CN109037118B - Method and equipment for taking and placing permanent magnet for multiple grains - Google Patents

Abstract

The invention discloses a method and equipment for using permanent magnets to pick and place multiple crystal grains. The use of neodymium iron boron magnets can ensure permanent and stable magnetic attraction and ensure stability. It is used in conjunction with a partition, through which the chip and the The permanent magnet blocks are separated and will not have the effect of blocking the magnetic force. This prevents the chip and the permanent magnet block from being inseparable due to direct contact and attraction, making it easier to pick up and remove the chip. Using a cylinder to push the permanent magnet block to move can make the permanent magnet block move slowly, which can slowly weaken the magnetic force and avoid the problem of violent shaking of the magnetic material during the process of upward attraction and downward detachment. It can pick up multiple chips at the same time, and push multiple ejector pins through one cylinder, so that multiple chips can be picked up and removed at the same time. The synchronization rate is high and the work efficiency is improved. The size of the magnetic force on the chip can be changed by adjusting the extension of the cylinder, thereby adapting to chips of different weights and having a wide range of applications.

Description

A method and equipment for picking and placing multiple crystal grains using permanent magnets

Technical field

The invention relates to the field of packaging process equipment, and in particular to a method and equipment for picking and placing a plurality of crystal grains using permanent magnets.

Background technique

IC packaging refers to connecting the circuit pins on the silicon chip to external connectors with wires to connect them to other devices. Package form refers to the housing used to install semiconductor integrated circuit chips. It not only plays the role of installing, fixing, sealing, protecting the chip and enhancing the electrical and thermal performance, but also connects to the pins of the package shell with wires through the contacts on the chip, which in turn pass through the wires on the printed circuit board. Connect with other devices to realize the connection between the internal chip and the external circuit.

IC packaging is formed by etching the lead frame. The currently used method is to connect a vacuum pump to a soft suction nozzle for pick-and-place operations. A vacuum pump refers to a device that uses mechanical, physical, chemical or physical and chemical methods to evacuate the pumped container to obtain a vacuum. or equipment. Generally speaking, a vacuum pump is a device that uses various methods to improve, generate and maintain vacuum in a certain closed space. Under the current technology, the suction head of a soft suction nozzle is easily deformed, resulting in poor stability during pick and place operations. , affecting work efficiency.

The robotic arm refers to a high-precision, high-speed dispensing robot. The robotic arm is a complex system with multiple inputs and multiple outputs, high nonlinearity, and strong coupling. Because of its unique operational flexibility, it has been widely used in industrial assembly, safety and explosion-proof and other fields.

The burring machine is a device used to process the burrs of compression or injection molded thermosetting plastic products. It is a self-contained projection device, chassis, endless belt conveyor, dust collection device, etc. It is a simple appearance, does not take up space, and is efficient. This high-end spray cleaning machine can be used in the etching process of IC packaging.

Contents of the invention

In order to solve the above technical problems, the purpose of the present invention is to provide a method and equipment for using permanent magnets to pick and place multiple crystal grains. By adjusting the size of the magnetic force to pick and place the chips, the stability is improved, time and effort are saved, and the efficiency is improved. Work efficiency.

The object of the present invention can be achieved through the following technical solutions:

A pick-and-place method using permanent magnets for multiple crystal grains, including an IC tray, a robotic arm, pick-and-place equipment, and an etching device. The pick-and-place method using permanent magnets for multiple crystal grains includes:

S1. Removing and fixing chips: The robotic arm is fixedly connected to the pick-and-place equipment. The robotic arm controls the movement of the pick-and-place equipment so that the pick-and-place equipment is aligned and close to the IC tray placed on the workbench. The pick-and-place equipment conflicts with the IC tray. After the upper end surface, the position of the robotic arm is fixed, and the pick-and-place equipment is started at the same time. The chip is sucked out of the IC tray by increasing the magnetic force, so that the chip is adsorbed on the lower end surface of the pick-and-place equipment, and the process of taking out and fixing is completed;

S2. Etching of chips: Control the robotic arm to horizontally transport the pick-and-place equipment with the chip attached to the etching device, and then change the magnitude of the magnetic force on the chip. When the gravity of the chip is greater than the magnetic force, the chip is separated from the pick-and-place equipment and etched. The device processes the chip;

S3. Chip transfer: After the etching device has completed processing the chip, repeat the operation of S1 so that the processed chip and the pick-and-place equipment are re-adsorbed and fixed together, and then transported to the next processing equipment through the robotic arm.

Further, the etching device is a burring machine.

Further, the chip is a QFN IC Package.

Further, the IC tray is a QFN Matrix IC Tray, and the surface of the IC tray is provided with forty-eight fixing slots distributed in a matrix, and the fixing slots have a cubic structure.

The beneficial effects of this method: the use of magnetic attraction can ensure stable force when picking and placing, and will not cause stability problems due to the deformation of the suction head of the soft suction nozzle. It also saves time and effort, and improves work efficiency. .

A pick-and-place equipment that uses permanent magnets for multiple crystal grains, including a cylinder. The cylinder is fixedly connected with a connecting threaded column. The connecting threaded column is threadedly connected with a mechanical arm. The piston rod of the cylinder is fixedly connected with a pusher. The lower end surface of the push plate is vertically fixedly connected with forty-eight push rods matching the fixing grooves. The outer side wall of the cylinder is connected with a mounting box through a fixed bracket. The mounting box is located directly below the cylinder, and the mounting box is connected to the The push plates are arranged in parallel, and the lower end surface of the installation box is provided with forty-eight sliding grooves that match the fixed grooves. The inner top wall of the sliding groove is provided with a jack hole that communicates with the upper end surface of the installation box. The jack hole, sliding groove and The ejector rod is coaxially arranged, and a permanent magnet block is slidably connected in the sliding groove. The upper end of the permanent magnet block is connected to the inner top wall of the sliding groove through a return spring. The return spring is movably sleeved on the ejector rod, so The lower end of the push rod passes through the jack and conflicts with the upper end surface of the permanent magnet block. One end of the connecting post is fixedly connected to the four end points of the lower end surface of the installation box, and the other ends of the four connecting posts are fixedly connected. On the same separator, the separator is made of non-magnetic reactive material.

Further, the permanent magnet block is a neodymium iron boron magnet, the permanent magnet block has a cylindrical structure, and the bottom surface area of the permanent magnet block is smaller than the area of the chip.

Further, the cylinder is a single-acting cylinder, and the pushing speed of the cylinder does not exceed 1mm/s.

Further, the thickness of the partition is no more than 1 mm, and the length of the sliding groove is no less than 7 cm.

When taking the chip, match the fixed groove on the IC tray with the permanent magnet block one by one, start the cylinder, push the push plate to move downward, and make the ejector push the permanent magnet block to move downward along the sliding groove. At this time, due to the permanent The distance between the magnet block and the chip slowly decreases at a speed of 1mm/s to ensure that the magnetic material will not shake violently during the process of upward attraction and downward detachment. Moreover, the chip contains a wire metal frame, which is a magnetic material, and the magnetic force increases. If the gravity is larger than the chip, the chip can be sucked out of the IC tray and tightly attached to the lower end surface of the partition. The partition made of non-magnetic reaction material ensures that the magnetic force will not be affected, and the permanent magnet block and chip will be Separation avoids the problem that the chip and the permanent magnet block are directly attracted and cannot be separated.

When removing the chip, just start the cylinder and push the push plate to move upward. The return spring pulls the permanent magnet block to move upward along the sliding groove. At the same time, the permanent magnet block maintains conflict with the ejector pin to ensure that the permanent magnet block rises slowly and the magnetic force slowly decreases. Small, when the gravity of the chip is greater than the magnetic force, the chip is separated from the separator.

Beneficial effects of this pick and place equipment:

(1) The use of neodymium iron boron magnets can ensure permanent and stable magnetic attraction and ensure stability. Use it with a separator to separate the chip and the permanent magnet block through a 1mm thick separator made of non-magnetic reactive material. There will be no The effect of blocking magnetic force prevents the chip and the permanent magnet block from being in direct contact and being unable to separate, making it easier to pick up and remove the chip.

(2) Using a cylinder to push the permanent magnet block to move can make the permanent magnet block move slowly, which can slowly weaken the magnetic force and avoid the problem of violent shaking of the magnetic material during the process of upward attraction and downward detachment.

(3) Multiple chips can be picked up at the same time, and multiple ejector pins are pushed through one cylinder, so that multiple chips can be picked up and removed at the same time. The synchronization rate is high and work efficiency is improved.

(4) The magnitude of the magnetic force on the chip can be changed by adjusting the extension of the cylinder, thereby adapting to chips of different weights and having a wide range of applications.

Description of the drawings

The present invention will be further described below in conjunction with the accompanying drawings.

Figure 1 is a schematic structural diagram of the pick and place equipment of the present invention;

Figure 2 is a schematic diagram of the internal structure of the pick and place equipment of the present invention;

Figure 3 is a schematic structural diagram of the IC tray of the present invention.

In the picture: cylinder 1, connecting threaded column 2, push plate 3, ejector rod 4, fixed bracket 5, installation box 6, connecting column 7, partition 8, return spring 9, permanent magnet block 10, IC tray 11, fixed groove 12.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.

Please refer to Figures 1-3. This embodiment provides a method and equipment for picking and placing multiple dies using permanent magnets, including an IC tray 11, a robotic arm, a picking and placing device, and an etching device. Several pick-and-place methods using permanent magnets for multiple dies include:

S1. Removing and fixing the chip: The robotic arm is fixedly connected to the pick-and-place equipment. The robotic arm controls the movement of the pick-and-place equipment so that the pick-and-place equipment is aligned and close to the IC tray 11 placed on the workbench. The pick-and-place equipment conflicts with the IC tray. After the upper end surface of 11, the position of the robotic arm is fixed, and the pick-and-place equipment is started at the same time. The chip is sucked out of the IC tray 11 by increasing the magnetic force, so that the chip is adsorbed on the lower end surface of the pick-and-place equipment, and the process of taking out and fixing is completed;

S2. Etching of chips: Control the robotic arm to horizontally transport the pick-and-place equipment with the chip attached to the etching device, and then change the magnitude of the magnetic force on the chip. When the gravity of the chip is greater than the magnetic force, the chip is separated from the pick-and-place equipment and etched. The device processes the chip;

S3. Chip transfer: After the etching device has completed processing the chip, repeat the operation of S1 so that the processed chip and the pick-and-place equipment are re-adsorbed and fixed together, and then transported to the next processing equipment through the robotic arm.

The etching device is a burring machine.

The chip is a QFN IC Package, which contains a wire metal frame inside and is a magnetic material.

The IC tray 11 is a QFN Matrix IC Tray. The surface of the IC tray 11 is provided with forty-eight fixing slots 12 distributed in a matrix. The fixing slots 12 have a cubic structure.

The beneficial effects of this method: the use of magnetic attraction can ensure stable force when picking and placing, and will not cause stability problems due to the deformation of the suction head of the soft suction nozzle. It also saves time and effort, and improves work efficiency. .

A pick-and-place equipment that uses permanent magnets for multiple crystal grains, including a cylinder 1. The cylinder 1 is a single-acting cylinder, and the pushing speed of the cylinder 1 does not exceed 1 mm/s. The magnetic force will be greatly affected by the distance becoming farther. It weakens quickly, but it does not change in equal proportion; therefore, the moving permanent magnet must be moved very slowly to be separated lightly. The cylinder 1 is fixedly connected with a connecting threaded column 2, and the connecting threaded column 2 is threadedly connected to the mechanical arm. The piston rod of the cylinder 1 is fixedly connected to a push plate 3, and the lower end surface of the push plate 3 is vertically fixedly connected to forty-eight ejector pins 4 matching the fixing groove 12 to ensure the synchronization rate of picking and placing multiple chips. The outer wall is connected to a mounting box 6 through a fixed bracket 5. The mounting box 6 is located directly below the cylinder 1, and the mounting box 6 is arranged parallel to the push plate 3. The lower end of the mounting box 6 is provided with a matching fixing groove 12. Forty-eight sliding grooves, and the length of the sliding groove is not less than 7cm, which can be used for chips of different weights. The inner top wall of the sliding groove is provided with a jack connecting the upper end surface of the installation box 6. The jack, sliding groove and top The rod 4 is coaxially arranged, and a permanent magnet block 10 is slidably connected in the sliding groove. The permanent magnet block 10 is a neodymium iron boron magnet. The permanent magnet block 10 has a cylindrical structure, and the bottom surface area of the permanent magnet block 10 is Smaller than the area of the chip, the upper end of the permanent magnet block 10 is connected to the inner top wall of the sliding groove through a return spring 9. The return spring 9 is movably sleeved on the push rod 4, and the lower end of the push rod 4 passes through the insert. hole and conflicts with the upper end surface of the permanent magnet block 10. One end of the connecting post 7 is fixedly connected to the four end points of the lower end surface of the installation box 6, and the other ends of the four connecting posts 7 are fixedly connected to the same partition. On the plate 8, the iron piece with magnetic reaction can best block the magnetic force; while the material without magnetic reaction will not block the magnetic force. Therefore, the partition 8 is made of non-magnetic reaction material. The key to separation is to use the partition 8. If it is not directly attracted by the permanent magnet block 10 and cannot be separated in the future, the thickness of the partition plate 8 should not exceed 1 mm.

This pick-and-place equipment uses neodymium iron boron magnets, which can ensure permanent and stable magnetic attraction and ensure stability. It is used with the partition 8. The chip and the permanent magnet block 10 are separated by the partition 8 made of 1mm thick non-magnetic reactive material. , there will be no magnetic blocking effect, and the chip and the permanent magnet block 10 will be prevented from being inseparable due to direct contact and adsorption, thereby facilitating the taking and removal of the chip. Using the cylinder 1 to push the permanent magnet block 10 to move can make the permanent magnet block 10 move slowly, which can slowly weaken the magnetic force and avoid the problem of violent shaking of the magnetic material during the process of upward attraction and downward detachment. It can pick up multiple chips at the same time, and push multiple ejector pins 4 through one cylinder 1, so that multiple chips can be picked up and removed at the same time. The synchronization rate is high and the work efficiency is improved. The magnitude of the magnetic force on the chip can be changed by adjusting the elongation of the cylinder 1, thereby adapting to chips of different weights and having a wide range of applications.

The specific working process of this pick and place equipment is as follows:

1) When taking the chip, match the fixed groove 12 on the IC tray 11 with the permanent magnet block 10 one by one, start the cylinder 1, push the push plate 3 to move downward, and make the ejector pin 4 push the permanent magnet block 10 to slide along The groove moves downward. At this time, since the distance between the permanent magnet block 10 and the chip slowly decreases at a speed of 1mm/s, it is ensured that the magnetic material will not shake violently during the upward attraction and downward detachment process, and the chip contains The wire metal frame is a magnetic material. When the magnetic force increases and is greater than the gravity of the chip, the chip can be sucked out from the IC tray 11 and tightly attached to the lower end surface of the partition 8. This is ensured by the partition 8 of non-magnetic reaction material. It will not affect the magnitude of the magnetic force and separate the permanent magnet block 10 from the chip, thus avoiding the problem that the chip and the permanent magnet block 10 are directly attracted and cannot be separated;

2) When removing the chip, just start the cylinder 1 and push the push plate 3 to move upward. The return spring 9 pulls the permanent magnet block 10 to move upward along the sliding groove. At the same time, the permanent magnet block 10 keeps in conflict with the push rod 4 to ensure permanent The magnetic block 10 rises slowly and the magnetic force slowly decreases. When the gravity of the chip is greater than the magnetic force, the chip is separated from the partition 8 .

The above contents are only examples and descriptions of the structure of the present invention. Those skilled in the art may make various modifications or supplements to the described specific embodiments or substitute them in similar ways, as long as they do not deviate from the structure of the invention or Anything beyond the scope defined by the claims shall belong to the protection scope of the present invention.

Claims (5)

1. A pick-and-place method using permanent magnets for multiple crystal grains, including an IC tray (11), a robotic arm, pick-and-place equipment, and an etching device. It is characterized in that the method uses permanent magnets for multiple crystal grains. The methods of picking and placing the crystal grains include: S1. Chip removal and fixation: The robotic arm is fixedly connected to the pick-and-place equipment. The robotic arm controls the movement of the pick-and-place equipment so that the pick-and-place equipment is aligned and close to the IC tray (11) placed on the workbench. The pick-and-place equipment conflicts with the IC tray (11) placed on the workbench. After the upper end surface of the IC tray (11), the position of the robot arm is fixed, and the pick-and-place equipment is started at the same time. The chip is sucked out of the IC tray (11) by increasing the magnetic force, so that the chip is adsorbed on the lower end surface of the pick-and-place equipment to complete the removal and fixation. process; S2. Etching of chips: Control the robotic arm to horizontally transport the pick-and-place equipment with the chip attached to the etching device, and then change the magnitude of the magnetic force on the chip. When the gravity of the chip is greater than the magnetic force, the chip is separated from the pick-and-place equipment and etched. The device processes the chip; S3. Chip transfer: After the etching device completes processing of the chip, repeat the operation of S1, so that the processed chip and the pick-and-place equipment are re-adsorbed and fixed together, and transported to the next processing equipment through the robotic arm; The pick-and-place equipment includes a cylinder (1). The cylinder (1) is fixedly connected with a connecting threaded column (2). The connecting threaded column (2) is threadedly connected to the mechanical arm. The piston rod of the cylinder (1) A push plate (3) is fixedly connected. The lower end surface of the push plate (3) is vertically fixedly connected with forty-eight ejector rods (4) matching the fixing groove (12). The outer wall of the cylinder (1) passes through a fixed bracket. (5) A mounting box (6) is connected. The mounting box (6) is located directly below the cylinder (1), and the mounting box (6) is arranged parallel to the push plate (3). The mounting box (6) is The lower end face is provided with forty-eight sliding grooves that match the fixed groove (12). The inner top wall of the sliding groove is provided with a socket that communicates with the upper end surface of the installation box (6). The socket, sliding groove and push rod (4 ) is coaxially arranged, and a permanent magnet block (10) is slidably connected in the sliding groove. The upper end of the permanent magnet block (10) is connected to the inner top wall of the sliding groove through a return spring (9). The return spring (10) 9) The movable sleeve is set on the ejector rod (4). The lower end of the ejector rod (4) passes through the jack and conflicts with the upper end surface of the permanent magnet block (10). The four sides of the lower end surface of the installation box (6) One end of the connecting post (7) is fixedly connected to each endpoint, and the other ends of the four connecting posts (7) are fixedly connected to the same partition (8). The partition (8) is non-magnetic. material; The permanent magnet block (10) is a neodymium iron boron magnet, the permanent magnet block (10) has a cylindrical structure, and the bottom surface area of the permanent magnet block (10) is smaller than the area of the chip; The cylinder (1) is a single-acting cylinder, and the pushing speed of the cylinder (1) does not exceed 1mm/s. 2. A method of using permanent magnets for picking and placing multiple crystal grains according to claim 1, characterized in that the etching device is a burring machine. 3. A method of using permanent magnets for picking and placing multiple crystal grains according to claim 1, characterized in that the chip is a QFN IC Package. 4. A method for picking and placing permanent magnets for multiple crystal grains according to claim 1, characterized in that the IC tray (11) is a QFN Matrix IC Tray, and the IC tray (11) Forty-eight fixing slots (12) distributed in a matrix are provided on the surface, and the fixing slots (12) have a cubic structure. 5. A method for picking and placing permanent magnets for multiple crystal grains according to claim 1, characterized in that the thickness of the partition (8) does not exceed 1 mm, and the length of the sliding groove is not less than 7 cm.