CN109195402B - Heat sink and testing equipment - Google Patents

Abstract

The application relates to a heat dissipation device and detection equipment. The detection device comprises a shell, a chip and a heat dissipation device. The housing is sealed. The chip is arranged in the shell. The heat dissipation device comprises a heat dissipation piece, and the heat dissipation piece is provided with a heat receiving part and a heat dissipation part which are mutually connected. The heat receiving part is connected with the chip, and the heat radiating part is arranged outside the shell. According to the heat dissipation device, the chip of the detection equipment can be connected through the heat receiving part of the heat dissipation piece, and therefore heat on the chip is directly conducted to the heat receiving part of the heat dissipation piece; then, the heat is conducted to the heat radiating part connected with the heat receiving part through the heat receiving part; finally, the heat dissipation part arranged outside the detection equipment dissipates heat to the outside of the detection equipment, so that the temperature of a chip of the detection equipment is reduced, and the service life of the detection equipment is prolonged.

Description

Heat sink and testing equipment

technical field

The present application relates to the technical field of detection, and in particular, to a heat dissipation device and detection equipment.

Background technique

With the development of detection technology, various detection settings are applied to various industries to facilitate people's judgment of various information.

Some detection devices in the related art use chips with high power consumption for high quality requirements. The high power consumption introduced when these detection devices work generates a lot of heat. At the same time, the above-mentioned devices often also need to set the chip in a sealed casing, so that it has the function of waterproof and dustproof.

But sealed enclosures cannot be vented to dissipate heat. The detection equipment will cause the chip to be overloaded and even damage the chip due to the high temperature of the chip. The service life of the inspection equipment is also reduced as a result.

SUMMARY OF THE INVENTION

Based on this, it is necessary to provide a heat dissipation device capable of effectively dissipating heat for the detection equipment in order to solve the above-mentioned technical problem that the sealed casing cannot dissipate heat.

Meanwhile, the present application also provides a detection device capable of effectively dissipating heat.

A heat dissipation device is applied to detection equipment, the heat dissipation device includes a heat dissipation part, the heat dissipation part has a heat connection part and a heat dissipation part connected to each other, the heat connection part is used for connecting a chip of the detection device, the heat dissipation part is The heat dissipation part is used to dissipate heat to the outside of the detection device.

In one embodiment, the heat receiving part includes a first casing, the heat dissipation part includes a second casing, the first casing communicates with the second casing and encloses a liquid storage cavity, The liquid storage cavity contains working liquid, and the working liquid is sealed inside the liquid storage cavity.

In one of the embodiments, the heat dissipation device further includes a cooling assembly facing at least part of the heat dissipation portion.

In one of the embodiments, the cooling assembly includes a fan, and the fan faces the heat dissipation part.

In one embodiment, the cooling assembly further includes a heat dissipation case with openings and a printed circuit board, the heat dissipation case wraps at least part of the heat dissipation part, and the printed circuit board and the fan are located in the heat dissipation case inside, and the printed circuit board is electrically connected to the fan.

In one of the embodiments, the cooling assembly includes a diffuser connected to the heat sink.

In one embodiment, the diffuser includes at least one fin and is connected to the heat dissipation portion in a surrounding manner.

In one embodiment, the heat dissipation device further includes a wire for electrically connecting the chip, and the wire and the heat dissipation member are wrapped together.

In one embodiment, the wire includes a conductive wire and an insulating layer, and the insulating layer covers the conductive wire.

A detection device includes a casing, a chip, and the heat dissipation device according to any one of the above, wherein the casing is sealed, the chip is arranged in the casing, the heat connection part is connected to the chip, and the heat dissipation part is arranged outside the casing.

The above-mentioned heat dissipation device can be connected to the chip of the detection device through the heat connection part of the heat dissipation part, and then the heat on the chip is directly conducted to the heat connection part of the heat dissipation part; then, the heat is conducted to the heat dissipation part connected to it through the heat connection part; Finally, heat is dissipated to the outside of the detection device through the heat dissipation part disposed outside the detection device, thereby reducing the chip temperature of the detection device and improving the service life of the detection device.

Description of drawings

1 is a perspective view of a detection device in one embodiment;

FIG. 2 is an exploded view of the detection device shown in FIG. 1 from another angle;

FIG. 3 is a cross-sectional view of the detection apparatus shown in FIG. 1 .

Reference number:

1-chip; 2-shell; 21-upper shell; 22-lower shell; 3-radiator; 31-radiator; 311-heat connection; 312-radiator; 32-cooling assembly; 321-fan; 322- Cooling chassis; 3221 - air inlet; 3222 - air outlet; 323 - printed circuit board; 324 - diffuser; 3241 - Qi piece.

Detailed ways

In order to make the purpose, technical solutions and advantages of the present application more clearly understood, the present application will be described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application.

The heat dissipation device provided in the present application can be applied to various detection equipment. Various testing equipment includes testing equipment in which the chip is arranged in a sealed casing so that it has waterproof and dustproof functions, such as a medical ultrasonic diagnostic apparatus. Due to the demand for high-quality images, medical ultrasound diagnostic instruments use chips with high channels and high power consumption. High-power chips generate a lot of heat. At the same time, the medical ultrasonic diagnostic instrument also needs to be disinfected and cleaned regularly. Therefore, the chip of the medical ultrasonic diagnostic instrument needs to be arranged in a sealed casing, so that it has the function of waterproof and dustproof.

In one embodiment, as shown in FIG. 1 to FIG. 2 , the detection device includes a chip 1 , a housing 2 and a heat sink 3 .

Referring to FIG. 3 , the chip 1 is arranged in the casing 2 . Specifically, the housing 2 may include an upper housing 21 and a lower housing 22 , and the housing 2 is sealed after the upper housing 21 and the lower housing 22 are assembled. Of course, the sealed casing 2 can also be in other forms.

Referring to FIG. 1 , the heat dissipation device 3 includes a heat dissipation member 31 . The heat sink 31 has a heat connection part 311 and a heat dissipation part 312 which are connected to each other. The heat connection portion 311 is used to connect the chip 1 . The heat dissipation part 312 is used to dissipate heat to the outside of the detection device. When the heat dissipation device 3 is assembled to the testing equipment, referring to FIG. 3 , the heat connection portion 311 is connected to the chip 1 . The heat dissipation part 312 is disposed outside the casing 2, and further dissipates heat to the outside of the detection device. The specific connection method between the heat connection portion 311 and the chip 1 may be various methods such as screw locking, welding, etc., which is not limited in this application.

When the detection device is in operation, since the heat connection part 311 is connected to the chip 1 , the heat on the chip 1 can be directly conducted to the heat connection part 311 . Then, since the heat dissipation part 312 and the heat connection part 311 are connected to each other, the heat on the heat connection part 311 is conducted to the heat dissipation part 312 . Finally, since the heat dissipation part 312 is disposed outside the casing 2, it will dissipate heat to the environment outside the detection device after being heated, thereby reducing the temperature of the chip 1 of the detection device and improving the service life of the detection device.

The structure of the heat sink 31 may be similar to a heat pipe, and may have a liquid storage chamber (not shown) and a working liquid (not shown), and the working liquid is sealed inside the liquid storage chamber. Specifically, the heat connection part 311 of the heat sink 31 includes a first casing, and the heat dissipation part 312 includes a second casing. The first shell and the second shell communicate with each other inside and enclose a liquid storage cavity, and the liquid storage cavity contains working liquid. When the detection device is working, the chip 1 continues to generate heat, which will heat the working liquid in the housing of the heat sink 31 connected to it. The heated working liquid is vaporized and saturated and flows toward the cold end of the heat dissipation member 31 (ie, one end of the heat dissipation portion 312 ). According to the principle of condensation and liquefaction, the vaporized working liquid condenses into a liquid state after being cooled at the cold end, and releases heat at the same time. The re-condensed working liquid also returns to the hot end of the heat sink 31 (ie, one end of the connecting portion 311 ) to continue to absorb heat and vaporize, and circulates in sequence to continuously reduce the chip temperature of the device. The heat sink 31 condenses, liquefies, and releases heat after being heated by the working liquid disposed therein, thereby effectively accelerating the heat dissipation speed of the heat sink 31 and improving the heat dissipation efficiency.

The above-mentioned working liquid can be, but not limited to, pure water. The heat sink 31 may also include a wick. Before the heat sink 31 is used, the inside of the casing can be pumped to a negative pressure, and then an appropriate amount of working liquid can be filled in the casing. After the working liquid fills the liquid-absorbing wick (capillary porous material) close to the inner wall of the casing, the casing is sealed. When the working liquid reaches the cold end after being heated, it flows back to the hot end along the porous material by the action of capillary force. The heat sink 31 may also not include a wick. When the detection equipment is in operation, if the heat sink 31 is placed in the vertical direction, the backflow of the working liquid can be satisfied by gravity, and there is no need to provide a liquid-absorbing wick with a capillary porous structure.

Of course, the form of the heat sink 31 in the present application is not limited to the above form, and it can also be a hollow shell, or even a solid shell. Since the heat dissipation portion 312 of the heat dissipation member 31 extends outside the casing 2 , even if the heat dissipation member 31 only includes a hollow or solid shell, the purpose of improving heat dissipation will be achieved to a certain extent.

In one embodiment, referring to FIG. 1 and FIG. 2 , the heat dissipation device 3 may further include a cooling component 32 . The cooling assembly 32 faces at least a part of the heat dissipation part 3 , and can rapidly reduce the temperature of the part of the heat dissipation part 3 , thereby increasing the speed of transferring the heat from the chip 1 to the part of the heat dissipation part 3 . Therefore, the disposition of the cooling component 32 can speed up the heat dissipation effect on the chip 1 and improve the heat dissipation efficiency.

In one embodiment, the cooling assembly 32 may specifically include a fan 321 . The fan 321 blows air toward the heat dissipation part 3 , which can speed up the heat exchange between the cold airflow in the air and the corresponding heat dissipation part 3 , thereby increasing the heat dissipation speed.

In one embodiment, in order to facilitate placement and driving of the fan 321 , the cooling assembly 32 may further include a heat dissipation case 322 with holes and a printed circuit board 323 . When both the printed circuit board 323 and the fan 321 are located in the heat dissipation case 322 . The printed circuit board 323 is electrically connected to the fan 321 to provide driving signals for the fan 321 .

The openings on the heat dissipation case 322 are used to provide cool air to the fan 321 and discharge the hot air exchanged with the cool air. Specifically, the opening on the heat dissipation case 322 may include an air inlet hole 3221 and an air outlet hole 3222 arranged oppositely. The air inlet hole 3221 is used for inflowing cold air into the heat dissipation case 322 , and the air outlet hole 3222 is used for exhausting the hot air in the heat dissipation case 322 . Of course, the way of openings on the heat dissipation case 322 can also be different from this.

The heat dissipation case 322 may cover part of the heat dissipation part 312 . Specifically, the heat dissipation part 312 may penetrate through the heat dissipation case 322 . At this time, the part of the heat dissipation part 312 inside the heat dissipation case 322 may be located between the fan 321 and the air outlet 3222 , and the fan 321 faces the part of the heat dissipation part 312 inside the heat dissipation case 322 . Alternatively, the end of the heat dissipation portion 312 may also be located in the heat dissipation case 322 without protruding. Of course, the heat dissipation case 322 can also cover the entire heat dissipation portion 312 .

In the embodiment of the present application, the fan 321 and the printed circuit board 323 for driving the fan 321 may also be placed on another component instead of being placed in the heat dissipation case 322 . The drive of the fan 321 may also not require a separate printed circuit board 323 , but directly control the switch and the like of the fan 321 by using a power source. This application does not limit this too much.

In the embodiment of the present application, the cooling component 32 may also adopt other cooling methods other than the cooling by the fan 321 . For example, ice cubes or cooling water are placed in the cooling case 322 . The ice cubes or the cooling water are in contact with the heat dissipation part 312 directly or through other components, and then the corresponding part of the heat dissipation part 312 is cooled by heat conduction.

In one embodiment, the cooling assembly 32 may also include a diffuser 324 . The diffusion member 324 is connected to the heat dissipation portion 312 , and further dissipates the heat of the heat dissipation portion 312 to the entire diffusion member 324 , thereby facilitating rapid heat dissipation. When the fan 321 and the diffuser 324 coexist, the heat dissipation part 312 may be located between the fan 321 and the diffuser 324 .

In one embodiment, the diffuser 324 includes at least one iris 3241 . The diffusing member 324 may be connected to the outer surface of the heat dissipation member 31 in a surrounding manner, so that the contact area between the diffusing member 324 and the heat dissipation member 31 is relatively large. The connection method between the diffusion member 324 and the heat dissipation member 31 may be welding or other methods, which are not limited in this application. At least one protruding unicorn 3241 can further increase the heat diffusion area, which is more conducive to rapid heat dissipation. The specific number of the unicorn 3241 can be set according to actual needs.

When the detection device is working normally, the chip 1 needs to provide it with an electrical signal input through a wire. Therefore, in one embodiment, the heat dissipation device 3 may further include wires electrically connected to the chip 1 . The wires and the heat sink 31 are wrapped together, thereby simplifying the structure of the testing device and facilitating the application of the testing device. When the detection device is in operation, the heat sink 31 has a relatively high temperature due to its contact with the chip 1. Therefore, in practical applications, the heat sink 31 and the wires can be covered with a heat-resistant material to avoid the high temperature of the heat sink 31. cause packaging damage. Of course, when the detection equipment is in operation, when the temperature on the heat sink 31 is not too high, the heat sink 31 and the wire covering material can also be made of common materials.

In one embodiment, the wire includes a conductive wire and an insulating layer covering the conductive wire. On the one hand, the insulating layer effectively insulates the conductive wire to avoid safety accidents. On the other hand, the insulating layer can also effectively isolate the conductive wire from the heat dissipation member 31 , so as to avoid the aging of the conductive wire caused by the relatively high temperature on the heat dissipation member 31 .

In the embodiment of the present application, the detection device may include the heat dissipation device 3 during production, or the heat dissipation device 3 may be assembled at a later stage. When the detection equipment includes the heat sink 3 during production, the wires may not be covered with the heat sink 31 . The heat sink 3 later assembled to the testing equipment may not include wires; or, when the heat sink 3 includes wires electrically connected to the chip 1 , the wires may not be covered with the heat sink 31 .

To sum up, the heat dissipation device provided by the present application includes a heat dissipation member, and the heat dissipation member has a heat connection portion and a heat dissipation portion that are connected to each other. The heat connection part is connected to the chip of the detection device, and then directly absorbs the heat on the chip. The heat dissipation part is connected to the heat connection part and is located outside the casing of the detection device, so that the absorbed heat on the chip can be dissipated to the outside of the detection device, thereby effectively dissipating heat to the chip.

The technical features of the above embodiments can be combined arbitrarily. In order to make the description simple, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction in the combination of these technical features It is considered to be the range described in this specification.

The above-mentioned embodiments only represent several embodiments of the present application, and the descriptions thereof are specific and detailed, but should not be construed as a limitation on the scope of the invention patent. It should be pointed out that for those skilled in the art, without departing from the concept of the present application, several modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the scope of protection of the patent of the present application shall be subject to the appended claims.

Claims (9)

1. A heat dissipation device is applied to detection equipment and is characterized by comprising a heat dissipation piece, wherein the heat dissipation piece is provided with a heat receiving part and a heat dissipation part which are connected with each other, the heat receiving part is used for being connected with a chip of the detection equipment, and the heat dissipation part is used for dissipating heat to the outside of the detection equipment;

the heat radiation part is an integrated structural part with a liquid storage cavity, and the heat receiving part and the heat radiation part are two connected components of the heat radiation part at different positions;

the heat receiving part comprises a first shell, the heat radiating part comprises a second shell, the first shell is communicated with the interior of the second shell and surrounds a liquid storage cavity, working liquid is arranged in the liquid storage cavity, and the working liquid is sealed in the liquid storage cavity;

the heat dissipation device further includes a cooling assembly facing the heat dissipation portion, and the cooling assembly further includes a heat dissipation case having an opening.

2. The heat dissipating device of claim 1, wherein the cooling assembly faces at least a portion of the heat dissipating portion.

3. The heat dissipating device of claim 2, wherein the cooling assembly comprises a fan facing the heat dissipating portion.

4. The heat dissipating device of claim 3, wherein the cooling assembly further comprises a printed circuit board, the heat dissipating housing encloses at least a portion of the heat dissipating portion, the printed circuit board and the fan are located within the heat dissipating housing, and the printed circuit board is electrically connected to the fan.

5. The heat dissipating device of claim 2, wherein the cooling assembly comprises a diffuser member, the diffuser member connecting the heat dissipating portion.

6. The heat sink of claim 5, wherein the diffuser comprises at least one fin and is circumferentially attached to the heat sink portion.

7. The heat dissipating device of claim 1, further comprising a wire for electrically connecting to the chip, the wire being encapsulated with the heat dissipating member.

8. The heat dissipating device of claim 7, wherein the wire comprises a conductive wire and an insulating layer, the insulating layer covering the conductive wire.

9. An inspection apparatus comprising a housing, a chip, and the heat dissipation device of any one of claims 1 to 8, wherein the housing is sealed, the chip is disposed in the housing, the heat receiving portion is connected to the chip, and the heat dissipation portion is disposed outside the housing.

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