CN109140252A - Lamps and lanterns, LED light source and its manufacturing method - Google Patents
Lamps and lanterns, LED light source and its manufacturing method Download PDFInfo
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- CN109140252A CN109140252A CN201810978827.8A CN201810978827A CN109140252A CN 109140252 A CN109140252 A CN 109140252A CN 201810978827 A CN201810978827 A CN 201810978827A CN 109140252 A CN109140252 A CN 109140252A
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
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Abstract
本发明涉及一种灯具、LED光源及其制造方法，其中灯具包括灯主体及LED光源。LED光源包括基板、红光单元、至少两个芯片单元及至少两种荧光层，芯片单元及红光单元体均设置于基板上。单个芯片单元包括至少一颗蓝光芯片，荧光层覆盖于蓝光芯片上，蓝光芯片用于激发不同种类的荧光层混合出不同色温的白光。至少有一个芯片单元对应一种荧光层，至少有另一个芯片单元对应另一种荧光层。红光单元包括至少一个红光发光体。LED光源的制造方法包括步骤：提供基板；将红光单元及至少两个芯片单元设置于基板上；将至少两种荧光层覆盖于蓝光芯片上。上述灯具、LED光源及其制造方法具有色温可调、宽色域且显色性好的特点。
The invention relates to a lamp, an LED light source and a manufacturing method thereof, wherein the lamp includes a lamp body and an LED light source. The LED light source includes a substrate, a red light unit, at least two chip units and at least two fluorescent layers, and the chip unit and the red light unit are both arranged on the substrate. The single chip unit includes at least one blue light chip, the phosphor layer covers the blue light chip, and the blue light chip is used to excite different types of phosphor layers to mix white light with different color temperatures. At least one chip unit corresponds to one type of phosphor layer, and at least one other chip unit corresponds to another type of phosphor layer. The red light unit includes at least one red light emitter. The manufacturing method of the LED light source includes the steps of: providing a substrate; arranging the red light unit and at least two chip units on the substrate; and covering the blue light chip with at least two fluorescent layers. The above-mentioned lamp, LED light source and manufacturing method thereof have the characteristics of adjustable color temperature, wide color gamut and good color rendering.
Description
Technical field
The present invention relates to LED technology fields, more particularly to a kind of lamps and lanterns, LED light source and its manufacturing method.
Background technique
LED light source is concerned because having many advantages, such as environmentally protective, long-life and low energy consumption, has been widely used in
Commercial lighting and the at home fields such as illumination.LED light source can be used as the light source of the lamps and lanterns such as ornament lamp, emergency light and headlamp, have
Good market prospects.Traditional LED light source mostly uses greatly blue chip that a kind of fluorescent powder is added to be made, and there are light source color temperatures
Problem single, colour gamut is relatively narrow and colour rendering is poor.
Summary of the invention
Based on this, it is necessary in view of the above-mentioned problems, providing a kind of adjustable color, wide colour gamut and the good lamps and lanterns of colour rendering, LED
Light source and its manufacturing method.
A kind of LED light source, comprising:
Substrate；
At least two chip units are set on the substrate, and the single chip unit includes an at least blue light core
Piece；
At least two fluorescence coatings are covered on the blue chip, at least one described chip unit corresponds to a kind of institute
Fluorescence coating is stated, at least the corresponding another fluorescence coating of another described chip unit；And
Red light unit is set on the substrate, and the red light unit includes at least one red emitting luminophores；
Wherein, the white light that the blue chip is used to that different types of fluorescence coating to be excited to blend different-colour.
At least a kind of fluorescence coating is warm colour temperature fluorescence coating in one of the embodiments, at least described in one kind
Fluorescence coating is cool colour temperature fluorescence coating.
The fluorescence coating is fluorescent adhesive layer in one of the embodiments, and different types of fluorescent adhesive layer has not
The same emission wavelength that is excited, so that the white light has different colour temperatures.
It in one of the embodiments, further include protective layer, the red emitting luminophores are red light chips, and the protective layer covers
It is placed on the red light chips.
Dividing on the substrate in one of the embodiments, has at least two luminous zones, sets in a luminous zone
It is equipped with the chip unit.
The red light unit is provided in each luminous zone in one of the embodiments,.
The adjustment module in one of the embodiments, further including thermistor and being electrically connected with the thermistor, institute
It states thermistor to be set on the substrate, the temperature T of the resistance value of the thermistor and the thermistorRHIt is corresponding, institute
Adjustment module is stated for according to the TRHAdjust the current or voltage of the chip unit Yu the red light unit.
A kind of lamps and lanterns, comprising:
Lamp main body；And
LED light source as described above is set in the lamp main body.
Above-mentioned lamps and lanterns and LED light source have at least the following advantages:
At least one chip unit corresponds to a kind of fluorescence coating, at least the corresponding another fluorescence of another chip unit
Layer, this corresponded manner makes a chip unit correspond to a kind of fluorescence coating, to guarantee light out that lamps and lanterns and LED light source have had
Effect.In use, a chip unit excites a kind of its corresponding fluorescence coating to blend the white light with a kind of colour temperature.It is not homochromy
The feux rouges that the white light and red emitting luminophores of temperature issue can be marked as different drop points in gamut map, and different drop points can be by
Power drives work independently.A polygon can be formed by vertex of drop point, it can be by adjusting on chip unit and red light unit
The mode of current or voltage obtain the color gamut value in the gamut range that the polygon surrounds at any point, further to make lamps and lanterns
And LED light source has wide colour gamut, and adjustable color.Since blue chip excites the white light of fluorescence coating generation to the reproducibility of color
It is poor, compared with only with the light source of blue chip, the presence of red emitting luminophores can play red spectral band compensating action, to mention
The light efficiency and raising colour rendering index of high entire light source.
A kind of manufacturing method of LED light source, comprising the following steps:
Substrate is provided；
Red light unit and at least two chip units are set on the substrate, the red light unit includes at least one
Red emitting luminophores, the single chip unit include an at least blue chip；And
At least two fluorescence coatings are covered on the blue chip, at least one described chip unit corresponds to a kind of institute
Fluorescence coating is stated, at least the corresponding another fluorescence coating of another described chip unit, wherein the blue chip is for swashing
Sending out the fluorescence coating different types of blends the white light of different-colour.
The manufacturing method of above-mentioned LED light source has at least the following advantages:
When manufacture, substrate is provided, red light unit and at least two chip units are set on substrate, red light unit includes
At least one red emitting luminophores, one single chip unit include an at least blue chip, substrate for carry red emitting luminophores and
Blue chip.At least two fluorescence coatings are covered on blue chip, blue chip is for exciting fluorescence coating to blend white light.Extremely
A rare chip unit corresponds to a kind of fluorescence coating, at least the corresponding another fluorescence coating of another chip unit, this correspondence
Mode makes a chip unit correspond to a kind of fluorescence coating, to guarantee light-out effect that LED light source has had.Blue chip is used for
Different types of fluorescence coating is excited to blend the white light of different-colour, the feux rouges that the white light and red emitting luminophores of different-colour issue
Different drop points can be marked as in gamut map, different drop points can be powered by a power supply the generation that works independently.It is with drop point
Vertex can form a polygon, and it is more can to obtain this by adjusting the mode of chip unit and the current or voltage in red light unit
Color gamut value in the gamut range that side shape surrounds at any point, further to make LED light source that there is wide colour gamut, and adjustable color.
Since the white light that blue chip excitation fluorescence coating generates is poor to the reproducibility of color, compared with only with the light of blue chip
The presence in source, red emitting luminophores can play red spectral band compensating action, be referred to improving the light efficiency of entire light source and improving colour developing
Number.
Technical solution is illustrated further below:
Red light unit and at least two chip units are set on the substrate in step in one of the embodiments,
Later, the protective mulch on the red emitting luminophores is further comprised the steps of:.
Detailed description of the invention
Fig. 1 is the front view of LED light source in an embodiment；
Fig. 2 is the schematic diagram of drop point of the LED light source in gamut map in Fig. 1；
Fig. 3 is the front view of LED light source in a further embodiment；
Fig. 4 is the flow diagram of the manufacturing method of LED light source in an embodiment；
Fig. 5 is the flow diagram of the manufacturing method of LED light source in another embodiment.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.Many details are explained in the following description in order to fully understand this hair
It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not
Similar improvement is done in the case where violating intension of the present invention, therefore the present invention is not limited to the specific embodiments disclosed below.
It should be noted that it can directly on the other element when element is referred to as " being set to " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Each technical characteristic of embodiment described above can carry out arbitrarily
Combination, for simplicity of description, it is not all possible to each technical characteristic in above-described embodiment combination be all described, so
And as long as there is no contradiction in the combination of these technical features, it all should be considered as described in this specification.
Referring to Fig. 1, the LED light source 10 in an embodiment, with adjustable color, wide colour gamut and the good spy of colour rendering
Point.Specifically, LED light source 10 include substrate 100, chip unit 200, fluorescence coating and red light unit 300, chip unit 200 and
Red light unit 300 is all set on substrate 100, and fluorescence coating is covered on chip unit 200.
Substrate 100 mainly plays carrying, for carrying chip unit 200 and red light unit 300.In present embodiment
In, substrate 100 is metal substrate, the heat dissipation effect having had.Certainly, in other embodiments, substrate 100 can also be pottery
Porcelain substrate etc..
The number of chip unit 200 is at least two, and one single chip unit 200 includes an at least blue chip 211, blue
Optical chip 211 is for exciting fluorescence coating to blend white light.Specifically, a chip unit 200 includes that at least one chip is single
Member 210, when the quantity for the chip subelement 210 that a chip unit 200 includes is at least two, at least two chips is single
Member 210 can be arranged in parallel.One chip subelement 210 includes an at least blue chip 211, when a chip subelement 210
Including the quantity of blue chip 211 be at least two when, at least two blue chips 211 can be arranged in series.In this embodiment party
In formula, a chip unit 200 includes 11 chip subelements 210, and a chip subelement 210 includes three blue chips
211。
Fluorescence coating can be only covered on blue chip 211, or be covered on chip unit 200 (it is to be appreciated that
In such coverage mode, when a chip unit 200 includes at least two blue chips 211, two adjacent blue chips
There is also fluorescence coatings between 211).The type of fluorescence coating is at least two, a kind of corresponding fluorescence of at least one chip unit 200
Layer, at least another chip unit answer another fluorescence coating to 200, and blue chip 211 is for exciting different types of fluorescence
Layer blends the white light of different-colour, in order to obtain different color gamut values.A kind of corresponding fluorescence coating of one chip unit 200,
It can guarantee the light-out effect that LED light source 10 has had.It should be noted that blue chip 211 herein is LED blue light core
Piece, white light refer to colour temperature for 3000K to the light between 6000K.Fluorescence coating can be fluorescence patch layer or fluorescent adhesive layer.In this implementation
In mode, fluorescence coating is fluorescent adhesive layer, and different types of fluorescent adhesive layer has the different emission wavelengths that is excited, so that white light has
There is different colour temperatures.Fluorescent adhesive layer has the characteristics that at low cost.Fluorescent adhesive layer includes fluorescent glue (such as silica gel) and is mixed in glimmering
Fluorescent powder in optical cement, the type of fluorescent powder can be it is a variety of, can by the modes such as the accounting that controls variety classes fluorescent powder come
Make fluorescent adhesive layer that there is the different emission wavelengths that is excited, in order to obtain the luminous wave that is excited of different length in required wave band
Long, cost is relatively low and convenience is good.
Further, at least a kind of fluorescence coating is warm colour temperature fluorescence coating, and at least a kind of fluorescence coating is cool colour temperature fluorescence
Layer, so that LED light source 10 has wider colour gamut.In the present embodiment, the type of fluorescence coating is two kinds, respectively warm colour
Warm fluorescence coating and cool colour temperature fluorescence coating.Warm colour temperature fluorescence coating is warm colour temperature fluorescent adhesive layer, including silica gel, red fluorescence powder and green
Fluorescent powder, cool colour temperature fluorescence coating are cool colour temperature fluorescent adhesive layer, including silica gel, red fluorescence powder and green emitting phosphor, and warm colour temperature
The accounting of red fluorescence powder is higher than the accounting of red fluorescence powder in cool colour temperature fluorescent adhesive layer in fluorescent adhesive layer.
Red light unit 300 includes at least one red emitting luminophores, and red emitting luminophores are for issuing feux rouges.Specifically, individually
Red light unit 300 includes at least one feux rouges subelement 310, when the number for the feux rouges subelement 310 that a red light unit 300 includes
When amount is at least two, at least two feux rouges subelements 310 can be arranged in parallel.One feux rouges subelement 310 includes at least one
Red emitting luminophores, when the quantity for the red emitting luminophores that a feux rouges subelement 310 includes is at least two, at least two feux rouges
Illuminator can be arranged in series.In the present embodiment, a red light unit 300 includes two feux rouges subelements 310, a feux rouges
Subelement 310 includes six red emitting luminophores.On the one hand the presence of red light unit 300 is convenient for covering with by different types of fluorescence coating
The combination of chip unit 200 of lid forms the light source with wide colour gamut；On the other hand, since blue chip 211 excites fluorescence coating to produce
Raw white light is poor to the reproducibility of color, compared with only with the light source of blue chip 211, the presence of red emitting luminophores can
Red spectral band compensating action is played, to improve the light efficiency of entire light source and improve colour rendering index.In the present embodiment, feux rouges
Illuminator is red light chips 311.It should be noted that red light chips 311 herein are LED red light chips.Certainly, at other
In embodiment, red emitting luminophores can also can issue the element of feux rouges for other.
Further, LED light source 10 further includes adhesive layer, and adhesive layer is between blue chip 211 and substrate 100 and red
Between light illuminator and substrate 100, blue chip 211 and red emitting luminophores pass through adhesive layer and are set on substrate 100.At this
In embodiment, the material of adhesive layer is die bond glue-line.
Further, LED light source 10 further includes protective layer, and protective layer is covered on red light chips 311, and protective layer mainly rises
Protective effect prevents the external environments such as steam corrosion red light chips 311 and the bonding wire of red light chips 311 can be protected not by external force institute
Wound.Protective layer can be fluorescence coating or substratum transparent, and protective layer can be ignored the influence of the light-out effect of feux rouges.In this reality
It applies in mode, protective layer is fluorescence coating.
Referring to Figure 2 together, in the present embodiment, it is blended after the excitation of blue chip 211 cool colour temperature fluorescent adhesive layer
Drop point of the white light in gamut map can be marked as W1, and blue chip 211 excites the white light blended after warm colour temperature fluorescent adhesive layer
Drop point in gamut map can be marked as W2, and drop point of the feux rouges that red emitting luminophores issue in gamut map can be marked as R.
Drop point W1, drop point W2 and drop point R, which can be powered by a power supply, to work independently.It can be formed using drop point W1, drop point W2 and drop point R as vertex
One triangle can obtain the triangle by adjusting the mode of the current or voltage on chip unit 200 and red light unit 300
Color gamut value in the gamut range surrounded at any point, further to make LED light source 10 that there is wide colour gamut and adjustable color.When
So, in other embodiments, the number of drop point can also be at least four, such as when the type of fluorescence coating is three kinds and feux rouges
When the type of illuminator remains unchanged, the number of drop point is four, can form a quadrangle by vertex of four drop points, can lead to
The mode for the current or voltage crossed in adjustment chip unit 200 and red light unit 300 obtains the gamut range that the quadrangle surrounds
Color gamut value at interior any point.
Referring to Fig. 1, further, dividing on substrate 100 has at least two luminous zones 110, a luminous zone 110
Inside it is provided with a chip unit 200.The design can guarantee that the white light of different-colour goes out light independence, prevent the white light of different-colour
It is interfered with each other in light out, in order to make LED light source that there is wide colour gamut.Two adjacent 110 space sets of luminous zone, so as to
In differentiation chip unit 200.In the present embodiment, Jiao Qiang (such as white silica gel wall is provided between two adjacent luminous zones 110
Deng), it can be further ensured that the white light of different-colour goes out light independence while facilitating and distinguishing chip unit 200.
Further, it is provided with red light unit 300 in each luminous zone 110, in order to well mix white light and feux rouges
It closes.When the quantity for the feux rouges subelement 310 that a red light unit 300 includes is that at least two or chip units 200 include
Chip subelement 210 quantity be at least two when, feux rouges subelement 310 is staggered with chip subelement 210, in order to
Preferably white light is mixed with feux rouges.Certainly, in other embodiments, also settable special red light district, such as two hairs
A settable red light district between light area is provided with red light unit 300 in red light district.
Further, LED light source 10 further includes electrode, electrode for being electrically connected to a power source, electrode include positive electrode 510 and
Negative electrode 520.In the present embodiment, positive electrode 510 includes positive electrode W1+, positive electrode R+ and positive electrode W2+, is covered with cold
The blue chip 211 of colour temperature fluorescent adhesive layer is electrically connected with positive electrode W1+ and is covered with the blue chip 211 of cool colour temperature fluorescent adhesive layer
It is electrically connected with negative electrode 520；The blue chip 211 for being covered with warm colour temperature fluorescent adhesive layer is electrically connected and is covered with positive electrode W2+
The blue chip 211 of warm colour temperature fluorescent adhesive layer is electrically connected with negative electrode 520；Red emitting luminophores are electrically connected with positive electrode R+ and feux rouges
Illuminator is electrically connected with negative electrode 520.LED light source 10 further includes metal wire, and blue chip 211 and electrode are electrically connected by metal wire
It connects, red emitting luminophores are electrically connected with electrode by metal wire.It is to be appreciated that when a chip subelement 210 includes at least two
When blue chip 211, at least two blue chips 211 can be arranged in series by metal wire.When a chip unit 200 includes
When at least two chip subelements 210, at least two chip subelements 210 can be arranged in parallel by metal wire.Similarly, when one
When feux rouges subelement 310 includes at least two red emitting luminophores, at least two red emitting luminophores can be arranged in series by metal wire.
When a red light unit 300 includes at least two feux rouges subelement 310, at least two red light units 300 can be by metal wire
It is arranged in parallel.
Further, LED light source 10 further includes thermistor and the adjustment module that is electrically connected with thermistor, thermistor
It is set on substrate 100, the resistance value of thermistor and the temperature T of thermistorRHCorresponding, adjustment module is used for according to temperature
TRHThe current or voltage for adjusting chip unit 200 and red light unit 300, so that the colour temperature of light source is consistent with predeterminated target.At this
In embodiment, adjustment module is external connected electronic route.It is to be appreciated that during making or using, using adjusting mould
Block is fed back and is corrected to the light specifications parameter of wide colour gamut, such as gamut error caused by temperature change etc..Further,
The presence of thermistor and adjustment module may also function as heat protective effect, such as electricity can be actively reduced when LED light source 10 overheats
Stream closes electric current.Correspondingly, dividing on substrate 100 has resistance fixed bit 530, and thermistor is set to resistance fixed bit
On 530.In the present embodiment, electrode includes resistance positive electrode 511, and resistance fixed bit 530 is located at resistance positive electrode 511 and bears
Between electrode 520.
Referring to Fig. 3, the LED light source 10 ' and the difference of the LED light source 10 in present embodiment in a further embodiment exist
In: the quantity of luminous zone 110 ' is four.One chip unit 200 ' includes eight chip subelements 210 ', and chip is single
Member 210 ' includes 17 blue chips 211 '.One red light unit 300 ' includes two feux rouges subelements 310 ', a feux rouges
Subelement 310 ' includes 23 red light chips 311 '.Positive electrode includes multiple sub- positive electrodes 512, and negative electrode includes multiple sons
Negative electrode 521, a luminous zone 110 ' are corresponding with a sub- positive electrode 512 and a sub- negative electrode 521, and a sub- positive electricity
Pole 512 and this sub- negative electrode 521 are located at the two sides of a luminous zone 110 '.Red light unit 300 ' is corresponding with one
Sub- positive electrode 512 and a sub- negative electrode 521, the corresponding sub- positive electrode 512 of red light unit 300 ' are respectively positioned on sub- negative electrode 521
Between the corresponding sub- positive electrode 512 in luminous zone 110 ' and sub- negative electrode 521.In addition, the resistance fixed bit in a further embodiment
530 ' the position on substrate 100 ' is carried out relative to the position of the resistance fixed bit 530 in present embodiment on the substrate 100
The adjustment of adaptability.
Lamps and lanterns in one embodiment include the LED light source in lamp main body and any of the above-described embodiment, LED light source setting
In in lamp main body, which can be used as decoration, emergency and illumination etc..Since lamps and lanterns include above-mentioned LED light source, therefore lamps and lanterns have color
The feature that domain is wider and colour rendering is good.
Above-mentioned lamps and lanterns and LED light source have at least the following advantages:
In use, blending the white light with a kind of colour temperature after a kind of fluorescence coating of blue chip excitation covering thereon.
At least one chip unit corresponds to a kind of fluorescence coating, at least the corresponding another fluorescence coating of another chip unit, this right
Mode is answered to be just coated with a kind of fluorescence coating on a blue chip, to guarantee that lamps and lanterns and LED light source had had goes out light efficiency
Fruit.The feux rouges that the white light and red emitting luminophores of different-colour issue can be marked as different drop points in gamut map, different
Drop point can be powered by a power supply and work independently.A polygon can be formed by vertex of drop point, can by adjusting chip unit with
The mode (i.e. regulation light emission luminance) of current or voltage in red light unit obtains any in the gamut range that the polygon surrounds
Color gamut value at point, further to make lamps and lanterns and LED light source that there is wide colour gamut and adjustable color.Since blue chip excites fluorescence
The white light that layer generates is poor to the reproducibility of color, compared with only with the light source of blue chip, the presence of red emitting luminophores
Red spectral band compensating action can be played, to improve colour rendering index.In addition, the lamps and lanterns and LED light source also have high brightness, structure letter
Single advantage.It can be by changing the arrangement mode of luminous zone, the arrangement mode of electrode, the distributing position of chip unit, chip list
The spirits such as distributing position of red emitting luminophores in the distributing position of blue chip, the distributing position of red light unit and red light unit in member
Design LED light source living, in order to simplify the structure of LED light source.This LED light source is COB (Chips On Board) light source, in color
The colour rendering index in most of region is greater than 70 in domain, and the colour rendering index in the region near Planck blackbody line can be greater than 90.
Referring to Fig. 4, the manufacturing method of the LED light source in an embodiment, has wide colour gamut and colour rendering for manufacturing
Good LED light source.The manufacturing method of the LED light source can realize that multiple color and color temperature light sources are integrated by once encapsulating.Specifically
Into present embodiment, the manufacturing method of LED light source the following steps are included:
S100 provides substrate.
Red light unit and at least two chip units are set on substrate by S200, and red light unit includes that at least one is red
Light illuminator, one single chip unit include an at least blue chip.
At least two fluorescence coatings are covered on blue chip by S300, at least one chip unit corresponds to a kind of fluorescence
The corresponding another fluorescence coating of layer, at least another chip unit, wherein blue chip is for exciting different types of fluorescence coating
Blend the white light of different-colour.
When manufacture, substrate is provided, red light unit and at least two chip units are set on substrate, red light unit includes
At least one red emitting luminophores, one single chip unit include an at least blue chip, substrate for carry red emitting luminophores and
Blue chip.At least two fluorescence coatings are covered on blue chip, blue chip excitation fluorescence coating blends white light.At least
One chip unit corresponds to a kind of fluorescence coating, at least the corresponding another fluorescence coating of another chip unit, this corresponded manner
So that a chip unit corresponds to a kind of fluorescence coating, to guarantee light-out effect that LED light source has had.Blue chip is for exciting
Different types of fluorescence coating blends the white light of different-colour, and the feux rouges that the white light and red emitting luminophores of different-colour issue is in color
Different drop points can be marked as on the figure of domain, work can be operated alone by power supply in different drop points.It can shape by vertex of drop point
At a polygon, the polygon can be obtained by adjusting the mode of chip unit and the current or voltage in red light unit and surrounded
Gamut range in color gamut value at any point, further to make LED light source that there is wide colour gamut and adjustable color.Due to blue light core
The white light that piece excites fluorescence coating to generate is poor to the reproducibility of color, compared with only with the light source of blue chip, feux rouges hair
The presence of body of light can play red spectral band compensating action, to improve colour rendering index.
Specific in present embodiment, fluorescence coating can be according to circumstances arranged using the modes such as stickup or coating.Fluorescence coating
Type is two kinds, respectively warm colour temperature fluorescent adhesive layer and cool colour temperature fluorescent adhesive layer.Due to there are two types of fluorescence coating, therefore fluorescence coating is set
Setting need to be carried out in two steps, and first warm colour temperature fluorescent adhesive layer is set on a part of blue chip, then cool colour temperature fluorescent adhesive layer is set
It is placed on another part blue chip；Alternatively, first cool colour temperature fluorescent adhesive layer is set on a part of blue chip, then by warm colour
Warm fluorescent adhesive layer is set on another part blue chip.
Referring to Fig. 5, further including step S110 after step S100 in yet another embodiment, electricity is formed on substrate
Pole.Electrode includes positive electrode and negative electrode, and blue chip is electrically connected with positive electrode and blue chip is electrically connected with negative electrode, feux rouges
Illuminator is electrically connected with positive electrode and red emitting luminophores are electrically connected with negative electrode.
It further, further include step S210, metal wire binding after step S200.Using metal wire make blue chip with
Electrode electrical connection, is electrically connected red emitting luminophores with electrode using metal wire.Specifically, a chip unit includes at least one
Chip subelement, a chip subelement include an at least blue chip.One red light unit includes at least one feux rouges
Unit, a feux rouges subelement include at least one red emitting luminophores, and red emitting luminophores can be red light chips.When a chip
When subelement includes at least two blue chips, at least two blue chips can be arranged in series by metal wire.When a chip
When unit includes at least two chip subelement, at least two chip subelements can be arranged in parallel by metal wire.Similarly, when one
When a feux rouges subelement includes at least two red emitting luminophores, at least two red emitting luminophores can be arranged in series by metal wire.
When a red light unit includes at least two feux rouges subelement, at least two red light units can be arranged in parallel by metal wire.
It further, further include step S310, the protective mulch on red emitting luminophores after step S300.In this implementation
In mode, protective layer is substratum transparent, and material is silica gel, is arranged by the way of coating.Red emitting luminophores are red light chips.
It is to be appreciated that protective layer can be arranged prior to fluorescence coating, be later than fluorescence coating setting or be arranged simultaneously with fluorescence coating.When use one
When kind fluorescence coating serves as protective layer, the photosphere can be covered in feux rouges hair together when the fluorescence coating to be covered on blue chip
In body of light.
Further, further include step S320 after step S300, thermistor is set on substrate.Thermistor
The booster action that Thermal protection can be played in the presence of one side, on the other hand can play booster action to the adjusting of light source color temperature.Temperature-sensitive
The resistance value of resistance and the temperature T of thermistorRHIt is corresponding, it can be according to TRHAdjust the electric current or electricity of chip unit and red light unit
Pressure.
Further, further include step S330 after step S300, thermistor is electrically connected with adjustment module, adjust mould
Block is used to adjust the current or voltage of chip unit and red light unit.Adjustment module is used for according to TRHAdjust chip unit and feux rouges
The current or voltage of unit, so that the colour temperature of light source is consistent with predeterminated target.Further, thermistor and adjustment module
In the presence of may also function as heat protective effect, such as electric current or closing electric current can be actively reduced when LED light source overheats.In this implementation
In mode, adjustment module is external connected electronic route.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of LED light source characterized by comprising
Substrate；
At least two chip units are set on the substrate, and the single chip unit includes an at least blue chip；
At least two fluorescence coatings are covered on the blue chip, at least one described chip unit is corresponding a kind of described glimmering
The corresponding another fluorescence coating of photosphere, at least another described chip unit；And
Red light unit is set on the substrate, and the red light unit includes at least one red emitting luminophores；
Wherein, the white light that the blue chip is used to that different types of fluorescence coating to be excited to blend different-colour.
2. LED light source according to claim 1, which is characterized in that at least a kind of fluorescence coating is warm colour temperature fluorescence
Layer, at least a kind of fluorescence coating are cool colour temperature fluorescence coating.
3. LED light source according to claim 1, which is characterized in that the fluorescence coating is fluorescent adhesive layer, different types of institute
Fluorescent adhesive layer is stated with the different emission wavelengths that is excited, so that the white light has different colour temperatures.
4. LED light source according to claim 1, which is characterized in that further include protective layer, the red emitting luminophores are feux rouges
Chip, the protective layer are covered on the red light chips.
5. LED light source according to claim 1, which is characterized in that dividing on the substrate has at least two luminous zones, and one
The chip unit is provided in a luminous zone.
6. LED light source according to claim 5, which is characterized in that be provided with the feux rouges in each luminous zone
Unit.
7. LED light source according to any one of claims 1 to 6, which is characterized in that further include thermistor and with the heat
The adjustment module of quick resistance electrical connection, the thermistor are set on the substrate, the resistance value of the thermistor with it is described
The temperature T of thermistorRHCorresponding, the adjustment module is used for according to the TRHAdjust the chip unit and the feux rouges
The current or voltage of unit.
8. a kind of lamps and lanterns characterized by comprising
Lamp main body；And
LED light source as described in any one of claim 1 to 7 is set in the lamp main body.
9. a kind of manufacturing method of LED light source, which comprises the following steps:
Substrate is provided；
Red light unit and at least two chip units are set on the substrate, the red light unit includes at least one feux rouges
Illuminator, the single chip unit include an at least blue chip；And
At least two fluorescence coatings are covered on the blue chip, at least one described chip unit is corresponding a kind of described glimmering
The corresponding another fluorescence coating of photosphere, at least another described chip unit, wherein the blue chip is for exciting not
The congener fluorescence coating blends the white light of different-colour.
10. the manufacturing method of LED light source according to claim 9, which is characterized in that step by red light unit and at least
After two chip units are set on the substrate, further comprise the steps of:
The protective mulch on the red emitting luminophores.
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