CN108989919B - Sensor - Google Patents
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- Publication number
- CN108989919B CN108989919B CN201810772091.9A CN201810772091A CN108989919B CN 108989919 B CN108989919 B CN 108989919B CN 201810772091 A CN201810772091 A CN 201810772091A CN 108989919 B CN108989919 B CN 108989919B
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- Prior art keywords
- light
- sensor
- shell
- diaphragm
- elastic body
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- 229920001971 elastomer Polymers 0.000 claims description 15
- 239000000806 elastomer Substances 0.000 claims description 15
- 230000035945 sensitivity Effects 0.000 claims description 9
- 238000006073 displacement reaction Methods 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims 1
- 230000002708 enhancing effect Effects 0.000 abstract description 3
- 239000003990 capacitor Substances 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910020776 SixNy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- -1 polydimethylsiloxane Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
The invention discloses a sensor, comprising: the device comprises a shell with a hollow inner cavity and an opening at the upper end, wherein a light emitting source for emitting light towards the opening end of the shell and a photoelectric detector for receiving reflected light are arranged at the bottom end of the inner cavity of the shell; a light-transmitting elastic body filled in the inner cavity of the shell and covering the light-emitting source and the photoelectric detector; the vibrating diaphragm is borne at the opening end of the shell and is attached to the light-transmitting elastic body, and the vibrating diaphragm is configured to deform with the light-transmitting elastic body under the change of an external environment; a reflection portion is disposed on the diaphragm, and the reflection portion is configured to reflect light emitted from the light-emitting source onto the photodetector. The sensor of the invention has no problem of acoustic resistance, and does not need a back cavity with larger volume, thereby greatly reducing the whole size of the sensor and enhancing the reliability of the sensor.
Description
Technical Field
The present invention relates to the field of measurement, and more particularly to a sensor, such as a microphone, a pressure sensor, a displacement sensor.
Background
The sensors that are currently used in the mainstream, such as microphones, pressure sensors, and displacement sensors, are all based on the principle of a flat capacitor. For example, in the structure of the microphone, the flat-plate capacitor includes a substrate, and a back plate and a diaphragm formed on the substrate, and a gap is formed between the back plate and the diaphragm, so that the back plate and the diaphragm form a flat-plate capacitor sensing structure.
To take full advantage of the mechanical sensitivity of the diaphragm, the microphone needs to be designed with a large back volume with ambient pressure to ensure the rigidity of the flowing air far from the diaphragm. The volume of the back cavity is usually much larger than 1mm3E.g. typically designed to be 1-15mm3. And when the microphone chip is packaged, the cavity of the microphone chip needs to be opened. This limits the design of the minimum size package of the MEMS microphone (>3mm3）。
This is because if the back volume is too small, it is not conducive to the circulation of air, the rigidity of which can greatly reduce the mechanical sensitivity of the diaphragm. In addition, dense vias are typically designed in the backplate for voltage equalization, and air flow resistance in the gaps or perforations due to air viscosity becomes the dominant factor for MEMS microphone noise, limiting the high signal-to-noise performance of the microphone.
Disclosure of Invention
It is an object of the present invention to provide a new solution for a sensor.
According to a first aspect of the present invention, there is provided a sensor comprising:
the device comprises a shell with a hollow inner cavity and an opening at the upper end, wherein a light emitting source for emitting light towards the opening end of the shell and a photoelectric detector for receiving reflected light are arranged at the bottom end of the inner cavity of the shell;
a light-transmitting elastic body filled in the inner cavity of the shell and covering the light-emitting source and the photoelectric detector;
the vibrating diaphragm is borne at the opening end of the shell and is attached to the light-transmitting elastic body, and the vibrating diaphragm is configured to deform with the light-transmitting elastic body under the change of an external environment; a reflection portion is disposed on the diaphragm, and the reflection portion is configured to reflect light emitted from the light-emitting source onto the photodetector.
Optionally, the mechanical sensitivity of the light-transmitting elastomer is less than or equal to the mechanical sensitivity of the diaphragm.
Optionally, the housing comprises a cavity surrounded by the side wall part, and a bottom part closing the lower end opening of the side wall part; the light emitting source and the photoelectric detector are arranged on the bottom.
Optionally, the bottom is a circuit board, and a pad or a pin for external connection is further disposed on the outer side of the circuit board.
Optionally, a contact surface of the light-transmitting elastic body and the diaphragm is a plane.
Optionally, a contact surface of the light-transmitting elastic body and the diaphragm is a convex or concave curved surface.
