CN109075254A - The method for manufacturing flexible display apparatus - Google Patents
The method for manufacturing flexible display apparatus Download PDFInfo
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- CN109075254A CN109075254A CN201780021125.4A CN201780021125A CN109075254A CN 109075254 A CN109075254 A CN 109075254A CN 201780021125 A CN201780021125 A CN 201780021125A CN 109075254 A CN109075254 A CN 109075254A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K99/00—Subject matter not provided for in other groups of this subclass
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133305—Flexible substrates, e.g. plastics, organic film
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
- G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- General Physics & Mathematics (AREA)
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- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Abstract
本发明涉及一种制造柔性显示装置的方法，所述方法包括：在第一载体基板上形成分离层；在分离层上形成保护层；在保护层上形成黑色矩阵(BM)层并在BM层之间形成着色剂层；将其上形成有分离层、保护层、BM层和着色剂层的第一载体基板与薄膜晶体管(TFT)阵列基板对准并接合；以及移除第一载体基板。
The invention relates to a method for manufacturing a flexible display device, the method comprising: forming a separation layer on a first carrier substrate; forming a protective layer on the separation layer; forming a black matrix (BM) layer on the protective layer and forming a black matrix (BM) layer on the BM layer forming a colorant layer therebetween; aligning and bonding the first carrier substrate on which the separation layer, the protective layer, the BM layer and the colorant layer are formed with a thin film transistor (TFT) array substrate; and removing the first carrier substrate.
Description
Technical field
The present invention relates to a kind of methods for manufacturing flexible display apparatus.Particularly, the present invention relates to one kind in carrier substrate
The method of the manufacture flexible display apparatus of upper implementation procedure.
Background technique
The display that flexible display, which refers to, can be bent, folds or crimp without damaging its performance, and it can be with
It is flexible LCD, flexibility OLED, Electronic Paper etc..
In order to realize flexible display, flexible base of a variety of plastic bases as substitution traditional glass substrate has been developed
Plate, and constitute flexible display various parts substrate replaced this plastic base.For example, in Korean Patent
A kind of filter substrate is disclosed in No.10-1174148 comprising the ilm substrate made of polyimides and be formed in film base
Color filter part on plate.A kind of flexible organic light emission is disclosed in Korean Patent Application Publication No.10-2013-0047971
Diode display comprising flexible layer；The buffer layer being coated on the entire upper surface of flexible layer；It is formed in buffer layer
Display element on upper surface；With there is elasticity and rear panel flexible, which is attached in the rear surface of flexible layer simultaneously
Support display element.
However, when using flexible base board, it is difficult to which delicate elements are accurately arranged on flexible substrate.In order to solve
Such problems, Korean Patent Publication No.10-12670688, which is disclosed, a kind of is attached at the load made of glass for film substrate
On structure base board, it is formed on element and the then method of removal carrier substrate.
However, since the transition temperature of ilm substrate is lower than the transition temperature of glass substrate, and ilm substrate is due to temperature change
Expansion rate caused by changing is high, therefore there are problems that the layer stacked on it is likely to be broken or deforms.
In addition, when filter substrate and thin-film transistor array base-plate is respectively formed on flexible substrates and group is filled with to be formed
When flexible display apparatus, since transfer method will be used to be attached flexible film substrate, there is big dislocation.
Summary of the invention
[technical problem]
It is an object of the present invention to provide a kind of methods for manufacturing flexible display apparatus, are formed in individually when manufacture has
Flexible base board on filter substrate and thin-film transistor array base-plate flexible display apparatus when, this method can reduce two
Alignment error between a substrate.
It is a further object to provide a kind of methods that manufacture includes the flexible display apparatus of filter substrate, should
Method can obtain the high resolution design being difficult to realize in common plastics substrate, solve thermal instability, and application is respectively
The basement membrane of kind material.
[technical solution]
According to an aspect of the invention, there is provided a kind of method for manufacturing flexible display apparatus, comprising the following steps:
Separating layer is formed on first vector substrate；Protective layer is formed in separating layer；Form black matrix" (BM) layer simultaneously on the protection layer
Coloring agent layer is formed therebetween；To be formed with thereon the first vector substrates of separating layer, protective layer, BM layers and coloring agent layer with it is thin
Film transistor (TFT) array substrate is aligned and is attached；And remove first vector substrate.
The method of manufacture flexible display apparatus can also include flexible base film is attached to separating layer remove the first load
Step on the surface of structure base board.
Tft array substrate may include Organic Light Emitting Diode (OLED).
Tft array substrate may include Second support substrate, and the method for manufacturing flexible display apparatus can also include
The step of removing Second support substrate after being aligned and being attached step.Furthermore it is possible to remove first vector substrate and simultaneously
Two carrier substrates.
Protective layer can be formed as to covering the side surface of separating layer.Moreover, protective layer may include organic insulating film and
At least one of inorganic insulating membrane.
The method of manufacture flexible display apparatus can also include the steps that forming planarization layer on BM layers and coloring agent layer.
It is being aligned and is being attached in step, pair being respectively formed on first vector substrate and tft array substrate can be used
Quasi- key (key) executes alignment, and separating layer, protective layer, BM layers and colorant have been formed on the first vector substrate
Layer, and alignment can be executed with 5 μm or smaller alignment error.
Alignment and attachment steps in, can be used optically clear adhesive (OCA) or optical clear resin (OCR) by its
On be formed with first vector substrate and the tft array substrate attachment of separating layer, protective layer, BM layers and coloring agent layer.
[beneficial effect]
It is according to the present invention manufacture flexible display apparatus method, the manufacturing process of colour filter in glass substrate rather than by
It is carried out on basement membrane made of plastics, to solve the thermal deformation problem of conventional plastic substrate.It is available cannot be in plastics base
The high resolution design realized in plate.
Moreover, passing through the filter substrate formed on the glass substrate and the film crystal being also formed on glass substrate
The alignment of pipe array substrate and combination, the alignment that can be significantly reduced between filter substrate and thin-film transistor array base-plate miss
Difference.
In addition, being used as carrier due to removing at room temperature after by filter substrate and thin-film transistor array base-plate bonding
The glass substrate of substrate and basement membrane is individually attached, therefore solves the thermal deformation problem of conventional plastic substrate.It is also advantageous
Be, the diversification of basal lamina material be it is feasible, it is unrestricted.
Detailed description of the invention
Fig. 1 is the cross-sectional view for showing flexible display apparatus according to embodiment of the present invention.
Fig. 2 to Figure 11 schematically shows an embodiment of flexible display apparatus manufacturing method according to the present invention
Process.
Specific embodiment
The present invention provides a kind of methods of the manufacture flexible display apparatus of alignment error with minimum, wherein can
Realize high resolution design, and the material of plastic base is unrestricted.
Hereinafter, the preferred embodiment of flexible display apparatus and its manufacturing method will be described in detail with reference to the attached drawings.So
And the attached drawing of the disclosure is only for illustrating example of the invention, and the present invention is not limited to attached drawings.In addition, in order to apparent
Expression, certain elements may be exaggerated in figure, reduce or omit.
Fig. 1 is the cross-sectional view for showing flexible display apparatus according to embodiment of the present invention.
With reference to Fig. 1, flexible display apparatus according to one embodiment of the present invention include with thin film transistor (TFT) (TFT) and
TFT+OLED substrate 200, colour filter (CF) substrate 100 and the adhesive phase therebetween of the array of Organic Light Emitting Diode (OLED)
300。
In flexible display apparatus according to embodiment of the present invention, CF substrate 100 and TFT+OLED substrate 200
It is flexible base board, wherein required element is arranged in flexible base film 110 and 210, so that providing includes two be bonded to each other
The flexible display apparatus of a substrate 100 and 200.In addition, if it is desired, each element being arranged in flexible base film 110 and 210
Flex capability is provided for flexible display apparatus.
Specifically, CF substrate 100 include basement membrane 110, separating layer 120, protective layer 130, black matrix" (BM) layer 140,
Colorant layer 150 and planarization layer 160, they are stacked with this sequence.
According to the present invention, at least one of the layer for constituting CF substrate 100, is preferably separated layer 120 or protective layer 130,
More preferably separating layer 120 can be organic layer, to provide flexibility CF substrate.
Organic layer can be made of organic polymer.Organic polymer may include selected from by polyacrylate, poly- methyl
Acrylate (such as PMMA), polyimides, polyamide, polyvinyl alcohol, polyamic acid, polyolefin (such as PE, PP), polyphenyl second
Alkene, polynorbornene, phenyl maleimide copolymers, poly- azobenzene, polyphenylene phthalamide, polyester (such as PET,
PBT), polyarylate, cortex cinnamomi acid polymer, cumarin polymer, benzyl first lactam polymer, chalcone polymer and Aromatic acetylene
At least one of the group of polymer composition.
Above-mentioned polymer is suitable for selected from by basement membrane 110, separating layer 120, protective layer 130, BM layer 140, coloring agent layer
150, at least one layer in group composed by planarization layer 160 and combinations thereof.For example, same or similar polymer can be answered
It is only applied to separating layer 120 for each layer, or by polyacrylate, and remaining layer can be by material system known in the art
At.
Now, it will be described in constituting each layer of flexibility CF substrate 100 according to the present invention.
Basement membrane 110 can be normally used as any one of those of optical clear film, and it is preferable to use with excellent
Flexibility, the transparency, thermal stability, moisture resistance, phase difference uniformity and isotropism etc. film.
The specific example of material for basement membrane 110 includes above-mentioned polymer or those of commonly used in the art, such as poly- pair
Ethylene terephthalate, polyethylene, polystyrene, polycarbonate, polyimides etc..
Separating layer 120 is formed for completing flexibility CF substrate 100 and TFT+OLED in the manufacturing method of the present invention
The layer removed after the bonding of substrate 200 from carrier substrate.
Therefore, separating layer 120 can be separated by physical force with carrier substrate, and be laminated to basement membrane after releasing
On 110.When separating layer 120 is separated with carrier substrate, the peel strength of separating layer 120 can be 5N/25mm or smaller, preferably
For 1N/25mm or smaller, more preferably 0.1N/25mm or smaller.That is, it is preferable that separating layer 120 is by that can divide
The physical force of application is maintained at the material in 1N/25mm, especially 0.1N/25mm by absciss layer 120 during separating with carrier substrate
It is formed.
If the peel strength of separating layer 120 is more than 1N/25mm, it is difficult to carrier substrate divide separating layer 120 completely
From, therefore separating layer 120 may be retained on carrier substrate.Furthermore, it is possible to separating layer 120, protective layer 130, BM layer 140,
It is cracked on one or more of coloring agent layer 150 and planarization layer 160.
Particularly, the peel strength of separating layer 120 is preferably 0.1N/25mm or smaller because it allow with carrier base
Curling after plate separation in control film generates.Although curling does not influence the function of flexible CF substrate itself, curling may
Reduce the efficiency of bonding and cutting process.Therefore, this is conducive to make the generation of curling to minimize.
The thickness of separating layer 120 is preferably 10nm to 1000nm, more preferably 50nm to 500nm.If separating layer 120
Thickness is less than 10nm, then may form unevenly separating layer to lead to be formed on uneven pattern, the stripping of separating layer 120
It may locally increase from intensity to cause to rupture, or may not be able to be rolled up after separating layer 120 is separated with carrier substrate
Song control.If the thickness of separating layer 120 is greater than 1000nm, the peel strength of separating layer 120 may be reduced no longer, and soft
Property may deteriorate.
After separating layer 120 is removed from carrier substrate, the surface of separating layer 120 can be preferably 30-70mN/m.In addition, point
Absciss layer 120 preferably has 10mN/m or bigger surface energy differential at it between carrier substrate.In separating layer 120 and carrier base
Before plate separation, separating layer 120 should keep bonding with stablizing for carrier substrate, then should be easily isolated, flexible without generating
The rupture or curling of CF substrate.When the surface of separating layer 120 is able to satisfy the range of 30-70mN/m, it is strong to can control its removing
Degree, it can be ensured that the excellent bonds between separating layer 120 and adjacent protective layer 130, to improve the efficiency of process.In addition, working as
Separating layer 120 meet its surface energy differential between carrier substrate be 10mN/m or bigger when, separating layer 120 can easily with
Carrier substrate separation, to prevent the rupture of flexible CF substrate or the crackle generation of flexibility CF substrate.
Protective layer 130 is used for the side surface protected separating layer 120 and cover separating layer 120 with packing forms.Protection
Layer can be made of above-mentioned organic material or it can be made of inorganic material.
Coloring agent layer 150 is for realizing full-color display, and in general, red, green, blue and white are patterned simultaneously
It is arranged between BM layer 140, the BM layer 140 is used to stop the light in the region in addition to pixel region.However, coloring agent layer
It not necessarily include all red, green, blue and white pattern.On the contrary, can only include these colors according to color model
In some patterns.
Meanwhile when exterior light reaches the coloring agent layer of each color, only transmission has light and the absorption of respective wavelength
Light with other wavelength.Therefore, the incident light quantity of exterior light can be effectively reduced, this allows coloring agent layer to be used as preventing
The only polarizer of external light reflection.
Planarization layer 160 is for compensating the step of coloring agent layer 150 and improving the layer of flatness, and material is in the present invention
In be not particularly limited.It is, for example, possible to use common materials, such as polyacrylate, polyimides, polyester etc..
The thickness of each organic layer is not particularly limited in the present invention.However, in order to make flexible CF substrate and Flexible Displays
Device is thinner, and the thickness of preferably each organic layer is less than several microns (μm).
Preferably, flexible CF substrate 100 according to embodiment of the present invention may include:
Basement membrane 110, is made of polyimide material, with a thickness of 10-100 μm；
Separating layer 120, is made of polyacrylic acid material, with a thickness of 0.01-1.0 μm；
Protective layer 130 is made, with a thickness of 0.5-5 μm of polycyclic alkene material；
Coloring agent layer 150, with a thickness of 0.5-5 μm；With
Planarization layer 160 is made and with a thickness of 0.5-5 μm of polyacrylic acid material.
Meanwhile TFT+OLED substrate 200 have basement membrane 210, TFT layer 220, oled layer 230 and encapsulated layer 240 stack it is in heaps
Structure, detailed construction is not particularly limited in the present invention.Moreover, TFT+OLED substrate 200 can pass through Flexible Displays
Known any method manufacture in device technical field.
In flexible display apparatus of the invention, the BM layer 140 and coloring agent layer 150 and TFT+ of flexible CF substrate 100
The TFT layer 220 of oled substrate 200 and the pattern of oled layer 230 are aligned with 5 μm or smaller alignment error, this is than using membranous type
The conventional flex display device of colour filter is much more accurate.It is more detailed below with reference to flexible display apparatus manufacturing method of the invention
Ground illustrates the alignment of substrate.
Adhesive phase 300 is formed between flexible CF substrate 100 and TFT+OLED substrate 200, each other by two substrates
Bonding.Adhesive phase 300 is made of optically clear adhesive (OCA) or optical clear resin (OCR).
Fig. 2 to Figure 11 is an embodiment for schematically showing flexible display apparatus manufacturing method according to the present invention
Process cross-sectional view.
The method of manufacture flexible display apparatus according to embodiment of the present invention can be by carrier substrate
Implementation procedure generates high resolution design.Since the flexible CF substrate being formed on carrier substrate and carrier base will be also formed in
TFT+OLED base plate alignment on plate is simultaneously attached, then carrier of separating substrate, therefore alignment error can be made to minimize.In addition,
Material as plastic base is unrestricted.
Firstly, as shown in Fig. 2, preparation first vector substrate 170, is coated with the composition for being used to form separating layer, and formed
Separating layer 120.
First vector substrate 170 is preferably glass substrate, but not limited to this.That is the material of other types can be used
Material, if they are the heat-resisting materials for being able to bear the technological temperature of subsequent process and keeping planarizing without deforming at high temperature
Material.
The composition for being used to form separating layer can be applied by conventional coating techniques known in the art.For example, can be with
Refer to spin coating, die coating, spraying, roller coating, silk screen coating, slot coated, dip-coating and intaglio plate coating etc..Alternatively, can be used
Ink jet type method.
After coating, solidified by heat cure or UV to solidify to the composition for being used to form separating layer, to be formed
Separating layer 120.Heat cure and UV solidification individually can carry out or combine progress.In the case of thermal curing, oven can be used
Or hot plate.Acid extraction depends on coating composition, and for example, solidification can carry out 10-120 at 80-250 DEG C
Minute.
Next, as shown in figure 3, the composition for being used to form protective layer is coated in separating layer 120 to form protection
Layer 130, the protective layer 130 cover the degree of separating layer to its side surface.
As noted previously, as separating layer 120 can be separated by physical force and its peel strength is very weak, therefore preferably
Protective layer is formed to cover the side surface of separating layer.
Coating and the curing method for being used to form the composition of protective layer are similar with those described above.
Then, as shown in Figure 4 and Figure 5, BM layer 140 is formed on protective layer 130, and between the pattern of BM layer 140
Form the coloring agent layer 150 of red (R), green (G), blue (B) and white (W).That is, first on protective layer 130
BM layer 140 is formed to limit pixel, and coloring agent layer is used to form with predetermined pattern coating, exposure, development and heat cure
The composition of various colors.The color of coloring agent layer 150 can be arbitrarily selected, and can also arbitrarily select the formation of color suitable
Sequence.
The coating of BM layer 140 and coloring agent layer 150 and curing method are similar with those described above.
Meanwhile alignment keys for being aligned with TFT+OLED substrate 200 are also formed during forming BM layer 140 (not
It shows).
In addition, if it is desired, can change the formation sequence of BM layer 140 and coloring agent layer 150.That is, can be first
It first patterns coloring agent layer 150, then forms BM layer 140.
Now, as shown in fig. 6, by the whole surface of BM layer 140 and coloring agent layer 150 be coated be used to form it is flat
Change the composition of layer to form planarization layer 160.
On the other hand, TFT+OLED substrate 200 shown in fig. 7 by with referring to figs. 2 to Fig. 6 those of describe to separate
Process is formed on Second support substrate 270.TFT+OLED substrate 200 can be by known in flexible display technologies field
Any method preparation, and be not particularly limited in the present invention.
Such as first vector substrate 170, Second support substrate 270 is preferably glass substrate, but not limited to this.Namely
It says, the material of other types can be used, if they are to be able to bear the technological temperature for being used to form TFT and OLED and guarantor
Hold the heat proof material planarized without deforming at high temperature.
Moreover, being formed in TFT+OLED substrate 200 for the alignment with CF base plate alignment during any manufacturing process
Key (not shown).For example, alignment keys can be formed in the metal layer forming step for being used to form wiring.
Then, as shown in figure 8, separating layer 120, protective layer will be formed on by Fig. 2 to process shown in fig. 6
130, the first vector substrate 170 of BM layer 140, coloring agent layer 150 and planarization layer 160 and it is formed in Second support substrate 270
On TFT+OLED substrate 200 be aligned.At this point, alignment keys and formation in the BM layer 140 being formed on first vector substrate 170
Alignment keys in the metal layer of TFT+OLED substrate 200 are for being aligned, and alignment precision can be 5 μm or smaller.
Alignment keys can be with the outermost portion of the panel in substrate that panel formed therein is cut at, or be formed in it
In be populated with multiple panels glass substrate outermost portion at.
Particularly, due to manufacturing the technique of colour filter on first vector substrate 170 and being made on Second support substrate 270
The technique for making TFT and OLED array is usually executed by individual process, thus formed respectively in predetermined position it is scheduled right
Quasi- key is to be directed at two substrates.
As it is in the prior art, when epilamellar CF substrate as flexible base board will be formed in by transfer method
When being attached to TFT+OLED substrate, alignment error is about 500 μm.However, according to embodiment of the present invention, will have shape
At on it separating layer 120, protective layer 130, BM layer 140, coloring agent layer 150 and planarization layer 160 first vector substrate
170 are aligned with the TFT+OLED substrate 200 being formed on Second support substrate 270, are the first of glass substrate without separating
Carrier substrate 170 and Second support substrate 270, to significantly improve alignment precision.Specifically, alignment error can reduce about
5 μm, this is the 1/100 of the prior art.
Next, as shown in figure 9, the substrate of alignment is bonded to each other.OCA can be used or OCR is bonded.Substrate
Bonding can by flexible display technologies field it is known it is any other in a manner of realize, and the technique in the present invention not by
Especially limitation.
Now, as shown in Figure 10, first vector substrate 170 and Second support substrate 270 are separated.First vector substrate
170 and Second support substrate 270 can simultaneously or sequentially separate, and they can be in any order when they are successively separated
Separation.
Particularly, the process isolated with separating layer 120 of first vector substrate 170 can be carried out at room temperature, and led to
It crosses physics removing to carry out, wherein carrier substrate 170 made of, for example, glass is removed from separating layer 120.
The example of stripping means may include lifting off and removing, but not limited to this.
Surface after the peel strength of separating layer 120, thickness, separation can etc. with about an embodiment party according to the present invention
Identical those of described in the detailed description of the structure of the flexible display apparatus of formula, in this way, separating layer 120 can be with carrier
Substrate is kept completely separate, and is generated without residue, crackle or curling.
Next, as shown in figure 11, basement membrane 110 is attached to separating layer 120.
Basement membrane 110 is flexible, and can be selected as adapting to the required purpose in above-mentioned material.
Although being not shown, adhesive phase can be used by basement membrane 110 and be adhered to separating layer 120, and can
To use Photocurable adhesive.Since Photocurable adhesive does not need individual drying process after photocuring, manufactured
Journey is simple.Therefore, productivity improves.In the present invention, Photocurable adhesive obtained by this field can be used without spy
It does not limit.It is, for example, possible to use the compositions comprising epoxide or acrylic monomers.
For solidification adhesive layer, far ultraviolet, ultraviolet light, near ultraviolet ray, infrared ray, electromagnetic wave (such as X can be used
Ray, gamma-rays) and electron beam, proton beam, neutron beam.However, UV be solidificated in curing rate, solidification equipment availability,
Cost etc. is advantageous.
High-pressure sodium lamp, Non-polarized lamp, ultrahigh pressure mercury lamp, carbon arc lamp, xenon lamp, metal halide lamp, chemical lamp and black light etc. can
For use as the cured light source of UV.
Meanwhile it is described in above embodiment of the invention by TFT+OLED substrate (wherein forming OLED on TFT)
With CF substrate mounting to form flexible OLED display, however, the invention is not limited thereto.For example, when by tft array base
Liquid crystal layer rather than oled layer are inserted between plate and CF substrate come when manufacturing flexible liquid crystal device, it can be for this field
Technical staff obviously modifies the method using manufacture flexible display apparatus of the invention.
While particular embodiments of the present invention have been shown and described and example, but those skilled in the art will manage
Solution, it is no intended to limit the invention to preferred embodiment, and will become apparent to those skilled in the art
It is that without departing from the spirit and scope of the present invention, can make various changes and modifications.
Therefore, the scope of the present invention will be by appended claims and its equivalents.
[description of symbols]
100: filter substrate 110: basement membrane
120: separating layer 130: protective layer
140: black-matrix layer 150: coloring agent layer
160: planarization layer 170: first vector substrate
200:TFT+OLED substrate 210: basement membrane
220:TFT layers 230:OLED layers
240: encapsulated layer 270: Second support substrate
300: adhesive phase
Claims (10)
1. a kind of method for manufacturing flexible display apparatus, comprising the following steps:
Separating layer is formed on first vector substrate；
Protective layer is formed in the separating layer；
Black-matrix layer is formed on the protective layer and forms coloring agent layer between the black-matrix layer；
It will be formed with described the first of the separating layer, the protective layer, the black-matrix layer and the coloring agent layer thereon
Carrier substrate and thin-film transistor array base-plate are aligned and are attached；And
Remove the first vector substrate.
2. according to the method described in claim 1, further include flexible base film is attached to the separating layer remove described
Step on the surface of one carrier substrate.
3. according to the method described in claim 1, wherein, the thin-film transistor array base-plate includes Organic Light Emitting Diode.
4. according to the method described in claim 1, wherein, the thin-film transistor array base-plate includes Second support substrate；And
And the method also includes removing the Second support substrate after being aligned and being attached step.
5. according to the method described in claim 4, wherein, by the first vector substrate and the same time shift of Second support substrate
It removes.
6. according to the method described in claim 1, wherein, the protective layer is formed as covering the side surface of the separating layer.
7. according to the method described in claim 1, wherein, the protective layer include in organic insulating film and inorganic insulating membrane extremely
Few one kind.
8. according to the method described in claim 1, further include formed in the black-matrix layer and the coloring agent layer it is flat
The step of changing layer.
9. according to the method described in claim 1, wherein, in the alignment and being attached in step, described in being respectively formed at
Alignment keys on first vector substrate and the thin-film transistor array base-plate execute the alignment, the first vector substrate
It has been formed on the separating layer, the protective layer, the black-matrix layer and the coloring agent layer；And with 5 μm or more
Small alignment error executes the alignment.
10. according to the method described in claim 1, wherein, in the alignment and attachment step, using optically clear adhesive
Or optical clear resin will be formed with the separating layer, the protective layer, the black-matrix layer and the coloring agent layer thereon
The first vector substrate and the thin-film transistor array base-plate be attached.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160039483A KR102469311B1 (en) | 2016-03-31 | 2016-03-31 | Fabrication Method for Flexible Display Device |
| KR10-2016-0039483 | 2016-03-31 | ||
| PCT/KR2017/003250 WO2017171323A2 (en) | 2016-03-31 | 2017-03-27 | Method for manufacturing flexible display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109075254A true CN109075254A (en) | 2018-12-21 |
Family
ID=59966141
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780021125.4A Pending CN109075254A (en) | 2016-03-31 | 2017-03-27 | The method for manufacturing flexible display apparatus |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2019512742A (en) |
| KR (1) | KR102469311B1 (en) |
| CN (1) | CN109075254A (en) |
| TW (1) | TWI703721B (en) |
| WO (1) | WO2017171323A2 (en) |
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| CN113261105A (en) * | 2019-11-28 | 2021-08-13 | 京东方科技集团股份有限公司 | Flexible display panel and manufacturing method thereof |
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| CN109950396A (en) * | 2017-12-21 | 2019-06-28 | 昆山维信诺科技有限公司 | Flexible apparatus removes method and flexible apparatus precursor structures |
| TWI667500B (en) * | 2018-04-03 | 2019-08-01 | 友達光電股份有限公司 | Color filter, display panel and manufacturing methods thereof |
| KR102514820B1 (en) | 2018-08-21 | 2023-03-29 | 삼성디스플레이 주식회사 | Display apparatus |
| KR102568784B1 (en) * | 2018-08-23 | 2023-08-22 | 삼성디스플레이 주식회사 | Display device and manufacturing method thereof |
| KR102709634B1 (en) | 2019-03-06 | 2024-09-25 | 삼성디스플레이 주식회사 | Display device |
| JP7585602B2 (en) | 2019-11-11 | 2024-11-19 | 日亜化学工業株式会社 | Image display device manufacturing method and image display device |
| KR102315129B1 (en) * | 2021-03-22 | 2021-10-19 | 동우 화인켐 주식회사 | Flexible Color Filter, Flexible Display Device Including the Same, and Fabrication Method Thereof |
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Also Published As
| Publication number | Publication date |
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| WO2017171323A3 (en) | 2018-08-09 |
| KR20170112441A (en) | 2017-10-12 |
| WO2017171323A2 (en) | 2017-10-05 |
| TWI703721B (en) | 2020-09-01 |
| TW201737484A (en) | 2017-10-16 |
| JP2019512742A (en) | 2019-05-16 |
| KR102469311B1 (en) | 2022-11-18 |
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