CN109148521B - Display module and display screen - Google Patents
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- CN109148521B CN109148521B CN201810886122.3A CN201810886122A CN109148521B CN 109148521 B CN109148521 B CN 109148521B CN 201810886122 A CN201810886122 A CN 201810886122A CN 109148521 B CN109148521 B CN 109148521B
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- 239000000463 material Substances 0.000 claims description 25
- 239000004952 Polyamide Substances 0.000 claims description 7
- 239000005062 Polybutadiene Substances 0.000 claims description 7
- 239000004642 Polyimide Substances 0.000 claims description 7
- 229920002647 polyamide Polymers 0.000 claims description 7
- 229920002857 polybutadiene Polymers 0.000 claims description 7
- 239000004417 polycarbonate Substances 0.000 claims description 7
- 229920000515 polycarbonate Polymers 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 7
- 239000004814 polyurethane Substances 0.000 claims description 7
- 229920002635 polyurethane Polymers 0.000 claims description 7
- 239000004800 polyvinyl chloride Substances 0.000 claims description 7
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229940037003 alum Drugs 0.000 claims description 4
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
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- 239000007772 electrode material Substances 0.000 claims 2
- 239000010410 layer Substances 0.000 description 250
- 238000004806 packaging method and process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
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- 230000007547 defect Effects 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
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- 238000005452 bending Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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Abstract
The invention relates to a display module and a display screen, wherein the display module comprises: the array substrate comprises an array substrate and a planarization layer formed on the array substrate. The planarization layer comprises a first planarization layer formed on the array substrate and a second planarization layer formed on the first planarization layer, and the elastic modulus of the first planarization layer is smaller than or larger than that of the second planarization layer. Through dividing into first planarization layer and second planarization layer with the planarization layer, and the elastic modulus of first planarization layer is unequal with the elastic modulus of second planarization layer, can effectively solve the too concentrated problem of stress when display module assembly receives foreign object impact, and wherein the planarization layer that elastic modulus is little can be used as flexible buffer layer, avoids stress concentration.
Description
Technical Field
The invention relates to the field of display, in particular to a display module and a display screen.
Background
An Organic Light-Emitting Diode (OLED) display panel, also called an Organic electroluminescent display panel, is a new flat display device, and has the advantages of simple manufacturing process, low cost, low power consumption, high brightness, thin and Light volume, fast response speed, easy realization of color display and large-screen display, easy realization of flexible display, and the like, thereby having a wide application prospect.
After the organic light emitting diode display panel is manufactured, a series of reliability tests of the display panel are generally required, the impact resistance of a screen is generally tested by adopting a ball drop test, and in the test scheme and practical use, the phenomenon that local stress of the display panel is increased suddenly due to instant impact exists, so that abnormal display may be caused.
Therefore, when the display panel is subjected to an instantaneous impact, the stress applied to the display panel increases rapidly, and display defects such as black spots, bright spots, and color spots are likely to occur in the display region.
Disclosure of Invention
Accordingly, it is desirable to provide a display panel, a display module and a method for manufacturing the same, which are directed to the problem that the display panel is prone to display defects when being impacted.
A display module, comprising: an array substrate; a planarization layer formed on the array substrate; the planarization layer comprises a first planarization layer formed on the array substrate and a second planarization layer formed on the first planarization layer, and the elastic modulus of the first planarization layer is smaller than or larger than that of the second planarization layer.
In one embodiment, the surface of the first planarizing layer facing the second planarizing layer has a concave-convex structure thereon, and the first planarizing layer is in fixed contact with the second planarizing layer through the concave-convex structure.
In one embodiment, the concave-convex structure comprises a plurality of grooves, and the grooves are sequentially arranged in an equally-spaced manner.
In one embodiment, the depth of the groove is less than the thickness of the first planarizing layer; the depth of the first groove ranges from 0.3 micrometers to 0.8 micrometers.
In one embodiment, the planarization layer comprises at least one first planarization layer and at least one second planarization layer which are stacked, and the surface of at least one side of each first planarization layer is provided with a concave-convex structure and is fixedly contacted with the adjacent second planarization layer through the concave-convex structure. In one embodiment, the first planarization layer includes a plurality of support posts formed on the array substrate; the voids between adjacent two of the plurality of pillars are filled with the same material as the second planarizing layer.
In one embodiment, the plurality of pillars are arranged in sequence at equal intervals, and the longitudinal section of each pillar is a trapezoid or a rectangle with a narrow top and a wide bottom.
In one embodiment, the material of the first planarizing layer is made of any one of butadiene rubber, polyurethane, polyvinyl chloride and polyamide or any one of polycarbonate, polyimide, polyether alum resin and epoxy resin; the second planarization layer is made of any one of polycarbonate, polyimide, polyether-alum resin and epoxy resin or any one of butadiene rubber, polyurethane, polyvinyl chloride and polyamide.
In one embodiment, the planarization layer includes a first planarization layer of a first layer formed on the array substrate, a second planarization layer formed on the first planarization layer of the first layer, and a first planarization layer of a second layer formed on the second planarization layer.
A display screen comprises the display module.
Above-mentioned display module assembly and display screen, this display module assembly includes: the array substrate comprises an array substrate and a planarization layer formed on the array substrate. The planarization layer comprises a first planarization layer formed on the array substrate and a second planarization layer formed on the first planarization layer, and the elastic modulus of the first planarization layer is smaller than or larger than that of the second planarization layer. Through dividing into first planarization layer and second planarization layer with the planarization layer, and the elastic modulus of first planarization layer is unequal with the elastic modulus of second planarization layer, can effectively solve the too concentrated problem of stress when display module assembly receives foreign object impact, and wherein the planarization layer that elastic modulus is little can be used as flexible buffer layer, avoids stress concentration.
Drawings
FIG. 1 is a schematic longitudinal cross-sectional view of a display module;
FIG. 2 is a partial cross-sectional view of a display module according to an embodiment of the present disclosure;
fig. 3a to 3b are partial cross-sectional views of a display module according to an embodiment of the present disclosure;
FIG. 4 is a partial cross-sectional view of a display module according to an embodiment of the present application;
FIG. 5 is a partial cross-sectional view of a display module according to an embodiment of the present application;
fig. 6 is a partial cross-sectional view of a display module according to an embodiment of the present application.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
As described in the background, after the conventional oled display panel is manufactured, the reliability of the display panel is usually tested. Generally, the screen reliability will be tested using a ball drop test. For example, under the following specific experimental conditions: when a steel ball with the weight of 32.65g and the diameter of 20mm is used, the falling ball is fixed on a clamp and falls from the height of 2cm to 62.5cm, and the falling ball hits the surface of the screen, the experimental result shows that the hitting area of the surface of the screen has the defects of black spots, bright spots, color spots and the like. The inventor analyzes and learns that the stress on the screen body is concentrated on the falling point of the falling ball at the moment when the falling ball hits the screen body, and the stress cannot be dispersed, so that a film layer in the display panel is damaged and even the display panel is broken.
Based on this, this application provides a display module assembly, can release the stress on the screen body, improves display panel's reliability. The display module of this application can be applied to hard screen (like the LCD display screen), also can be applied to flexible display screen (like AMOLED flexible display screen).
Fig. 1 shows a longitudinal cross-sectional view of a display module. The display panel includes a substrate 110, a driving layer 120, a planarization layer 130, a first electrode layer 140, a light emitting layer 150, a second electrode layer 160, and a pixel defining layer 170. Among them, the driving layer 120 includes a TFT (thin film transistor). The light emitting layer 150 is divided into a first sub-pixel 181, a second sub-pixel 182, and a third sub-pixel 183. The first electrode layer 140 is electrically connected to the lead conductive layer 121 through a through hole provided in the planarization layer 130. An opening is provided on the pixel defining layer 170 at a position corresponding to the light emitting layer 150. When the first electrode layer 140 is driven by the driving layer 120 to obtain a positive voltage, the light emitting layer 150 is located between the first electrode layer 140 and the second electrode layer 160, and the light emitting layer generates visible light due to excitation. The light has different brightness according to the magnitude of the voltage. Depending on the material, for example, the first sub-pixel 181 may be a red sub-pixel, the second sub-pixel 182 may be a blue sub-pixel, and the material of the third sub-pixel 183 may be a green sub-pixel, and the emission layer emits red, green, or blue light. It should be noted that the term "longitudinal section" as used herein refers to a section parallel to the falling movement direction of the falling ball. In one embodiment, a display module is provided. The display module includes an array substrate 210 and a planarization layer 130 formed on the array substrate. The planarization layer 130 includes a first planarization layer 220 formed on the array substrate 210 and a second planarization layer 230 formed on the first planarization layer 220, and an elastic modulus of the first planarization layer 220 is smaller or greater than an elastic modulus of the second planarization layer 230.
Referring to fig. 2, the array substrate 210 includes a thin film transistor, which generally includes a buffer layer 211, a semiconductor layer 212 formed on the buffer layer 211, the semiconductor layer including a source region 212a, a drain region 212b, and a channel region 212c between the source region 212a and the drain region 212 b. The thin film transistor further includes a gate insulating layer 213 on the semiconductor layer 212 and a gate electrode 214 on the gate insulating layer 213. The gate electrode 214 includes an interlayer insulating layer 215 thereon, and the source and drain electrodes 216 and 217 are positioned on the interlayer insulating layer 215 and are electrically connected to the source and drain regions 212a and 212b through contact holes.
Specifically, the source electrode 216 and the drain electrode 217 are covered with the planarization layer 130, and the planarization layer 130 includes a first planarization layer 220 formed on the array substrate 210 and a second planarization layer 230 formed on the first planarization layer 220. Contact holes are formed in both the first planarizing layer 220 and the second planarizing layer 230 to extend to the drain electrode 217. The elastic modulus of the first planarization layer 220 is smaller or larger than that of the second planarization layer 230. It is understood that a passivation layer is further disposed between the interlayer insulating layer 215 and the planarization layer 130, and the disposition of the passivation layer is well known in the art and will not be described herein.
When the elastic modulus of the first planarizing layer 220 is smaller than that of the second planarizing layer 230, the first planarizing layer 220 functions as a stress absorbing layer. Because the first electrode layer 140 is closer to the first planarization layer 220, when the display module is impacted by a heavy object, the stress on the first electrode layer 140 can be dispersed to a certain degree, so that the bending characteristic of the display module is enhanced, and the reliability of the display module in a ball drop test is improved.
When the elastic modulus of the first planarizing layer 220 is greater than that of the second planarizing layer 230, the second planarizing layer 230 functions as a stress absorbing layer. Because the first electrode layer 140 is directly located above the second planarization layer 230, when the display module is impacted by a heavy object, the second planarization layer 230 serves as a stress buffer layer, and the stress applied to the first electrode layer 140 can be dispersed, so that the bending characteristic of the display module is enhanced, and the reliability of the display module in a ball drop test is improved.
Further, the planarization layer 130 has a thickness ranging from 1.5 micrometers to 3 micrometers. When the elastic modulus of the first planarization layer is smaller than that of the second planarization layer, the material of the first planarization layer is any one flexible organic material of butadiene rubber, polyurethane, polyvinyl chloride and polyamide, and the thickness of the first planarization layer ranges from 0.8 micrometers to 1.2 micrometers. The material of the second planarization layer is any one of polycarbonate, polyimide, polyether vitriol resin and epoxy resin, and the thickness of the second planarization layer ranges from 0.5 micrometers to 1.8 micrometers. It is to be understood that when the elastic modulus of the first planarizing layer is greater than that of the second planarizing layer, the material of the first planarizing layer may be any one of polycarbonate, polyimide, polyethervitriol, and epoxy. The material of the second planarization layer can be any flexible organic material of butadiene rubber, polyurethane, polyvinyl chloride and polyamide.