Optionally, the light emitting source is a laser diode; the photodetector is a four quadrant photodetector.
Optionally, the reflection portion is a metal thin film layer formed on the diaphragm.
Optionally, a plurality of sets of the photodetectors and the light emitting sources are arranged at the bottom of the inner cavity of the housing, and the number of the reflecting portions corresponds to the number of the sets of the photodetectors and the light emitting sources.
Optionally, the sensor is a microphone, a pressure sensor, a displacement sensor.
According to one embodiment of the invention, the sensor of the invention, the diaphragm and the light-transmitting elastomer sealed in the inner cavity are combined together, and the diaphragm and the light-transmitting elastomer are driven to deform together by external acting force and the detection of the change signal of the optical signal is carried out. The sensor of the invention has no problem of acoustic resistance, and does not need a back cavity with larger volume, thereby greatly reducing the whole size of the sensor and enhancing the reliability of the sensor.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
FIG. 1 is a schematic diagram of the construction of the sensor of the present invention.
Fig. 2 is a schematic structural diagram of another embodiment of the sensor of the present invention.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
The present invention provides a sensor which may be a microphone, a pressure sensor, a displacement sensor or other sensors known to those skilled in the art. For convenience of description, the technical solution of the present invention will be described in detail by taking a microphone as an example.
The sensor comprises a shell with a hollow inner cavity, and the upper end of the shell is provided with an opening end communicated with the inner cavity of the shell. The housing may be integrally formed, and may be selected from single crystal silicon or other materials known to those skilled in the art. When the material of the single crystal silicon is selected, a hollow inner cavity with an upper end opening can be formed in the middle area of the shell by means of etching and the like.
In another embodiment of the invention, the housing comprises a cavity enclosed by the side wall part 2, and a bottom part 1 closing the lower end opening of the side wall part 2. The sidewall 2 can be made of silicon, and the bottom 1 can be made of a circuit board. The circuit board may be fixed to the lower end of the side wall portion 2 by means of bonding, thereby closing the lower end opening of the side wall portion 2.
A light emitting source 6 for emitting light toward the open end of the housing and a photodetector 5 for receiving reflected light are provided on the bottom 1; the inner cavity of the shell is filled with a light-transmitting elastic body 4, and the light-transmitting elastic body 4 covers the light-emitting source 6 and the photoelectric detector 5, so as to protect the light-emitting source 6 and the photoelectric detector 5 to a certain extent.
A diaphragm 3 is further disposed at the upper end of the sidewall portion 2, and the diaphragm 3 is carried on the upper end surface of the sidewall portion 2 and is attached to the light-transmitting elastic body 4. The diaphragm 3 is provided with a reflection portion 7 for reflecting light emitted from the light emission source 6 to the photodetector 5.
The light emitted from the light source 6 passes through the light-transmitting elastic body 4 to reach the reflection part 7 on the diaphragm 3, and after being reflected by the reflection part 7, the reflected light passes through the light-transmitting elastic body 4 to reach the photodetector 5 and is detected by the photodetector 5. After an external sound signal acts on the diaphragm 3, the diaphragm 3 deforms together with the light-transmitting elastic body 4, so that the angle of the reflection part 7 on the diaphragm 3 is changed, the light path between the light source 6, the reflection part 7 and the photoelectric detector 5 is changed, the change of the light path is finally detected by the photoelectric detector 5, and the photoelectric detector 5 outputs an electric signal of the change of the light path, so that the deformation of the diaphragm 3 is represented, and the conversion from sound to the electric signal is realized.
The light emitting source 6, the photodetector 5 may be fixed on the bottom 1 of the circuit board, for example, by means well known to those skilled in the art. A bonding pad or pin 9 communicated with the light-emitting source 6 and the photoelectric detector 5 is also arranged on the outer side of the bottom part 1, and the connection of the sensor and an external circuit can be realized through the bonding pad or pin 9. The light Emitting source 6 of the present invention may be a light Emitting diode such as an LED, and preferably a Laser diode with a small light spot, such as a Vertical cavity surface Emitting Laser (Vertical cavity surface Emitting Laser), to improve the sensitivity of detection. The wavelength of the light emitted from the laser diode may be, for example, 0.85um, 1.064um, 20um, or the like. The photo detector 5 may be, for example, a four-quadrant photo detector, which is well known to those skilled in the art and will not be described in detail herein.
The light-transmitting elastomer 4 may be a polymer, such as polydimethylsiloxane. The housing cavity may be filled with a liquid polymer by dropping glue or other means known to those skilled in the art, which when cured forms the light transmissive elastomer 4. After the light-transmitting elastomer 4 is cured, the upper surface of the light-transmitting elastomer for attaching to the diaphragm 3 may be flat, refer to fig. 1; or a concave curved surface, refer to fig. 2; or a curved surface which is convex upwards. When the upper surface of the light-transmitting elastic body 4 is curved, the angle of the reflecting portion 7 on the diaphragm 3 can be more easily modulated, so that the photodetector 5 can receive the optical signal modulated by the reflecting portion 7.
The diaphragm 3 of the present invention is a flexible film, which may be selected from, for example, polySi, Si, SiO2、SixNyMetal, polymer, or any combination. It can be bonded by deposition on the sidewall 2 and on the light-transmissive elastomer 4; or can also be usedIs bonded to the side wall portion 2 by bonding and is bonded to the light-transmitting elastic body 4 by adhesion.
In a preferred embodiment of the invention, the mechanical sensitivity of the diaphragm 3 is greater than the mechanical sensitivity of the light-transmitting elastomer 4, and the sealed light-transmitting elastomer 4 may dominate the mechanical sensitivity of the entire sensor after the diaphragm 3 is combined with the light-transmitting elastomer 4. Specifically, the Young's modulus of the light-transmitting elastomer 4 may be selected to be 100kPa to 500 kPa.
The reflection portion 7 may be a metal thin film layer formed on the diaphragm 3, which may be formed on the diaphragm 3 by deposition, patterning, and the like. The reflective portion 7 may be made of Al, Au, Ag, or the like. The reflection portion 7 is formed by deposition, etching, etc. on the diaphragm 3, which process is common knowledge of those skilled in the art and will not be described in detail here.
On the premise that the light can reach the emitting part 7, the reflecting part 7 can be arranged above the diaphragm 3, below the diaphragm 3 or in a hollow area of the diaphragm 3. The position of the reflection portion 7 needs to correspond to the light source 6 and the photodetector 5, and even when the diaphragm 3 is deformed, the reflection portion 7 needs to be ensured to reflect the light emitted from the light source 6 to the photodetector 5.
According to the sensor, the vibrating diaphragm and the light-transmitting elastic body sealed in the inner cavity are combined together, the vibrating diaphragm and the light-transmitting elastic body are driven to deform together by external acting force, and signals are detected through the change of optical signals. The sensor of the invention has no problem of acoustic resistance, and does not need a back cavity with larger volume, thereby greatly reducing the whole size of the sensor and enhancing the reliability of the sensor.
The photoelectric detector and the luminous source of the invention can be provided with a plurality of groups, and the number of the reflecting parts corresponds to the number of the reflecting parts. For example, the diaphragm is a circular diaphragm, four sets of the photodetectors and the light-emitting sources may be arranged, and are uniformly distributed in the circumferential direction, and four sets of the reflection portions are arranged, and correspond to the four sets of the photodetectors and the four sets of the light-emitting sources respectively.
In each set of the photo detectors and the light sources, there may be a plurality of light sources, and a plurality of light sources correspond to one photo detector, which is not described in detail herein.
The sensor of the invention can be applied to a microphone, a pressure sensor and a displacement sensor. For example, when the diaphragm is applied to a pressure sensor, the diaphragm is sensitive to external pressure, and the diaphragm and the light-transmitting elastic body are driven to deform by the change of the external pressure. When using among the displacement sensor, can set up a actuating lever and diaphragm 3 and link together, promote diaphragm 3, printing opacity elastomer through the actuating lever and take place deformation, no longer enumerate one by one here.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (9)
1. A sensor, comprising:
the device comprises a shell with a hollow inner cavity and an opening at the upper end, wherein a light emitting source for emitting light towards the opening end of the shell and a photoelectric detector for receiving reflected light are arranged at the bottom end of the inner cavity of the shell;
a light-transmitting elastic body filled in the inner cavity of the shell and covering the light-emitting source and the photoelectric detector;
the vibrating diaphragm is borne at the opening end of the shell and is attached to the light-transmitting elastic body, and the vibrating diaphragm is configured to deform with the light-transmitting elastic body under the change of an external environment; a reflection part is arranged on the diaphragm and is configured to reflect light rays emitted by the light emitting source to the photoelectric detector;
the Young modulus of the light-transmitting elastomer is 100 kPa-500 kPa;
the shell comprises a cavity surrounded by side wall parts and a bottom for closing the lower end opening of the side wall parts; the light emitting source and the photoelectric detector are arranged on the bottom.
