CN109210514A - A kind of manufacture craft of Homogeneouslly-radiating mould group - Google Patents
A kind of manufacture craft of Homogeneouslly-radiating mould group Download PDFInfo
- Publication number
- CN109210514A CN109210514A CN201811013053.1A CN201811013053A CN109210514A CN 109210514 A CN109210514 A CN 109210514A CN 201811013053 A CN201811013053 A CN 201811013053A CN 109210514 A CN109210514 A CN 109210514A
- Authority
- CN
- China
- Prior art keywords
- heat
- mould group
- homogeneouslly
- manufacture craft
- radiating mould
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D53/00—Making other particular articles
- B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The present invention provides a kind of manufacture craft of Homogeneouslly-radiating mould group, comprising the following steps: S1: being squeezed into after aluminium sheet is heated and sets reeded hollow slat；S2: it will be pumped into the groove after negative pressure and be filled with liquid refrigerating working medium and the thin plate both ends are pressed by sealing by punching press, form heat-dissipating aluminium plate；S3: the aluminum substrate for posting LED light source board is pasted on heat-dissipating aluminium plate described in S2 with heat-conducting glue, forms heat radiation module.The present invention overcomes original heat dissipation defect, thermally conductive uniform rapidly, is evenly distributed to the heat of any point rapidly on effective radiator area.
Description
Technical field
The invention belongs to LED technical field of heat dissipation, and in particular to a kind of manufacture craft of Homogeneouslly-radiating mould group.
Background technique
Semiconductor LED has the advantages that low energy consumption, high brightness have been widely used in illuminating because of it.But LED is working
In can generate high temperature, if cannot sufficiently radiate, the high temperature caused by work long hours due to, causes brightness to reduce, and uses
The lost of life.LED is limited by self-characteristic, can only rely on convection current and heat loss through radiation, the existing generally existing heat dissipation of radiator
The slow disadvantage of low efficiency, radiating rate, prevent on the other hand LED is also influenced from doing powerful lamp bead on compared with small area
The service life of LED.And original LED use lead heat sink due to thermally conductive slow, medium temperature is high and the edge temperature difference is big, causes
LED lamp bead quick aging due to high temperature in middle section is set to fail.
Summary of the invention
The object of the present invention is to provide a kind of manufacture crafts of Homogeneouslly-radiating mould group, overcome original heat dissipation defect, thermally conductive fast
It is fast uniform, it is evenly distributed to the heat of any point rapidly on effective radiator area.
The present invention provides the following technical solutions:
A kind of manufacture craft of Homogeneouslly-radiating mould group, comprising the following steps:
S1: it is squeezed into after aluminium sheet is heated and sets reeded hollow slat；
S2: it will be pumped into the groove after negative pressure and be filled with liquid refrigerating working medium and pressed the thin plate both ends by punching press
Sealing forms heat-dissipating aluminium plate；
S3: the aluminum substrate for posting LED light source board is pasted on heat-dissipating aluminium plate described in S2 with heat-conducting glue, forms heat dissipation
Mould group.
Preferably, the hollow slat with a thickness of 5mm-10mm.
Preferably, the negative pressure in the S2 is the 13 × (negative pressure of the 10 negative minus 4) Pa of 1-10.
Preferably, the aluminium sheet in the S1 is 1060 aluminium sheets.
Preferably, the LED light source board is patch lamp bead or integrated COB light source plate.
Preferably, the heat radiation module is fitted in lamp body radiator plane.
The beneficial effects of the present invention are: the heat radiation module that the present invention makes is thermally conductive uniform rapidly, can make to appoint in a short time
What any heat is evenly distributed to rapidly on effective radiator area, has overturned original heat sink of leading due to thermally conductive slow, intermediate
Temperature is high and the edge temperature difference is big, causes the drawbacks of middle section LED lamp bead is because of high temperature quick aging failure；And invention production
Heat emission module structure is simple, should be small suitable for light-emitting area and requires 50W or more high-power or hectowatt multikilowatt super large function
In the LED lamp of rate.
Detailed description of the invention
Attached drawing is used to provide further understanding of the present invention, and constitutes part of specification, with reality of the invention
It applies example to be used to explain the present invention together, not be construed as limiting the invention.In the accompanying drawings:
Fig. 1 is hollow slat structural schematic diagram of the present invention；
Fig. 2 is that present invention production uses schematic diagram；
In the figure, it is marked as 1. hollow slats；11. groove；2. aluminum substrate；21.LED light source board；3. radiator.
Specific embodiment
As depicted in figs. 1 and 2, a kind of manufacture craft of Homogeneouslly-radiating mould group, comprising the following steps:
S1: the hollow slat 1 equipped with groove 11 is squeezed into after aluminium sheet is heated；
S2: will be pumped into after negative pressure in groove 11 and be filled with liquid refrigerating working medium and thin plate both ends are pressed sealing by punching press,
Form heat-dissipating aluminium plate；
S3: the aluminum substrate 2 for posting LED light source board 21 is pasted on the heat-dissipating aluminium plate in S2 with heat-conducting glue, forms heat dissipation
Mould group.
As depicted in figs. 1 and 2, a kind of manufacture craft of Homogeneouslly-radiating mould group, specifically, 1060 aluminium sheets are heated to centainly
Temperature then pass through mold and be squeezed into the hollow slat 1 as shown in Figure 1 with a thickness of 5mm-10mm super thin tape fluted 11,
Then 13 will be pumped into groove 11 after one end being pressed by stamping technology × it (is filled with after the negative pressure of the 10 negative minus 4) Pa of 1-10
The other end is pressed to after suitable working fluid refrigeration working medium by stamping technology aluminium that is closed, then will posting LED light source board 21
Substrate 2 is pasted onto any one side of hollow slat 1 with heat-conducting glue and constitutes a heat radiation module.Further, LED light source board 21 can
For patch lamp bead or integrated COB light source plate.Manufactured LED heat radiation module is fitted in the heat dissipation of bulkhead lamp goods high-power LED lamp
In device plane, the heat of any point can be made to be evenly distributed to rapidly on effective radiator area in a short time, overturned original
Beginning leads heat sink due to thermally conductive slow, and medium temperature is high and the edge temperature difference is big, causes middle section LED lamp bead because high temperature is quickly old
The drawbacks of changing failure.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, although referring to aforementioned reality
Applying example, invention is explained in detail, for those skilled in the art, still can be to aforementioned each implementation
Technical solution documented by example is modified or equivalent replacement of some of the technical features.It is all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (6)
1. a kind of manufacture craft of Homogeneouslly-radiating mould group, which comprises the following steps:
S1: it is squeezed into after aluminium sheet is heated and sets reeded hollow slat；
S2: will be pumped into the groove after negative pressure be filled with liquid refrigerating working medium and by punching press by the thin plate both ends press it is close
Envelope forms heat-dissipating aluminium plate；
S3: the aluminum substrate for posting LED light source board is pasted on heat-dissipating aluminium plate described in S2 with heat-conducting glue, forms radiating mould
Group.
2. a kind of manufacture craft of Homogeneouslly-radiating mould group according to claim 1, which is characterized in that the hollow slat
With a thickness of 5mm-10mm.
3. a kind of manufacture craft of Homogeneouslly-radiating mould group according to claim 1, which is characterized in that the negative pressure in the S2
For the 13 × (negative pressure of the 10 negative minus 4) Pa of 1-10.
4. a kind of manufacture craft of Homogeneouslly-radiating mould group according to claim 1, which is characterized in that the aluminium sheet in the S1
For 1060 aluminium sheets.
5. a kind of manufacture craft of Homogeneouslly-radiating mould group according to claim 1, which is characterized in that the LED light source board
For patch lamp bead or integrated COB light source plate.
6. a kind of manufacture craft of Homogeneouslly-radiating mould group according to claim 1, which is characterized in that the heat radiation module patch
It closes in lamp body radiator plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811013053.1A CN109210514A (en) | 2018-08-31 | 2018-08-31 | A kind of manufacture craft of Homogeneouslly-radiating mould group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811013053.1A CN109210514A (en) | 2018-08-31 | 2018-08-31 | A kind of manufacture craft of Homogeneouslly-radiating mould group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109210514A true CN109210514A (en) | 2019-01-15 |
Family
ID=64986071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811013053.1A Pending CN109210514A (en) | 2018-08-31 | 2018-08-31 | A kind of manufacture craft of Homogeneouslly-radiating mould group |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109210514A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100818745B1 (en) * | 2006-08-21 | 2008-04-02 | 주식회사 도시환경이엔지 | LED module with chiller |
| JP2012089476A (en) * | 2010-10-21 | 2012-05-10 | 恆揚 ▲ふ▼ | Light-emitting diode bulb |
| CN202660507U (en) * | 2012-05-31 | 2013-01-09 | 华南理工大学 | Integrated heat dissipation structure for light-emitting diode (LED) aluminum vapor chamber |
| CN103196057A (en) * | 2013-03-18 | 2013-07-10 | 林智勇 | High-power liquid heat dissipating LED (light emitting diode) lamp |
| CN203190134U (en) * | 2013-03-18 | 2013-09-11 | 林智勇 | Magnetic fluid heat exchange light-emitting diode (LED) lamp |
-
2018
- 2018-08-31 CN CN201811013053.1A patent/CN109210514A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100818745B1 (en) * | 2006-08-21 | 2008-04-02 | 주식회사 도시환경이엔지 | LED module with chiller |
| JP2012089476A (en) * | 2010-10-21 | 2012-05-10 | 恆揚 ▲ふ▼ | Light-emitting diode bulb |
| CN202660507U (en) * | 2012-05-31 | 2013-01-09 | 华南理工大学 | Integrated heat dissipation structure for light-emitting diode (LED) aluminum vapor chamber |
| CN103196057A (en) * | 2013-03-18 | 2013-07-10 | 林智勇 | High-power liquid heat dissipating LED (light emitting diode) lamp |
| CN203190134U (en) * | 2013-03-18 | 2013-09-11 | 林智勇 | Magnetic fluid heat exchange light-emitting diode (LED) lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190115 |
|
| RJ01 | Rejection of invention patent application after publication |