CN109119375A - Detection and repair method of array panel and photoresist repair device - Google Patents
Detection and repair method of array panel and photoresist repair device Download PDFInfo
- Publication number
- CN109119375A CN109119375A CN201810852339.2A CN201810852339A CN109119375A CN 109119375 A CN109119375 A CN 109119375A CN 201810852339 A CN201810852339 A CN 201810852339A CN 109119375 A CN109119375 A CN 109119375A
- Authority
- CN
- China
- Prior art keywords
- photoresist
- abnormal conditions
- line pattern
- metal
- information
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 147
- 238000000034 method Methods 0.000 title claims abstract description 57
- 230000008439 repair process Effects 0.000 title claims abstract description 47
- 238000001514 detection method Methods 0.000 title claims description 33
- 239000002184 metal Substances 0.000 claims abstract description 164
- 229910052751 metal Inorganic materials 0.000 claims abstract description 163
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 230000002159 abnormal effect Effects 0.000 claims description 119
- 235000008429 bread Nutrition 0.000 claims description 23
- 238000005530 etching Methods 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 30
- 239000011248 coating agent Substances 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 4
- 230000005856 abnormality Effects 0.000 abstract 3
- 238000000151 deposition Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 55
- 239000007921 spray Substances 0.000 description 19
- 239000004973 liquid crystal related substance Substances 0.000 description 7
- 239000010409 thin film Substances 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- 229910021417 amorphous silicon Inorganic materials 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 210000002858 crystal cell Anatomy 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 238000000399 optical microscopy Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 2
- 238000001182 laser chemical vapour deposition Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000386 microscopy Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000012812 sealant material Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
本发明涉及一种阵列面板的检测修复方法和光阻修补装置，该方法包括提供一基板，并在基板上沉积金属层，之后在所述金属层上涂覆光阻，并显影形成金属线图形，再检测所述金属线图形对应的光阻是否有异常情况，若有，对所述异常情况进行修复，最后刻蚀金属层形成金属线。因此，在金属线的制作过程中，显影形成金属线图形时，若检测到金属线图形有异常情况及时将其修补，无需光阻重工，避免金属线断线，工艺简单，节约了制作成本。
The invention relates to a method for detecting and repairing an array panel and a photoresist repairing device. The method includes providing a substrate, depositing a metal layer on the substrate, then coating a photoresist on the metal layer, and developing a metal line pattern, Then, check whether the photoresist corresponding to the metal line pattern has any abnormality, if so, repair the abnormality, and finally etch the metal layer to form metal lines. Therefore, in the production process of the metal wire, when the metal wire pattern is formed by developing, if an abnormality of the metal wire pattern is detected, it is repaired in time, no photoresist rework is required, and the wire breakage is avoided, the process is simple, and the production cost is saved.
Description
Technical field
The present invention relates to display screen production fields, repair more particularly to the detection restorative procedure and photoresist of a kind of arraying bread board
Mend device.
Background technique
The process of pixel controller part (such as thin film transistor (TFT)) in arraying bread board (such as tft array panel) in production
In need to form metal wire, which includes grid line and data line, if detecting during being lithographically formed metal wire
Photoresist has the abnormal conditions such as broken string or perforation, it will usually handle photoresist heavy industry, or after metal wire formation, pass through laser
Metal wire caused by the mode being vapor-deposited is repaired because of abnormal conditions such as photoresist broken string or perforation is learned to break.
But photoresist heavy industry can cost of idleness, increase the complexity of production, and the metal that laser chemical vapor deposition generates
Electrical impedance is relatively high, so can not utilize the side of laser chemical vapor deposition when finding that broken string caused by processing procedure is long
Formula repairing, can only scrap, increase cost.
Summary of the invention
Based on this, it is necessary to the detection restorative procedure and photoresist repair apparatus of a kind of arraying bread board are provided, effectively to gold
The photoresist belonged in line manufacturing process is repaired, and avoids metal wire from breaking, simple process has saved cost of manufacture.
The present invention proposes a kind of detection restorative procedure of arraying bread board, comprising:
One substrate is provided；
Deposited metal layer on the substrate；
Photoresist is coated on the metal layer, and is developed and formed metal line pattern；
Detect whether the corresponding photoresist of the metal line pattern there are abnormal conditions, if so, repairing to the abnormal conditions
It is multiple；
It etches the metal layer and forms metal wire.
The described the step of abnormal conditions are repaired in one of the embodiments, are as follows: using photoresist to described
Abnormal conditions are repaired.
Whether the corresponding photoresist of the detection metal line pattern has abnormal conditions in one of the embodiments, if
The step of having, being repaired using photoresist to the abnormal conditions includes:
Detect whether the corresponding photoresist of the metal line pattern there are abnormal conditions by detection device, if so, described in obtaining
The information of abnormal conditions, and it is sent to photoresist repair apparatus；
The photoresist repair apparatus repairs the abnormal conditions according to the information of the abnormal conditions.
The information of the abnormal conditions includes the location information and size of the abnormal conditions in one of the embodiments,
Information.
The location information includes position of the abnormal conditions on the glass substrate in one of the embodiments,
Coordinate；The dimension information includes the overall size of the abnormal conditions.
The abnormal conditions include wearing for the corresponding photoresist exception of the metal line pattern in one of the embodiments,
Hole, gap or notch.
It is described in one of the embodiments, to coat photoresist on the metal layer, and develop and form metal line pattern
Step includes:
Photoresist is coated on the metal layer, forms photoresist layer；
Mask plate is set on the photoresist layer, blocks the corresponding photoresist of the metal line pattern；
The photoresist layer is exposed, is washed the photoresist of exposed portion with developer, development forms metal line pattern.
The step of etching metal layer forms metal wire in one of the embodiments, are as follows:
It will not etched away by the metal layer that photoresist covers, retain the metal layer of the metal line pattern covering, form metal
Line.
The detection restorative procedure of above-mentioned arraying bread board coats light on substrate after deposited metal layer on the metal layer
Resistance, and develop and form metal line pattern, then detect whether the corresponding photoresist of the metal line pattern there are abnormal conditions, if so,
Then the abnormal conditions are repaired, the metal layer is finally etched and forms metal wire.Due to forming metal line chart in development
After shape, if detect that the corresponding photoresist of metal line pattern there are abnormal conditions, photoresist is repaired in time, without light
Heavy industry is hindered, avoids metal wire from breaking, simple process has saved cost of manufacture.
The present invention also proposes a kind of photoresist repair apparatus, and the photoresist repair apparatus includes control module and processing module,
The control module is used for after the photoresist layer develops and to form metal line pattern, obtains the metal line pattern pair
The information of the abnormal conditions for the photoresist answered controls the control of the processing module operation according to the output of the information of the abnormal conditions
Instruction；
The processing module is used to repair the abnormal conditions according to the control instruction.
In above-mentioned photoresist repair apparatus, control module is used for after the photoresist layer develops and to form metal line pattern, is obtained
The information of the abnormal conditions of the corresponding photoresist of the metal line pattern controls the place according to the output of the information of the abnormal conditions
Manage the control instruction of module operation.Processing module is used to repair abnormal conditions according to the control instruction.Therefore, it is being lithographically formed
During metal wire, photoresist layer develops to form metal line pattern after, control module obtains the corresponding photoresist of metal line pattern
After the information of abnormal conditions, just control processing module repairs the abnormal conditions in time, and metal wire is avoided to break, technique letter
It is single, save cost of manufacture.
The present invention also proposes a kind of detection restorative procedure of arraying bread board, comprising:
One substrate is provided；
Deposited metal layer on the substrate；
Photoresist is coated on the metal layer, and is developed and formed metal line pattern；
Detect whether the corresponding photoresist of the metal line pattern there are abnormal conditions by detection device, if so, described in obtaining
The information of abnormal conditions, and it is sent to photoresist repair apparatus；Wherein, the information of the abnormal conditions includes the abnormal conditions
Location information and dimension information；
The photoresist repair apparatus repairs the abnormal conditions according to the information of the abnormal conditions；
It etches the metal layer and forms metal wire.
The detection restorative procedure of above-mentioned arraying bread board coats light on substrate after deposited metal layer on the metal layer
Resistance, and develop and form metal line pattern, then detect whether the corresponding photoresist of the metal line pattern there are abnormal conditions, if so,
Then the abnormal conditions are repaired, the metal layer is finally etched and forms metal wire.Due to forming metal line chart in development
After shape, if detect that the corresponding photoresist of metal line pattern there are abnormal conditions, photoresist is repaired in time, without light
Heavy industry is hindered, avoids metal wire from breaking, simple process has saved cost of manufacture.
Detailed description of the invention
Fig. 1 is the flow chart of the detection restorative procedure of arraying bread board in an embodiment；
Fig. 2 is the process schematic diagram of pixel controller part manufacturing process in an embodiment
Fig. 3 is the process schematic diagram of pixel controller part manufacturing process in another embodiment；
Fig. 4 is the flow chart of the detection restorative procedure of arraying bread board in another embodiment；
Fig. 5 is the structural block diagram of the photoresist repair apparatus of an embodiment.
Specific embodiment
Referring to the flow chart for the detection restorative procedure that Fig. 1, Fig. 1 are arraying bread board in an embodiment.Wherein, pixel controller
Part is, for example, thin film transistor (TFT) (TFT, Thin Film Transistor).Arraying bread board is, for example, tft array panel etc..
In the present embodiment, the detection restorative procedure of the arraying bread board, comprising:
Step S101 provides a substrate.
Specifically, substrate is, for example, glass substrate.
Step S102, the deposited metal layer on substrate.
Step S103 coats photoresist on the metal layer, and develops and form metal line pattern.
Metal wire is for example including grid line and data line.During forming metal wire, referring to fig. 2, in glass substrate
Deposited metal layer 11 on 10 coats photoresist on metal layer 11, forms photoresist layer, mask plate is arranged on photoresist layer, blocks gold
Belong to the corresponding photoresist of line graph, photoresist layer is exposed, is washed the photoresist of exposed portion with developer, development forms metal wire
Figure 12.Wherein, the material of metal layer 11 is aluminium (or copper) and molybdenum.
Step S104, whether the corresponding photoresist of detection metal line pattern has abnormal conditions, if so, repairing to abnormal conditions
It is multiple.
After development forms metal line pattern, needs not etched away by the metal layer that photoresist covers, retain metal wire
The metal layer of figure covering, forms metal wire.Referring to Fig. 3, if the corresponding photoresist of metal line pattern 12 has abnormal conditions (abnormal feelings
Perforation 20, gap 21 and notch 22 of the condition for example including the corresponding photoresist exception of the metal line pattern), in the process of etching
In, then metal wire can be caused abnormal not etched away by the metal layer 11 that photoresist covers at abnormal conditions, if grid line breaks,
Grid line is caused to lose its due function, display screen cancels, it is therefore desirable to avoid such case.In the present embodiment, in order to keep away
Exempt from above situation occur, is detecting that metal line pattern 12 there are after abnormal conditions, is repaired in time.
Specifically, the step of abnormal conditions being repaired are as follows: abnormal conditions are repaired using photoresist.Such as: it can
To fill up perforation 20 with photoresist, gap 21 is repaired, notch 22 is repaired complete etc..
Step S105, etching sheet metal form metal wire.
After abnormal conditions in metal line pattern are repaired, it thereby may be ensured that metal line pattern is intact.
In this case, to not performed etching by the metal layer that photoresist covers, retain the metal layer of metal line pattern covering, and then most
It is capable of forming complete metal wire eventually.
The detection restorative procedure of above-mentioned arraying bread board provided in this embodiment, the deposited metal layer on substrate, in metal layer
Upper coating photoresist, and develop and form metal line pattern, it is repaired in time if detecting that metal line pattern has abnormal conditions later
It mends, without photoresist heavy industry, metal wire is avoided to break.Break simultaneously without after etching sheet metal forms metal wire
Line repairing, simple process have saved cost of manufacture.