In this embodiment, the planarization layer is divided into the first planarization layer and the second planarization layer, and the elastic modulus of the first planarization layer is different from the elastic modulus of the second planarization layer, so that the problem of too concentrated stress when the display module is impacted by a foreign object can be effectively solved, and the planarization layer with a smaller elastic modulus can be used as a stress buffer layer to avoid stress concentration.
In one embodiment, referring to fig. 3a, the planarization layer 130 includes a first planarization layer 220 formed on the array substrate 210 and a second planarization layer 230 formed on the first planarization layer 220. The surface of the first planarization layer 220 facing the second planarization layer 230 has a concave-convex structure 310 thereon, and the first planarization layer 220 is in fixed contact with the second planarization layer 230 through the concave-convex structure 310. Specifically, a first planarization layer 220 is formed on the array substrate 210, and a second planarization layer 230 is formed on the first planarization layer 220. The surface of the first planarization layer 220 facing the second planarization layer 230 has the concave-convex structure 310 thereon, and the concave-convex structure 310 makes the surface of the first planarization layer 220 facing the second planarization layer 230 uneven, increasing a contact area between the first planarization layer 220 and the second planarization layer 230, thereby increasing an adhesive force between the first planarization layer 220 and the second planarization layer 230 by the concave-convex structure 310.
Further, the concave-convex structure 310 includes a first groove 311, and a plurality of the first grooves 311 are sequentially arranged in an equally spaced manner. The depth of the first groove 311 may be less than the thickness of the first planarization layer 220, and the depth of the first groove 311 ranges from 0.3 micrometers to 0.8 micrometers. The second planarization layer 230 is formed on the surface of the first planarization layer 220 having the plurality of first grooves 311, and then the plurality of first grooves 311 are filled with the same material as the second planarization layer 230. The surface of the second planarization layer 230 facing the first electrode 140 may be flat, and the surface of the first electrode 140 formed on the second planarization layer 230 is also flat, thereby ensuring flatness of the light emitting layer.
It is understood that the surface of the second planarization layer 230 facing the first electrode 140 may also be uneven. For example, referring to fig. 3b, a plurality of second grooves 321 are disposed on a surface of the second planarization layer 230 facing the first electrode 140. When the first electrode 140 is formed on the second planarization layer 230, the material of the first electrode 140 fills the second grooves 321, and the surface of the first electrode 140 facing away from the second planarization layer 230 can also be made flat by some processing methods such as inkjet printing. The plurality of second grooves 321 increases a contact area between the first electrode 140 and the second planarization layer 230, and increases an adhesive force between the first electrode 140 and the second planarization layer 230. When the display module is impacted by a foreign object, the first electrode 140 and the second planarization layer 230 are not easily peeled off due to the increased adhesion between the first electrode 140 and the second planarization layer 230, thereby improving the reliability of the display module.
In one embodiment, referring to fig. 4, the first planarization layer 220 includes a plurality of first pillars 410, and the plurality of first pillars 410 are formed on the array substrate 210. The plurality of first support columns 410 are sequentially arranged at equal intervals, and the longitudinal section of the plurality of first support columns 410 is trapezoidal or rectangular. It should be noted that the term "longitudinal section" used in the present embodiment refers to a section parallel to the falling movement direction of the falling ball.
Specifically, the first planarizing layer 220 is prepared on the array substrate 210, and the material of the first planarizing layer 220 may be any one of flexible organic materials such as butadiene rubber, polyurethane, polyvinyl chloride, and polyamide. The first planarization layer 220 is patterned to form a plurality of first pillars 410. Since the surface of the array substrate 210 facing the planarization layer 130 is not flat, the heights of the plurality of first pillars 410 are not the same. The height of the plurality of first pillars 410 may range from 0.8 microns to 1.2 microns. The longitudinal cross-section of the first plurality of struts 410 may be trapezoidal or rectangular. When the longitudinal section of the first pillar 410 is trapezoidal, the first pillar 410 may be shaped as a truncated cone or a truncated pyramid. When the longitudinal section of the first pillar 410 is rectangular, the shape of the first pillar 410 may be a cylinder or a rectangular parallelepiped.
After patterning the first planarization layer 220, a second planarization layer 230 is formed on the first planarization layer 220. The material of the second planarization layer 230 may be any one of polycarbonate, polyimide, polyethervitriol, and epoxy. First, the material of the second planarization layer 230 fills the gap between adjacent two first pillars 410 of the plurality of first pillars 410. Next, the second planarizing layer 230 is formed on the first planarizing layer 220 after having been filled with the same material as the second planarizing layer 230. In order to ensure the flatness of the planarization layer, the thickness of the second planarization layer may be greater than that of the first planarization layer. Preferably, the thickness of the second planarizing layer ranges from 1.2 micrometers to 1.8 micrometers. It should be noted that the materials used for the first planarizing layer 220 and the second planarizing layer 230 can be interchanged, and this embodiment is only for illustration and is not limited thereto.
In this embodiment, the planarization layer is divided into a first planarization layer and a second planarization layer, and the first planarization layer is patterned to be formed on the array substrate in an array structure. The material of the second planarizing layer fills the voids in the first planarizing layer. And the elastic modulus of the first planarization layer is different from that of the second planarization layer, so that the stress in the impact process can be dispersed, and the impact resistance of the display module is improved.
In one embodiment, referring to fig. 5, the planarization layer 130 includes at least one first planarization layer 220 and at least one second planarization layer 230 stacked, and a surface of at least one side of each first planarization layer 220 has a concave-convex structure and is in fixed contact with the adjacent second planarization layer 230 through the concave-convex structure, and specifically, the display module includes an array substrate 210 and a planarization layer 131 formed on the array substrate. The planarization layer 130 includes at least one first planarization layer 220 and at least one second planarization layer 230 formed on the array substrate 210. Wherein, at least one first planarization layer 220 and at least one second planarization layer 230 are alternately stacked, the surface of at least one side of each first planarization layer 220 has a concave-convex structure, and is fixedly contacted with the adjacent second planarization layer 230 through the concave-convex structure, and the elastic modulus of the first planarization layer 220 is smaller than or greater than that of the second planarization layer 230.
Illustratively, with continued reference to fig. 5, the planarization layer 130 includes a first planarization layer 220 of a first layer formed on the array substrate 210, a second planarization layer 230 formed on the first planarization layer 220 of the first layer, and a first planarization layer 220 of a second layer formed on the second planarization layer 230. The surface of the first planarization layer 220 of the first layer facing the second planarization layer 230 has a number of third grooves 510 thereon, and the material of the second planarization layer 230 fills the number of third grooves 510. The second planarization layer 230 has a plurality of fourth grooves 520 on a surface of the second layer facing the first planarization layer 220, and the material of the second layer of the first planarization layer 220 fills the plurality of fourth grooves 520.
Illustratively, referring to fig. 6, the planarization layer 130 includes a first planarization layer 220 of a first layer formed on the array substrate 210, a second planarization layer 230 formed on the first planarization layer 220 of the first layer, and a first planarization layer 220 of a second layer formed on the second planarization layer 230. Wherein, the surface of the first planarization layer 220 facing the second planarization layer 230 of the first layer has a plurality of third grooves 510, and the material of the second planarization layer 230 fills the plurality of third grooves 510. The second planarization layer 230 includes a plurality of second support posts 610, and the plurality of second support posts 610 correspond to the positions of the plurality of third grooves 510. The material of the second layer of the first planarizing layer 220 fills the gaps between adjacent two of the plurality of second pillars 610. Preferably, the elastic modulus of the second planarizing layer 230 in this example is smaller than that of the first planarizing layer 220.
It is understood that the materials used for the first and second planarization layers 220 and 230 are different, and the materials used for the first and second planarization layers 220 and 220 may be the same or different.
In this embodiment, the planarization layer includes at least one first planarization layer and at least one second planarization layer, which are stacked, and at least one side of each first planarization layer has a concave-convex structure, and the concave-convex structure is in fixed contact with the adjacent second planarization layer, so that the mechanical strength of the display panel is improved. In addition, the elastic modulus of the first planarization layer is different from that of the second planarization layer, so that stress in the impact process can be dispersed, and the impact resistance of the display module can be improved.
