, driving a main shaft 46 to rotate through the driven wheel 45, driving a turntable 33 to rotate through the main shaft 46, driving a feeding pipe 38 to rotate through the turntable 33, opening a third electromagnetic valve 39, conveying the raw materials in the storage hoppers 41 to all positions of a preparation box 32 from the feeding pipe 38, and simultaneously driving stirring blades 34 to rotate through the turntable 33, so that various raw materials can be quickly and uniformly stirred, and the preparation is convenient.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Claims (9)
1. A multi-chip packaging process is characterized by comprising the following steps: a. thinning: thinning the wafer in a mechanical grinding mode, wherein the final thickness of thinned wafer is 250 and 280 microns; b. scribing: scribing the thinned wafer by a scribing machine; c. once pasting: sticking the first layer of single chip to a base of a lead frame by a chip mounter, wherein the used glue is conductive glue; d. primary curing: putting the semi-finished product after the primary pasting into curing equipment to cure the conductive adhesive; e. secondary pasting: respectively sticking the second layer of the plurality of chips to a bracket of the lead frame by a chip mounter, wherein the used glue is insulating glue; f. secondary curing: putting the semi-finished product after secondary pasting into curing equipment to cure the insulating glue; g. pressure welding: bonding wires to the first layer of chip and the second layer of chip through a wire bonding machine; h. plastic packaging: preparing a plastic packaging material through a preparation device, and plastically packaging the pressure welded semi-finished product through a plastic packaging machine; i. punching and molding; j. removing flash; removing residual glue on the half-finished product after the plastic punching through flash removing equipment; k. electroplating: electroplating the pin of the semi-finished product after the flash is removed by an electroplating device; l, printing; printing the information of the product on the electroplated semi-finished product by a marking machine; m, cutting ribs and forming: cutting the electroplated semi-finished product according to a specified size by a shearing machine to obtain a finished product; n, detection: carrying out electrical detection on the finished product through a testing machine;
the preparation device comprises a base, a preparation box is fixed on the base, a main shaft is vertically arranged on the upper portion of the preparation box, the upper end of the main shaft is connected with a power structure capable of driving the main shaft to rotate, the lower end of the main shaft extends into the preparation box and is connected with a rotary table, a plurality of stirring blades are fixed on the rotary table, a mounting plate is also fixed on the upper end of the main shaft, a plurality of storage hoppers for placing raw materials are fixed on the mounting plate and are uniformly distributed, an input port is formed in the upper end of each storage hopper, an output port is formed in the lower end of each storage hopper, a third electromagnetic valve is arranged at the output port and is communicated with the upper end of a feeding pipe, the lower end of the feeding pipe is located in the preparation box, the; the base is also provided with a material supplementing mechanism capable of supplementing raw materials into the storage hopper, the material supplementing mechanism comprises a bottom plate, a material supplementing pipe, a first telescopic pipe, a second telescopic pipe and a delivery pump, the bottom plate is fixed on the base, a plurality of placing frames are fixed on the bottom plate, hooks capable of positioning the opening of a material bag are arranged on the placing frames, the material supplementing pipe is obliquely fixed on the base through a connecting frame and is positioned between the bottom plate and the configuration box, the lower end of the material supplementing pipe is communicated with the upper end of the first telescopic pipe, the lower end of the first telescopic pipe is connected with a weighting ring, the upper end of the material supplementing pipe is communicated with the upper end of the second telescopic pipe, the lower end of the second telescopic pipe is connected with a lifting ring, the lifting ring can be positioned right above the storage hopper, the lifting ring is also connected with a moving structure capable of; still be provided with guide mechanism in the preparation incasement, guide mechanism includes a plurality of passage, passage one end is linked together through elasticity pipe and inlet pipe lower extreme, the passage other end is the guide end, and the passage is the level and arranges, the passage lateral part still links to each other with the guide arm lower extreme, guide arm upper end and stopper link to each other, be connected with drive roller on the stopper, the cover is equipped with the guide pin bushing in the middle part of the guide arm, the guide pin bushing passes through the bracing piece and links to each other with the carousel, it is equipped with the spring still to overlap on the guide arm, spring upper end and stopper link to each other, spring lower extreme and guide pin bushing link to each other, preparation case upper portion still has and is irregular wavy guide ring.
2. The multi-chip package process of claim 1, wherein the mechanical grinding in step a is divided into two stages: front-section coarse grinding and rear-section fine grinding.
3. The multi-chip packaging process according to claim 2, wherein the front-stage coarse grinding uses carborundum grinding wheels with the particle diameter of 30-40 μm, and the rear-stage fine grinding uses carborundum grinding wheels with the particle diameter of 4-6 μm.
4. The multi-chip packaging process of claim 1, wherein the dicing saw in step b is a DAD651 dicing saw, and the dicing speed is 20-25 mm/s.
5. The multi-chip package process of claim 1, wherein the primary curing conditions in step d are as follows: nitrogen is filled for protection, the curing temperature is 190-210 ℃, and the curing time is 40-80 min.
6. The multi-chip package process of claim 1, wherein the secondary curing conditions in step f are: nitrogen is filled for protection, the curing temperature is 140-160 ℃, and the curing time is 40-80 min.
7. The multi-chip packaging process of claim 1, wherein the bonding in step g is performed by a low arc bonding process and high and low arc positive and negative wire bonding, wherein the bonding material is gold wire, and the bonding temperature is 180-210 ℃.
8. The multi-chip packaging process of claim 1, wherein the plastic package in step h is a potting type plastic package.
9. The multi-chip packaging process according to claim 1, wherein a layer of 6-12 μm copper is electroplated first, and a layer of 12-16 μm tin is electroplated later in step k.
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| CN110190003B (en) * | 2019-06-10 | 2021-07-30 | 池州华宇电子科技股份有限公司 | Stacked multi-chip QFN packaging method |
| CN111816575B (en) * | 2020-06-19 | 2022-01-28 | 浙江亚芯微电子股份有限公司 | Three-chip packaging process |
| CN111816576B (en) * | 2020-07-01 | 2022-09-30 | 浙江亚芯微电子股份有限公司 | 3D packaging process |
| CN112786457A (en) * | 2020-12-31 | 2021-05-11 | 江苏和睿半导体科技有限公司 | High-efficiency integrated circuit packaging process |
| CN116525506B (en) * | 2023-07-04 | 2023-09-01 | 成都汉芯国科集成技术有限公司 | SIP chip stacking and packaging system and packaging method thereof |
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