2. The sensor of claim 1, wherein: the mechanical sensitivity of the light-transmitting elastomer is less than or equal to that of the diaphragm.
3. The sensor of claim 1, wherein: the bottom is a circuit board, and a welding disc or a pin used for external connection is arranged on the outer side of the circuit board.
4. The sensor of claim 1, wherein: the contact surface of the light-transmitting elastic body and the vibrating diaphragm is a plane.
5. The sensor of claim 1, wherein: the contact surface of the light-transmitting elastic body and the vibrating diaphragm is a convex or concave curved surface.
6. The sensor of claim 1, wherein: the light emitting source is a laser diode; the photodetector is a four quadrant photodetector.
7. The sensor of claim 1, wherein: the reflecting part is a metal film layer formed on the vibrating diaphragm.
8. The sensor of claim 1, wherein: the bottom of the inner cavity of the shell is provided with a plurality of groups of photoelectric detectors and luminous sources, and the number of the reflecting parts corresponds to the number of the photoelectric detectors and the luminous sources.
9. The sensor of any one of claims 1 to 8, wherein: the sensor is a microphone, a pressure sensor and a displacement sensor.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810772091.9A CN108989919B (en) | 2018-07-13 | 2018-07-13 | Sensor |
| PCT/CN2019/088915 WO2020010950A1 (en) | 2018-07-13 | 2019-05-29 | Sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810772091.9A CN108989919B (en) | 2018-07-13 | 2018-07-13 | Sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108989919A CN108989919A (en) | 2018-12-11 |
| CN108989919B true CN108989919B (en) | 2020-09-22 |
Family
ID=64537557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810772091.9A Active CN108989919B (en) | 2018-07-13 | 2018-07-13 | Sensor |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108989919B (en) |
| WO (1) | WO2020010950A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112019985B (en) * | 2020-10-15 | 2021-01-22 | 潍坊歌尔微电子有限公司 | Microphone structure and electronic equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1160999C (en) * | 1997-05-08 | 2004-08-04 | 艾利森公司 | Sound transducer and method having light detector for detecting displacement of transducer diaphragm |
| CN103492832A (en) * | 2011-04-08 | 2014-01-01 | 株式会社村田制作所 | Displacement sensor, displacement detecting apparatus, and operation device |
| CN103901556A (en) * | 2012-12-27 | 2014-07-02 | 鸿富锦精密工业（深圳）有限公司 | Photoelectric conversion module |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201118979Y (en) * | 2007-07-09 | 2008-09-17 | 祝文光 | Semiconductor laser microphone |
| CN101646121A (en) * | 2008-08-08 | 2010-02-10 | 鸿富锦精密工业（深圳）有限公司 | Microphone module |
| JP5066307B1 (en) * | 2011-03-22 | 2012-11-07 | パナソニック株式会社 | Optical microphone |
| NO3004829T3 (en) * | 2013-06-06 | 2018-07-28 | ||
| CN104113813A (en) * | 2014-06-20 | 2014-10-22 | 宁波兴隆电子有限公司 | MEMS fiber microphone |
| CN106153227B (en) * | 2016-08-31 | 2019-03-08 | 贾岳杭 | Stress and strain detection device based on intensity of illumination measurement |
-
2018
- 2018-07-13 CN CN201810772091.9A patent/CN108989919B/en active Active
-
2019
- 2019-05-29 WO PCT/CN2019/088915 patent/WO2020010950A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1160999C (en) * | 1997-05-08 | 2004-08-04 | 艾利森公司 | Sound transducer and method having light detector for detecting displacement of transducer diaphragm |
| CN103492832A (en) * | 2011-04-08 | 2014-01-01 | 株式会社村田制作所 | Displacement sensor, displacement detecting apparatus, and operation device |
| CN103901556A (en) * | 2012-12-27 | 2014-07-02 | 鸿富锦精密工业（深圳）有限公司 | Photoelectric conversion module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108989919A (en) | 2018-12-11 |
| WO2020010950A1 (en) | 2020-01-16 |
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Effective date of registration: 20200804 Address after: 261061 building 10, Geer phase II Industrial Park, No. 102, Ronghua Road, Ronghua community, Xincheng street, high tech Zone, Weifang City, Shandong Province Applicant after: Weifang goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Applicant before: GOERTEK Inc. |
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