CN109116879A - A kind of temperature controller - Google Patents
A kind of temperature controller Download PDFInfo
- Publication number
- CN109116879A CN109116879A CN201811221945.0A CN201811221945A CN109116879A CN 109116879 A CN109116879 A CN 109116879A CN 201811221945 A CN201811221945 A CN 201811221945A CN 109116879 A CN109116879 A CN 109116879A
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- test
- heating component
- element under
- under test
- temperature controller
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/003—Environmental or reliability tests
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- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Automation & Control Theory (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention belongs to detect jig technical field, a kind of temperature controller is disclosed.The temperature controller includes heating component and cooling assembly, and heating component is located at element under test side, and when heating, heating component contacts with element under test and starts heating；Cooling assembly is located at side of the heating component far from element under test, and barrier assembly is provided between heating component and cooling assembly；When heating component heats element under test, cooling assembly is isolated by barrier assembly and heating component；Driving assembly can be connected to cooling assembly and drive it and be moved to straight down and be in contact with crimp assemblies.Cooling assembly and heating component can be isolated by the barrier assembly of the temperature controller, ensure that element under test test accuracy.
Description
Technical field
The present invention relates to detection jig technical field more particularly to a kind of temperature controllers.
Background technique
With the rapid development of semicon industry, the industries such as design, encapsulation and detection of electronic component have wide answer
Use prospect.Especially in the detection field of chip, test device essential detection jig when being detected as chip, it appears outstanding
It is important.
Since different types of chip is according to itself different purposes, in normal use process, often in opposite
In high temperature, low temperature and normal temperature environment.In order to guarantee that the accuracy of test, test device need to simulate in high temperature and low temperature environment
Under, can detection chip be worked normally.Existing major part test device can only be individually for chip and provide high temperature and low temperature ring
Border, user need while buying two kinds of test devices of refrigeration and heating, bring great financial burden to user.Although small part
Test device can meet high temperature and low temperature both of which simultaneously, since refrigeration module and heating module contact with each other, when
Under high temperature mode, refrigeration module can have an impact heating module, generate interference to measurement of the chip under high temperature mode, influence
The accuracy of chip measurement, leads to low measurement accuracy.
Summary of the invention
The purpose of the present invention is to provide a kind of temperature controllers, can provide high temperature and low temperature for the performance test of element under test
Environment, and influence of the cooling assembly to heating component under high temperature mode is reduced, to improve the measurement accuracy of element under test.
To achieve this purpose, the present invention adopts the following technical scheme:
A kind of temperature controller,
A kind of temperature controller, to test temperature needed for providing element under test, the temperature controller includes:
Heating component, heating component are located at element under test side, and when heating, the heating component contacts simultaneously with element under test
Starting heating；
Cooling assembly, cooling assembly are located at side of the heating component far from element under test, the heating component and refrigeration train
Barrier assembly is provided between part；
When heating, heating component contacts heating with element under test, and cooling assembly is separated by barrier assembly with heating component；
When refrigeration, heating component stops heating, and cooling assembly is mobile to heating component side and contacts with heating component, and cooling assembly opens
It is dynamic, realize refrigeration.
Preferably, the temperature controller further include:
For placing the test jack of element under test；
Crimp assemblies, the crimp assemblies are contacted with heating component, and crimp assemblies are connected to the element under test；The survey
Examination socket is set to the underface of the heating component, and the top surface of the test jack is provided with the appearance for accommodating element under test
Receive slot, the test jack is used to test the performance of element under test.
Preferably, the cooling assembly is supported in above the heating component, the barrier assembly includes cut spring,
When refrigeration, cooling assembly is pushed, the cooling assembly moves down compression cut spring, and cooling assembly is contacted with heating component.
Preferably, the temperature controller further includes driving assembly, the driving component can be connected to the cooling assembly, and
The cooling assembly is driven to be moved at the position being in contact with the crimp assemblies straight down.
Preferably, the crimp assemblies include connecting plate, the direction of the connecting plate towards the holding tank is convexly equipped with
Pressure head, the pressure head can protrude into the holding tank and be connected to the element under test.
