[go: up one dir, main page]

CN109065493B - A device for assisting the precise alignment of a hard via mask and a sample - Google Patents

A device for assisting the precise alignment of a hard via mask and a sample Download PDF

Info

Publication number
CN109065493B
CN109065493B CN201811047890.6A CN201811047890A CN109065493B CN 109065493 B CN109065493 B CN 109065493B CN 201811047890 A CN201811047890 A CN 201811047890A CN 109065493 B CN109065493 B CN 109065493B
Authority
CN
China
Prior art keywords
sample
hard mask
hole
hole hard
mask plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201811047890.6A
Other languages
Chinese (zh)
Other versions
CN109065493A (en
Inventor
包文中
昝武
郭晓娇
胡荣民
周鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fudan University
Original Assignee
Fudan University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fudan University filed Critical Fudan University
Priority to CN201811047890.6A priority Critical patent/CN109065493B/en
Publication of CN109065493A publication Critical patent/CN109065493A/en
Application granted granted Critical
Publication of CN109065493B publication Critical patent/CN109065493B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682Mask-wafer alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Sampling And Sample Adjustment (AREA)

Abstract

The utility model belongs to the technical field of film materials, and particularly relates to a device for assisting in accurately aligning a hard through hole mask and a sample. The device of the utility model comprises: sample tray, carrying disc, mask plate adsorption head, displacement regulator, microscope, etc.; the object carrying disc has rotation adjustment freedom, and the object carrying disc rotates to drive the sample tray to rotate, so that the rotation angle of the sample is accurately controlled; the displacement adjusting device has X, Y, Z three-axis rotation and horizontal adjustment degrees of freedom; the position of the through hole hard mask plate can be accurately adjusted through the displacement adjusting device; the whole device has the advantages of simple structure, convenient operation, high alignment precision and strong practicability. The photoetching function is replaced to a certain extent, the influence of photoresist on a sample in the photoetching process is avoided, and the method is very suitable for processing devices made of thin film materials such as organic materials or two-dimensional materials (graphene and the like).

Description

一种辅助硬通孔掩膜版和样品进行精确对准的装置A device for assisting the precise alignment of a hard via mask and a sample

技术领域technical field

本发明属于薄膜材料技术领域,具体涉及一种辅助硬通孔掩膜版和样品进行精确对准的装置。The invention belongs to the technical field of thin film materials, and in particular relates to a device for assisting precise alignment between a hard through-hole mask and a sample.

背景技术Background technique

在有机半导体或者二维材料的器件制作过程中,定义电极图形主要有光刻曝光图形(使用光掩膜板)和使用通孔硬掩膜版定义图形两种方法。其中,光刻定义图形需要在衬底上旋涂光刻胶,显影过后不可避免地会有光刻胶残留,导致器件的性能退化,譬如难以形成良好的金属半导体接触,影响载流子迁移率等等。相比之下,使用通孔硬掩膜版,可以直接对通孔暴露的部位进行器件工艺加工(譬如金属蒸镀,干法刻蚀等等),过程中不需要接触任何化学物质,因此不会对薄膜材料造成损伤。In the device manufacturing process of organic semiconductors or two-dimensional materials, there are mainly two methods for defining electrode patterns: photolithography exposure patterns (using photomasks) and using through-hole hard masks to define patterns. Among them, photolithographic definition of graphics requires spin-coating photoresist on the substrate. After development, there will inevitably be photoresist residues, resulting in degradation of device performance. For example, it is difficult to form a good metal-semiconductor contact, which affects carrier mobility. etc. In contrast, using a through-hole hard mask plate can directly process the device process (such as metal evaporation, dry etching, etc.) on the exposed part of the through-hole, and does not need to contact any chemical substances during the process, so there is no need to Will cause damage to the film material.

