CN109226977A - Method and system for low temperature processing of hard and brittle materials - Google Patents
Method and system for low temperature processing of hard and brittle materials Download PDFInfo
- Publication number
- CN109226977A CN109226977A CN201811062207.6A CN201811062207A CN109226977A CN 109226977 A CN109226977 A CN 109226977A CN 201811062207 A CN201811062207 A CN 201811062207A CN 109226977 A CN109226977 A CN 109226977A
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- sliver portion
- sliver
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- 239000000463 material Substances 0.000 title abstract description 36
- 238000000034 method Methods 0.000 title abstract description 30
- 238000005520 cutting process Methods 0.000 abstract description 38
- 238000001816 cooling Methods 0.000 abstract description 16
- 238000003698 laser cutting Methods 0.000 abstract description 16
- 238000003672 processing method Methods 0.000 abstract description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 16
- 239000007789 gas Substances 0.000 description 9
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
- 239000007921 spray Substances 0.000 description 6
- 238000005507 spraying Methods 0.000 description 5
- 238000002679 ablation Methods 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 239000010437 gem Substances 0.000 description 1
- 229910001751 gemstone Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 235000015170 shellfish Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention discloses a low-temperature processing method of a hard and brittle material, which adopts a method of matching laser cutting and low-temperature cooling, firstly carries out laser cutting on a workpiece to be processed to form a cutting channel, then carries out local low-temperature cooling on the workpiece to be processed to crack the workpiece at the cutting channel, and finally pressurizes the local part of the workpiece to be processed to make the cracked part fall off from the workpiece to be processed. The invention also discloses a low-temperature processing system for implementing the low-temperature processing method, which comprises a laser cutting device, a fixing device and a cooling and pressurizing device. The low-temperature processing method and the system provided by the invention are suitable for processing hard and brittle materials, can cut and crack the hard and brittle materials with high quality, have high quality of cutting edges, and are particularly suitable for processing the inner grooves of the hard and brittle materials.
Description
Technical field
The present invention relates to a kind of low temperature process method of hard brittle material processing technique field more particularly to hard brittle material and it is
System.
Background technique
Existing hard brittle material generally carries out cutting and sliver using mechanical means, in cutting process, due to hard crisp material
Expect the feature that hardness is high, brittleness is big, is easy that material is caused to damage, defect rate is high, and cut edge is second-rate, and wants cutter
Ask high, the abrasion of cutter is also larger.
Summary of the invention
The purpose of the present invention is to provide a kind of low temperature process method and system of hard brittle material, in high quality to hard crisp material
Material carries out cutting and sliver.
To achieve this purpose, the present invention adopts the following technical scheme:
A kind of low temperature process method of hard brittle material, comprising the following steps:
It is cut by laser on workpiece to be added along desired guiding trajectory, forms Cutting Road, the Cutting Road is by workpiece to be added
It is divided into sliver portion and fixed part；
The fixed fixed part；
Sliver portion described in sub-cooled gradually tapers up the sliver portion towards the direction far from the fixed part, and then makes
It splits at the Cutting Road with the fixed part in the sliver portion；
It pressurizes to the sliver portion, falls the sliver portion from workpiece to be added, complete sliver.
Optionally, the step: being cut by laser on workpiece to be added along desired guiding trajectory, and Cutting Road is formed, described
Workpiece to be added is divided into sliver portion and fixed part by Cutting Road, is specifically included:
It is cut by laser on workpiece to be added along the profile of predetermined inside groove, forms Cutting Road, the Cutting Road will be to
Workpiece is divided into sliver portion and fixed part, and the fixed part is arranged around the sliver portion；
The step: pressurizeing to the sliver portion, fall the sliver portion from workpiece to be added, completes sliver；Specifically
Include:
It pressurizes to the sliver portion, falls the sliver portion from workpiece to be added, formed on workpiece to be added described pre-
Determine inside groove.
Optionally, the step: being cut by laser on workpiece to be added along the profile of predetermined inside groove, and cutting is formed
Workpiece to be added is divided into sliver portion and fixed part by road, the Cutting Road, and the fixed part is arranged around the sliver portion, specific to wrap
It includes:
One laser cutting device is provided；The laser cutting device carries out on workpiece to be added along the profile of predetermined inside groove
Laser cutting forms Cutting Road；
The Cutting Road run through workpiece to be added two opposite plate faces, the Cutting Road by workpiece to be added be divided into sliver portion and
Fixed part, the fixed part are arranged around the sliver portion；
Wherein, the laser cutting device includes ultrafast laser, and the ultrafast laser is installed with Bezier cutting head.
Optionally, the step: sliver portion described in sub-cooled specifically includes: spraying high pressure cold towards the sliver portion.
The step: it pressurizes, specifically includes to the sliver portion: continuing to spray high pressure cold towards the sliver portion.
Optionally, the step: sliver portion described in sub-cooled specifically includes: spraying cryogenic high pressure towards the sliver portion
Liquid nitrogen；
The step: it pressurizes, specifically includes to sliver portion: spraying high pressure gas towards the sliver portion.
Optionally, the step: the fixed fixed part specifically includes:
One fixed device is provided；The fixed device clamps the both ends of workpiece to be added；
Wherein, the fixed device includes symmetrically arranged two fixtures, and two fixtures clamp workpiece to be added respectively
One end；Each fixture includes two clamping parts, and workpiece to be added is located between two clamping parts, two clampings
Portion is symmetrical arranged about workpiece to be added.
A kind of low temperature process system of hard brittle material, including laser cutting device, fixed device and cooling pressurizing device；
The laser cutting device forms Cutting Road for being cut by laser to machined part along desired guiding trajectory；Institute
It states Cutting Road and workpiece to be added is divided into sliver portion and fixed part；
The fixed device is for fixing the fixed part；
The cooling pressurizing device pressurizes for sliver portion described in sub-cooled, and to the sliver portion, makes the sliver
Portion is fallen from workpiece to be added.
Optionally, the fixed part is arranged around the sliver portion, and the laser cutting device includes ultrafast laser, institute
It states ultrafast laser and is installed with Bezier cutting head；
The fixed device includes symmetrically arranged two fixtures, and two fixtures clamp one end of workpiece to be added respectively
Portion；Each fixture includes two clamping parts, and workpiece to be added is located between two clamping parts, two clamping parts about
Workpiece to be added is symmetrical arranged.
Optionally, the cooling pressurizing device includes high pressure cold source, and it is defeated that the high pressure cold source is connected with high pressure cold
Pipe is sent, the gas outlet of the high pressure cold delivery pipe is arranged towards the sliver portion.
Optionally, the cooling pressurizing device includes liquid nitrogen sprinkling instrument, and liquid nitrogen sprinkling instrument is for spraying liquid nitrogen to splitting
Piece portion；The cooling pressurizing device further includes high-pressure air source, and the high-pressure air source is connected with high pressure gas delivery pipe, the high pressure
The gas outlet of air shooter is arranged towards sliver portion.
Compared with prior art, the embodiment of the present invention has the advantages that
The cooperation with sub-cooled is cut by laser in the present invention, so that workpiece to be added is split at Cutting Road, then to be added
The sliver portion pressurization of workpiece falls sliver portion from workpiece to be added.Low temperature process method and system provided by the invention can be efficient
Ground carries out cutting and sliver to hard brittle material, keeps the cut edge quality of hard brittle material high, is particularly suitable for the interior of hard brittle material
Slot processing.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without any creative labor, may be used also for those of ordinary skill in the art
To obtain other attached drawings according to these attached drawings.
Fig. 1 is the schematic diagram of low temperature process system provided in an embodiment of the present invention.
It illustrates: 1, fixed device；2, cooling pressurizing device；3, workpiece to be added；31, Cutting Road；32, sliver portion；33,
Fixed part.
Specific embodiment
In order to make the invention's purpose, features and advantages of the invention more obvious and easy to understand, below in conjunction with the present invention
Attached drawing in embodiment, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that disclosed below
Embodiment be only a part of the embodiment of the present invention, and not all embodiment.Based on the embodiments of the present invention, this field
Those of ordinary skill's all other embodiment obtained without making creative work, belongs to protection of the present invention
Range.
In the description of the present invention, it is to be understood that, term " on ", "lower", "top", "bottom", "inner", "outside" etc. indicate
Orientation or positional relationship be based on the orientation or positional relationship shown in the drawings, be merely for convenience of description the present invention and simplification retouch
It states, rather than the device or element of indication or suggestion meaning must have a particular orientation, be constructed and operated in a specific orientation,
Therefore it is not considered as limiting the invention.It should be noted that when a component is considered as " connection " another component,
It can be directly to another component or may be simultaneously present the component being centrally located.
To further illustrate the technical scheme of the present invention below with reference to the accompanying drawings and specific embodiments.
The present invention provides a kind of low temperature process method and system of hard brittle material, can efficiently add on workpiece 3 to be added
The predetermined inside groove of work.
Embodiment one
Referring to FIG. 1, present embodiments providing a kind of low temperature process method of hard brittle material, comprising the following steps:
(1) it is cut by laser on workpiece 3 to be added along desired guiding trajectory, forms Cutting Road 31；The Cutting Road 31 will
Workpiece 3 to be added divides for sliver portion 32 and fixed part 33.
(2) fixed fixed part 33.
(3) sub-cooled sliver portion 32 gradually tapers up sliver portion 32 towards the direction far from fixed part 33, and then makes sliver
Portion 32 separates at Cutting Road 31 with fixed part 33.
(4) it pressurizes to sliver portion 32, falls sliver portion 32 from workpiece 3 to be added, complete sliver.
Step (1) specifically includes: providing a laser cutting device；Laser cutting device is on workpiece 3 to be added along predetermined
The profile of inside groove is cut by laser, and Cutting Road 31 is formed；
Two plate faces (top and bottom of to be added workpiece 3 in Fig. 1) opposite through workpiece 3 to be added of Cutting Road 31, cutting
Road 31 divides workpiece 3 to be added for sliver portion 32 and fixed part 33, the circular setting of sliver portion 32 of fixed part 33.
Wherein, laser cutting device includes ultrafast laser, and ultrafast laser is installed with Bezier cutting head.Ultrafast laser
Burst length it is short, peak energy is high, and heat affected area is small in material processing, and the cut edge quality of hard brittle material is higher.Shellfish
The Bezier focus on light beam diameter that Sai Er cutting head issues is small, depth of focus is long, and the hard brittle material edge taper being cut into is smaller, edge
It is high-quality.
Step (2) specifically includes: providing a fixed device 1；Fixed device 1 clamps the both ends of hard brittle material 3.Wherein,
Fixed device 1 includes symmetrically arranged two fixtures, and two fixtures clamp the one end of workpiece 3 to be added respectively.Each fixture includes
Two clamping parts, workpiece 3 to be added are located between two clamping parts, and two clamping parts are symmetrical arranged about workpiece 3 to be added.
Step (3) specifically includes: spraying high pressure cold towards the sliver portion 32；Make sliver portion 32 due to cold service gradually to
Contract, fixed part 33 fix device 1 and fixed since heat diffusion is gradually to contract (as shown in Fig. 1 solid arrow)
Frictional force between portion 33 prevents fixed part 33 to contract (as shown in Fig. 1 dotted arrow), and then makes fixed part 33 and sliver
It splits at Cutting Road 3 in portion 32.
Cooperate since perforative 31 gap of Cutting Road is smaller, between fixed part 33 and sliver portion 32 closely, without sliver sky
Between, directly applying external force to sliver portion 32 can make the cut edge of workpiece 3 to be added of poor quality.Made by the principle expanded with heat and contract with cold
It obtains fixed part 33 and sliver portion 32 cracks, it is low in cost, and make the cut edge of workpiece 3 to be added high-quality.
Step (4) specifically includes: continuing to spray high pressure cold towards sliver portion 32, to pressurize to sliver portion 32, makes sliver portion 32
It falls, forms predetermined inside groove on workpiece 3 to be added.
It is pressurizeed by high pressure gas, so that the stress in sliver portion 32 is more uniform, the cut edge quality of workpiece 3 to be added
It is good.It is cooling that sliver portion 32 can not only have been made by high pressure cold, but also can have been pressurizeed to sliver portion 32, equipment, save the cost are simplified.
The present embodiment additionally provides a kind of low temperature process system of hard brittle material, including laser cutting device, fixed device 1
With cooling pressurizing device 2.
Laser cutting device for 3 being cut by laser to machined part along the profile of predetermined inside groove；Laser cutting dress
It sets including ultrafast laser, ultrafast laser is installed with Bezier cutting head.
Fixed device 1 is used to fix fixed part 33, including symmetrically arranged two fixtures, two fixtures clamp to be added respectively
The one end of workpiece 3.Each fixture includes two clamping parts, and workpiece 3 to be added is located between two clamping parts, two clamping parts about
Workpiece 3 to be added is symmetrical arranged.
Cooling pressurizing device 2 is used for sub-cooled sliver portion 32, and pressurizes to sliver portion 32, in the present embodiment,
Cooling pressurizing device 2 includes high pressure cold source, and high pressure cold source connects high pressure cold delivery pipe, the outlet of high pressure cold delivery pipe
Mouth is arranged towards sliver portion 32.
