CN109093909A - LED circuit board encapsulating die, method and LED circuit board encapsulating structure - Google Patents
LED circuit board encapsulating die, method and LED circuit board encapsulating structure Download PDFInfo
- Publication number
- CN109093909A CN109093909A CN201810937863.XA CN201810937863A CN109093909A CN 109093909 A CN109093909 A CN 109093909A CN 201810937863 A CN201810937863 A CN 201810937863A CN 109093909 A CN109093909 A CN 109093909A
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- China
- Prior art keywords
- circuit board
- led circuit
- mold
- substrate
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title abstract description 12
- 239000003292 glue Substances 0.000 claims abstract description 97
- 239000000758 substrate Substances 0.000 claims abstract description 66
- 238000005538 encapsulation Methods 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 239000000565 sealant Substances 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 4
- 238000009755 vacuum infusion Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 3
- 238000002347 injection Methods 0.000 abstract description 3
- 239000007924 injection Substances 0.000 abstract description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000010412 perfusion Effects 0.000 description 4
- 239000000084 colloidal system Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920000715 Mucilage Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 210000002421 cell wall Anatomy 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/26—Moulds or cores
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/26—Moulds or cores
- B29C39/265—Moulds or cores comprising two large plates positioned at a small distance from each other, e.g. for making panels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Led Device Packages (AREA)
Abstract
本发明公开了一种LED电路板灌胶模具，用于封装LED电路板，LED电路板包括基板和设于基板上的若干LED单元，其包括第一模具和第二模具，所述容纳槽的槽底凸设有若干凸体，以使所述基板反面朝内配合安装于容纳槽内时，基板反面与容纳槽的槽底之间具有一注胶间隙；第二模具上形成有与所述LED电路板正面相对的灌胶面和与第一模具配合的合模面。本发明灌胶时，可LED电路板的正反两面分别注塑成型绝缘层，有效提高了LED电路板的防水防潮性能。本发明还公开了对应的灌胶方法和灌胶制成的LED电路板封装结构。
The invention discloses a glue filling mold for LED circuit boards, which is used for packaging LED circuit boards. The LED circuit board includes a base plate and several LED units arranged on the base plate. The bottom of the groove is provided with several protrusions, so that when the reverse side of the substrate is fitted in the containing groove, there is a glue injection gap between the reverse surface of the substrate and the groove bottom of the containing groove; The glue filling surface opposite to the front of the LED circuit board and the mold clamping surface matched with the first mould. When the invention is filled with glue, the front and back sides of the LED circuit board can be respectively injection-molded to form insulating layers, which effectively improves the waterproof and moisture-proof performance of the LED circuit board. The invention also discloses a corresponding glue filling method and an LED circuit board package structure made by glue filling.
Description
Technical field
The present invention relates to LED encapsulation more particularly to the encapsulating encapsulation of LED circuit board.
Background technique
Existing LED circuit board includes LED display board, LED illumination panel etc., generally comprises substrate, is installed on electricity
LED package unit and driving element on the plate of road, manufactured LED circuit board need to carry out encapsulating encapsulation at LED package unit.
Such as Chinese patent 201710943275.2 and Chinese patent 201710312123.2.
Chinese patent 201710943275.2 discloses a kind of LED screen with hollow out device, when production produces, first exists
Side with LED chip coats transparent anticorrosion sealing, then between LED chip row gap carry out hollow processing with
Obtain the LED screen of hollow out.However, this manufacturing process, has Railway Project: first, anticorrosion sealing is coated on substrate
, so that the anticorrosion sealing uniformity, smoothness are inadequate, waterproof and dampproof property is poor and light-out effect is bad.Second, necessary when production
Hollow out operation is carried out after encapsulating encapsulation, operating procedure is complicated, and the engraved structure that subsequent technique is cut into, hollow out groove sidewall
Flatness is bad, influences the translucency and display effect of entire LED screen.
Chinese patent 201710312123.2 discloses a kind of LED display, shaping mould group and its production technology, phase
For Chinese patent 201710943275.2, in substrate there is a side packing of LED unit to form using injection molding process for filling colloid
Packaging protection layer increases the waterproof and dampproof performance of LED display, but the behind of its LED panel is still exposed, can not
Comprehensive waterproof and dampproof protection is carried out to LED panel.
Therefore it is badly in need of a kind of LED circuit that LED encapsulating mould, method and the waterproof and dampproof performance that can be solved the above problems are good
Plate.
Summary of the invention
The object of the present invention is to provide a kind of LED circuit board encapsulating die and glue-pouring method, manufactured LED circuit board is positive and negative
The equal encapsulating in two sides forms insulating sealed layer, effectively increases the waterproof and dampproof performance of LED circuit board.
It is a further object of the present invention to provide a kind of LED circuit board encapsulating structure, the equal encapsulating of tow sides is formed absolutely
Edge encapsulated layer effectively increases the waterproof and dampproof performance of LED circuit board.
Upper purposeful in order to realize, the invention discloses a kind of LED circuit board encapsulating dies, in encapsulation LED circuit board, institute
Stating LED circuit board includes substrate and several LED units for being installed on substrate front side, and the LED circuit board encapsulating die includes the
One mold and the second mold, offer on the lower surface of first mold to match with the substrate and merge the appearance for accommodating the substrate
Receive slot, the slot bottom of the holding tank is convexly equipped with several convex bodys, so that the substrate back side is coupled inwardly in the holding tank
When interior, there is the injecting glue gap being connected to an injecting glue area, the second mold between the substrate back side and the slot bottom of the holding tank
It is upper with the land area matched with first mold lower surface, after first mold and the second mold clamping, described the
It is formed on two molds with the LED circuit board front with the opposite encapsulating face of a fixed spacing, so that the LED circuit board is upper
Injecting glue area is formed between surface and the encapsulating face.
Compared with prior art, present invention use and mutually matched first mold of LED circuit board, the base of LED circuit board
The plate body of plate is completely accommodated in the holding tank of the first mold, and convex body makes the LED circuit board lower surface and the encapsulating face
Between have an injecting glue gap, in injecting glue, transparent insulated enclosure glue injecting glue area formed encapsulation LED circuit board upper surface
Encapsulated layer while, may also pass through the gap between the cell wall of holding tank and the side of LED circuit board or other injecting glues
Channel enters in the injecting glue gap, to effectively increase LED in one layer insulating of reverse side injection molding of LED circuit board
The waterproof and dampproof performance of circuit board.
Preferably, the encapsulating face is plane.
Preferably, the injecting glue area is connected with the injecting glue gap.
Preferably, the glue-filling slot protruded into for first mold is formed on second mold, encapsulating face shape
The slot bottom of glue-filling slot described in Cheng Yu.
Preferably, the distance of the lower surface of first mold to the convex body is corresponding more than or equal to the LED circuit board
The thickness of position, the program make injecting glue area at least partly or are entirely located in the holding tank of the first mold, the second mold
Encapsulating face can be plane.
Specifically, the land area is generally aligned in the same plane with the encapsulating face, and the program makes insulated enclosure glue whole
It takes shape on the first mold, is directly separated convenient for insulated enclosure glue and the second mold.
More preferably, one or more hollow slots is offered in the LED circuit board respectively to separate the substrate
In several lamp bars, also it is convexly equipped on first mold and the one-to-one division wall of hollow slots in the LED circuit board, institute
It states division wall and the holding tank is divided into several grooves, and the end face of the division wall is affixed with the encapsulating face after molding
It closes.Sealing can form the insulating layer of hollow out directly on the substrate of hollow out in the program, without carry out after sealing hollow out operation plus
Work hollow hole saves process.
Specifically, the end face of the division wall is concordant with the lower surface of first mold.
More preferably, position is offered in the two opposite side walls of each groove respectively relatively and relative to first mould
Vertically disposed several longitudinally disposed and uniform thickness the longitudinal raised line in the lower surface of tool, several longitudinal raised lines make the groove
Side wall and the LED circuit board several lamp bar side walls between formed and be respectively communicated with the injecting glue area and the injecting glue gap
Injecting glue gap.LED circuit board is accurately positioned can in the program and what is consolidated is fixed in holding tank, and in LED electricity after injecting glue
The two opposite sides of its lamp bar of road plate form the injecting glue layer of consistency of thickness, realize the omnibearing protection of LED circuit board, and ensure that
The illumination effect of LED circuit board.
Preferably, several positioning screw holes are offered on the substrate respectively, the slot bottom of the holding tank offer with it is described
The corresponding multiple location holes of positioning screw hole.
Preferably, offering several positioning screw holes on the substrate, offered on the slot bottom of the holding tank and the LED
The corresponding location hole of a portion positioning screw hole on circuit board, the slot bottom of the holding tank are also convexly equipped with and the LED circuit
Remainder positioning screw hole is corresponding on plate and cooperates the positioning column for going deep into the positioning screw hole with the fixation LED circuit board.It should
Scheme can effectively reduce the number of location hole on the first mold, reduce glue and be spilled over to the first mould upper surface from location hole
Probability.
Preferably, offered on the slot bottom of the holding tank in the LED circuit board at least partly screw hole correspond
Location hole, the LED circuit board encapsulating die further includes and gasket made of the first mold same material, the sealing
It offers corresponding with position of positioning hole on pad and cooperates the avoiding hollow groove for accommodating screw head, the gasket is installed on described first
The upper surface of mold simultaneously seals the avoiding hollow groove.The program is spilled over to the from location hole after effectivelying prevent glue to pass through location hole
One mould upper surface.
Preferably, first mold is made of one piece by flexible material so that first mold is full soft mold.
The program makes flexible first mold of the present invention, to the LED circuit board in the first mold be removed away, convenient for de-
Mould.
The invention also discloses a kind of preparation methods of LED circuit board, comprising the following steps: LED circuit board to be packaged
With LED circuit board encapsulating die, the LED circuit board encapsulating die is as described above, be formed on second mold for institute
The glue-filling slot that the first mold protrudes into is stated, encapsulating face is formed in the slot bottom of the glue-filling slot；Several LED units will be installed
Substrate is installed in the holding tank and fixed, and the substrate has the side of LED unit towards outside the holding tank；Described
The insulated enclosure glue of injection liquid clear in the glue-filling slot of second mold；The lower surface court of the first mold of substrate will be fixed with
Under be gradually pressed into the glue-filling slot, and make between the upper surface of the LED circuit board and the slot bottom of glue-filling slot formed with it is described
The injecting glue area that injecting glue gap is connected；By LED circuit board encapsulating die as vacuum environment, so that the insulation in the glue-filling slot
It seals glue and is full of the injecting glue gap and injecting glue area；Encapsulation is formed to insulated enclosure glue curing and in the injecting glue gap location
The insulating waterproof layer of the base lower surface forms the insulation-encapsulated for encapsulating the upper surface of base plate and LED unit in injecting glue area
Layer；Vacuum environment is removed, takes out first mold, and packaged LED circuit board is dismantled to stripping from first mold
From getting off, LED circuit board encapsulating structure is made.
Compared with prior art, the LED circuit board front that the present invention prepares forms encapsulation institute by vacuum perfusion process
While stating the insulating sealed layer of upper surface of base plate and LED unit, pass through vacuum perfusion process program in the reverse side of LED circuit board
The insulating waterproof layer for encapsulating the base lower surface effectively increases the waterproof and dampproof performance of LED circuit board.
The invention also discloses a kind of LED circuit board encapsulating structures, if including substrate, being installed on the upper surface of base plate
The insulation of dry LED unit, the insulating sealed layer of the encapsulation upper surface of base plate and LED unit and the encapsulation base lower surface is anti-
Water layer, the insulating sealed layer and the insulating waterproof layer are by electric insulating sealant water difference vacuum infusion molding on the substrate
Solidify behind surface and lower surface.
Compared with prior art, LED circuit board front of the present invention is formed by vacuum perfusion process and encapsulates the base
The insulating sealed layer of plate upper surface and LED unit encapsulates the base by vacuum perfusion process program in the reverse side of LED circuit board
The insulating waterproof layer of plate lower surface effectively increases the waterproof and dampproof performance of LED circuit board.
Preferably, offering several hollow slots on the substrate respectively to separate the substrate in several lamp bars, often
The two opposite side walls of one lamp bar are enclosed with the side waterproof layer of consistency of thickness respectively, and the side waterproof layer is by insulated enclosure
Glue is distinguished vacuum infusion molding and is solidified behind the two opposite sides of lamp bar on substrate, and is formed on the side waterproof layer
The vertically disposed longitudinal groove in several upper surfaces relative to the substrate can mating mold guarantee when the program makes encapsulating
The position of substrate is prevented injecting glue caused by being deviated as substrate uneven, influences the illumination effect of LED circuit board.
Detailed description of the invention
Fig. 1 is the stereoscopic schematic diagram of the first mold of the present invention.
Fig. 2 is the bottom view of the first mold of the present invention.
Fig. 3 is the partial enlargement diagram of the first mold described in Fig. 2.
Fig. 4 is the first mold described in Fig. 3 along the cross-sectional view of line A-A.
Fig. 5 is the structural schematic diagram of LED circuit board of the present invention.
Fig. 6 is sectional view of the LED circuit board described in Fig. 5 along line B-B.
Fig. 7 a- Fig. 7 d is the procedure chart of the preparation method of LED circuit board of the present invention.
Fig. 8 is the cross-sectional view of LED circuit board encapsulating structure of the present invention.
Fig. 9 is the magnified partial view of LED circuit board encapsulating structure described in Fig. 8.
Specific embodiment
In order to describe the technical content, the structural feature, the achieved object and the effect of this invention in detail, below in conjunction with embodiment
And attached drawing is cooperated to be explained in detail.
Referring to figs. 1 to Fig. 4 and Fig. 7 a, the invention discloses a kind of LED circuit board encapsulating dies 100, for encapsulating LED
Circuit board 200, the LED circuit board 200 include substrate 21 and are installed on the positive several LED units 22 of substrate 21, the LED
Circuit board encapsulating die 100 includes the first mold 11 and the second mold 12, offer on the lower surface of first mold 11 with
The substrate 21 accommodates the holding tank 31 of the substrate 21 with merging, and the slot bottom of the holding tank 31 is convexly equipped with several convex bodys 52,
So that 21 reverse side of substrate is coupled in the holding tank 31 inwardly (reverse side of substrate 21 is opposite with 31 slot bottom of holding tank)
When interior, there is an injecting glue gap 41 being connected to glue-filling slot 32 between 21 reverse side of substrate and the slot bottom of the holding tank 31
(as shown in Figure 7b)；The glue-filling slot 32 protruded into for first mold 11, the first mold are formed on second mold 12
11 and second mold 12 mold after, first mold 11 protrudes into the glue-filling slot 32 and makes the upper surface of LED circuit board 200
Between the slot bottom of the glue-filling slot 32 injecting glue area 43 (as shown in Figure 7 c).Wherein, convex body 52 is small top pillar in the present embodiment.This
In embodiment, the slot bottom of the glue-filling slot 32 forms the land area with 11 lower surface of the first mold cooperation molding.This implementation
In example, the slot bottom of glue-filling slot 32 forms the encapsulating face of the second mold 12.
Certainly, it is different from above-mentioned technology, main body of the encapsulating plate as the second mold also can be used, in use, will fill
The lower surface of offset plate and the first mold 12 for being fixed with LED circuit board 200 is bonded to each other, thus in the upper of the LED circuit board
Injecting glue area is formed between surface and the plate face (encapsulating face) of the encapsulating plate, is wherein opened up on encapsulating plate and/or the first mold 11
There is glue filling opening and vacuumize hole, directly inject insulated enclosure glue from glue filling opening to injecting glue area, extracts the first mould out from hole is vacuumized
Air in tool 11, so that insulated enclosure mucilage sealing fills LED circuit board 200.
Wherein, enter injecting glue gap 41 from glue-filling slot 32 for the ease of insulative glue, opened up on the side wall of holding tank 31
There are several vertically disposed several longitudinally disposed and uniform thickness longitudinal raised lines 51 in lower surface relative to first mold 11,
Several longitudinal raised lines 51 to form injecting glue between the side wall of the holding tank 31 and the side wall of the LED circuit board 200
Gap 42.42 one end of injecting glue gap is connected to injecting glue gap 41, and the other end is connected to glue-filling slot 32, so that after encapsulating, LED circuit board
Insulating cement waterproof layer, omnibearing protection LED circuit board 200 are coated on 200 front, the back side and side wall.Wherein, holding tank
31 two opposite sides are respectively provided with longitudinal raised line 51, and LED circuit board 200 is clipped in the middle by longitudinal raised line 51, at this point, longitudinal
Raised line 51 and 200 side wall of LED circuit board contradict, and prevent 200 placement location of LED circuit board from deviating.It is of course also possible to directly
The glueing channel of molding connection glue-filling slot 32 and injecting glue gap 41 on one mold 11, or connection is formed in LED circuit board 200
The glueing channel of glue-filling slot 32 and injecting glue gap 41, it is also possible that the holding tank 31 of the first mold 11 and LED circuit board 200
Sidewall spacers cooperation, forms injecting glue gap directly between 21 side wall of 31 side wall of holding tank and substrate.
Preferably, with reference to Fig. 7 b, in the present embodiment, land area is generally aligned in the same plane with encapsulating face.First mold 11
Lower surface to the convex body 52 distance be greater than 200 corresponding position of LED circuit board thickness so that the LED circuit
When plate 200 is installed in the holding tank 31 and contacts molding with the slot bottom of glue-filling slot 32,200 upper surface of LED circuit board
There is injecting glue area 43 between 11 lower surface of the first mold.When injecting glue, first mold 11 can protrude into the glue-filling slot
32 and the slot bottom cooperation of 11 lower surface of the first mold and the glue-filling slot 32 is contacted, in the upper of the LED circuit board 200
Injecting glue area 43 is formed between surface and the slot bottom of glue-filling slot 32, the injecting glue area 43 is connected with the injecting glue gap 41.Wherein,
Coarse table is used full of injecting glue area 43 and injecting glue gap 41,11 lower surface of the first mold or 32 slot bottom of glue-filling slot in order to facilitate glue
Face, so that having the gap passed in and out for glue water and air between 32 slot bottom of the first mold 11 and glue-filling slot.It is of course also possible to directly
Glue filling opening and aspirating hole are opened up in the slot bottom of the first mold 11 or glue-filling slot 32.
In the present embodiment, slot bottom (encapsulating face) position corresponding with LED circuit board 200 of the glue-filling slot 32 is plane,
So that the surfacing thereon of LED circuit board 200 processed.Certainly, the concrete shape of the slot bottom (encapsulating face) of glue-filling slot 32 by
Insulated enclosure glue shape in LED circuit board 200 determines.
When injecting glue, the top of the positive electric insulating sealant water submerged LED unit of LED circuit board 200, so that LED circuit board
Front be entirely wrapped in.Certainly, the distance of the lower surface of the first mold 11 to the convex body 52 can also be equal to described
The thickness of 200 corresponding position of LED circuit board, so that the positive insulated enclosure glue of LED circuit board 200 and LED unit top horizontal
Together.Wherein, the colloid thickness encapsulated in specific LED unit is according to needing to be controlled by mold, to obtain corresponding lamp face colloid thickness
Degree.The LED circuit board can be used for illuminator, display screen, floor tile screen etc..
With reference to Fig. 5, present invention is alternatively directed to the LED circuit boards 200 of hollow out to be packaged, and divide in the LED circuit board 200
Not offering multiple hollow slots 23 to separate the substrate 21 is in several lamp bars 24, is also convexly equipped on first mold 21
It is concordant with the lower surface of first mold 11 and with the one-to-one division wall of hollow slots 23 in the LED circuit board 200
33, so that the end face of the division wall 33 fits with the encapsulating face after molding, the division wall 33 is by the holding tank 23
It is divided into several grooves 34.In the program can directly on the substrate of hollow out 21 sealing formed hollow out insulating sealed layer, be not necessarily to
Hollow out operation processing hollow hole is carried out after sealing, saves process.In the present embodiment, hollow slots 23 are in longitudinal and multiple hollow slots 23
Between parallel arranged so that lamp bar 24 be in bar shaped and parallel arranged.