然而,通常的实验或者加工过程中,没有一个很好的通孔硬掩膜版与样品的对准方法,往往采用手动对准等比较粗糙的方法,而当通孔硬掩膜版精度较高时,就很难实现精确对准。已有的手段一般采用小型对准装置(参考实用新型CN104064505A)将样品与通孔硬掩膜版对准固定后,一起进行后续加工(蒸镀或者刻蚀,等等),该装置比较笨重且操作过程容易损坏对准状态。也有直接在加工设备(蒸镀机或者刻蚀机,等等)内部安装遥控对准装置,但是成本非常昂贵。However, in the usual experiment or processing process, there is no good alignment method between the through-hole hard mask and the sample, and rough methods such as manual alignment are often used, and when the through-hole hard mask has higher precision , it is difficult to achieve precise alignment. Existing methods generally use a small alignment device (refer to the utility model CN104064505A) to align and fix the sample with the through-hole hard mask, and then perform subsequent processing (evaporation or etching, etc.). Alignment can easily be damaged during manipulation. There is also a remote alignment device directly installed inside the processing equipment (vapor deposition machine or etching machine, etc.), but the cost is very expensive.

发明内容Contents of the invention

本发明的目的在于提供一种对准精度高、设备成本低的辅助硬通孔掩膜版和样品进行精确对准的装置。The purpose of the present invention is to provide a device with high alignment accuracy and low equipment cost for assisting the precise alignment of hard through-hole masks and samples.

本发明提供的辅助硬通孔掩膜版和样品进行精确对准的装置,拥有多个自由度(包括X、Y、Z三轴的旋转和水平调整自由度),在实现样品与通孔硬掩膜版对准后,与对准平台进行脱离。因而可以方便的进行下一步的加工。此装置可以实现样品与硬掩膜版的精确对准,在一定程度上替代了光刻的功能,避免了光刻过程中光刻胶对样品产生影响的问题。The device provided by the present invention to assist in the precise alignment of the hard through-hole mask and the sample has multiple degrees of freedom (including the rotation and horizontal adjustment degrees of freedom of the X, Y, and Z axes). After the mask is aligned, it is separated from the alignment platform. Therefore, the next step of processing can be carried out conveniently. This device can realize the precise alignment of the sample and the hard mask plate, replace the function of photolithography to a certain extent, and avoid the problem that the photoresist will affect the sample during the photolithography process.

本发明提供的辅助硬通孔掩膜版和样品进行精确对准的装置,其结构如图1所示,包括:样品托盘1,载物圆盘3,载物圆盘夹具2,掩膜版吸附头5,位移调节装置6,显微镜7;其中,样品托盘1用于装载样品;样品托盘1通过载物圆盘夹具2同轴固定于载物圆盘3上;样品固定在样品托盘1上;载物圆盘3具有旋转调整自由度,载物圆盘3旋转带动样品托盘1旋转,从而精确控制样品旋转角度;位移调节装置6具有X、Y、Z三轴的旋转和水平调整自由度;位移调节装置6有一伸出臂,掩膜版吸附头5固定在伸出臂上,通孔硬掩膜版4放置于掩膜版吸附头5底部,掩膜版吸附头5底部设有小孔,可以在外部泵机抽力的作用下吸附住通孔硬掩膜版4;通过位移调节装置6,可以精确调整通孔硬掩膜版4的位置;载物圆盘3和位移调节装置6固定在同一水平板上。The device for assisting the precise alignment of hard through-hole masks and samples provided by the present invention has a structure as shown in Figure 1, including: a sample tray 1, a loading disk 3, a loading disk fixture 2, and a mask Adsorption head 5, displacement adjustment device 6, microscope 7; among them, the sample tray 1 is used to load the sample; the sample tray 1 is coaxially fixed on the loading disc 3 through the loading disc clamp 2; the sample is fixed on the sample tray 1 ; The loading disk 3 has a degree of freedom of rotation and adjustment, and the rotation of the loading disk 3 drives the rotation of the sample tray 1, thereby precisely controlling the rotation angle of the sample; the displacement adjustment device 6 has the rotation and horizontal adjustment degrees of freedom of the X, Y, and Z axes ; The displacement adjusting device 6 has an extension arm, the mask plate adsorption head 5 is fixed on the extension arm, the through-hole hard mask plate 4 is placed on the mask plate adsorption head 5 bottom, and the mask plate adsorption head 5 bottom is provided with a small hole, which can absorb the through-hole hard mask 4 under the action of external pump suction; through the displacement adjustment device 6, the position of the through-hole hard mask 4 can be precisely adjusted; the loading disc 3 and the displacement adjustment device 6 are fixed on the same horizontal board.