Preferably, the temperature controller further includes a test box, the crimp assemblies further include being set to the test box
And the crimping preload piece between connecting plate, the crimping preload piece is elastic component, when crimp assemblies are connected on element under test,
Under the action of test box self gravity, crimping preload piece is compressed, the downward reaction force that compression preload piece generates is made
For pressure head, pressure head and element under test are in close contact.
Preferably, the crimping preload piece is compression spring, the crimp assemblies further include being arranged in the connecting plate
With the first bolt of the test box, the compression spring is sheathed on first bolt and is set to the connecting plate and institute
It states between the inner wall of test box, the connecting plate can move up and down vertically along first bolt.
Preferably, the heating component includes heating sheet, it is provided on the connecting plate for accommodating the heating sheet
Locating slot.
Preferably, the cooling assembly includes being set to cooling fin above the connecting plate, being set to test box side
The fan and cooling piece in face, the cooling piece are set to inside the cooling fin and towards the sides of the heating component；
Thermally conductive sheet is additionally provided between the connecting plate and the cooling fin.
Preferably, the barrier assembly further includes the second bolt for wearing the connecting plate and the thermally conductive sheet, it is described
Cut spring is sheathed on second bolt and is set between the connecting plate and the thermally conductive sheet, thermally conductive sheet energy edge
Second bolt moves up and down vertically.
Beneficial effects of the present invention:
Temperature controller provided by the invention, high temperature and low temperature environment needed for test can be provided for element under test, to chip
Environmental testing is carried out, to verify performance of the element under test under high temperature and low-temperature condition.Meanwhile it needing to mention element under test when working as
When for hot environment, cooling assembly and heating component can be isolated by barrier assembly, prevent both cooling assembly and heating component
It contacts, avoids interference of the cooling assembly to heating component under high temperature mode, test temperature needed for ensure that element under test
Degree and test accuracy, to improve the measurement accuracy of element under test.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of temperature controller of the present invention；
Fig. 2 is the structural schematic diagram at a visual angle of test box in temperature controller of the present invention；
Fig. 3 is the explosive view of test box in temperature controller of the present invention；
Fig. 4 is the cross-sectional view of temperature controller of the present invention.
In figure:
1, test box；2, test jack；3, crimp assemblies；4, heating component；5, cooling assembly；6, barrier assembly；7, it drives
Dynamic component；8, sensor；9, thermally conductive sheet；10, fixing seat；
11, positioning column；
21, holding tank；22, location hole；
31, connecting plate；32, pressure head；33, compression spring；34, the first bolt；
41, heating sheet；
51, cooling fin；52, cooling piece；53, fan；
61, cut spring；62, the second bolt；
71, screw rod；72, handle.
Specific embodiment
To keep the technical problems solved, the adopted technical scheme and the technical effect achieved by the invention clearer, below
It will the technical scheme of the embodiment of the invention will be described in further detail in conjunction with attached drawing, it is clear that described embodiment is only
It is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those skilled in the art exist
Every other embodiment obtained under the premise of creative work is not made, shall fall within the protection scope of the present invention.
In the description of the present invention unless specifically defined or limited otherwise, term " connected ", " connection ", " fixation " are answered
It is interpreted broadly, for example, it may be being fixedly connected, may be a detachable connection, or is integral；It can be mechanical connection,
It can be electrical connection；It can be directly connected, the company inside two elements can also be can be indirectly connected through an intermediary
Logical or two elements interaction relationship.For the ordinary skill in the art, can be understood with concrete condition above-mentioned
The concrete meaning of term in the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower"
It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it
Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above "
Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of
First feature horizontal height is less than second feature.
To further illustrate the technical scheme of the present invention below with reference to the accompanying drawings and specific embodiments.
A kind of temperature controller is present embodiments provided, to test temperature needed for providing element under test, in laboratory
Or the performance test when element under test design verification stage to element under test, as shown in Figure 1-3, the temperature controller includes two big portions
Point, a part is test jack 2, and another part is the test box 1 right above test jack 2 and is all set in test box 1
Internal crimp assemblies 3, heating component 4, cooling assembly 5 and barrier assembly 6 and driving assembly 7, the top surface setting of test jack 2
There is the holding tank 21 for accommodating element under test, test jack 2 is used to test the performance of element under test, member to be measured in the present embodiment
Part is specially chip.Test box 1 is the cabinet of rectangular parallelepiped structure, is used to support and accommodates crimp assemblies 3, heating component 4, refrigeration
Component 5 and barrier assembly 6 and driving assembly 7, and this five components are integrated into an entirety, it is compact-sized, it is user-friendly
And carrying.
As shown in Figs. 1-2, it is sequentially overlapped setting crimp assemblies 3, heating group from top to bottom in the bottom of test box 1 to top
Part 4, barrier assembly 6, cooling assembly 5 and driving assembly 7, heating component 4 are located at element under test side, when heating, heating component 4
Contact and start heating with element under test, cooling assembly 5 is located at side of the heating component 4 far from element under test, heating component 4 with
Barrier assembly 6 is provided between cooling assembly 5.Before test, first crimp assemblies 3 are partially protruded into holding tank 21 and is abutted
In element under test, as shown in figure 3, the work of heating component 4 carries out heat temperature raising when needing to provide hot environment to element under test
And crimp assemblies 3 are transferred heat to, so that test jack 2 is to element under test performance test in a high temperauture environment.At this point, every
It is set between heating component 4 and cooling assembly 5 from component 6, cooling assembly 5 is separated by by barrier assembly 6 with heating component 4
From, reduce influence of the cooling assembly 5 to heating component 4 under high temperature mode, test temperature needed for ensure that element under test and
Test accuracy, to improve the measurement accuracy of element under test；When needing to provide low temperature environment to element under test, will heat
Component 4 stops working, while the top that driving assembly 7 is arranged in test box 1 straight down is mobile simultaneously to 4 side of heating component
After abutting against with cooling assembly 5, driving assembly 7 drives cooling assembly 5 to continue to be moved to straight down to connect with crimp assemblies 3
At the position of touching, then cooling assembly 5 starts, so that cooling assembly 5 is to element under test cooling and heat dissipation, so that test jack 2 is right
The performance test of element under test at low ambient temperatures.
Temperature controller provided in this embodiment, high temperature and low temperature environment needed for test can be provided for element under test, to core
Piece carries out environmental testing, to verify performance of the element under test under high temperature and low-temperature condition.Meanwhile when needing to mention element under test
When for hot environment, cooling assembly 5 and heating component 4 can be isolated by barrier assembly 6, prevent cooling assembly 5 and heating component 4
The two contacts, and avoids interference of the cooling assembly 5 to heating component 4 under high temperature mode, ensure that needed for element under test
Test temperature and test accuracy, to improve the measurement accuracy of element under test.
As shown in Figure 3-4, crimp assemblies 3 include connecting plate 31, pressure head 32 and compression spring 33, and connecting plate 31 is cuboid
Structure, the side of connecting plate 31 are used to carry the component of heating component 4 and support on connecting plate 31,32 projection of pressure head
Side in the other side of connecting plate 31, specially towards holding tank 21.First bolt 34 is arranged in connecting plate 31 and test box 1
Inner wall, compression spring 33 is sheathed on the first bolt 34 and is set between connecting plate 31 and the inner wall of test box 1, connecting plate
31 can move up and down vertically along the first bolt 34.
Pressure head 32 can protrude into holding tank 21 and be connected to element under test, compress to compression spring 33, compressed
The downward reaction force that compression spring 33 generates upward active force to test box 1 respectively and generates to connecting plate 31, this to
Under reaction force ensure that the compactness that pressure head 32 is contacted with element under test, prevent from connecing between pressure head 32 and element under test
Bad situation is touched, to influence test effect in a high temperauture environment.Elastic rubber also can be used in addition to using compression spring
Circle or other elastomeric elements are as crimping preload piece, and the first bolt 34 play the guiding role in this design, in other embodiments
It can be not provided with, the position of compression spring be limited by way of slot, specific constructive form is with no restrictions.
Connecting plate 31 and pressure head 32 are an integral molding structure, connecting plate 31 and pressure head 32 by the material production of metallic copper and
At, therefore there is thermal conductivity.After pressure head 32 is connected to element under test, so that heating component 4 will add thermogenetic heat to lead to
It crosses connecting plate 31 and pressure head 32 passes to element under test, for providing test required hot environment to element under test.
It can be surveyed with the precise positioning of holding tank 21 through there is multiple positioning columns 11 on test box 1 for the ease of pressure head 32
The corresponding positioning column 11 of examination socket 2 is provided with multiple location holes 22, and the present embodiment is with quantity four of positioning column 11 and location hole 22
For, each positioning column 11 can be inserted into location hole 22 corresponding thereto, and positioning column 11 and location hole 22 match, and be played
Positioning, the effect being oriented to.
As shown in Figure 3-4, above-mentioned heating component 4 specifically includes heating sheet 41 and heating power supply line, and the one of heating power supply line
End is connected to external power supply, and the other end is electrically connected to heating sheet 41.It is provided in the side of connecting plate 31 for accommodating heating sheet
41 locating slot, heating sheet 41 is specially ceramic heating flake, and after opening external power supply, heating sheet 41 works and can generate heat
Amount.In order to monitor the temperature of element under test, which further includes the sensor 8 for detecting element under test temperature, even
The side of fishplate bar 31 is provided with the groove for accommodating sensor 8.
As shown in Figure 3-4, cooling assembly 5 includes the cooling fin 51 for being set to 31 top of connecting plate, is set to 1 side of test box
The fan 53 and cooling piece 52 in face, cooling piece 52 are set to 51 inside of cooling fin and the side towards heating component 4 processed.Cooling piece
52 also referred to as thermoelectric semiconductor refrigeration component, Peltier, cooling pieces 52 are thermally conductive patch, and cooling piece 52 has two sides, inhales on one side
Heat radiates on one side, but cooling piece 52 itself can't generate it is cold.After cooling piece 52 is electrified, 52 cold end of cooling piece
Heat be transferred to hot end, cause cold junction temperature to reduce, hot-side temperature increase, thus by around element under test heat take out
From, and heat is discharged by cooling fin 51 and fan 53, for providing test required low temperature environment to element under test.
Since cooling assembly 5 is located at the surface of heating component 4, can fast implement for the ease of cooling assembly 5 to be measured
The cooling and heat dissipation of element is additionally provided with thermally conductive sheet 9 between connecting plate 31 and cooling fin 51.Thermally conductive sheet 9 is by metal copper material system
It forms, there is stronger heating conduction, convenient for will be in the heat transfer around element under test to cooling piece 52.
In order to reduce interference of the cooling assembly 5 to heating component 4, above-mentioned barrier assembly 6 specifically include cut spring 61 and
The second bolt 62 of connecting plate 31 and thermally conductive sheet 9 is worn, connecting plate 31 is connected by the second bolt 62 with thermally conductive sheet 9, cut spring
61 are sheathed on the second bolt 62 and are set between connecting plate 31 and thermally conductive sheet 9, and thermally conductive sheet 9 can be moved along the second bolt 62.
Under the action of cut spring 61, there can be certain gap between thermally conductive sheet 9 and heating sheet 41, when heating sheet 41 is heating
When, it prevents heat to be transferred to the generation of cooling assembly 5 by thermally conductive sheet 9, scattering and disappearing for heat is reduced, to ensure that element under test
Measuring accuracy in a high temperauture environment.
As shown in Figure 3-4, above-mentioned driving assembly 7 includes fixing seat 10, screw rod 71 and the handle for being set to 1 top of test box
72, the threaded one end of screw rod 71 is connected to fixing seat 10 and is connected to the top of cooling assembly 5, and the other end of screw rod 71 is provided with
Handle 72.When element under test needs to test at low ambient temperatures, operator passes through manual or pneumatic rotary handle 72, so that
Screw rod 71 presses on the top of cooling fin 51, continues to rotate handle 72 later, and screw rod 71 continues to compress cooling fin 51 and push away therewith
Dynamic cooling piece 52, thermally conductive sheet 9 move straight down, compress cut spring 61 until thermally conductive sheet 9 and connecting plate 31 in thermally conductive sheet 9
Top surface is in contact, and cooling piece 52 works at this time, completes the test of chip at low ambient temperatures.After completing low-temperature test, instead
To rotational handle 72, thermally conductive sheet 9, cooling piece 52 and cooling fin 51 are under the action of compressed cut spring 61, straight up
It is mobile, reseting procedure is completed, for using next time.