Specifically, if arraying bread board is TFT-LCD (thin film transistor-liquid crystal
Display, Thin Film Transistor-LCD), then the manufacturing process of TFT-LCD includes: the manufacturing process of tft array, CF
The manufacturing process of (color filter, colored filter) substrate, the manufacturing process of liquid crystal cell, peripheral circuit, assembling backlight
Deng module assembled technique.
(1) manufacturing process of tft array
It can be using above-mentioned steps S101 to step about the manufacturing process of grid line in the manufacturing process of tft array
S105.After the completion of grid line manufacture, will also following steps be continued to execute in the manufacturing process of tft array:
Step a deposits Si3N4 (silicon nitride), a-Si (amorphous silicon), N+a-si (N-type silicon): first with PECVD
(Plasma Enhanced Chemical Vapor Deposition, the vapour deposition process of plasma enhanced chemical) technology
Be respectively coated one layer of Si3N4, N+a-si and a-Si, then on N+a-si and a-Si be coated with photoresist glue, by exposure, development,
Etching forms required shape except glue.It wherein, equally can be according to the method inspection of above-mentioned steps S104 after the completion of development
Whether photoresist has abnormal conditions, if so, repairing to abnormal conditions.
Step b forms source electrode line, drain line.One layer of metal material is coated with first on a-Si as source electrode line and drain electrode
Then line is coated with photoresist glue on the metal material and forms required shape by exposing, developing, etching and removing glue.Wherein, exist
After the completion of development, equally it can check whether photoresist has abnormal conditions according to the method for above-mentioned steps S104, if so, to abnormal feelings
Condition is repaired.
Step c precipitates Si3N4 and ITO (Indium tin oxide, tin indium oxide): precipitating first with PECVD technique
Then one layer of Si3N4 is coated one layer of ITO.
So far, entire TFT substrate manufacture is completed.
(2) manufacturing process of CF (color filter, colored filter) substrate
The forming method of colored filter coloured part has dye method, pigment dispersion method, print process, strike, spray
The method of the use of ink and water.
Wherein, the first step of pigment dispersion method be by evengranular micro pigment (average grain diameter is less than 0.1 μm) (R, G,
Tri- color of B) it is dispersed in transparent photosensitive resin.Then they are sequentially formed successively with coating, exposure, developing process method
R.G.B trichromatic diagram case.Optical lithography is used during manufacturing, and equipment therefor is mainly applied, exposed, developing apparatus.
Light leakage in order to prevent will generally blacken matrix (BM) in tri- color intersection of RGB.Such as single layer is formed with sputtering method
Crome metal film；Or with the compound BM film of crome metal and chromium oxide or the resin type BM of resin mixing carbon.
In addition it is also necessary to make layer protecting film on BM and form IT0 electrode, due to having the substrate of colored filter
(i.e. CF substrate) be constitute liquid crystal cell together with the metacoxal plate (i.e. TFT substrate) of TFT as the preceding substrate of liquid crystal display, so
Orientation problem must have been paid close attention to, has kept each unit of colored filter corresponding with each pixel of TFT substrate.
(3) manufacturing process of liquid crystal cell
Polyimide film is respectively applied on CF substrate, TFT substrate surface first and passes through friction process, being formed, which can induce, divides
The alignment films that son arranges as required.Later in the good sealant material of TFT substrate periphery cloth, and sprinkling liner on the tft substrate.Together
When CF substrate transparent electrode end be coated with silver paste.Then by two pieces of substrate contraposition bondings, make CF pattern and TFT pattern of pixels
One it is a pair of just, then thermally treated solidify sealing material.In printing and sealing material, inlet need to be left, is filled to vacuumize
Injecting liquid crystal.
(4) the module assembled technique of peripheral circuit, assembling backlight etc.
After the completion of liquid crystal cell manufacture craft, need to install peripheral drive circuit on panel, then in two pieces of substrate surfaces
Stick polarizing film.Backlight to be also installed if it is transmission-type LCD..
Referring to fig. 4, Fig. 4 is the flow chart of the detection restorative procedure of arraying bread board in another embodiment.
In the present embodiment, the detection restorative procedure of the arraying bread board includes:
Step S201 provides a substrate.
Step S202, the deposited metal layer on substrate.
Step S203 coats photoresist on the metal layer, forms photoresist layer.
Step S204, is arranged mask plate on photoresist layer, blocks the corresponding photoresist of metal line pattern.
Step S205 exposes photoresist layer, is washed the photoresist of exposed portion with developer, and development forms metal line chart
Shape.
It is understood that coating photoresist on the metal layer, and the specific reality for the step for the forming metal line pattern that develop
Existing mode is not limited to above situation, as long as can develop to form metal line pattern.
Step S206 detects whether the corresponding photoresist of metal line pattern has abnormal conditions by detection device, if there is entrance
Step S207, if it is not, entering step S209.
Wherein, detection device such as optical microscopy.After development forms metal line pattern, pass through Microscopy
Whether the metal line pattern in have abnormal conditions, optical microscopy, which can amplify small abnormal conditions, to be imaged, and is obtained if surveying
The information of abnormal conditions.
Step S207, obtains the information of abnormal conditions, and is sent to photoresist repair apparatus.
Wherein, location information of the information of abnormal conditions for example including abnormal conditions, dimension information, a kind of in depth information
Or it is two or more.Wherein, position coordinates of the location information for example including abnormal conditions on the glass substrate.Dimension information for example wraps
Include the overall size of abnormal conditions.
Step S208, photoresist repair apparatus repair abnormal conditions according to the information of abnormal conditions.
In the step, for photoresist repair apparatus for example including control module and processing module, the control module is different for obtaining
The information of reason condition, and the control instruction that control processing module operates is exported according to the information of the abnormal conditions.Processing module is used
According to control instruction reparation abnormal conditions.Wherein, processing module can flexible motion, such as may be rotated and horizontal fortune
It is dynamic, and have the spray head for spraying photoresist, the abnormal conditions of the photoresist of any position are repaired with realizing.Specifically
Ground, processing module for example can use traditional mechanical arm in conjunction with traditional automatic double surface gluer to repair to abnormal conditions.
In this step, processing module controls the spray head of processing module according to location information, the dimension information of abnormal conditions
Photoresist is sprayed to abnormal conditions, and processing module controls what spray head was sprayed in each position according to the depth information of abnormal conditions
Photoresist total amount (such as: if the spray head unit time in spray photoresist amount it is identical, control module by control spray head injection
The time of photoresist is the total amount for the photoresist that controllable spray head sprays each position).
Further, after the completion of being repaired to abnormal conditions, the photoresist of reparation can also be toasted (for example, by using with
The identical condition of front baking is toasted in conventional lithography process), to avoid the lens for the gaseous contamination detection device that photoresist distributes,
From the accuracy for improving detection device detection abnormal conditions.
It is understood that whether the corresponding photoresist of detection metal line pattern has abnormal conditions, if so, using photoresist to different
The specific implementation for the step for reason condition is repaired is not limited to above situation, as long as metal line pattern can detected
Corresponding photoresist occurs repairing abnormal conditions when abnormal conditions.
Step S209 will not etched away by the metal layer that photoresist covers, be retained the metal layer of metal line pattern covering, be formed
Metal wire.
The information (such as location information and dimension information) of photoresist abnormal conditions is sent to photoresist repair apparatus, by photoresist
Repair apparatus repairs the abnormal conditions of photoresist according to the information of the abnormal conditions, and then forms complete metal line chart
Shape avoids generating metal wire broken string during being lithographically formed metal wire.
The detection restorative procedure of above-mentioned arraying bread board, the deposited metal layer on substrate coat photoresist on the metal layer, and show
Shadow forms metal line pattern, detects whether metal line pattern has abnormal conditions by detection device, and obtain the letter of abnormal conditions
Breath, is sent to photoresist repair apparatus for the information of the abnormal conditions, is repaired the abnormal conditions in time by photoresist repair apparatus, from
Without photoresist heavy industry, metal wire is avoided to break.It is repaired simultaneously without break after etching sheet metal forms metal wire
It mends, simple process has saved cost of manufacture.
The present invention also proposes a kind of photoresist repair apparatus, can be to occurring in thin film transistor (TFT) manufacturing process in arraying bread board
Photoresist broken string or perforation etc. abnormal conditions repaired.Wherein, arraying bread board is, for example, tft array panel etc..
In one of the embodiments, referring to FIG. 5, the photoresist repair apparatus includes control module 100 and processing module
200, which is used for after photoresist layer develops and to form metal line pattern, obtains the corresponding photoresist of metal line pattern
Abnormal conditions information (location information of the information of the abnormal conditions for example including abnormal conditions, dimension information, in depth information
One or more), and according to the information of the abnormal conditions export control processing module 200 operate control instruction.Control
Molding block 100 is, for example, PLC (Programmable Logic Contro, programmable logic controller (PLC)).
Processing module 200 is used to repair abnormal conditions according to the control instruction.Further, the place of the photoresist repair apparatus
Manage module 200 can flexible motion, such as may be rotated and horizontal movement, and have the spray head for spraying photoresist, with
The abnormal conditions of the photoresist of any position are repaired in realization.Specifically, processing module 200 for example can use traditional machine
Tool arm repairs abnormal conditions in conjunction with traditional automatic double surface gluer.
Processing module 200 controls the spray head of processing module 200 to exception according to location information, the dimension information of abnormal conditions
Situation sprays photoresist, and processing module 200 controls the light that spray head is sprayed in each position according to the depth information of abnormal conditions
Resistance total amount (such as: if the spray head unit time in spray photoresist amount it is identical, control module 100 by control spray head spray
The total amount for the photoresist that the time for penetrating photoresist can control spray head to spray each position).
In one of the embodiments, with continued reference to FIG. 5, photoresist repair apparatus further includes above-mentioned optical microscopy 300.
The optical microscopy 300 is for detecting whether the corresponding photoresist of metal line pattern has abnormal conditions, if so, obtaining abnormal conditions
Information, and send and supreme state control module 100.
Above-mentioned photoresist repair apparatus, during being lithographically formed metal wire, photoresist layer develops to form metal line pattern after,
When the corresponding photoresist of metal line pattern has abnormal conditions, control module 100 obtains the information of abnormal conditions, and according to the exception
The information of situation generates the corresponding instruction control movement of processing module 200 and is accurately repaired to the abnormal conditions, avoids gold
Belong to line broken string, simple process has saved cost of manufacture.
It should be noted that function and above-described embodiment that photoresist repair apparatus provided in this embodiment may be implemented provide
Arraying bread board detection restorative procedure in photoresist detection with repair principle it is corresponding, just repeat no more here.
Each technical characteristic of above embodiments can be combined arbitrarily, for simplicity of description, not to above-described embodiment
In each technical characteristic it is all possible combination be all described, as long as however, the combination of these technical characteristics be not present lance
Shield all should be considered as described in this specification.
Only several embodiments of the present invention are expressed for above embodiments, and the description thereof is more specific and detailed, but can not
Therefore it is construed as limiting the scope of the patent.It should be pointed out that for those of ordinary skill in the art,
Under the premise of not departing from present inventive concept, various modifications and improvements can be made, and these are all within the scope of protection of the present invention.
Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of detection restorative procedure of arraying bread board characterized by comprising
One substrate is provided；
Deposited metal layer on the substrate；
Photoresist is coated on the metal layer, and is developed and formed metal line pattern；
Detect whether the corresponding photoresist of the metal line pattern there are abnormal conditions, if so, repairing to the abnormal conditions；
It etches the metal layer and forms metal wire.
2. the method according to claim 1, wherein described the step of being repaired to the abnormal conditions are as follows:
The abnormal conditions are repaired using photoresist.
3. according to the method described in claim 2, it is characterized in that, whether described detect the corresponding photoresist of the metal line pattern
There are abnormal conditions, if so, the step of repairing using photoresist to the abnormal conditions includes:
Detect whether the corresponding photoresist of the metal line pattern there are abnormal conditions by detection device, if so, obtaining the exception
The information of situation, and it is sent to photoresist repair apparatus；
The photoresist repair apparatus repairs the abnormal conditions according to the information of the abnormal conditions.
4. according to the method described in claim 3, it is characterized in that, the information of the abnormal conditions includes the abnormal conditions
Location information and dimension information.
5. according to the method described in claim 4, it is characterized in that, the location information includes the abnormal conditions in the glass
Position coordinates on glass substrate；The dimension information includes the overall size of the abnormal conditions.
6. the method according to claim 1, wherein the abnormal conditions include that the metal line pattern is corresponding
Perforation, gap or the notch of photoresist exception.
7. the method according to claim 1, wherein described coat photoresist on the metal layer, and shape of developing
Include: at the step of metal line pattern
Photoresist is coated on the metal layer, forms photoresist layer；
Mask plate is set on the photoresist layer, blocks the corresponding photoresist of the metal line pattern；
The photoresist layer is exposed, is washed the photoresist of exposed portion with developer, development forms metal line pattern.
8. the method according to the description of claim 7 is characterized in that the step of etching metal layer forms metal wire
Are as follows:
It will not etched away by the metal layer that photoresist covers, retain the metal layer of the metal line pattern covering, form metal wire.
9. a kind of photoresist repair apparatus, which is characterized in that the photoresist repair apparatus includes:
Control module, the control module are used for after photoresist layer develops and to form metal line pattern, obtain the metal line pattern
The information of the abnormal conditions of corresponding photoresist, and the processing module operation is controlled according to the output of the information of the abnormal conditions
Control instruction；And
Processing module, the processing module are used to repair the abnormal conditions according to the control instruction.
10. a kind of detection restorative procedure of arraying bread board characterized by comprising
One substrate is provided；
Deposited metal layer on the substrate；
Photoresist is coated on the metal layer, and is developed and formed metal line pattern；
Detect whether the corresponding photoresist of the metal line pattern there are abnormal conditions by detection device, if so, obtaining the exception
The information of situation, and it is sent to photoresist repair apparatus；
Wherein, the information of the abnormal conditions includes the location information and dimension information of the abnormal conditions；
The photoresist repair apparatus repairs the abnormal conditions according to the information of the abnormal conditions；
It etches the metal layer and forms metal wire.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810852339.2A CN109119375A (en) | 2018-07-30 | 2018-07-30 | Detection and repair method of array panel and photoresist repair device |
| PCT/CN2018/113793 WO2020024472A1 (en) | 2018-07-30 | 2018-11-02 | Detecting and restoring method for array panel, and photoresist repair apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810852339.2A CN109119375A (en) | 2018-07-30 | 2018-07-30 | Detection and repair method of array panel and photoresist repair device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109119375A true CN109119375A (en) | 2019-01-01 |
Family
ID=64863648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810852339.2A Pending CN109119375A (en) | 2018-07-30 | 2018-07-30 | Detection and repair method of array panel and photoresist repair device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109119375A (en) |
| WO (1) | WO2020024472A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110034035A (en) * | 2019-03-06 | 2019-07-19 | 泉州台商投资区雷墨设计有限公司 | A kind of photoresist coating detection device of the quality inspection of wafer production collection and reparation one |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DK3773495T3 (en) | 2019-06-07 | 2023-01-16 | Philip Morris Products Sa | COMPOSITION OF NICOTINE POUCH |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040087947A (en) * | 2003-04-08 | 2004-10-15 | 호야 가부시키가이샤 | Defect correcting method of a grayton mask |
| CN101458407A (en) * | 2007-12-10 | 2009-06-17 | 东捷科技股份有限公司 | Pixel device repairing device and its application |
| CN102253506A (en) * | 2010-05-21 | 2011-11-23 | 京东方科技集团股份有限公司 | Method for manufacturing liquid crystal display substrate and detecting and repairing equipment of liquid crystal display substrate |
| CN102809839A (en) * | 2012-08-31 | 2012-12-05 | 深圳市华星光电技术有限公司 | Graphic repair device and method for array substrate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006053405A (en) * | 2004-08-13 | 2006-02-23 | Sharp Corp | Manufacturing method of array substrate and manufacturing method of liquid crystal display device using the same |
-
2018
- 2018-07-30 CN CN201810852339.2A patent/CN109119375A/en active Pending
- 2018-11-02 WO PCT/CN2018/113793 patent/WO2020024472A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040087947A (en) * | 2003-04-08 | 2004-10-15 | 호야 가부시키가이샤 | Defect correcting method of a grayton mask |
| CN101458407A (en) * | 2007-12-10 | 2009-06-17 | 东捷科技股份有限公司 | Pixel device repairing device and its application |
| CN102253506A (en) * | 2010-05-21 | 2011-11-23 | 京东方科技集团股份有限公司 | Method for manufacturing liquid crystal display substrate and detecting and repairing equipment of liquid crystal display substrate |
| CN102809839A (en) * | 2012-08-31 | 2012-12-05 | 深圳市华星光电技术有限公司 | Graphic repair device and method for array substrate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110034035A (en) * | 2019-03-06 | 2019-07-19 | 泉州台商投资区雷墨设计有限公司 | A kind of photoresist coating detection device of the quality inspection of wafer production collection and reparation one |
| CN110034035B (en) * | 2019-03-06 | 2021-06-15 | 重庆慧聚成江信息技术合伙企业(有限合伙) | Photoresist coating detection device integrating wafer production quality inspection and repair |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020024472A1 (en) | 2020-02-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6855465B2 (en) | Color filter substrate and method for fabricating the same | |
| KR100768492B1 (en) | A display device having a substrate having a light shielding film, a color filter substrate, a manufacturing method thereof and a substrate having a light blocking film | |
| CN104865731A (en) | Display panel and manufacturing method thereof and display device | |
| CN109119375A (en) | Detection and repair method of array panel and photoresist repair device | |
| KR20070083194A (en) | Liquid crystal display and electronic device | |
| US20020140893A1 (en) | Method for fabricating a spacer for liquid crystal display | |
| JP6427337B2 (en) | Display device and method of manufacturing the same | |
| US7300828B2 (en) | Method of manufacturing a liquid crystal display device | |
| US20080099429A1 (en) | Methods for repairing patterned structures of electronic devices | |
| US7649609B2 (en) | Method of fabricating and repairing a short defect in LCD device having a residue pattern of a predetermined line width removed after forming photo-resist pattern through rear exposure | |
| KR101380493B1 (en) | Color filter substrate for liquid crystal display and manufacturing method thereof | |
| CN100538409C (en) | Method for repairing pattern defect of electronic element | |
| CN104297995A (en) | Display substrate, preparation method of display substrate and display device | |
| CN103021941B (en) | Method for manufacturing array substrate, array substrate and liquid crystal display device | |
| KR100710141B1 (en) | Manufacturing Method of Color Filter Substrate | |
| KR101331805B1 (en) | Method of fabricating liquid crystal display device | |
| JP2008028156A (en) | Method for removing resist of end of glass substrate | |
| KR20050064888A (en) | Polyimide repair apparatus | |
| US20200099014A1 (en) | Method of producing electronic component substrate, method of producing display panel, electronic component substrate, and display panel | |
| KR20060093411A (en) | LCD and its bright point repair method | |
| KR100632729B1 (en) | Method for liquid crystal display panel | |
| JP2022143150A (en) | Black matrix substrate, color filter, image display device, and method for manufacturing black matrix substrate | |
| CN105929613A (en) | Manufacturing method of array substrate, display panel and display device | |
| KR100246040B1 (en) | Method of manufacturing patterned transparent conductive film | |
| KR20160055365A (en) | Display panel and method of manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190101 |