CN109119522B - Automated lighting flexible aluminum substrate - Google Patents
Automated lighting flexible aluminum substrate Download PDFInfo
- Publication number
- CN109119522B CN109119522B CN201811161496.5A CN201811161496A CN109119522B CN 109119522 B CN109119522 B CN 109119522B CN 201811161496 A CN201811161496 A CN 201811161496A CN 109119522 B CN109119522 B CN 109119522B
- Authority
- CN
- China
- Prior art keywords
- flexible
- metal
- insulating layer
- layer
- aluminum substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 75
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 63
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 63
- 229910052751 metal Inorganic materials 0.000 claims abstract description 84
- 239000002184 metal Substances 0.000 claims abstract description 84
- 239000011888 foil Substances 0.000 claims abstract description 7
- 229910000679 solder Inorganic materials 0.000 claims abstract description 7
- 239000004677 Nylon Substances 0.000 claims description 22
- 229920001778 nylon Polymers 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 230000000712 assembly Effects 0.000 claims description 8
- 238000000429 assembly Methods 0.000 claims description 8
- 239000013039 cover film Substances 0.000 claims description 7
- 239000002313 adhesive film Substances 0.000 claims description 6
- 239000012212 insulator Substances 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 4
- 230000003014 reinforcing effect Effects 0.000 claims 4
- 238000009434 installation Methods 0.000 claims 2
- 230000002787 reinforcement Effects 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 abstract description 25
- 238000005286 illumination Methods 0.000 abstract description 15
- 238000003466 welding Methods 0.000 abstract description 12
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 74
- 238000000034 method Methods 0.000 description 23
- 230000008569 process Effects 0.000 description 22
- 239000000047 product Substances 0.000 description 11
- 239000004411 aluminium Substances 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 238000007650 screen-printing Methods 0.000 description 8
- 239000011810 insulating material Substances 0.000 description 6
- 239000002390 adhesive tape Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 239000003351 stiffener Substances 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 238000010023 transfer printing Methods 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 241001391944 Commicarpus scandens Species 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000011087 paperboard Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses an automatic illumination flexible aluminum substrate, which comprises a flexible metal substrate, a circuit mounting assembly, a solder resist assembly and an illumination assembly, wherein the circuit mounting assembly comprises a metal circuit layer, a first insulating layer and a second insulating layer, the first insulating layer is attached to one side surface of the metal circuit layer, the second insulating layer is attached to one side surface of the metal circuit layer far away from the first insulating layer, and the second insulating layer is adhered to one side surface of the flexible metal substrate; the lighting assembly comprises a lighting lamp set and a chip resistor, the LED lamp assembly and the chip resistor are respectively arranged on the metal circuit layer, the LED lamp assembly and the chip resistor are respectively electrically connected with the metal circuit layer, and the LED lamp assembly and the chip resistor are accommodated in the bonding window. The product of the invention eliminates the formation of another automatic illumination flexible circuit board by the aluminum foil on the back, does not need to be welded, saves resources, reduces the harm of harmful gas generated during welding to human bodies, reduces the operation flow in the production of the prior art, and improves the production efficiency of the flexible aluminum substrate.
Description
Technical Field
The invention relates to the field of flexible aluminum substrates, in particular to an automatic illumination flexible aluminum substrate.
Background
Flexible printed wiring boards have one-sided, two-sided, and multi-layer board divisions. The base material adopted is mainly polyimide copper-clad plate. The material has high heat resistance and good dimensional stability, and is pressed with a cover film with mechanical protection and good electric insulation performance to form a final product. The surface layer and the inner layer conductors of the double-sided and multi-layer printed circuit board realize the electric connection of the inner and outer layer circuits through metallization. The flexible Circuit board can be divided into four types, namely a Lead Line (Lead Line), a Printed Circuit (Printed Circuit), a Connector (Connector) and a multifunctional integrated system (Integration of Function), and the functions of the flexible Circuit board cover the range of computers, computer peripheral auxiliary systems, consumer electronics, automobiles and the like.
However, the whole roll fluorescent tube roll coating transfer printing process flexible circuit board is widely applied, for example, to household lighting, billboard lighting, commercial lighting and the like. The traditional process production widely adopts a single flexible printed circuit board, adopts a PI insulator as a base material, then forms a flexible printed circuit board with metal coated on one side by adhering metal foil on one side, and then adopts the traditional circuit board process method to manufacture. The plate needs to be processed and welded after the LED lamp is installed later, so that the required length can be achieved. Requiring a large number of man-hours and welding materials. During welding of the finished product, harmful gas generated at high temperature is harmful to human body.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, and provides an automatic illumination flexible aluminum substrate, wherein a metal circuit layer and an illumination component are arranged on the flexible metal substrate, and when the whole roll of a roll coating transfer circuit and the whole roll of other flexible insulating materials are coated on the whole roll of the transfer circuit, the whole roll of other flexible insulating materials and the like are in the length required by a finished product, the welding processing is not needed, the resources are saved, the harm of harmful gas generated during welding to human bodies is reduced, the operation flow in the production of the prior art is reduced, and the production efficiency of the flexible aluminum substrate is improved.
The aim of the invention is realized by the following technical scheme:
an automated illuminated flexible aluminum substrate, comprising:
a flexible metal substrate having a plurality of metal layers,
the circuit mounting assembly comprises a metal circuit layer, a first insulating layer and a second insulating layer, wherein the first insulating layer is attached to one side surface of the metal circuit layer, the second insulating layer is attached to one side surface of the metal circuit layer far away from the first insulating layer, and the second insulating layer is adhered to one side surface of the flexible metal substrate;
the welding resistance assembly comprises a whole roll of die-cut window covering film and a back adhesive tape, wherein one side surface of the whole roll of die-cut window covering film is adhered to one side surface of the first insulating layer, which is far away from the metal circuit layer, an adhesion window is formed in the whole roll of die-cut window covering film, and the back adhesive tape is adhered to one side surface of the flexible metal substrate, which is far away from the second insulating layer; and
The lighting assembly comprises a lighting lamp set and a chip resistor, wherein the lighting lamp set and the chip resistor are respectively arranged on the metal circuit layer, the lighting lamp set and the chip resistor are respectively electrically connected with the metal circuit layer, and the lighting lamp set and the chip resistor are accommodated in the bonding window.
In one embodiment, the flexible metal substrate has an elongated structure.
In one embodiment, the first insulating layer is an adhesive or a thermosetting flexible adhesive film.
In one embodiment, the second insulating layer is an adhesive or a thermosetting flexible adhesive film.
In one embodiment, the metal wiring layer is a copper foil wiring layer.
In one embodiment, the flexible metal substrate is aluminum foil.
In one embodiment, the lighting lamp group is a fluorescent lighting tube.
In one embodiment, the length of the fluorescent lighting tube is 50 mm-2000 mm.
In one embodiment, the first insulating layer and the second insulating layer are equal in thickness.
In one embodiment, the first insulating layer is a PI insulator.
Compared with the prior art, the invention has the following advantages:
the invention relates to an automatic illumination flexible aluminum substrate, which is characterized in that a metal circuit layer and an illumination component are arranged on a flexible metal substrate, and a whole roll of a roll coating transfer circuit and a whole roll of other flexible insulating materials are adopted on the whole roll of the circuit, so that when the length required by a finished product is obtained, the welding processing is not needed, the resources are saved, the harm of harmful gas generated during welding to human bodies is reduced, the operation flow in the production of the prior art is reduced, and the production efficiency of the flexible aluminum substrate is improved. In addition, the flexible aluminum substrate solves the problem that the traditional circuit board is deformed due to screen printing process screen printing plate deformation, screen printing plate expansion and contraction, uneven tension causes circuit deformation, a bonding pad is misplaced, and a customer cannot load a steel mesh in SMT production.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of an automated illumination flexible aluminum substrate according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a metal circuit layer according to an embodiment shown in fig. 1.
Detailed Description
In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, an automated illuminated flexible aluminum substrate, comprising: the flexible metal substrate 100, the circuit mounting assembly 200, the solder resist assembly 300 and the lighting assembly 400 should be noted, wherein the flexible metal substrate 100 is used for bonding a metal circuit layer; the circuit mounting assembly 200 is used for realizing connection of a circuit; the solder resist assembly 300 is used for protecting the metal circuit layer from oxidation; the lighting assembly 400 is used to implement the lighting function of a flexible circuit board.
Referring to fig. 1, the circuit mounting assembly 200 includes a metal circuit layer 210, a first insulating layer 220 and a second insulating layer 230, wherein the first insulating layer 220 is attached to a side of the metal circuit layer 210, the second insulating layer 230 is attached to a side of the metal circuit layer 210 away from the first insulating layer 220, and the second insulating layer 220 is adhered to a side of the flexible metal substrate 100. In this way, it is possible that the upper and lower surfaces of the metal wiring layer 210 are respectively attached with an insulating paste, and the upper surface of the metal layer is attached with one layer (PI insulator), other flexible insulating material, etc., and the lower surface is attached with an insulating paste to form a three-layer structure.
Thus, by providing the first insulating layer 220 and the second insulating layer 230, a relatively stable adhesion effect can be achieved, and the phenomenon that the metal circuit layer 210 and the flexible substrate 100 are electrically interfered with each other can be prevented; in addition, the flexibility of the flexible aluminum substrate can be enhanced, and the winding performance of the flexible aluminum substrate is further improved, so that the flexible aluminum substrate can be placed in a rolled mode or in a rolled mode.
Referring to fig. 1, the solder resist assembly 300 includes a full-roll die-cut and windowed cover film 310 and a back adhesive tape 320, wherein one side of the full-roll die-cut and windowed cover film is adhered to one side of the first insulating layer away from the metal circuit layer, an adhesive window is formed in the full-roll die-cut and windowed cover film, and the back adhesive tape is adhered to one side of the flexible metal substrate away from the second insulating layer. The back adhesive tape 320 includes an adhesive layer 321 and a release layer 322, wherein the adhesive layer is adhered to a side surface of the flexible metal substrate away from the second insulating layer, and the release layer is adhered to a side surface of the adhesive layer away from the flexible metal substrate.
Referring to fig. 1, the lighting assembly 400 includes a lighting lamp set 410 and a chip resistor 420, wherein the lighting lamp set and the chip resistor are respectively disposed on the metal circuit layer, the lighting lamp set and the chip resistor are respectively electrically connected with the metal circuit layer, and the lighting lamp set and the chip resistor are accommodated in the bonding window. Thus, the flexible aluminum substrate can realize the lighting function.
Referring to fig. 2, the metal circuit layer 210 includes an anode metal wire 211 and a cathode metal wire 212, where the anode metal wire and the cathode metal wire are electrically connected with the lighting lamp set respectively, so as to supply power to the lighting lamp set, and the anode metal wire and the cathode metal wire are electrically connected with the chip resistor respectively, so that the chip resistor realizes a voltage dividing or current dividing function.
The flexible metal substrate has a long strip structure. The metal circuit layer is a copper foil circuit layer. The flexible metal substrate is aluminum foil. The flexible metal substrate is only a metal layer, and the circuit is etched on the flexible metal substrate to form an uninterrupted seamless and infinitely extending circuit layer. The metal circuit layer is a circuit formed by a copper foil conductor which extends uninterruptedly and infinitely.
The first insulating layer is an adhesive or a thermosetting flexible adhesive film. The second insulating layer is an adhesive or a thermosetting flexible adhesive film. The thickness of the first insulating layer is equal to that of the second insulating layer. The first insulating layer is a PI insulator. The second insulating layer is a PI insulator.
The lighting lamp group is a fluorescent lighting lamp tube. The length of the fluorescent lighting tube is 50 mm-2000 mm.
It can be understood that, because the structure of the automatic illumination flexible aluminum substrate is flat and long, the automatic illumination flexible aluminum substrate is easy to break in the production and use processes, so that the circuit on the flexible aluminum substrate is broken, the reject ratio of the flexible aluminum substrate is increased, the service life of the flexible aluminum substrate is also reduced, the connection equipment is seriously damaged, and the reliability of the equipment is reduced; therefore, in order to increase the structural strength of the flexible aluminum substrate, the problems that the flexible aluminum substrate is easy to break in the production and use processes, and the circuit on the flexible aluminum substrate is prevented from being broken are solved, so that the yield of the flexible aluminum substrate is improved, the service life of the flexible aluminum substrate is prolonged, the problem that equipment connected with the flexible aluminum substrate is damaged is avoided, and the reliability of the equipment is improved; for example, in an embodiment, the flexible aluminum substrate further includes a plurality of anti-breaking stiffener assemblies, each of the anti-breaking stiffener assemblies is sequentially connected, each of the anti-breaking stiffener assemblies is respectively disposed on the metal circuit layer, in one of the anti-breaking stiffener assemblies, the anti-breaking stiffener assembly includes a connecting nylon wire, a first ring sleeve, a second ring sleeve and a third ring sleeve, the connecting nylon wire is sequentially fixed with the first ring sleeve, the second ring sleeve and the third ring sleeve, the first ring sleeve includes a plurality of sequentially connected first nylon sleeves, each of the first nylon sleeves is provided with a first through hole, the second ring sleeve includes a plurality of sequentially connected second nylon sleeves, each of the second nylon sleeves is provided with a second through hole, the third ring sleeve includes a plurality of sequentially connected third nylon sleeves, each of the third nylon sleeves is provided with a third through hole, the metal circuit layer includes a plurality of sequentially connected metal wires, each of the first through holes and the third through holes; so, can increase the structural strength of flexible aluminium base board, solve flexible aluminium base board in production and use, break easily, avoid the circuit on the flexible aluminium base board to appear the problem of breaking circuit, and then improve the yields of flexible aluminium base board production to, can also improve the life of flexible aluminium base board, avoid causing the problem of damaging with flexible aluminium base board junction device, improve the reliability of device. Specifically, through setting up first nylon ring cover, second nylon ring cover and third nylon ring cover, at first, because these all are nylon materials to can not disturb the connection of circuit, guarantee that its circuit can normal work, the electric connection of circuit is reliable and stable, simultaneously, because each nylon ring cover all overlaps and put on the metal wire to, whole nylon ring cover can span on flexible aluminium base board, thereby can strengthen the structural strength of flexible aluminium base board, avoid appearing the easy problem of breaking of flexible aluminium base board.
The flexible aluminum substrate has the following beneficial effects:
the flexible aluminum substrate with the rolling coating transfer printing technology is automatically integrated (a round rolling coating transfer printing mould is manufactured according to a circuit diagram) and can be continuously and seamlessly extended, the main body is only a metal layer, and the circuit is etched on the metal layer to form a metal circuit layer. The novel process is adopted for production, and the roll coating transfer circuit process is adopted, so that the use amount of traditional equipment such as screen plates, screen frames, screen printers and the like and printing ink is reduced, the leftover materials are reduced, and the resources are saved.
The product of the invention cancels the back aluminum foil to form another automatic illumination flexible circuit board, uses the novel process to produce, adopts the full-automatic single or multiple round steel mould die cutting rolling hole to synchronously and automatically align and cover the film, uses the low-viscosity transfer film to remove the waste material generated by the rolling hole process, coats the aluminum foil with the heat conducting glue to cover the back of the product by using the automatic die cutting process to form the flexible aluminum substrate, strengthens the supporting force, improves the heat dissipation effect, prolongs the service life of the lamp beads, improves the productivity and the quality, reduces the pollution of dust to the air caused by the drilling in the traditional process, reduces the consumption of auxiliary materials (paper board and wood board) required by the drilling in the traditional process, reduces the offset phenomenon caused by manual alignment, saves time, electricity and pollution, achieves green production, saves energy and protects the environment. The flexible circuit board produced by the process solves the problems that the traditional circuit board is deformed due to screen printing process, the screen is expanded and contracted, the wire is deformed due to uneven tension, the bonding pads are misplaced, and a customer cannot put a steel mesh in SMT production.
Therefore, when the process is adopted to manufacture the circuit, the circuit is not manufactured after the material is cut like the traditional circuit board, and the circuit is welded to the required length when the circuit is manufactured to a finished product, so that a large amount of harmful gas to human bodies is avoided. The novel process is to use the whole roll of the substrate, directly use the novel process to roll-coat the transfer circuit and cover the whole roll (PI solder mask layer) and other flexible insulating materials on the whole roll of the circuit, thereby reducing the operation flow of the traditional process and improving the production efficiency. The novel process is used for production, the traditional equipment such as screen plates, screen frames, screen printers and the like are reduced, and resources are saved. The adoption of the roll coating transfer printing process can completely avoid defective products caused by the expansion and contraction of the screen plate in the traditional silk screen printing production process, the finished product does not need to be welded again when the length of the finished product is required by the client terminal, and the finished product is cut from the position of the required length. The energy consumption of the whole process is reduced, the production efficiency is improved, the quality problem caused by poor welding in the traditional production mode is also reduced, and the harm of harmful gas generated in the traditional welding mode to human bodies is reduced.
The invention relates to an automatic illumination flexible aluminum substrate, which is characterized in that a metal circuit layer and an illumination component are arranged on a flexible metal substrate, and a whole roll of a roll coating transfer circuit and a whole roll of other flexible insulating materials are adopted on the whole roll of the circuit, so that when the length required by a finished product is obtained, the welding processing is not needed, the resources are saved, the harm of harmful gas generated during welding to human bodies is reduced, the operation flow in the production of the prior art is reduced, and the production efficiency of the flexible aluminum substrate is improved. In addition, the flexible aluminum substrate solves the problem that the traditional circuit board is deformed due to screen printing process screen printing plate deformation, screen printing plate expansion and contraction, uneven tension causes circuit deformation, a bonding pad is misplaced, and a customer cannot load a steel mesh in SMT production. The flexible aluminum substrate is a whole roll which continuously replaces the traditional single Zhang Shengchan, so that energy conservation and emission reduction are realized.
The above embodiments represent only a few embodiments of the present invention, which are described in more detail and are not to be construed as limiting the scope of the present invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811161496.5A CN109119522B (en) | 2018-09-30 | 2018-09-30 | Automated lighting flexible aluminum substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811161496.5A CN109119522B (en) | 2018-09-30 | 2018-09-30 | Automated lighting flexible aluminum substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109119522A CN109119522A (en) | 2019-01-01 |
| CN109119522B true CN109119522B (en) | 2024-02-13 |
Family
ID=64856314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811161496.5A Active CN109119522B (en) | 2018-09-30 | 2018-09-30 | Automated lighting flexible aluminum substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109119522B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5136470A (en) * | 1990-06-29 | 1992-08-04 | Loral/Rolm Mil-Spec Computers | Printed circuit board vibration stiffener |
| CN202001921U (en) * | 2011-04-08 | 2011-10-05 | 深圳市畅龙昇光电科技有限公司 | LED (light emitting diode) light bar |
| CN202403172U (en) * | 2012-01-04 | 2012-08-29 | 黄森祥 | Light-emitting diode (LED) paster lamp tape with flowing effect |
| WO2014042413A1 (en) * | 2012-09-12 | 2014-03-20 | 주식회사 두산 | Heat dissipating metal foil, method for manufacturing same, and heat dissipating metal-clad laminate and multi-layer printed circuit board comprising heat dissipating metal foil |
| CN105228339A (en) * | 2015-08-26 | 2016-01-06 | 惠州市鹏程电子科技有限公司 | Reverse side main line is double-faced flexible LED circuit board and the production technology of metal wire knitted |
| CN205355071U (en) * | 2015-10-20 | 2016-06-29 | 东莞市当盛电子有限公司 | Imitative lumen support |
| CN206181545U (en) * | 2016-10-14 | 2017-05-17 | 惠州市鹏程电子科技有限公司 | Whole roll of braided wire flexible line way board |
| WO2018027454A1 (en) * | 2016-08-08 | 2018-02-15 | 深圳市蓝月光电子科技有限公司 | Led light string |
| CN209016089U (en) * | 2018-09-30 | 2019-06-21 | 惠州市鹏程电子科技有限公司 | Automation illuminates flexible aluminum substrate |
-
2018
- 2018-09-30 CN CN201811161496.5A patent/CN109119522B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5136470A (en) * | 1990-06-29 | 1992-08-04 | Loral/Rolm Mil-Spec Computers | Printed circuit board vibration stiffener |
| CN202001921U (en) * | 2011-04-08 | 2011-10-05 | 深圳市畅龙昇光电科技有限公司 | LED (light emitting diode) light bar |
| CN202403172U (en) * | 2012-01-04 | 2012-08-29 | 黄森祥 | Light-emitting diode (LED) paster lamp tape with flowing effect |
| WO2014042413A1 (en) * | 2012-09-12 | 2014-03-20 | 주식회사 두산 | Heat dissipating metal foil, method for manufacturing same, and heat dissipating metal-clad laminate and multi-layer printed circuit board comprising heat dissipating metal foil |
| CN105228339A (en) * | 2015-08-26 | 2016-01-06 | 惠州市鹏程电子科技有限公司 | Reverse side main line is double-faced flexible LED circuit board and the production technology of metal wire knitted |
| CN205355071U (en) * | 2015-10-20 | 2016-06-29 | 东莞市当盛电子有限公司 | Imitative lumen support |
| WO2018027454A1 (en) * | 2016-08-08 | 2018-02-15 | 深圳市蓝月光电子科技有限公司 | Led light string |
| CN206181545U (en) * | 2016-10-14 | 2017-05-17 | 惠州市鹏程电子科技有限公司 | Whole roll of braided wire flexible line way board |
| CN209016089U (en) * | 2018-09-30 | 2019-06-21 | 惠州市鹏程电子科技有限公司 | Automation illuminates flexible aluminum substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109119522A (en) | 2019-01-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202697035U (en) | LED circuit board with conducting adhesive lines, and LED lamp band | |
| CN109757039A (en) | A kind of circuit board and preparation method thereof of composition metal circuit | |
| CN109268718A (en) | LED soft light rope and preparation method thereof | |
| CN210225864U (en) | Multilayer braided wire flexible circuit board | |
| CN102223767A (en) | Production process for high heat-conduction circuit board | |
| CN213073220U (en) | Adopt flexible double-sided circuit board for LED lamp area of blind hole structure | |
| CN106804092A (en) | A kind of FPC and preparation method thereof | |
| CN211821838U (en) | Discontinuous layered flexible laminated circuit board lamp strip | |
| CN109757032A (en) | A kind of method of metal-foil circuits and wire circuit produced with combination circuit board | |
| CN109119522B (en) | Automated lighting flexible aluminum substrate | |
| WO2021057312A1 (en) | Led light strip capable of multi-directional turning installation and manufacturing method therefor | |
| CN206181549U (en) | LED fluorescent lamp double layers of circuit boards module | |
| CN206181545U (en) | Whole roll of braided wire flexible line way board | |
| CN107911939B (en) | Flexible printed circuit board | |
| CN204894663U (en) | Flexible aluminium base copper -clad plate | |
| CN107072044A (en) | A kind of double-faced flexible wiring board | |
| CN209016089U (en) | Automation illuminates flexible aluminum substrate | |
| CN210807783U (en) | LED multilayer flexible circuit board | |
| CN206743658U (en) | A kind of encapsulated light bar of double-faced flexible | |
| CN212204123U (en) | LED lamp strip capable of being mounted in multidirectional turning mode | |
| CN212381469U (en) | Double-layer circuit board manufactured by combining single-layer circuit board on flat cable | |
| CN210351772U (en) | LED lamp area circuit board | |
| CN210519001U (en) | Ultra-long flexible circuit board for LED lamp strip | |
| CN112770541A (en) | Processing method for improving surface roughness of flexible circuit board and flexible circuit board | |
| CN206743673U (en) | A kind of heat-resisting encapsulated light bar of double-faced flexible |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |