CN109181406A - A kind of preparation method of high catalytic efficiency type photocuring white solder mask material - Google Patents
A kind of preparation method of high catalytic efficiency type photocuring white solder mask material Download PDFInfo
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- CN109181406A CN109181406A CN201811098963.4A CN201811098963A CN109181406A CN 109181406 A CN109181406 A CN 109181406A CN 201811098963 A CN201811098963 A CN 201811098963A CN 109181406 A CN109181406 A CN 109181406A
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- solder mask
- mask material
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- 239000000463 material Substances 0.000 title claims abstract description 25
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 24
- 238000000016 photochemical curing Methods 0.000 title claims abstract description 15
- 230000003197 catalytic effect Effects 0.000 title claims abstract description 14
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 102000004169 proteins and genes Human genes 0.000 claims abstract description 17
- 108090000623 proteins and genes Proteins 0.000 claims abstract description 17
- 239000002245 particle Substances 0.000 claims abstract description 14
- 239000012463 white pigment Substances 0.000 claims abstract description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 20
- 239000000706 filtrate Substances 0.000 claims description 19
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 18
- 239000006185 dispersion Substances 0.000 claims description 17
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 12
- 239000000843 powder Substances 0.000 claims description 12
- LEAHFJQFYSDGGP-UHFFFAOYSA-K trisodium;dihydrogen phosphate;hydrogen phosphate Chemical compound [Na+].[Na+].[Na+].OP(O)([O-])=O.OP([O-])([O-])=O LEAHFJQFYSDGGP-UHFFFAOYSA-K 0.000 claims description 10
- 238000009777 vacuum freeze-drying Methods 0.000 claims description 10
- 238000007873 sieving Methods 0.000 claims description 9
- 239000002002 slurry Substances 0.000 claims description 9
- 238000001914 filtration Methods 0.000 claims description 8
- 239000004408 titanium dioxide Substances 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 7
- 238000002390 rotary evaporation Methods 0.000 claims description 7
- 241001147461 Bangiales Species 0.000 claims description 6
- 229960000583 acetic acid Drugs 0.000 claims description 6
- 150000001298 alcohols Chemical class 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 239000012141 concentrate Substances 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 239000012362 glacial acetic acid Substances 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 238000000227 grinding Methods 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 2
- 239000005864 Sulphur Substances 0.000 claims description 2
- 229910052788 barium Inorganic materials 0.000 claims description 2
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910021485 fumed silica Inorganic materials 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 238000005303 weighing Methods 0.000 claims description 2
- 240000001972 Gardenia jasminoides Species 0.000 claims 1
- 241000195493 Cryptophyta Species 0.000 abstract description 10
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- 239000003795 chemical substances by application Substances 0.000 abstract description 2
- 239000000284 extract Substances 0.000 abstract description 2
- 230000005283 ground state Effects 0.000 abstract description 2
- 230000000977 initiatory effect Effects 0.000 abstract description 2
- 239000000049 pigment Substances 0.000 abstract description 2
- 230000009257 reactivity Effects 0.000 abstract description 2
- 230000011514 reflex Effects 0.000 abstract description 2
- 230000035945 sensitivity Effects 0.000 abstract description 2
- 238000007711 solidification Methods 0.000 abstract description 2
- 230000008023 solidification Effects 0.000 abstract description 2
- 235000010215 titanium dioxide Nutrition 0.000 description 10
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 8
- 241000157835 Gardenia Species 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- SOQBVABWOPYFQZ-UHFFFAOYSA-N oxygen(2-);titanium(4+) Chemical class [O-2].[O-2].[Ti+4] SOQBVABWOPYFQZ-UHFFFAOYSA-N 0.000 description 4
- 239000003643 water by type Substances 0.000 description 4
- 241000234435 Lilium Species 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 241000196324 Embryophyta Species 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000001055 blue pigment Substances 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 235000013601 eggs Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials For Photolithography (AREA)
Abstract
The present invention relates to a kind of preparation methods of high catalytic efficiency type photocuring white solder mask material, belong to ink material technical field.Technical solution of the present invention extracts photosensitive protein using algae, due under the irradiation of appropriate light, algae protein molecular absorbs certain energy and is excited, the algae protein molecular stability being excited is poor, need to radiate particle and energy to return to unawakened ground state, technical solution of the present invention is carried out sufficiently modified and is filled using plant white pigment to algae albumen simultaneously, algae albumen is improved to the exposure intensity and sensitivity of white light, further increases the reactivity worth that material prepares white solder mask material；And the present invention passes through white plant source pigment modified light-sensitive agent material, overcome the problems, such as that White system solidification is difficult, reducing white has the reflex arranged by force to light, greatly enhance the intensity that ultraviolet light is received in system, make white coating completion of cure, the especially deep cure of coating, preparation have dynamical light initiation system.
Description
Technical field
The present invention relates to a kind of preparation methods of high catalytic efficiency type photocuring white solder mask material, belong to ink material
Expect technical field.
Background technique
White solder mask is to be printed on the coating film for being used to cover surface route in LED circuit board, this layer of welding resistance oil
Black mainly there are two effects: one is welding resistance, i.e., prevent unnecessary tin during LED lamp wiring board (PCB plate) scolding tin
Attachment causes line short on the line；Second, reflective, various LED luminescence chips are directly welded on wiring board,
Therefore the solder mask of covering in the circuit board also has reflection action.It is well known that the reflector efficiency highest of white, it can be significantly
Reduce the loss of light.But after printing this layer of solder mask, a procedure is scolding tin, and the temperature of scolding tin process can reach
To 250 DEG C or more, common solder mask is not resistant to this temperature, and color can turn yellow, and lamp plate surface xanthochromia will affect lamp plate
Light loss increase is also resulted in while beautiful.Therefore, it is necessary to increase its covering power plus some blue pigments, neutralizes high temperature and generate
Yellow.But reflector efficiency can be made to reduce after adding blue, lead to the loss of light, prevents LED from playing maximum efficiency.
Xanthochromia easily occurs under high temperature, is just made as lily difficulty.Currently, the technology and product of lily solder mask not enough at
It is ripe, it is necessary to develop a white solder mask material for having self-character.
Summary of the invention
The technical problems to be solved by the invention: for xanthochromia easily occurs under existing lily solder mask high temperature,
The pure white bad problem of ink light-cured performance provides a kind of preparation of high catalytic efficiency type photocuring white solder mask material
Method.
In order to solve the above technical problems, the technical solution adopted by the present invention is that:
(1) Bangiales are taken and are cleaned, vacuum freeze drying is simultaneously ground up, sieved, sieving powder and 1:10 in mass ratio are collected, incited somebody to action
Sieve powder and disodium hydrogen phosphate-sodium dihydrogen phosphate, which are stirred and collect mixed liquor, to be placed in refiner, and homogenized is simultaneously
It is dry, obtain photosensitive protein particle；
(2) take gardenia petal and clean and crush, collect and crush petal and according to parts by weight, respectively 45~50 parts of weighing go from
Sub- water, 55~60 parts of dehydrated alcohols, 1~2 part of glacial acetic acid and 10~15 parts of crushing petals are placed in three-necked flask, are stirred simultaneously
Insulation reaction, filters and collects filtrate, and rotary evaporation obtains white pigment concentrate；
(3) according to parts by weight, 45~50 parts of UV resin UV2282,10~15 part of 200 mesh titanium dioxide, 3~5 parts of sulphur are weighed respectively
Sour barium, 10~15 parts of photosensitive protein particles, are stirred to obtain component A；
(4) again according to parts by weight, 40~45 parts of epoxy resin E-41,10~15 part of 200 mesh titanium dioxide, 3~5 parts are weighed respectively
Fumed silica and 25~30 parts of n,N-Dimethylformamide are placed in a beaker, and are stirred to obtain component B；
(5) component A and component B are stirred and are placed in dispersion machine by 1:1 in mass ratio, are protected from light dispersion, collect dispersion liquid simultaneously
Grinding filtering, high catalytic efficiency type photocuring white solder mask material can be prepared by collecting filtering slurries.
Disodium hydrogen phosphate-sodium dihydrogen phosphate described in step (1) is 5mmol/L disodium hydrogen phosphate-sodium dihydrogen phosphate
Solution.
Rotary evaporation described in step (2) is that rotation is evaporated to the 1/5 of filtrate volume at 45~50 DEG C.
It is 5 μm that aperture of filter screen is filtered in grinding described in step (5).
The present invention is compared with other methods, and advantageous effects are:
(1) technical solution of the present invention extracts photosensitive protein using algae, since under the irradiation of appropriate light, algae protein molecular absorbs
Certain energy and be excited, the algae protein molecular stability being excited is poor, needs to radiate particle and energy to return to not
The ground state being excited, while technical solution of the present invention is carried out sufficiently modified and is filled using plant white pigment to algae albumen, is mentioned
High algae albumen further increases the reactivity that material prepares white solder mask material to the exposure intensity and sensitivity of white light
Energy；
(2) technical solution of the present invention effectively overcomes White system solidification difficult by white plant source pigment modified light-sensitive agent material
The problem of, reducing white itself has the reflex arranged by force to light, and the intensity for actually receiving ultraviolet light in system is made to increase greatly
By force, make the deep cure of white coating completion of cure, especially coating, preparation has dynamical light initiation system.
Specific embodiment
It takes Bangiales and cleans, vacuum freeze drying and ground 200 mesh collect sieving powder and in mass ratio 1:
10, the powder that will be sieved, which is stirred with 5mmol/L disodium hydrogen phosphate-sodium dihydrogen phosphate and collects mixed liquor, is placed in refiner
In, homogenized and vacuum freeze drying obtain photosensitive protein particle；It takes gardenia petal and cleans and crush, collect and crush petal
And according to parts by weight, 45~50 parts of deionized waters, 55~60 parts of dehydrated alcohols, 1~2 part of glacial acetic acid and 10~15 are weighed respectively
Part crushing petal is placed in three-necked flask, is stirred and is placed in insulation reaction 20 at 75~80 DEG C~for 24 hours, filters and collect filter
Filtrate is placed in rotation at 45~50 DEG C and is evaporated to the 1/5 of filtrate volume, obtains white pigment concentrate by liquid；According to parts by weight,
45~50 parts of UV resin UV2282,10~15 part of 200 mesh titanium dioxide, 3~5 parts of barium sulfate, 10~15 portions of photosensitive eggs are weighed respectively
White particle is stirred to obtain component A；Again according to parts by weight, 40~45 parts of epoxy resin E-41,10~15 parts are weighed respectively
200 mesh titanium dioxides, 3~5 parts of fumed silicas and 25~30 parts of n,N-Dimethylformamide are placed in a beaker, and are stirred
Component A and component B are stirred and are placed in dispersion machine by component B, in mass ratio 1:1, are kept away at 4500~5000r/min
Light disperses 10~15min, collects dispersion liquid and ground 5 μm of the screen to filtrates, and high catalysis effect can be prepared by collecting filtering slurries
Rate type photocuring white solder mask material.
Example 1
It takes Bangiales and cleans, vacuum freeze drying and ground 200 mesh collect sieving powder and 1:10 in mass ratio, will
Sieving powder and 5mmol/L disodium hydrogen phosphate-sodium dihydrogen phosphate, which are stirred and collect mixed liquor, to be placed in refiner, even
Slurry processing and vacuum freeze drying, obtain photosensitive protein particle；It takes gardenia petal and cleans and crush, collect and crush petal and by weight
Number meter is measured, 45 parts of deionized waters, 55 parts of dehydrated alcohols, 1 part of glacial acetic acid and 10 parts of crushing petals is weighed respectively and is placed in three mouthfuls of burnings
In bottle, it is stirred and is placed in insulation reaction 20h at 75 DEG C, filter and collect filtrate, filtrate is placed in rotary evaporation at 45 DEG C
To the 1/5 of filtrate volume, white pigment concentrate is obtained；According to parts by weight, 45 parts of UV resin UV2282,10 parts are weighed respectively
200 mesh titanium dioxides, 3 parts of barium sulfate, 10 parts of photosensitive protein particles, are stirred to obtain component A；Again according to parts by weight, claim respectively
40 parts of epoxy resin E-41,10 part of 200 mesh titanium dioxide, 3 parts of fumed silicas and 25 parts of n,N-Dimethylformamide are measured to be placed in
In beaker, it is stirred to obtain component B, in mass ratio 1:1, component A and component B are stirred and are placed in dispersion machine,
It is protected from light dispersion 10min under 4500r/min, collects dispersion liquid and ground 5 μm of the screen to filtrates, collecting filtering slurries can be prepared into
High catalytic efficiency type photocuring white solder mask material.
Example 2
It takes Bangiales and cleans, vacuum freeze drying and ground 200 mesh collect sieving powder and 1:10 in mass ratio, will
Sieving powder and 5mmol/L disodium hydrogen phosphate-sodium dihydrogen phosphate, which are stirred and collect mixed liquor, to be placed in refiner, even
Slurry processing and vacuum freeze drying, obtain photosensitive protein particle；It takes gardenia petal and cleans and crush, collect and crush petal and by weight
Number meter is measured, 47 parts of deionized waters, 57 parts of dehydrated alcohols, 1 part of glacial acetic acid and 12 parts of crushing petals is weighed respectively and is placed in three mouthfuls of burnings
In bottle, it is stirred and is placed in insulation reaction 22h at 77 DEG C, filter and collect filtrate, filtrate is placed in rotary evaporation at 47 DEG C
To the 1/5 of filtrate volume, white pigment concentrate is obtained；According to parts by weight, 47 parts of UV resin UV2282,12 parts are weighed respectively
200 mesh titanium dioxides, 4 parts of barium sulfate, 12 parts of photosensitive protein particles, are stirred to obtain component A；Again according to parts by weight, claim respectively
47 parts of epoxy resin E-41,12 part of 200 mesh titanium dioxide, 4 parts of fumed silicas and 27 parts of n,N-Dimethylformamide are measured to be placed in
In beaker, it is stirred to obtain component B, in mass ratio 1:1, component A and component B are stirred and are placed in dispersion machine,
It is protected from light dispersion 12min under 4750r/min, collects dispersion liquid and ground 5 μm of the screen to filtrates, collecting filtering slurries can be prepared into
High catalytic efficiency type photocuring white solder mask material.
Example 3
It takes Bangiales and cleans, vacuum freeze drying and ground 200 mesh collect sieving powder and 1:10 in mass ratio, will
Sieving powder and 5mmol/L disodium hydrogen phosphate-sodium dihydrogen phosphate, which are stirred and collect mixed liquor, to be placed in refiner, even
Slurry processing and vacuum freeze drying, obtain photosensitive protein particle；It takes gardenia petal and cleans and crush, collect and crush petal and by weight
Number meter is measured, 50 parts of deionized waters, 60 parts of dehydrated alcohols, 2 parts of glacial acetic acid and 15 parts of crushing petals is weighed respectively and is placed in three mouthfuls of burnings
In bottle, it is stirred and is placed in insulation reaction at 80 DEG C and for 24 hours, filters and collect filtrate, filtrate is placed in rotary evaporation at 50 DEG C
To the 1/5 of filtrate volume, white pigment concentrate is obtained；According to parts by weight, 50 parts of UV resin UV2282,15 parts are weighed respectively
200 mesh titanium dioxides, 5 parts of barium sulfate, 15 parts of photosensitive protein particles, are stirred to obtain component A；Again according to parts by weight, claim respectively
45 parts of epoxy resin E-41,15 part of 200 mesh titanium dioxide, 5 parts of fumed silicas and 30 parts of n,N-Dimethylformamide are measured to be placed in
In beaker, it is stirred to obtain component B, in mass ratio 1:1, component A and component B are stirred and are placed in dispersion machine,
It is protected from light dispersion 15min under 5000r/min, collects dispersion liquid and ground 5 μm of the screen to filtrates, collecting filtering slurries can be prepared into
High catalytic efficiency type photocuring white solder mask material.
Example 1,2,3 prepared by the present invention is tested for the property, specific test result is as follows shown in table table 1:
1 performance test table of table
As seen from the above table, ink material prepared by the present invention has excellent color inhibition and adhesive force.
Claims (4)
1. a kind of preparation method of high catalytic efficiency type photocuring white solder mask material, it is characterised in that specific preparation step
Are as follows:
(1) Bangiales are taken and are cleaned, vacuum freeze drying is simultaneously ground up, sieved, sieving powder and 1:10 in mass ratio are collected, incited somebody to action
Sieve powder and disodium hydrogen phosphate-sodium dihydrogen phosphate, which are stirred and collect mixed liquor, to be placed in refiner, and homogenized is simultaneously
It is dry, obtain photosensitive protein particle；
(2) take gardenia petal and clean and crush, collect and crush petal and according to parts by weight, respectively 45~50 parts of weighing go from
Sub- water, 55~60 parts of dehydrated alcohols, 1~2 part of glacial acetic acid and 10~15 parts of crushing petals are placed in three-necked flask, are stirred simultaneously
Insulation reaction, filters and collects filtrate, and rotary evaporation obtains white pigment concentrate；
(3) according to parts by weight, 45~50 parts of UV resin UV2282,10~15 part of 200 mesh titanium dioxide, 3~5 parts of sulphur are weighed respectively
Sour barium, 10~15 parts of photosensitive protein particles, are stirred to obtain component A；
(4) again according to parts by weight, 40~45 parts of epoxy resin E-41,10~15 part of 200 mesh titanium dioxide, 3~5 parts are weighed respectively
Fumed silica and 25~30 parts of n,N-Dimethylformamide are placed in a beaker, and are stirred to obtain component B；
(5) component A and component B are stirred and are placed in dispersion machine by 1:1 in mass ratio, are protected from light dispersion, collect dispersion liquid simultaneously
Grinding filtering, high catalytic efficiency type photocuring white solder mask material can be prepared by collecting filtering slurries.
2. a kind of preparation method of high catalytic efficiency type photocuring white solder mask material according to claim 1,
Be characterized in that: disodium hydrogen phosphate-sodium dihydrogen phosphate described in step (1) is 5mmol/L disodium hydrogen phosphate-sodium dihydrogen phosphate
Solution.
3. a kind of preparation method of high catalytic efficiency type photocuring white solder mask material according to claim 1,
Be characterized in that: rotary evaporation described in step (2) is that rotation is evaporated to the 1/5 of filtrate volume at 45~50 DEG C.
4. a kind of preparation method of high catalytic efficiency type photocuring white solder mask material according to claim 1,
Be characterized in that: it is 5 μm that aperture of filter screen is filtered in grinding described in step (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811098963.4A CN109181406A (en) | 2018-09-20 | 2018-09-20 | A kind of preparation method of high catalytic efficiency type photocuring white solder mask material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811098963.4A CN109181406A (en) | 2018-09-20 | 2018-09-20 | A kind of preparation method of high catalytic efficiency type photocuring white solder mask material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109181406A true CN109181406A (en) | 2019-01-11 |
Family
ID=64908672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811098963.4A Withdrawn CN109181406A (en) | 2018-09-20 | 2018-09-20 | A kind of preparation method of high catalytic efficiency type photocuring white solder mask material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109181406A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004086845A2 (en) * | 2003-03-28 | 2004-10-14 | Freescale Semiconductor, Inc. | Flip-chip assembley with thin underfill and thick solder mask |
| CN102352150A (en) * | 2011-08-09 | 2012-02-15 | 江门市阪桥电子材料有限公司 | Liquid photosensitive solder resist white oil and manufacturing method thereof |
| CN102757692A (en) * | 2011-06-10 | 2012-10-31 | 戴龙飞 | Thermosetting system white ink composition of LED flexible strip plate |
-
2018
- 2018-09-20 CN CN201811098963.4A patent/CN109181406A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004086845A2 (en) * | 2003-03-28 | 2004-10-14 | Freescale Semiconductor, Inc. | Flip-chip assembley with thin underfill and thick solder mask |
| CN102757692A (en) * | 2011-06-10 | 2012-10-31 | 戴龙飞 | Thermosetting system white ink composition of LED flexible strip plate |
| CN102352150A (en) * | 2011-08-09 | 2012-02-15 | 江门市阪桥电子材料有限公司 | Liquid photosensitive solder resist white oil and manufacturing method thereof |
Non-Patent Citations (2)
| Title |
|---|
| 刘涛: "《大型海藻实验技术》", 31 May 2016 * |
| 邓开野等: "《天然药物概论》", 30 April 2008 * |
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Application publication date: 20190111 |