Referring to figs. 1 to Fig. 4, it is opposite and relative to described that position is offered in the two opposite side walls of each groove 34 respectively
Vertically disposed several longitudinally disposed and uniform thickness the longitudinal raised line 51 in the lower surface of one mold 11, several longitudinal raised lines 51 make
It obtains to be formed between the two opposite side walls of the groove 34 and 24 side wall of several lamp bars of the LED circuit board 200 and is respectively communicated with institute
State the injecting glue gap 42 in injecting glue area 43 Yu the injecting glue gap 41.Wherein, 34 two opposite sides of groove are respectively provided with longitudinal raised line 51,
And the lamp bar 24 of LED circuit board 200 is clipped in the middle by longitudinal raised line 51, at this point, longitudinal raised line 51 is supported with 24 side wall of lamp bar
Touching prevents 200 placement location of LED circuit board from deviating.
With reference to 2 and Fig. 5, several positioning screw holes 211 are offered on the substrate 21 respectively, the slot bottom of the holding tank 31 is opened
Equipped with multiple location holes 35 corresponding with positioning screw hole 211 described in a portion.The slot bottom of the holding tank 31 is also convexly equipped with
It is corresponding with remainder positioning screw hole 211 on the substrate 21 and cooperate and go deep into the positioning column 36 of the positioning screw hole 211 with solid
The fixed substrate 21.It is of course also possible to be opened in the one-to-one location hole 35 of positioning screw hole 211 on holding tank 31.Screw
It may pass through location hole 35 to be threadedly coupled with positioning screw hole 211, substrate 21 be fixed on the first mold 11.
With reference to Fig. 7 a to Fig. 7 d, the LED circuit board encapsulating die 100 further includes and the 11 same material system of the first mold
At gasket 13, offer on the gasket 13 corresponding with 35 position of location hole and cooperate the avoiding hollow groove for accommodating screw head
(not shown), the gasket 13 are installed on the upper surface of first mold 11 and seal the avoiding hollow groove.
Preferably, first mold 11 is made of one piece by flexible material so that first mold 11 is full soft mode
Tool.Wherein, the first mold 11 is made of the flexible material that not being adhered with insulated enclosure glue, and can integrally bending in favor of de-
Mould.
With reference to Fig. 7 a to Fig. 7 d, the preparation method of LED circuit board of the present invention is described, comprising the following steps:
With reference to Fig. 7 a, LED circuit board 200 and LED circuit board encapsulating die 100 to be packaged are provided.Specifically: as schemed
Shown in 5 and Fig. 6, LED circuit board 200 includes substrate 21 and several LED units 22 for being arranged on substrate 21, pre- on substrate 21
Forming several perforative longitudinal hollow slots 23 first to separate the substrate 21 is in several lamp bars 24, is arranged in each lamp bar 24
Show several LED units.Several perforative positioning screw holes 211 are also provided on substrate 23.LED circuit board encapsulating die 100
As shown in Figures 1 to 4, including the first mold 11 and the second mold 12.In the present embodiment, the position of the back end of substrate 21
It is additionally provided with driving circuit 25, the first mold 11 position corresponding with the element of driving circuit 25 offers corresponding avoiding hollow groove 37,
Avoiding hollow groove 37 select as required through substrate 21 or not through.
With reference to Fig. 7 b, LED circuit board 200 to be packaged is installed in the holding tank 31, one with LED unit 22
Side is towards outside the holding tank 31；Positioning column 36 protrudes into positioning screw hole 211 so that LED circuit board 200 is tentatively fixed on the first mould
On tool 21, location hole 35 is passed through using screw and is threadedly coupled with corresponding positioning screw hole 211, LED circuit board 200 is locked
On the first mold 21.Upper gasket 13 is pressed at the back side of the first mold 11, briquetting can be reused and press gasket 13 surely.?
The insulated enclosure glue 40 of injection liquid clear in the glue-filling slot 32 of second mold 12.Wherein, in the filling of the second mold 12
Before 32 encapsulating of glue groove, processing release paper and surface-treated layer can also be laid in the slot bottom of glue-filling slot 32.
With reference to Fig. 7 c, the following table for being fixed with the first mold 11 of substrate 21 is gradually pressed into the glue-filling slot 32 down,
And to be formed between the upper surface of the LED circuit board 200 and the slot bottom of glue-filling slot 32 and be connected with the injecting glue gap 41
Injecting glue area 43；By LED circuit board encapsulating die 100 as vacuum environment, so that the electric insulating sealant in the glue-filling slot 32
Water 40 partially passes through injecting glue gap 42 and fills the full injecting glue gap 41, is partially filling up the injecting glue area 43.
With reference to Fig. 7 d, is formed at the injecting glue gap 41 after insulated enclosure glue curing and encapsulate 21 following table of substrate
The insulating waterproof layer 61 in face forms the insulating sealed layer 62 for encapsulating 21 upper surface of substrate and LED unit 22 in injecting glue area 43；
First mold 11 is taken out from glue-filling slot 32, and packaged LED circuit board 200 is dismantled from first mold 11
It strips down, LED circuit board encapsulating structure 300 (as shown in Figure 8) is made.Wherein, the surface also shape of the insulating waterproof layer 61
At there is several pits, the pit is corresponding with protrusion 52, for the cutter trade of protrusion 52.
With reference to Fig. 7 d, the side of 21 side wall of package substrate is formed also at injecting glue gap 42 after insulated enclosure glue curing
Waterproof layer 63.Wherein, longitudinal groove corresponding with longitudinal raised line 51 is also formed on side wall encapsulated layer 63.Wherein, each described
The two opposite side walls of lamp bar 24 are enclosed with the side waterproof layer 63 of consistency of thickness respectively.
Wherein, the two opposite sides of longitudinal raised line 51 are parallel to each other, so that longitudinal raised line 51 is in rectangle.
The above disclosure is only a preferred embodiment of the invention, cannot limit the right of the present invention with this certainly
Range, therefore according to equivalent variations made by scope of the present invention patent, it is still within the scope of the present invention.
Claims (10)
1. a kind of LED circuit board encapsulating die, for encapsulating LED circuit board, the LED circuit board includes substrate and is installed on base
The positive several LED units of plate, it is characterised in that: the LED circuit board encapsulating die includes the first mold and the second mold, institute
It states to offer to match with the substrate on the lower surface of the first mold and merges the holding tank for accommodating the substrate, the slot of the holding tank
Bottom is convexly equipped with several convex bodys so that the substrate back side is coupled inwardly when in the holding tank, the substrate back side with
There is the injecting glue gap being connected to an injecting glue area between the slot bottom of the holding tank, have and first mold on the second mold
The land area that lower surface matches, and after first mold and the second mold clamping, is formed with and institute on second mold
State the LED circuit board front encapsulating face opposite with a fixed spacing so that the upper surface of the LED circuit board and the encapsulating face it
Between form the injecting glue area.
2. LED circuit board encapsulating die as described in claim 1, it is characterised in that: the lower surface of first mold to institute
The distance for stating convex body is more than or equal to the thickness of the LED circuit board corresponding position, and the land area is same with the encapsulating face
Plane.
3. LED circuit board encapsulating die as claimed in claim 2, it is characterised in that: offered respectively in the LED circuit board
One or more hollow slots is in several lamp bars to separate the substrate, be also convexly equipped on first mold with it is described
The one-to-one division wall of hollow slots in LED circuit board, the holding tank is divided into several grooves by the division wall, and is closed
The end face of the division wall fits with the encapsulating face after mould.
4. LED circuit board encapsulating die as claimed in claim 3, it is characterised in that: the two opposite side walls of each groove
It is upper to offer position respectively relatively and the vertically disposed several longitudinally disposed and uniform thickness in lower surface relative to first mold
Longitudinal raised line, several longitudinal raised lines make the groove side wall and the LED circuit board several lamp bar side walls it
Between formed and be respectively communicated with the injecting glue gap in the injecting glue area Yu the injecting glue gap.
5. LED circuit board encapsulating die as described in claim 1, it is characterised in that: offer several positioning on the substrate
Screw hole offers location hole corresponding with a portion positioning screw hole in the LED circuit board on the slot bottom of the holding tank,
The slot bottom of the holding tank be also convexly equipped with it is corresponding with remainder positioning screw hole in the LED circuit board and cooperate go deep into it is described fixed
The positioning column of position screw hole is with the fixation LED circuit board.
6. LED circuit board encapsulating die as described in claim 1, it is characterised in that: offered on the slot bottom of the holding tank
With at least partly the corresponding location hole of screw hole, the LED circuit board encapsulating die further include and described in the LED circuit board
Gasket made of one mold same material offers corresponding with position of positioning hole on the gasket and cooperates receiving screw head
Avoiding hollow groove, the gasket is installed on the upper surface of first mold and seals the avoiding hollow groove.
7. LED circuit board encapsulating die as described in claim 1, it is characterised in that: first mold is by flexible material one
It is body formed to form so that first mold is full soft mold.
8. a kind of preparation method of LED circuit board, it is characterised in that:
In LED circuit board and LED circuit board encapsulating die to be packaged, the LED circuit board encapsulating die such as claim 1-7
Described in any one, the glue-filling slot protruded into for first mold is formed on second mold, the encapsulating face is formed in
The slot bottom of the glue-filling slot；
The substrate for being equipped with several LED units is installed in the holding tank and is fixed, the substrate has the one of LED unit
Side is towards outside the holding tank；
The insulated enclosure glue of liquid clear is injected in the glue-filling slot；
The following table for being fixed with the first mold of substrate is gradually pressed into the glue-filling slot down, and makes the LED circuit board
Upper surface and glue-filling slot slot bottom between form the injecting glue area that is connected with the injecting glue gap；
By LED circuit board encapsulating die as vacuum environment, so that the insulated enclosure glue in the glue-filling slot is full of the note
Glue gap and injecting glue area；
To insulated enclosure glue curing to form the insulating waterproof layer for encapsulating the base lower surface in the injecting glue gap location,
Injecting glue area forms the insulating sealed layer for encapsulating the upper surface of base plate and LED unit；
Vacuum environment is removed, takes out first mold, and packaged LED circuit board is dismantled to stripping from first mold
From getting off, LED circuit board encapsulating structure is made.
9. a kind of LED circuit board encapsulating structure, it is characterised in that: including substrate, be installed on several LED of the upper surface of base plate
The insulating waterproof layer of unit, the insulating sealed layer of the encapsulation upper surface of base plate and LED unit and the encapsulation base lower surface,
The insulating sealed layer is with the insulating waterproof layer by electric insulating sealant water difference vacuum infusion molding in the upper surface of base plate
Solidify with behind lower surface.
10. LED circuit board encapsulating structure as claimed in claim 9, it is characterised in that: offered respectively on the substrate several
Hollow slots are in several lamp bars to separate the substrate, and the two opposite side walls of each lamp bar are enclosed with consistency of thickness respectively
Side waterproof layer, the side waterproof layer is by electric insulating sealant water difference vacuum infusion molding in the two opposite of lamp bar on substrate
Solidify behind side, and is formed with several vertically disposed longitudinal directions in the upper surface relative to the substrate on the side waterproof layer
Groove.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810937863.XA CN109093909B (en) | 2018-08-16 | 2018-08-16 | LED circuit board glue pouring mold, method and LED circuit board packaging structure |
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|---|---|---|---|
| CN201810937863.XA CN109093909B (en) | 2018-08-16 | 2018-08-16 | LED circuit board glue pouring mold, method and LED circuit board packaging structure |
Publications (2)
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| CN109093909A true CN109093909A (en) | 2018-12-28 |
| CN109093909B CN109093909B (en) | 2024-04-23 |
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| CN111081162A (en) * | 2020-01-07 | 2020-04-28 | 深圳市丽晶光电科技股份有限公司 | Process for solving flatness of display screen module |
| CN111326081A (en) * | 2020-03-20 | 2020-06-23 | 深圳视爵光旭电子有限公司 | Preparation method of novel display screen external member and special clamp |
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