The course of work of temperature controller provided in this embodiment is as follows:
When the test of element under test hot environment, driving assembly pushes test box 1, and test box integrally moves down pressure head 32 first
It protrudes into holding tank 21 and is connected to element under test, under the action of 1 self gravity of test box, compression spring 33 is pressed
Contracting, the downward reaction force that compressed compression spring 33 generates connecting plate 31, so that pressure head 32 and element under test are close
Contact, under the action of cut spring 61, can have certain gap, when 41 work of heating sheet between thermally conductive sheet 9 and heating sheet 41
When making and heat can be generated, heat is prevented to be transferred to the generation of cooling assembly 5 by thermally conductive sheet 9, so that element under test carries out height
Performance test under warm environment.
When the test of element under test low temperature environment, after pressure head 32 is connected to element under test, operator passes through manual
Or pneumatic rotary handle 72 continues to rotate handle 72 so that screw rod 71 presses on the top of cooling fin 51 later, screw rod 71 continues
It compresses cooling fin 51 and pushes cooling piece 52, thermally conductive sheet 9 to move straight down therewith, it is straight to compress cut spring 61 in thermally conductive sheet 9
It is in contact to thermally conductive sheet 9 with the top surface of connecting plate 31, cooling piece 52 works at this time, completes the test of chip at low ambient temperatures.
After completing low-temperature test, handle 72 is rotated backward, thermally conductive sheet 9, cooling piece 52 and cooling fin 51 are in compressed separation bullet
It under the action of spring 61, moves straight up, reseting procedure is completed, for using next time.
In the description of this article, it is to be understood that term " on ", "lower", " right side ", etc. orientation or positional relationships be based on
Orientation or positional relationship shown in the drawings is merely for convenience of description and simplification and operates, rather than the dress of indication or suggestion meaning
It sets or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to limit of the invention
System.In addition, term " first ", " second ", are only used to distinguish between description, have no special meaning.
In the description of this specification, the description of reference term " embodiment ", " example " etc. means to combine the embodiment
Or example particular features, structures, materials, or characteristics described are included at least one embodiment or example of the invention.?
In this specification, schematic expression of the above terms be may not refer to the same embodiment or example.
In addition, the above is only a better embodiment of the present invention and the applied technical principle.It will be appreciated by those skilled in the art that
The invention is not limited to the specific embodiments described herein, be able to carry out for a person skilled in the art it is various it is apparent variation,
It readjusts and substitutes without departing from protection scope of the present invention.Therefore, although being carried out by above embodiments to the present invention
It is described in further detail, but the present invention is not limited to the above embodiments only, without departing from the inventive concept, also
It may include more other equivalent embodiments, and the scope of the invention is determined by the scope of the appended claims.
Claims (10)
1. a kind of temperature controller, to test temperature needed for providing element under test, which is characterized in that the temperature controller includes:
Heating component (4), heating component (4) are located at element under test side, when heating, the heating component (4) and element under test
It contacts and starts heating；
Cooling assembly (5), cooling assembly (5) are located at the side of heating component (4) far from element under test, the heating component (4)
Barrier assembly (6) are provided between cooling assembly (5)；
When heating, heating component (4) contacts heating with element under test, and cooling assembly (5) passes through barrier assembly (6) and heating component
(4) it separates；When refrigeration, heating component stops heating, and cooling assembly (5) is moved to heating component (4) side and and heating component
(4) it contacts, refrigeration is realized in cooling assembly (5) starting.
2. temperature controller according to claim 1, which is characterized in that the temperature controller further include:
For placing the test jack (2) of element under test；
Crimp assemblies (3), the crimp assemblies (3) contact with heating component (4), and crimp assemblies (3) are connected to the member to be measured
Part；The test jack (2) is set to the underface of the heating component (4), and the top surface setting of the test jack (2) is useful
In the holding tank (21) for accommodating element under test, the test jack (2) is used to test the performance of element under test.
3. temperature controller according to claim 2, which is characterized in that the cooling assembly (5) is supported in the heating component
(4) top, the barrier assembly (6) include cut spring (61), when refrigeration, are pushed cooling assembly (5), the cooling assembly
(5) compression cut spring (61) is moved down, cooling assembly (5) is contacted with heating component (6).
4. temperature controller according to claim 3, which is characterized in that the temperature controller further includes driving assembly (7), the drive
Dynamic component (7) can be connected to the cooling assembly (5), and the cooling assembly (5) is driven to be moved to straight down and the pressure
At the position that connected components (3) are in contact.
5. temperature controller according to claim 4, which is characterized in that the crimp assemblies (3) include connecting plate (31), described
The direction of connecting plate (31) towards the holding tank (21) is convexly equipped with pressure head (32), and the pressure head (32) can protrude into the holding tank
(21) in and it is connected to the element under test.
6. temperature controller according to claim 5, which is characterized in that the temperature controller further includes a test box (1), the pressure
Connected components (3) further include the crimping preload piece being set between the test box (1) and connecting plate (31), the crimping preload piece
For elastic component, when crimp assemblies (3) are connected on element under test, under the action of test box (1) self gravity, crimping is pre-tightened
Part is compressed, and the downward reaction force that compression preload piece generates acts on pressure head (32), and pressure head (32) and element under test are tight
Contiguity touching.
7. temperature controller according to claim 6, which is characterized in that the crimping preload piece is compression spring (33), described
Crimp assemblies (3) further include the first bolt (34) for being arranged in the connecting plate (31) and the test box (1), the pressure bullet
Spring (33) be sheathed on first bolt (34) and be set to the connecting plate (31) and the test box (1) inner wall it
Between, the connecting plate (31) can move up and down vertically along first bolt (34).
8. temperature controller according to claim 6, which is characterized in that the heating component (4) includes heating sheet (41), described
The locating slot for accommodating the heating sheet (41) is provided on connecting plate (31).
9. temperature controller according to claim 8, which is characterized in that the cooling assembly (5) includes being set to the connection
Cooling fin (51) above plate (31), the fan (53) and cooling piece (52) for being set to test box (1) side, the cooling piece
(52) it is internal and towards the side of the heating component (4) to be set to the cooling fin (51)；
Thermally conductive sheet (9) are additionally provided between the connecting plate (31) and the cooling fin (51).
10. temperature controller according to claim 9, which is characterized in that the barrier assembly (6) further includes wearing the connection
The second bolt (62) of plate (31) and the thermally conductive sheet (9), the cut spring (61) are sheathed on second bolt (62)
And be set between the connecting plate (31) and the thermally conductive sheet (9), the thermally conductive sheet (9) can be perpendicular along second bolt (62)
Directly move up and down.
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| CN201811221945.0A CN109116879B (en) | 2018-10-19 | 2018-10-19 | Temperature controller |
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| CN201811221945.0A CN109116879B (en) | 2018-10-19 | 2018-10-19 | Temperature controller |
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| CN110174247A (en) * | 2019-05-29 | 2019-08-27 | 深圳市亚派光电器件有限公司 | Optical device test device |
| CN110261695A (en) * | 2019-06-12 | 2019-09-20 | 深圳市江波龙电子股份有限公司 | A kind of test device |
| CN112283973A (en) * | 2020-10-16 | 2021-01-29 | 广东唯实生物技术有限公司 | Thermal control device and immunodiagnosis system |
| CN112595921A (en) * | 2021-03-02 | 2021-04-02 | 天津金海通半导体设备股份有限公司 | High-low temperature testing device and method for electronic element |
| CN112631348A (en) * | 2020-12-29 | 2021-04-09 | 安徽盛世天朗软件科技有限公司 | Temperature self-adjusting network equipment temperature controller and adjusting method thereof |
| CN113125934A (en) * | 2019-12-31 | 2021-07-16 | 深圳市江波龙电子股份有限公司 | Chip test circuit and chip test equipment |
| CN114077241A (en) * | 2021-11-24 | 2022-02-22 | 合肥启胜自动化科技有限公司 | Temperature controller endurance test machine |
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