CN108987286B - Method for improving co-firing mismatch of LTCC (Low temperature Co-fired ceramic) - Google Patents
Method for improving co-firing mismatch of LTCC (Low temperature Co-fired ceramic) Download PDFInfo
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- CN108987286B CN108987286B CN201810696582.XA CN201810696582A CN108987286B CN 108987286 B CN108987286 B CN 108987286B CN 201810696582 A CN201810696582 A CN 201810696582A CN 108987286 B CN108987286 B CN 108987286B
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- 239000000919 ceramic Substances 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000010344 co-firing Methods 0.000 title claims abstract description 19
- 238000005245 sintering Methods 0.000 claims abstract description 42
- 238000010438 heat treatment Methods 0.000 claims abstract description 25
- 230000008569 process Effects 0.000 claims abstract description 6
- 230000007613 environmental effect Effects 0.000 claims description 2
- 239000002184 metal Substances 0.000 abstract description 8
- 239000000758 substrate Substances 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 2
- 238000002474 experimental method Methods 0.000 description 11
- 230000006872 improvement Effects 0.000 description 6
- 238000000280 densification Methods 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 238000009770 conventional sintering Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
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- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
The invention provides a method for improving co-firing mismatch of LTCC (low temperature co-fired ceramic), which comprises the steps of improving the heating rate when the sintering temperature reaches the rapid shrinkage temperature interval of inner-layer conductive paste in the co-firing process of an LTCC ceramic body and the inner-layer conductive paste, and recovering the conventional heating rate when the sintering temperature exceeds the rapid shrinkage temperature interval of the conductive paste. The method for improving the co-firing mismatch of the LTCC greatly improves the problem of shrinkage matching between the conductive metal layer and the substrate on the premise of not influencing the sintering density of a product, so that the range of material selection is widened, the reliability of the LTCC substrate and a functional device is greatly improved, and more excellent electrical property is realized.
Description
Technical Field
The invention relates to the technical field of ceramic material preparation methods, in particular to a method for improving co-fired mismatch of LTCC.
Background
The LTCC technology is one of the mainstream integrated packaging technologies at present, has many advantages, and electronic components prepared by using the LTCC technology have the advantages of high reliability, high performance, high frequency and the like, are important means for realizing the development of the current electronic components in the direction of miniaturization, light weight, integration and the like, and have been increasingly and widely applied.
However, the LTCC also has difficulties related to reliability, for example, shrinkage rate of the LTCC ceramic body when co-fired with the inner conductive paste is an important challenge, and is related to the quality of the multilayer metallized wiring. When the LTCC is co-fired, the mismatching of the sintering characteristics of the ceramic body and the conductive slurry is mainly reflected in that the sintering densification temperature is different; the sintering shrinkage rates of the substrate and the slurry are inconsistent; the rate of sintering densification does not match, etc. These mismatches tend to cause unevenness, warpage, delamination of the substrate surface after firing, and also a decrease in adhesion of metal wiring, etc. In practice, the ceramic body and the conductive paste with the same maximum shrinkage can be used, but the sintering densification speeds of the ceramic body and the conductive paste are not matched, the shrinkage rates are different to a certain extent, and if the ceramic body and the conductive paste are sintered conventionally, the sintered ceramic body and the inner metal conductive layer are not well combined together, and a large gap exists between the sintered ceramic body and the inner metal conductive layer. For some high-frequency functional devices or functional substrates, the metal layer and the ceramic body have a gap, which means that the structure of the whole product is changed, and the electric performance of the product is greatly influenced, such as the insertion loss of a filter is increased, the standing-wave ratio is poor, and the like.
In view of this, it is an urgent need to provide a method for improving co-firing mismatch of LTCC, and solve the problem of mismatch of temperature point and shrinkage rate of the LTCC ceramic body and the inner conductive paste during sintering process.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a method for improving the co-firing mismatch of LTCC, which can greatly improve the shrinkage matching problem between a conductive metal layer and a substrate on the premise of not influencing the sintering density of a product, widen the material selection range, greatly improve the reliability of the LTCC substrate and a functional device and realize more excellent electrical property.
In order to achieve the purpose, the technical scheme provided by the invention is as follows:
in the co-firing process of an LTCC ceramic body and inner layer conductive paste, when the sintering temperature reaches the rapid shrinkage temperature interval of the inner layer conductive paste, the heating rate is increased, and when the sintering temperature exceeds the rapid shrinkage temperature interval of the conductive paste, the conventional heating rate is recovered;
when the sintering temperature is in the range from the current environmental temperature to 500 ℃, controlling the heating rate to be 1 ℃/min;
when the sintering temperature is between 500 ℃ and 600 ℃, controlling the heating rate to be 3.5 ℃/min;
when the sintering temperature is between 600 ℃ and 750 ℃, controlling the heating rate to be 5 ℃/min;
when the sintering temperature is between 750 ℃ and 870 ℃, the heating rate is controlled to be 3.5 ℃/min.
The invention provides a method for improving the co-firing mismatch of an LTCC, which sets a faster heating rate on a conductive paste rapid shrinkage starting temperature section, shortens the time of the conductive paste rapid shrinkage period, accelerates the reaching of a ceramic body rapid shrinkage temperature point, and then recovers the conventional heating rate, so that the co-firing mismatch of the LTCC ceramic body and an inner layer conductive paste can be improved under the condition of ensuring that the compactness of the ceramic body is not influenced, the mismatch of the sintered ceramic body and a metal conductive layer is reduced by about 7%, and the reliability of a product is improved.
Drawings
FIG. 1 is a flow chart of an embodiment of a LTCC cofiring mismatch improvement method of the present invention;
FIG. 2 is a diagram of temperature rise rate setting and sintering of an experiment 1 of the LTCC cofiring mismatch improvement method of the present invention;
FIG. 3 is a graph of temperature rise rate setting and sintering of experiment 2 of the LTCC cofiring mismatch improvement method of the present invention;
FIG. 4 is a graph of temperature rise rate setting and sintering of experiment 3 of the LTCC cofiring mismatch improvement method of the present invention;
FIG. 5 is a graph of temperature rise rate setting and sintering of an experiment 4 of the LTCC cofiring mismatch improvement method of the present invention;
FIG. 6 is a schematic structural view of an LTCC ceramic body according to an embodiment of the method for improving co-firing mismatch of LTCC of the present invention.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
The invention provides a method for improving co-firing mismatch of LTCC (low temperature co-fired ceramic), which comprises the steps of improving the heating rate when the sintering temperature reaches the rapid shrinkage temperature interval of inner-layer conductive paste in the co-firing process of an LTCC ceramic body and the inner-layer conductive paste, and recovering the conventional heating rate when the sintering temperature exceeds the rapid shrinkage temperature interval of the conductive paste.
Referring to fig. 1 and fig. 6, an embodiment of a method for improving co-firing mismatch of an LTCC of the present invention is shown, the method for improving co-firing mismatch of an LTCC includes:
and S100, when the sintering temperature is in a range from the current environment temperature to 500 ℃, controlling the heating rate to be 1 ℃/min.
And S200, controlling the heating rate to be 3.5 ℃/min when the sintering temperature is in a range of 500-600 ℃.
And S300, controlling the temperature rise rate to be 5 ℃/min when the sintering temperature is within the range of 600-750 ℃.
S400, controlling the heating rate to be 3.5/min when the sintering temperature is between 750 and 870 degrees.
The maximum shrinkage temperature of the LTCC ceramic body is close to that of the inner layer conductive paste; the shrinkage starting temperature of the conductive paste is low, and the conductive paste is firstly shrunk in the co-firing process; conducting slurry is quickly shrunk in a temperature range of 600-700 ℃, the ceramic body is in the initial shrinking stage, and the temperature of the temperature range is quickly raised by rate of 5-10 ℃/min; the slow temperature rise is recovered until the temperature is more than or equal to 700 ℃.
Characteristic temperature of ceramic body: a glass transition temperature Tg of about 600 ℃, a viscous flow temperature Tf of about 705 ℃, a shrinkage cut-off temperature Ts of about 900 ℃, and a longitudinal shrinkage rate Delta Z/Z of about 17.35%;
conductive paste characteristic temperature: a glass transition temperature Tg of about 520 ℃, a viscous flow temperature Tf of about 614 ℃, a shrinkage cut-off temperature Ts of about 950 ℃, and a longitudinal shrinkage Δ Z/Z of about 4.64%;
experimental data
Referring to fig. 2, experiment 1, conventional sintering: 1# sample, sintering furnace I;
RT-500 ℃ at a rate of 1 ℃/min;
500 ℃ and 870 ℃, at a rate of 3.5 ℃/min.
Referring to fig. 3, experiment 2, 5 ℃/min sintering: 2# sample, sintering furnace I;
RT-500 ℃ at a rate of 1 ℃/min;
500 ℃ and 600 ℃, the speed is 3.5 ℃/min;
600 ℃ and 750 ℃, and the speed is 5 ℃/min;
750 ℃ and 870 ℃, and the speed is 3.5/min.
Comparing experiment 1 with experiment 2, sintering is carried out in the same sintering furnace by controlling the heating rate, and the average mismatch rate of the sintered finished product is reduced from 17.736% to 10.502%.
Referring to fig. 4, experiment 3, conventional sintering: 3# sample, sintering furnace II;
RT-500 ℃ at a rate of 1 ℃/min;
500 ℃ and 870 ℃, at a rate of 3.5 ℃/min.
Referring to FIG. 5, run 4, 5 ℃/min sintering: 4# sample, sintering furnace II;
RT-500 ℃ at a rate of 1 ℃/min;
500 ℃ and 600 ℃, the speed is 3.5 ℃/min;
600 ℃ and 750 ℃, and the speed is 8 ℃/min;
750 ℃ and 870 ℃, and the speed is 3.5 ℃/min.
Comparing experiment 3 with experiment 4, sintering is carried out in the same sintering furnace by controlling the heating rate, and the average mismatch rate of the sintered finished product is reduced from 21.136% to 14.475%.
The invention provides a method for improving the co-firing mismatch of an LTCC, which sets a faster heating rate on a conductive paste rapid shrinkage starting temperature section, shortens the time of the conductive paste rapid shrinkage period, accelerates the reaching of a ceramic body rapid shrinkage temperature point, and then recovers the conventional heating rate, so that the co-firing mismatch of the LTCC ceramic body and an inner layer conductive paste can be improved under the condition of ensuring that the compactness of the ceramic body is not influenced, the mismatch of the sintered ceramic body and a metal conductive layer is reduced by about 7%, and the reliability of a product is improved.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that are within the spirit and principle of the present invention are intended to be included therein.
Claims (1)
1. The method is characterized by comprising the steps of improving the heating rate when the sintering temperature reaches the rapid shrinkage temperature interval of the inner-layer conductive paste in the co-firing process of an LTCC ceramic body and the inner-layer conductive paste, and recovering the conventional heating rate when the sintering temperature exceeds the rapid shrinkage temperature interval of the conductive paste;
when the sintering temperature is in the range from the current environmental temperature to 500 ℃, controlling the heating rate to be 1 ℃/min;
when the sintering temperature is between 500 ℃ and 600 ℃, controlling the heating rate to be 3.5 ℃/min;
when the sintering temperature is between 600 ℃ and 750 ℃, controlling the heating rate to be 5 ℃/min;
when the sintering temperature is between 750 ℃ and 870 ℃, the heating rate is controlled to be 3.5 ℃/min.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1394113A (en) * | 2001-06-05 | 2003-01-29 | 株式会社村田制作所 | Method for mfg. glass ceramic multi-substrate and glass ceramic multi-substrate |
| CN102013320A (en) * | 2010-10-22 | 2011-04-13 | 广东风华高新科技股份有限公司 | Single-layer capacitor and preparation method thereof |
| CN103050281A (en) * | 2011-10-12 | 2013-04-17 | 李文熙 | Shrinkage sintering inhibition for improving electrode continuity of multilayer ceramic assembly |
| CN103137326A (en) * | 2011-12-01 | 2013-06-05 | 李文熙 | Electronic component and manufacturing method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100471932B1 (en) * | 2002-05-13 | 2005-03-08 | 한국과학기술연구원 | Low Temperature Co-Firing Ceramic (LTCC) Composition for Microwave Frequency |
| CN109250920A (en) * | 2018-09-19 | 2019-01-22 | 深圳市晶特智造科技有限公司 | A kind of low-temperature co-burning ceramic material and preparation method thereof |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1394113A (en) * | 2001-06-05 | 2003-01-29 | 株式会社村田制作所 | Method for mfg. glass ceramic multi-substrate and glass ceramic multi-substrate |
| CN102013320A (en) * | 2010-10-22 | 2011-04-13 | 广东风华高新科技股份有限公司 | Single-layer capacitor and preparation method thereof |
| CN103050281A (en) * | 2011-10-12 | 2013-04-17 | 李文熙 | Shrinkage sintering inhibition for improving electrode continuity of multilayer ceramic assembly |
| CN103137326A (en) * | 2011-12-01 | 2013-06-05 | 李文熙 | Electronic component and manufacturing method thereof |
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