In the present embodiment, hard brittle material is glass, and workpiece 3 to be added is sheet glass.It is understood that hard brittle material
It can be the materials that hardness are big and brittleness is big such as jewel, crystalline silicon, hard alloy or ceramics.
Embodiment two
The present embodiment on the basis of example 1, has changed the type of cooling in sub-cooled sliver portion 32, also has changed
The pressuring method to pressurize to sliver portion 32.
In the present embodiment, the mode in sub-cooled sliver portion 32 is to spray cryogenic high pressure liquid nitrogen towards sliver portion 32.Counterincision
The mode that piece portion 32 pressurizes is to spray high pressure gas towards sliver portion 32.
Corresponding, in the present embodiment, cooling pressurizing device 2 includes that liquid nitrogen sprays instrument, and liquid nitrogen sprays instrument and is used for flushing liquor
Nitrogen is to sliver portion 32.Cooling pressurizing device 2 further includes high-pressure air source, and high-pressure air source is connected with high pressure gas delivery pipe, high pressure gas
The gas outlet of body delivery pipe is arranged towards sliver portion 32.
The cooperation with sub-cooled, which is cut by laser, in the present invention makes workpiece 3 to be added split at Cutting Road 31, then treats
The pressurization of sliver portion 32 of workpiece 3 falls sliver portion 32 from workpiece 3 to be added.Low temperature process method provided by the invention and it is
System is suitable for the processing of hard brittle material, and cut edge quality is high, low in cost.
Low temperature process method and system provided by the invention are particularly suitable for the inside groove processing of hard brittle material.It is existing hard crisp
For material when carrying out inside groove processing, the hard brittle material clout due to inside groove can not use CO without scattering around normal direction2The side such as laser method
Method carries out sliver.Due to inside groove can not sliver, it is existing it is predetermined in groove processing method, mainly divide following two.The first uses super
The mode of fast laser cooperation galvanometer, in layer to incision, layer-by-layer ablation forms joint-cutting, and the edge quality of hard brittle material can not
Guarantee.Second of mode used inside the repeated multiple times grinding hard brittle material of CNC cutter, completes the processing of inside groove, this grinding side
Formula needs to use the repeated multiple times grinding of CNC bistrique, promotes grinding accuracy step by step after CNC internal notches, to reach product essence
Degree, this mode inefficiency, and also bistrique consumption is larger, if to promote yield, needs to be equipped with a large amount of CNC mill
Bed, higher cost.Using low temperature process method and system provided by the invention, can efficiently and rapidly be opened up on hard brittle material interior
Slot, and cut edge quality is high, and required equipment is simple, low in cost.
The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to the foregoing embodiments
Invention is explained in detail, those skilled in the art should understand that: it still can be to aforementioned each implementation
Technical solution documented by example is modified or equivalent replacement of some of the technical features；And these modification or
Replacement, the spirit and scope for technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution.
Claims (10)
1. a kind of low temperature process method of hard brittle material, which comprises the following steps:
It is cut by laser on workpiece to be added along desired guiding trajectory, forms Cutting Road, workpiece to be added is divided by the Cutting Road
Sliver portion and fixed part；
The fixed fixed part；
Sliver portion described in sub-cooled gradually tapers up the sliver portion towards the direction far from the fixed part, and then makes described
It splits at the Cutting Road with the fixed part in sliver portion；
It pressurizes to the sliver portion, falls the sliver portion from workpiece to be added, complete sliver.
2. the low temperature process method of predetermined inside groove according to claim 1, which is characterized in that the step: to be processed
It is cut by laser on part along desired guiding trajectory, forms Cutting Road, workpiece to be added is divided into sliver portion and fixation by the Cutting Road
Portion specifically includes:
It is cut by laser on workpiece to be added along the profile of predetermined inside groove, forms Cutting Road, the Cutting Road will be to be processed
Part is divided into sliver portion and fixed part, and the fixed part is arranged around the sliver portion；
The step: pressurizeing to the sliver portion, fall the sliver portion from workpiece to be added, completes sliver, specifically includes:
It pressurizes to the sliver portion, falls the sliver portion from workpiece to be added, formed on workpiece to be added described predetermined interior
Slot.
3. the low temperature process method of predetermined inside groove according to claim 1, which is characterized in that the step: to be processed
It is cut by laser on part along desired guiding trajectory, forms Cutting Road, workpiece to be added is divided into sliver portion and fixation by the Cutting Road
Portion specifically includes:
One laser cutting device is provided；The laser cutting device carries out laser along the profile of predetermined inside groove on workpiece to be added
Cutting forms Cutting Road；
The Cutting Road runs through the two opposite plate faces of workpiece to be added, and workpiece to be added is divided into sliver portion and fixation by the Cutting Road
Portion, the fixed part are arranged around the sliver portion；
Wherein, the laser cutting device includes ultrafast laser, and the ultrafast laser is installed with Bezier cutting head.
4. the low temperature process method of predetermined inside groove according to claim 1, which is characterized in that the step: sub-cooled
The sliver portion, specifically includes: spraying high pressure cold towards the sliver portion.
The step: it pressurizes, specifically includes to the sliver portion: continuing to spray high pressure cold towards the sliver portion.
5. the low temperature process method of predetermined inside groove according to claim 1, which is characterized in that the step: sub-cooled
The sliver portion, specifically includes: spraying cryogenic high pressure liquid nitrogen towards the sliver portion；
The step: it pressurizes, specifically includes to sliver portion: spraying high pressure gas towards the sliver portion.
6. the low temperature process method of predetermined inside groove according to claim 1, which is characterized in that the step: described in fixed
Fixed part specifically includes:
One fixed device is provided；The fixed device clamps the both ends of workpiece to be added；
Wherein, the fixed device includes symmetrically arranged two fixtures, and two fixtures clamp the one of workpiece to be added respectively
End；Each fixture includes two clamping parts, and workpiece to be added is located between two clamping parts, and two clamping parts close
It is symmetrical arranged in workpiece to be added.
7. a kind of low temperature process system of hard brittle material, which is characterized in that add including laser cutting device, fixed device and cooling
Pressure device；
The laser cutting device forms Cutting Road for being cut by laser to machined part along desired guiding trajectory；It is described to cut
It cuts and workpiece to be added is divided into sliver portion and fixed part；
The fixed device is for fixing the fixed part；
The cooling pressurizing device pressurizes for sliver portion described in sub-cooled, and to the sliver portion, make the sliver portion from
It is fallen on workpiece to be added.
8. the low temperature process system of predetermined inside groove according to claim 7, which is characterized in that the fixed part is around described
The setting of sliver portion, the laser cutting device includes ultrafast laser, and the ultrafast laser is installed with Bezier cutting head；
The fixed device includes symmetrically arranged two fixtures, and two fixtures clamp the one end of workpiece to be added respectively；
Each fixture includes two clamping parts, and workpiece to be added is located between two clamping parts, two clamping parts about to
Workpiece is symmetrical arranged.
9. the low temperature process system of predetermined inside groove according to claim 7, which is characterized in that the cooling pressurizing device packet
High pressure cold source is included, the high pressure cold source is connected with high pressure cold delivery pipe, the gas outlet court of the high pressure cold delivery pipe
It is arranged to the sliver portion.
10. the low temperature process system of predetermined inside groove according to claim 7, which is characterized in that the cooling pressurizing device
Instrument is sprayed including liquid nitrogen, the liquid nitrogen sprinkling instrument is for spraying liquid nitrogen to sliver portion；The cooling pressurizing device further includes high pressure
Gas source, the high-pressure air source are connected with high pressure gas delivery pipe, and the gas outlet of the high pressure gas delivery pipe is set towards sliver portion
It sets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811062207.6A CN109226977A (en) | 2018-09-12 | 2018-09-12 | Method and system for low temperature processing of hard and brittle materials |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811062207.6A CN109226977A (en) | 2018-09-12 | 2018-09-12 | Method and system for low temperature processing of hard and brittle materials |
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| CN201811062207.6A Pending CN109226977A (en) | 2018-09-12 | 2018-09-12 | Method and system for low temperature processing of hard and brittle materials |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111261749A (en) * | 2020-01-20 | 2020-06-09 | 东方日升（常州）新能源有限公司 | Novel heterojunction battery slicing method |
| CN113524316A (en) * | 2021-08-04 | 2021-10-22 | 广东华南特种气体研究所有限公司 | Low-temperature cutting method and system for cold brittle material |
| CN114227260A (en) * | 2022-01-14 | 2022-03-25 | 金当量能源科技(山东)有限公司 | Laser high-pressure water-rocket crusher and working method thereof |
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Application publication date: 20190118 |