In an embodiment, an embodiment of the present application further provides a display screen, including the foregoing display module. The display screen further comprises a packaging structure, the packaging structure is arranged on the cathode layer, and the packaging structure can be any one of a thin film packaging structure or glass powder packaging. Both of these packaging methods are well known in the art and will not be described further.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A display module, comprising:
an array substrate;
a planarization layer formed on the array substrate;
wherein the planarization layer includes a first planarization layer formed on the array substrate and a second planarization layer formed on the first planarization layer, and an elastic modulus of the first planarization layer is greater than an elastic modulus of the second planarization layer; a plurality of grooves for filling electrode materials are arranged on the surface, away from the first planarization layer, of the second planarization layer, and the depth of the grooves for filling the electrode materials is smaller than the thickness of the second planarization layer;
and forming a first electrode on the surface of the second planarization layer, which faces away from the first planarization layer, wherein the material of the first electrode fills the grooves, the grooves are used for increasing the contact area between the first electrode and the second planarization layer, and the surface of the first electrode, which faces away from the second planarization layer, is flat.
2. The display module according to claim 1, wherein the surface of the first planarizing layer facing the second planarizing layer has a concave-convex structure thereon, and the first planarizing layer is in fixed contact with the second planarizing layer through the concave-convex structure.
3. The display module according to claim 2, wherein the concave-convex structure comprises a plurality of grooves, and the plurality of grooves are sequentially arranged in an equally spaced manner.
4. The display module of claim 3, wherein the depth of the groove is less than the thickness of the first planarizing layer; the depth of the grooves ranges from 0.3 microns to 0.8 microns.
5. The display module according to claim 2, wherein the planarization layer comprises at least one first planarization layer and at least one second planarization layer, which are alternately stacked, and a surface of at least one side of each first planarization layer has a concave-convex structure, and is fixedly contacted with the adjacent second planarization layer through the concave-convex structure.
6. The display module of claim 1, wherein the first planarization layer comprises a plurality of support posts formed on the array substrate; the space between two adjacent ones of the plurality of pillars is filled with the same material as the second planarizing layer.
7. The display module of claim 6, wherein the plurality of support posts are arranged in sequence at equal intervals, and the longitudinal section of the plurality of support posts is trapezoidal or rectangular.
8. The display module according to any one of claims 1 to 7, wherein the material of the first planarization layer is any one of butadiene rubber, polyurethane, polyvinyl chloride, polyamide, polycarbonate, polyimide, polyether alum resin and epoxy resin;
the second planarization layer is made of any one of polycarbonate, polyimide, polyether-alum resin, epoxy resin, butadiene rubber, polyurethane, polyvinyl chloride and polyamide.
9. The display module of claim 8, wherein the planarization layer comprises a first planarization layer formed on a first layer of the array substrate, a second planarization layer formed on the first planarization layer of the first layer, and a second planarization layer formed on the first planarization layer of the second layer.
10. A display screen, characterized by comprising the display module of any one of claims 1 to 9.
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| CN109755287B (en) * | 2019-02-25 | 2021-12-28 | 武汉华星光电半导体显示技术有限公司 | Flexible OLED device and preparation method thereof |
| CN110083269B (en) * | 2019-04-28 | 2022-08-19 | 云谷（固安）科技有限公司 | Display panel and preparation method thereof |
| CN110707232A (en) * | 2019-09-12 | 2020-01-17 | 武汉华星光电半导体显示技术有限公司 | Display device |
| CN112259579B (en) * | 2020-10-10 | 2024-06-07 | 深圳市华星光电半导体显示技术有限公司 | OLED display panel and manufacturing method thereof |
| CN112635530B (en) * | 2020-12-21 | 2022-09-16 | 武汉天马微电子有限公司 | Display panel and display device |
| CN114447000A (en) * | 2022-01-28 | 2022-05-06 | 深圳市华星光电半导体显示技术有限公司 | Display panel and method of making the same |
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