本发明中,通孔硬掩膜版吸附方式可以有两种:In the present invention, there are two ways to adsorb the through-hole hard mask plate:

方式一:所述通孔硬掩膜版吸附头5底部有可与外部抽气泵机相连的小孔,外部泵机抽气时可以吸附通孔硬掩膜版4,关闭气泵,通孔硬掩膜版4即可与吸附头5分离;Method 1: There is a small hole at the bottom of the through-hole hard mask plate adsorption head 5 that can be connected to an external air pump. The stencil 4 can be separated from the adsorption head 5;

方式二:采用电磁铁吸附(掩膜版相应的位置需附加铁片),可以通过电流的开关来控制吸附与否。Method 2: Use electromagnet to absorb (the corresponding position of the mask plate needs to be attached with an iron sheet), and the adsorption or not can be controlled by the switch of the current.

另外,样品托盘1上还设有弹性夹具8,另外可附设一磁性薄片9,用于固定对准后样品与通孔硬掩膜版4。In addition, an elastic clamp 8 is provided on the sample tray 1 , and a magnetic sheet 9 may be attached to fix the aligned sample and the through-hole hard mask 4 .

对准操作在显微镜7的帮助下进行,透过通孔硬掩膜版4的镂空区域观察到样品托盘1上样品的形貌(或者在样品上事先图案化好的对准标记),通过调节位移调节装置6对应的螺纹杆来带动与之相连的掩膜版吸附头5。首先利用水平自由度调整使通孔硬掩膜版4与样品表面保持平行,随后对通孔硬掩膜版4在X、Y方向上进行相对位移的对准操作,最后通过Z方向的调整将通孔硬掩膜版与样品贴紧。从而完成对准操作。The alignment operation is carried out with the help of the microscope 7, and the morphology of the sample on the sample tray 1 (or the alignment mark patterned on the sample in advance) is observed through the hollow area of the through-hole hard mask plate 4. By adjusting The threaded rod corresponding to the displacement adjustment device 6 drives the mask plate suction head 5 connected thereto. First, the horizontal degree of freedom is used to adjust the through-hole hard mask 4 to keep parallel to the sample surface, and then the through-hole hard mask 4 is aligned with relative displacement in the X and Y directions, and finally the adjustment in the Z direction will The through-hole hard mask is tightly attached to the sample. The alignment operation is thus completed.

对准完成后,将样品与通孔硬掩膜版固定,固定方式有两种:After the alignment is completed, fix the sample with the through-hole hard mask. There are two ways to fix it:

方式一、采用固定在样品托盘1上的弹性夹具8来固定通孔硬掩膜版4;Method 1: Using the elastic clamp 8 fixed on the sample tray 1 to fix the through-hole hard mask 4;

方式二、采用磁性薄片9通过与铁质样品托盘产生的磁性吸力固定通孔硬掩膜版4。Method 2: Using the magnetic sheet 9 to fix the through-hole hard mask plate 4 through the magnetic attraction generated by the iron sample tray.

具体操作如下:将与载物托盘连接的弹性夹具8,或者使用磁性薄片9缓慢靠近已经完成对准的通孔硬掩膜板4表面,并将之缓慢下降并固定在通孔硬掩膜板4表面,使得通孔硬掩膜板4与样品保持贴紧状态。然后关闭泵机以解除通孔硬掩膜板吸附头5与通孔硬掩膜板4之间的吸附,并通过位移调节装置6的Z轴螺纹杆缓慢升起掩膜板吸附头5。松开夹具2将样品托盘1与载物圆盘3脱离。此时就在样品托盘1上完成了通孔硬掩膜板4与样品之间的对准操作和固定,并在不破坏对准关系的前提下将它们和对准装置进行了分离。The specific operation is as follows: Slowly approach the elastic clamp 8 connected to the loading tray, or use the magnetic sheet 9, to the surface of the through-hole hard mask board 4 that has been aligned, and slowly lower it and fix it on the through-hole hard mask board. 4 surface, so that the through-hole hard mask plate 4 remains in close contact with the sample. Then turn off the pump to release the adsorption between the through-hole hard mask suction head 5 and the through-hole hard mask 4 , and slowly lift the mask suction head 5 through the Z-axis threaded rod of the displacement adjustment device 6 . Release the clamp 2 to separate the sample tray 1 from the loading disk 3 . At this point, the alignment operation and fixation between the through-hole hard mask board 4 and the sample are completed on the sample tray 1 , and they are separated from the alignment device without destroying the alignment relationship.

本发明中,所述通孔硬掩膜版通常以不锈钢或者硅片为制作材料(参考发明专利CN105261588A),通过图案化和刻蚀得到所需图形。具有一定的平整度和机械强度,满足本系统的操作要求。In the present invention, the through-hole hard mask plate is usually made of stainless steel or silicon wafer (refer to the invention patent CN105261588A), and the required pattern is obtained by patterning and etching. It has a certain degree of flatness and mechanical strength, which meets the operating requirements of this system.

高精度通孔硬掩膜版用来定义图形,可以在薄膜材料的任意位置定义图形,对薄膜材料无伤害;可多次重复对准,通孔硬掩膜版也可以重复使用。The high-precision through-hole hard mask is used to define graphics, and the graphics can be defined at any position on the film material without damage to the film material; it can be repeatedly aligned, and the through-hole hard mask can also be reused.

本发明整个装置结构简单,操作方便,对准精度高,具有很强的实用性。此装置可以实现样品与硬掩膜版的精确对准,在一定程度上替代了光刻的功能,避免了光刻过程中光刻胶对样品产生影响,非常适合有机材料或者二维材料(石墨烯等)等薄膜材料的器件加工。The whole device of the invention has simple structure, convenient operation, high alignment precision and strong practicability. This device can realize the precise alignment of the sample and the hard mask plate, replace the function of photolithography to a certain extent, avoid the influence of photoresist on the sample during the photolithography process, and is very suitable for organic materials or two-dimensional materials (graphite Graphene, etc.) and other thin-film material device processing.

附图说明Description of drawings

图1 是该辅助硬掩膜版精确套刻对准平台的整体结构图。Fig. 1 is an overall structure diagram of the precise overlay alignment platform for the auxiliary hard mask.

图中标号:1为样品托盘,2为载物圆盘夹具,3为载物圆盘,4为通孔硬掩膜板,5为掩膜板吸附头,6为位移调节装置,7为显微镜,8为掩膜板固定弹性夹具,9为磁性薄片。Numbers in the figure: 1 is the sample tray, 2 is the loading disc fixture, 3 is the loading disc, 4 is the through-hole hard mask plate, 5 is the mask plate adsorption head, 6 is the displacement adjustment device, 7 is the microscope , 8 is the elastic clamp for fixing the mask plate, and 9 is the magnetic sheet.

具体实施方式Detailed ways

下面给出一个具体实施例,对本发明作进一步描述。A specific embodiment is given below to further describe the present invention.

样品托盘1为直径100mm的铁制圆盘;载物圆盘夹具2为用螺丝固定于底座的一对铜弹性薄片;载物圆盘3为直径150mm,厚度3mm,带有旋转功能,材料为铝质;硅基高精度通孔硬掩膜板4(参考发明专利CN105261588A);掩膜板吸附片5为底部通有小孔的塑料方块,底部小孔另一端连接与外部泵机;位移调节装置6为可由X、Y、Z三个螺纹杆以及三个水平调整旋钮组成,可以精细调整以使与之相连的掩膜板吸附头发生位移的机械装置;显微镜7为常见长焦距显微镜;弹性夹具8,磁性薄片9制成的矩形薄片,可以设计成框架形状,其靠近掩膜板4的一端中心是镂空的,以在固定掩膜板的同时又暴露出掩膜板的对准区域。The sample tray 1 is an iron disc with a diameter of 100 mm; the loading disc fixture 2 is a pair of copper elastic sheets fixed to the base with screws; the loading disc 3 is 150 mm in diameter and 3 mm thick, with a rotating function, and the material is Aluminum; silicon-based high-precision through-hole hard mask plate 4 (refer to invention patent CN105261588A); mask plate adsorption piece 5 is a plastic square with a small hole at the bottom, and the other end of the small hole at the bottom is connected to an external pump; displacement adjustment Device 6 is a mechanical device that can be composed of three threaded rods X, Y, and Z and three horizontal adjustment knobs, which can be finely adjusted to cause displacement of the mask plate suction head connected to it; microscope 7 is a common long-focus microscope; elastic The clamp 8, a rectangular sheet made of a magnetic sheet 9, can be designed as a frame shape, and the center of one end near the mask plate 4 is hollowed out to expose the alignment area of the mask plate while fixing the mask plate.

Claims (3)

1.一种辅助硬通孔掩膜版和样品进行精确对准的装置,其特征在于,包括:样品托盘(1),载物圆盘(3),载物圆盘夹具(2),掩膜版吸附头(5),位移调节装置(6),显微镜(7);其中,样品托盘(1)用于装载样品;样品托盘(1)通过载物圆盘夹具(2)同轴固定于载物圆盘(3)上;样品固定在样品托盘(1)上;载物圆盘(3)具有旋转调整自由度,载物圆盘(3)旋转带动样品托盘(1)旋转,从而精确控制样品旋转角度;位移调节装置(6)具有X、Y、Z三轴的旋转和水平调整自由度;位移调节装置(6)有一伸出臂,掩膜版吸附头(5)固定在伸出臂上,通孔硬掩膜版(4)放置于掩膜版吸附头(5)底部,掩膜版吸附头(5)底部设有小孔,可以在外部泵机抽力的作用下吸附住通孔硬掩膜版(4);通过位移调节装置(6),可以精确调整通孔硬掩膜版(4)的位置;载物圆盘(3)和位移调节装置(6)固定在同一水平板上;1. A device for assisting the precise alignment of a hard through-hole mask and a sample, characterized in that it includes: a sample tray (1), a loading disc (3), a loading disc clamp (2), a mask The stencil adsorption head (5), the displacement adjustment device (6), and the microscope (7); among them, the sample tray (1) is used to load the sample; the sample tray (1) is coaxially fixed on the on the loading disk (3); the sample is fixed on the sample tray (1); the loading disk (3) has a degree of freedom to rotate and adjust, and the rotation of the loading disk (3) drives the rotation of the sample tray (1), thereby precisely Control the rotation angle of the sample; the displacement adjustment device (6) has three-axis rotation and horizontal adjustment degrees of freedom of X, Y, Z; the displacement adjustment device (6) has an extension arm, and the mask plate adsorption head (5) is fixed on the extension arm On the arm, the through-hole hard mask (4) is placed at the bottom of the mask suction head (5). There is a small hole at the bottom of the mask suction head (5), which can be sucked under the action of the external pump. Through-hole hard mask (4); through the displacement adjustment device (6), the position of the through-hole hard mask (4) can be precisely adjusted; the loading disc (3) and the displacement adjustment device (6) are fixed on the same horizontal plate; 通孔硬掩膜版吸附方式有两种:There are two methods of adsorption of through-hole hard mask: 方式一:所述通孔硬掩膜版吸附头(5)底部有可与外部抽气泵机相连的小孔,外部泵机抽气时可以吸附通孔硬掩膜版(4),关闭气泵,通孔硬掩膜版(4)即可与吸附头(5)分离;Method 1: There is a small hole at the bottom of the through-hole hard mask plate adsorption head (5) that can be connected to an external air pump. When the external pump pumps air, the through-hole hard mask plate (4) can be adsorbed, and the air pump is turned off. The through-hole hard mask plate (4) can be separated from the adsorption head (5); 方式二:采用电磁铁吸附,在通孔硬掩膜版(4)相应的位置需附加铁片,通过电流的开关来控制吸附与否;Method 2: Electromagnet is used for adsorption, and an iron sheet needs to be attached to the corresponding position of the through-hole hard mask (4), and the adsorption or not is controlled by the current switch; 样品托盘(1)上还设有弹性夹具(8),另外附设一磁性薄片(9),用于固定对准后样品与通孔硬掩膜版(4)。The sample tray (1) is also provided with an elastic clamp (8), and a magnetic sheet (9) is attached to fix the aligned sample and the through-hole hard mask (4). 2.根据权利要求1所述的装置,其特征在于,对准操作在显微镜(7)的帮助下进行,透过通孔硬掩膜版(4)的镂空区域观察到样品托盘(1)上样品的形貌,通过调节位移调节装置(6)对应的螺纹杆来带动与之相连的掩膜版吸附头(5);首先利用水平自由度调整使通孔硬掩膜版(4)与样品表面保持平行,随后对通孔硬掩膜版(4)在X、Y方向上进行相对位移的对准操作,最后通过Z方向的调整将通孔硬掩膜版与样品贴紧,从而完成对准操作。2. The device according to claim 1, characterized in that the alignment operation is carried out with the help of a microscope (7), and the sample tray (1) is observed through the hollowed out area of the through-hole hard mask (4) The shape of the sample is adjusted by adjusting the threaded rod corresponding to the displacement adjustment device (6) to drive the mask plate adsorption head (5) connected to it; firstly, the through-hole hard mask plate (4) and the sample The surface is kept parallel, and then the through-hole hard mask (4) is aligned with the relative displacement in the X and Y directions, and finally the through-hole hard mask is closely attached to the sample through the adjustment in the Z direction, thereby completing the alignment. ready to operate. 3.根据权利要求2所述的装置,其特征在于,对准完成后,将样品与通孔硬掩膜版固定方式有两种:3. The device according to claim 2, wherein after the alignment is completed, there are two ways to fix the sample and the through-hole hard mask: 方式一、采用固定在样品托盘(1)上的弹性夹具(8)来固定通孔硬掩膜版(4);Method 1: Use the elastic clamp (8) fixed on the sample tray (1) to fix the through-hole hard mask plate (4); 方式二、采用磁性薄片(9)通过与铁质样品托盘产生的磁性吸力固定通孔硬掩膜版(4)。Method 2: Using the magnetic sheet (9) to fix the through-hole hard mask plate (4) through the magnetic attraction generated by the iron sample tray.
CN201811047890.6A 2018-09-10 2018-09-10 A device for assisting the precise alignment of a hard via mask and a sample Active CN109065493B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811047890.6A CN109065493B (en) 2018-09-10 2018-09-10 A device for assisting the precise alignment of a hard via mask and a sample

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811047890.6A CN109065493B (en) 2018-09-10 2018-09-10 A device for assisting the precise alignment of a hard via mask and a sample

Publications (2)

Publication Number Publication Date
CN109065493A CN109065493A (en) 2018-12-21
CN109065493B true CN109065493B (en) 2023-09-05

Family

ID=64760055

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811047890.6A Active CN109065493B (en) 2018-09-10 2018-09-10 A device for assisting the precise alignment of a hard via mask and a sample

Country Status (1)

Country Link
CN (1) CN109065493B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109491201B (en) * 2018-12-26 2024-01-19 仪晟科学仪器(嘉兴)有限公司 High-precision two-dimensional movement mechanism for mask
CN109968206B (en) * 2019-03-28 2020-05-29 杭州电子科技大学 Mask plate auxiliary jet machining method
CN113716520A (en) * 2021-08-31 2021-11-30 电子科技大学 Multifunctional system and method for preparing two-dimensional material micro-nano device
CN114879452A (en) * 2022-04-26 2022-08-09 中国科学院光电技术研究所 A flexible film high uniform contact alignment exposure device
CN116121697A (en) * 2022-11-04 2023-05-16 南方科技大学 Electrode alignment and growth system and method for ultra-high vacuum film samples

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1154901A (en) * 1997-08-01 1999-02-26 Sumitomo Wiring Syst Ltd Soldering method and soldering jig
JP2007042858A (en) * 2005-08-03 2007-02-15 Mejiro Precision:Kk Projection aligner
CN203932033U (en) * 2014-07-07 2014-11-05 南通威倍量子科技有限公司 A kind of micro device of aiming at for precision mask plate
CN108193169A (en) * 2018-03-06 2018-06-22 华东师范大学 A kind of mask plate for preparing two-dimensional material metal electrode
CN108205237A (en) * 2016-12-19 2018-06-26 航天科工惯性技术有限公司 The device and method that a kind of wafer profile is precisely aligned with mask plate patterns

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1154901A (en) * 1997-08-01 1999-02-26 Sumitomo Wiring Syst Ltd Soldering method and soldering jig
JP2007042858A (en) * 2005-08-03 2007-02-15 Mejiro Precision:Kk Projection aligner
CN203932033U (en) * 2014-07-07 2014-11-05 南通威倍量子科技有限公司 A kind of micro device of aiming at for precision mask plate
CN108205237A (en) * 2016-12-19 2018-06-26 航天科工惯性技术有限公司 The device and method that a kind of wafer profile is precisely aligned with mask plate patterns
CN108193169A (en) * 2018-03-06 2018-06-22 华东师范大学 A kind of mask plate for preparing two-dimensional material metal electrode

Also Published As

Publication number Publication date
CN109065493A (en) 2018-12-21

Similar Documents

Publication Publication Date Title
CN109065493B (en) A device for assisting the precise alignment of a hard via mask and a sample
US10571807B2 (en) Method and apparatus for aligning substrates on a substrate support unit
TWI815329B (en) A method of clamping a substrate to a clamping system, a substrate holder and a substrate support
JPH0434812B2 (en)
CN208690229U (en) A device to assist precise alignment of hard via mask and sample
JP5474751B2 (en) Imprint lithography apparatus and imprint lithography method
JP5773761B2 (en) Lithographic system and article manufacturing method using the same
TW202232246A (en) Charge dissipative reticle table cleaning reticle
TW201838490A (en) Maintaining alignment while turning over a panel
CN109521649A (en) A kind of integral system pinpointing transfer and alignment photoetching for two-dimensional material
US11187997B2 (en) Photolithography apparatus and method for handling wafer
JP2010106297A (en) Mask alignment device
US20180307133A1 (en) Pellicle removal tool
KR101585511B1 (en) Device and method for aligning a substrate and a mask
KR101005582B1 (en) Substrate alignment module and lithographic apparatus having the same
CN116759356A (en) Alignment clamping device and method for hard mask and silicon wafer
JP2010182997A (en) Wafer exposure device, and wafer exposure method
CN105204287A (en) Clamp for manufacturing process of photoetching mask plate
JP2010039227A (en) Exposure apparatus, exposure method and substrate-mounting method
EP4220302A1 (en) System for holding an object in a semiconductor manufacturing process, lithographic apparatus provided with said system and method
CN221804490U (en) Adaptive leveling device
JP2007243086A (en) Exposure mask, substrate holder and proximity exposure apparatus
JP2014029957A (en) Stage device, lithographic apparatus, and commodity manufacturing method
JP2005203399A (en) Aligner
WO2004114285A1 (en) Spin stand

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant