CN108984030B - A high weather resistance bonding method for the upper electrode and the lower electrode of the touch screen - Google Patents
A high weather resistance bonding method for the upper electrode and the lower electrode of the touch screen Download PDFInfo
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- CN108984030B CN108984030B CN201810722548.5A CN201810722548A CN108984030B CN 108984030 B CN108984030 B CN 108984030B CN 201810722548 A CN201810722548 A CN 201810722548A CN 108984030 B CN108984030 B CN 108984030B
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- 238000000034 method Methods 0.000 title claims abstract description 24
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 68
- 229910052709 silver Inorganic materials 0.000 claims abstract description 62
- 239000004332 silver Substances 0.000 claims abstract description 62
- 238000003825 pressing Methods 0.000 claims abstract description 20
- 230000001070 adhesive effect Effects 0.000 claims abstract description 17
- 239000000853 adhesive Substances 0.000 claims abstract description 16
- 239000012943 hotmelt Substances 0.000 claims abstract description 7
- 239000000084 colloidal system Substances 0.000 claims description 23
- 239000002390 adhesive tape Substances 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 claims description 6
- 239000003292 glue Substances 0.000 abstract description 11
- 230000007547 defect Effects 0.000 abstract description 3
- 230000008569 process Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229940112822 chewing gum Drugs 0.000 description 1
- 235000015218 chewing gum Nutrition 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
本发明提供一种高耐候性用于触摸屏上电极和下电极的粘合方法，包括如下步骤：采用异方性热熔导电胶将柔性电路板与下电极的压合位进行压合，使得柔性电路板与下电极电性连接；在Film上覆盖有ITO膜的上电极对位贴合双面胶，同时双面胶上预留有点银胶孔，点银胶孔与上电极的点银胶位相对应；将银胶点在下电极绝缘油墨镂空、露出导电电极的部位上；将上电极与下电极进行对位贴合，使得银胶穿过所述银胶孔；将经过对位贴合的上电极与下电极在60℃~80℃进行烘烤15min~25min。本发明提供的高耐候性用于触摸屏上电极和下电极的粘合方法，避免上电极因压合的高温而变形，进而避免了外观不良的瑕疵。
The invention provides a high weather resistance bonding method for the upper electrode and the lower electrode of the touch screen, which comprises the following steps: using anisotropic hot-melt conductive adhesive to press the pressing position of the flexible circuit board and the lower electrode, so that the flexible circuit board and the lower electrode are pressed together. The circuit board is electrically connected to the lower electrode; the upper electrode covered with ITO film on the Film is aligned and pasted with double-sided tape, and a little silver glue hole is reserved on the double-sided tape, and the silver glue hole is connected with the silver glue of the upper electrode. The positions correspond to each other; the silver glue is dotted on the part where the insulating ink of the lower electrode is hollowed out and the conductive electrodes are exposed; the upper electrode and the lower electrode are aligned and bonded, so that the silver glue passes through the silver glue hole; The upper electrode and the lower electrode are baked at 60℃~80℃ for 15min~25min. The high weather resistance provided by the invention is used for the bonding method of the upper electrode and the lower electrode of the touch screen, so as to avoid the deformation of the upper electrode due to the high temperature of pressing, thereby avoiding the defects of poor appearance.
Description
Technical Field
The invention relates to a production process technology of a touch screen, in particular to a method for bonding an upper electrode and a lower electrode of the touch screen with high weather resistance.
Background
Touch screens are widely applied to mobile phones, tablet computers and other electronic display devices, and capacitive touch screens widely used in the market at present can realize advanced complex functions of multi-point touch, so that the application fields of the capacitive touch screens are widely covered. Electronic devices have relatively high requirements for touch sensitivity and appearance.
At present, an upper electrode and a lower electrode of a touch screen and a flexible circuit board are pressed on two sides. The two surfaces of the flexible circuit board are coated with anisotropic hot melt conductive adhesive, one surface of the flexible circuit board is pressed with the film (upper electrode), and the other surface of the flexible circuit board is pressed with the glass (lower electrode). The pressing process is started by the contact and pressurization of the pressure head from the upper surface of the film. And (3) enabling a pressure head to act on the front surface of the film, quickly heating to 150 ℃, keeping the pressure at 0.1-0.15 Mpa for 8-20 seconds, quickly cooling to 80 ℃, reducing the pressure, lifting the pressure head, separating from the front surface of the film, and finishing pressing.
The anisotropic hot-melt conductive adhesive material is resin mixed with small conductive particles, namely gold balls. After pressing, the gold ball and the silver colloid reach the contact effect, and the resin has the fixing and bonding functions to fix the position of the gold ball.
The Film base material PET has a softening temperature of 80 ℃ and begins to deform when the softening temperature exceeds 80 ℃. Therefore, the touch screen manufactured by the method has defects in appearance.
On the other hand, in the prior art, the upper electrode and the lower electrode are connected by a carbon tape, a 3M conductive adhesive tape or other conductive adhesive tapes, the viscosity of the adhesive is greatly reduced below-10 ℃, and the adhesive is separated from the electrode under the influence of factors such as deformation and vibration, so that the electric conduction fails. The material can not be used under severe conditions in the fields of outdoor, industrial control, military industry and the like and other low-temperature environments.
Disclosure of Invention
In order to solve the above problems, the present invention provides a method for bonding an upper electrode and a lower electrode of a touch screen with high weather resistance, comprising the steps of:
s10: pressing the pressing position of the flexible circuit board and the lower electrode by using anisotropic hot-melt conductive adhesive to electrically connect the flexible circuit board and the lower electrode;
s20: aligning and adhering a double-sided adhesive tape on an upper electrode covered with an ITO Film on the Film, and reserving a silver dispensing hole on the double-sided adhesive tape, wherein the silver dispensing hole corresponds to the silver dispensing position of the upper electrode;
s30: dispensing the silver colloid on the part of the S10 lower electrode, which is hollowed out by the insulating ink and exposed out of the conductive electrode;
s40: aligning and attaching the upper electrode obtained in the step S20 and the lower electrode obtained in the step S30 to enable the silver colloid to penetrate through the silver colloid hole;
s50: and baking the upper electrode and the lower electrode which are subjected to the alignment lamination and obtained in the step S40 at the temperature of between 60 and 80 ℃ for 15 to 25 minutes.
Further, the height of the silver paste dot dispensed in step S30 is 2 times the thickness of the double-sided tape.
Further, in step S30, the silver colloid includes silver powder, resin, isophorone diamine;
wherein: the weight ratio of each component is 10-20% of resin, 70-90% of silver powder and 5-10% of isophorone diamine.
Furthermore, the position of the pressing position of the lower electrode corresponds to the position of the silver dispensing position of the upper electrode.
Further, the diameter of the silver paste dots dispensed in step S30 is 0.8-1.5mm, and the height is 0.1-0.15 mm.
Further, the technological parameters of the point silver paste in step S30 are pressure: 0.4MPa to 0.6MPa, time: 0.5 s-1.2 s.
Further, the stitching in step S10 specifically includes: the pressure head acts on the front surface of the flexible circuit board, the temperature is rapidly raised to 150 ℃, the pressure is 0.1-0.15 Mpa, after the temperature is maintained for 8-20 min, the temperature is rapidly lowered to 80 ℃, the pressure is reduced, the pressure head is lifted, and the pressing is finished.
According to the method for bonding the upper electrode and the lower electrode of the touch screen with high weather resistance, provided by the invention, the silver adhesive is dotted between the upper electrode and the lower electrode by adopting a silver adhesive dispensing process, and the lower electrode is connected with the flexible circuit board through the anisotropic hot-melt conductive adhesive (a single-side pressing process), so that the upper electrode does not need to be pressed, the upper electrode is prevented from deforming due to high temperature of pressing, and further, the defect of poor appearance is avoided.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is an exploded view of a touch screen manufactured by a bonding method for upper and lower electrodes of a touch screen with high weather resistance;
fig. 2 is a schematic cross-sectional view of a touch screen manufactured by a bonding method for upper and lower electrodes of a touch screen with high weather resistance.
Reference numerals:
| 1. ITO glass | 2. Transparent filmExposed isolation point | 3. Silver adhesive for inserting wire |
| 4. Insulation of inserting winding | 5. Line key double-sided adhesive tape | 6. Top line insulation |
| 7. Silver glue for |
8. ITO PE film | 9. Silver point glue position |
| 10. Flexible circuit board | 11. Silver dispensing hole | 12. Lamination position clearance |
| 13. Silver paste | 14. Pressing position |
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
The invention provides a high-weather-resistance bonding method for an upper electrode and a lower electrode of a touch screen, which comprises the following steps:
s10: pressing the pressing position of the flexible circuit board and the lower electrode by using anisotropic hot-melt conductive adhesive to electrically connect the flexible circuit board and the lower electrode;
preferably, the stitching in step S10 is specifically:
the pressure head acts on the front surface of the flexible circuit board, the temperature is rapidly raised to 150 ℃, the pressure is 0.1-0.15 Mpa, after the temperature is maintained for 8-20 min, the temperature is rapidly lowered to 80 ℃, the pressure is reduced, the pressure head is lifted, and the pressing is finished;
s20: aligning and adhering a double-sided adhesive tape on an upper electrode covered with an ITO Film on the Film, and reserving a silver dispensing hole on the double-sided adhesive tape, wherein the silver dispensing hole corresponds to the silver dispensing position of the upper electrode;
s30: dispensing the silver colloid on the part of the S10 lower electrode, which is hollowed out by the insulating ink and exposed out of the conductive electrode;
preferably, the height of the silver paste dots dispensed in step S30 is 2 times of the thickness of the double-sided tape;
preferably, in step S30, the components of the silver colloid include silver powder, resin, isophorone diamine;
wherein: the weight ratio of each component is 10-20% of resin, 70-90% of silver powder and 5-10% of isophorone diamine; the silver colloid used in the silver colloid process in the invention is in a pot-shaped sealing package and is usually kept in the environment of 0-10 ℃. When in use, the product needs to be thawed to normal temperature in advance and then can be opened. And (4) taking a proper amount of the mixture, filling the mixture into a glue dispensing needle cylinder, and mounting a needle head with a proper specification on the needle cylinder.
The silver colloid for dispensing in the invention is different from the silver colloid coated on the upper and lower electrodes in the attached drawings of the specification. The silver colloid coated on the upper and lower electrodes is common silver colloid; after the silver adhesive for dispensing is subjected to the silver adhesive dispensing process, the colloid keeps certain elasticity and good cohesiveness and conductivity; after the silver paste is applied, the paste can maintain good adhesive property and conductivity within the temperature range of-50 ℃ to 120 ℃, and has elastic property similar to rubber. Under the condition of expansion with heat and contraction with cold, the colloid can change along with the external environment and deform together with the base material, and microcracks can not be generated; the Film of the upper electrode and the glass of the lower electrode are bonded very firmly.
Preferably, the diameter of the silver paste dots dispensed in the step S30 is 0.8-1.5mm, and the height is 0.1-0.15 mm;
preferably, the process parameters of the point silver paste in step S30 are pressure: 0.4MPa to 0.6MPa, time: 0.5 s-1.2 s;
s40: aligning and attaching the upper electrode obtained in the step S20 and the lower electrode obtained in the step S30 to enable the silver colloid to penetrate through the silver colloid hole; the position of the pressing position of the lower electrode corresponds to the position of the silver dispensing position of the upper electrode. In the laminating process, the dispensed silver colloid points can be diffused and deformed under the extrusion of the upper circuit board and the lower circuit board, and finally a cylinder similar to a flat shape is formed. The upper surface and the lower surface of the cylinder can be fully infiltrated and combined with the exposed conductive electrodes of the upper circuit board and the lower circuit board.
S50: and baking the upper electrode and the lower electrode which are subjected to the alignment lamination and obtained in the step S40 at the temperature of between 60 and 80 ℃ for 15 to 25 minutes. The baked silver colloid point cylinder is shaped like chewing gum, is rich in elasticity and cannot flow randomly; meanwhile, the upper surface and the lower surface of the cylinder continuously keep sufficient infiltration and combination with the exposed conductive electrodes of the upper circuit board and the lower circuit board; even if the upper circuit board and the lower circuit board are forcedly torn, the silver glue point cylinder can be torn, and the phenomenon of wire drawing occurs. The silver glue dot cylinder can be split into two parts which are respectively remained on the upper circuit board and the lower circuit board. While the wet-bonded portion will continue to remain tightly bonded.
The processed silver adhesive point cylinder has the characteristics of being capable of enduring low temperature of-50 ℃, high temperature of 120 ℃, severe temperature alternation, strong vibration, extrusion and the like, and is continuously kept to be tightly combined with the upper circuit board and the lower circuit board, and the silver adhesive point cylinder cannot crack, so that the upper circuit board and the lower circuit board are well electrically conducted; when the environment test is carried out, the device has high reliability, resists cold and hot impact, bears the condition that the temperature is switched to 70 ℃ at minus 40 ℃, has no failure in the function of environment cross change, and keeps the reliable function and the reliable appearance of the product.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (7)
1. A method for bonding an upper electrode and a lower electrode of a touch screen with high weather resistance is characterized by comprising the following steps:
s10: pressing the pressing position of the flexible circuit board and the lower electrode by using anisotropic hot-melt conductive adhesive to electrically connect the flexible circuit board and the lower electrode;
s20: aligning and adhering a double-sided adhesive tape on an upper electrode covered with an ITO Film on the Film, and reserving a silver dispensing hole on the double-sided adhesive tape, wherein the silver dispensing hole corresponds to the silver dispensing position of the upper electrode;
s30: dispensing the silver colloid on the part of the S10 lower electrode, which is hollowed out by the insulating ink and exposed out of the conductive electrode;
s40: aligning and attaching the upper electrode obtained in the step S20 and the lower electrode obtained in the step S30 to enable the silver colloid to penetrate through the silver colloid hole;
s50: and baking the upper electrode and the lower electrode which are obtained in the step S40 and subjected to the alignment bonding at the temperature of 60-80 ℃ for 15-25 min.
2. The method for bonding an upper electrode and a lower electrode of a touch panel with high weather resistance according to claim 1, wherein: the height of the silver paste dots dispensed in the step S30 is 2 times of the thickness of the double-sided tape.
3. The method for bonding an upper electrode and a lower electrode of a touch panel with high weather resistance according to claim 1, wherein: in step S30, the silver colloid includes silver powder, resin, and isophorone diamine;
wherein: the weight ratio of each component is 10-20% of resin, 70-90% of silver powder and 5-10% of isophorone diamine.
4. The method for bonding an upper electrode and a lower electrode of a touch panel with high weather resistance according to claim 1, wherein: the position of the pressing position of the lower electrode corresponds to the position of the silver dispensing position of the upper electrode.
5. The method for bonding an upper electrode and a lower electrode of a touch panel with high weather resistance according to claim 1, wherein: the diameter of the silver colloid point pointed out in the step S30 is 0.8-1.5mm, and the height is 0.1-0.15 mm.
6. The method for bonding an upper electrode and a lower electrode of a touch panel with high weather resistance according to claim 1, wherein: the technological parameters of the point silver paste in the step S30 are pressure: 0.4 MPa-0.6 MPa, time: 0.5s to 1.2 s.
7. The method for bonding an upper electrode and a lower electrode of a touch panel with high weather resistance according to claim 1, wherein: the stitching in step S10 specifically includes:
and the pressure head acts on the front surface of the flexible circuit board, the temperature is rapidly raised to 150 ℃, the pressure is 0.1-0.15 Mpa, the temperature is rapidly lowered to 80 ℃ after the temperature is maintained for 8-20 min, the pressure is reduced, the pressure head is lifted, and the pressing is finished.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810722548.5A CN108984030B (en) | 2018-07-04 | 2018-07-04 | A high weather resistance bonding method for the upper electrode and the lower electrode of the touch screen |
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|---|---|---|---|
| CN201810722548.5A CN108984030B (en) | 2018-07-04 | 2018-07-04 | A high weather resistance bonding method for the upper electrode and the lower electrode of the touch screen |
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| CN108984030B true CN108984030B (en) | 2021-07-09 |
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| CN109683753B (en) * | 2018-12-25 | 2021-09-17 | 黄石瑞视光电技术股份有限公司 | Anti-deformation processing method for touch display module |
| CN111445787B (en) * | 2020-04-15 | 2022-04-15 | 友达光电（苏州）有限公司 | Display device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104102399A (en) * | 2013-04-13 | 2014-10-15 | 贵州达沃斯光电有限公司 | Capacitive touch screen and manufacturing method thereof |
| CN105045449A (en) * | 2015-08-06 | 2015-11-11 | 山东华芯富创电子科技有限公司 | Touch panel structure and manufacturing method therefor |
| CN105786264A (en) * | 2016-05-20 | 2016-07-20 | 京东方科技集团股份有限公司 | Touch screen, manufacturing method thereof and touch device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2015146347A1 (en) * | 2014-03-28 | 2015-10-01 | 富士フイルム株式会社 | Conductive film laminated body and touch panel using same |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104102399A (en) * | 2013-04-13 | 2014-10-15 | 贵州达沃斯光电有限公司 | Capacitive touch screen and manufacturing method thereof |
| CN105045449A (en) * | 2015-08-06 | 2015-11-11 | 山东华芯富创电子科技有限公司 | Touch panel structure and manufacturing method therefor |
| CN105786264A (en) * | 2016-05-20 | 2016-07-20 | 京东方科技集团股份有限公司 | Touch screen, manufacturing method thereof and touch device |
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Effective date of registration: 20241223 Address after: 338000 Building 9, Phase I Small and Micro Incubation Base, Chengdong Industrial Park, Fenyi County, Xinyu City, Jiangxi Province Patentee after: Jiangxi Qiwo Electronics Co.,Ltd. Country or region after: China Address before: 523287 3rd floor, building B, Xiaoyong third industrial zone, Gaopo Town, Dongguan City, Guangdong Province Patentee before: DONGGUAN DTOUCH OPTOELECTRONICS TECHNOLOGY CO.,LTD. Country or region before: China |