CN108966491A - The ceramic substrate and its manufacturing method of airtight feedthrough - Google Patents
The ceramic substrate and its manufacturing method of airtight feedthrough Download PDFInfo
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- CN108966491A CN108966491A CN201811001832.XA CN201811001832A CN108966491A CN 108966491 A CN108966491 A CN 108966491A CN 201811001832 A CN201811001832 A CN 201811001832A CN 108966491 A CN108966491 A CN 108966491A
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- A—HUMAN NECESSITIES
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- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/08—Arrangements or circuits for monitoring, protecting, controlling or indicating
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
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- C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
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- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
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- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3244—Zirconium oxides, zirconates, hafnium oxides, hafnates, or oxide-forming salts thereof
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Abstract
The present invention relates to the ceramic substrates and its manufacturing method of a kind of airtight feedthrough, wherein the ceramic substrate includes: ceramic bases, is fired by the stacking of more ceramic sheets material, each ceramic sheet material has multiple through-holes；Feed through pole is fired by the first conductive paste, fills each through-hole；And wiring conductor, it is fired by the second conductive paste, wiring pattern is formed between each ceramic sheet material, and the feed through pole for being located at adjacent ceramic sheet material is connected via wiring conductor, and each ceramic sheet material is formed with the first conductive paste and the second conductive paste in 1450 DEG C to 1600 DEG C of at a temperature of cofiring.In this case, due to carrying out stacking sintering using more ceramic sheets material, ceramic sheet material is easier to be burnt into, binding force between feed through pole, wiring conductor and ceramic bases can be also improved, sintering temperature can either be reduced as a result, also can be improved the air-tightness of ceramic substrate.
Description
Technical field
The present invention relates to the ceramic substrates and its manufacturing method of a kind of airtight feedthrough.
Background technique
Currently, implantable medical devices have been widely used for restoring body function, improve quality of life or saving life
The various aspects such as life.Such implantable medical devices be for example implanted into intracorporal pacemaker, deep brain stimulator,
Artificial cochlea, artificial retina etc..
Since implantable medical devices needs implant and retain for a long time in vivo, it is implanted to intracorporal implantation
Formula medical instrument needs to face intracorporal complex physiologic environment, after being chronically implanted, implantable medical devices and surrounding tissue
The part of contact may occur aging, degradation, cracking, be crosslinked etc. and physically or chemically to react again, and it is unfavorable to cause to implantation object
Influence the bad biological respinse such as causing inflammation.Therefore, for implantable medical devices, biological safety, long-term plant
The requirement for entering reliability etc. is all very high.
In order to ensure implantable medical devices biological safety, be chronically implanted the requirement of reliability, on the one hand need to make
With seal casinghousing by abiotic security component in implantable medical devices such as chip, printed circuit board (PCB) etc. and quilt
Implant site (such as blood, tissue or bone) isolation；On the other hand, it is also necessary to from the seal casinghousing draw for example with stimulation unit
The function conducting wire of part progress signal interaction.
In view of the biological safety and long-term reliability of implantable medical devices, seal casinghousing is usually with biological safety
Good glass, ceramics etc. are used as substrate (substrate), and by covering the good metal of biological safety in substrate
Lid etc. and be formed together sealing structure.In such sealing structure, substrate usually has multiple through-holes (via), at these
Feedthrough (feedthrough) electrode is filled in through-hole.In addition, the electronic component being encapsulated in inside the seal casinghousing is via this
A little feed through pole and carry out signal interaction with outside.Therefore, in implantable medical devices, such substrate both have sealing every
From effect, it may have with the external world interact be connected to effect.
Summary of the invention
Problem to be solved by the invention
In existing ceramic substrate, bore that open (drill) multiple cylindrical logical usually on the ceramic sheet material as substrate
Then hole is filled metal lotion in these through-holes, is then sintered.However, due in metal lotion and ceramic base
During sintering (cofiring) processing of plate, ceramic sheet material as ceramic substrate often uneven heating and cause in each through-hole
The contraction or expansion degree of metal is different, as a result, the stickiness of the through-hole of metal and ceramic sheet material is bad, leads to existing sealing
The air-tightness of structure is bad, influences the long-term reliability that implantable medical devices use.
In addition, the material in implantable medical devices for example usually using aluminium oxide as ceramic sheet material at present.At this
In sample ceramic substrate, it is however generally that, the content of aluminium oxide is higher, and the biological safety of ceramic substrate is better, and intensity is also higher.So
And alumina content is higher, the sintering temperature of ceramic substrate is often also higher, such as alumina content in 99% (quality
For high-purity alumina ceramic score, similarly hereinafter) or more, sintering temperature is often beyond 1650 DEG C, or even close to 2000 DEG C
The high temperature of left and right, at this high temperature, ceramics are difficult to be sintered together with other materials such as metal, therefore are unfavorable for high pure oxygen
Change the application of aluminium ceramic substrate.
Technical means to solve problem
The present invention is the situation in view of the above-mentioned prior art and completes, even if its purpose is to provide one kind in low temperature
Also the ceramic substrate and its system of the airtight feedthrough of air-tightness be can be improved in the case where sintering (such as 1450 DEG C to 1600 DEG C)
Make method.
An aspect of of the present present invention is related to a kind of ceramic substrate of airtight feedthrough comprising: ceramic bases, by multi-disc ceramics
Sheet material stacking is fired, and each ceramic sheet material has multiple through-holes；Feed through pole, by the firing of the first conductive paste
At each through-hole of filling；And wiring conductor, fired by the second conductive paste, each ceramic sheet material it
Between form wiring pattern, and the feed through pole for being located at the adjacent ceramic sheet material is connected via the wiring conductor,
Each ceramic sheet material and the at a temperature of cofiring of first conductive paste and second conductive paste at 1450 DEG C to 1600 DEG C
It forms.
In in one aspect of the invention, by carrying out stacking firing using more ceramic sheets material, and each ceramics are utilized
The feed through pole and wiring conductor of sheet material form intraconnection, in this case, due to carrying out layer using more ceramic sheets material
Folded sintering, ceramic sheet material is easier to be burnt into, so that the binding force between feed through pole, wiring conductor and ceramic bases also can
It is improved, sintering temperature can either be reduced as a result, also can be improved the air-tightness of ceramic substrate.
In addition, the feed through pole can penetrate through the ceramics in ceramic substrate involved in one aspect of the invention
The upper and lower surface of sheet material.In this case, conductive interconnection is capable of forming between the upper surface and lower surface of ceramic sheet material.
In addition, the ceramic sheet material can be by aluminium oxide ceramics in ceramic substrate involved in one aspect of the invention
It constitutes.Thereby, it is possible to improve the biological safety of constituted ceramic substrate and long-term reliability.It is highly preferred that the ceramics
Sheet material can be made of content not less than the aluminium oxide ceramics of 99.99% (mass fraction, similarly hereinafter).Thereby, it is possible to further mention
The biological safety and long-term reliability for the ceramic substrate that height is constituted.
In addition, involved in one aspect of the invention in ceramic substrate, adjacent each ceramic sheet material it is described
Through-hole can arrange with being staggered.In this case, it can be avoided the through-hole on each adjacent ceramic sheet material
It is overlapped, is conductively connected, so, it is possible so that the feed through pole between adjacent ceramic sheet material is staggered and is formed via wiring conductor
The path for effectively extending air-tightness leakage, to improve the air-tightness of ceramic substrate.
In addition, in ceramic substrate involved in one aspect of the invention, first conductive paste and second conduction
Slurry can be made of the material one or more of worked as selected from tungsten, molybdenum manganese, silver, gold, platinum and their alloy respectively.As a result, by
Feed through pole and wiring conductor made of first conductive paste and the second conductive paste are fired, more with the performance parameters of the ceramic bases
Add matching, connection structure intensity higher, the electrical property of ceramic substrate not only can be improved, further improves it reliably and with long-term
Property.It is highly preferred that first conductive paste can be made of with second conductive paste platinum.In this case, the feedthrough
Electrode with the wiring conductor is consistent is made of platinum, which can be improved electrical efficiency, promotes the performances such as conduction, thus
Further improve the electrical property and long-term reliability of ceramic substrate.
In addition, second conductive paste can pass through screen printing in ceramic substrate involved in one aspect of the invention
It brushes and forms the wiring pattern.In this case, wiring conductor easily efficiently more can be made, and is routed gained
The size and structure of conductor are more accurate, it is possible to prevente effectively from wiring pattern each wiring conductor inessential connection,
So as to avoid the generation of the conductive accident such as short circuit, it is possible thereby to improve the practicability of ceramic substrate and reliability is used for a long time.
In addition, the thickness of the ceramic sheet material can be in ceramic substrate involved in one aspect of the invention
0.05mm or more and 0.35mm or less.Ceramic sheet material is more readily processed as a result, and the molding better effect of punching.
Another aspect of the present invention relates to a kind of manufacturing methods of the ceramic substrate of airtight feedthrough comprising: prepare multi-disc
Ceramic sheet material, and multiple through-holes are formed on each ceramic sheet material；In each described logical of each ceramic sheet material
The first conductive paste is filled in hole as feed through pole；Using the second conductive paste as wiring conductor on each ceramic sheet material
Wiring pattern as defined in being formed；Each ceramic sheet material is stacked gradually, the feedthrough of the adjacent ceramic sheet material is made
Electrode is connected via the wiring conductor；Also, each ceramic sheet material and first conductive paste and described second are led
Plasma-based is together in 1450 DEG C to 1600 DEG C of at a temperature of cofiring.
In another aspect of the invention, by carrying out stacking firing using more ceramic sheets material, and each pottery is utilized
The feed through pole and wiring conductor of tile material form intraconnection, in this case, due to being carried out using more ceramic sheets material
Sintering, ceramic sheet material are easier to be burnt into, and the binding force between feed through pole, wiring conductor and ceramic bases can also be mentioned
Height, can either reduce sintering temperature as a result, also can be improved the air-tightness of ceramic substrate.
In addition, in the manufacturing method of ceramic substrate involved in another aspect of this invention, the ceramic sheet material can be with
It is made of aluminium oxide ceramics.Thereby, it is possible to improve the biological safety of constituted ceramic substrate and long-term reliability.More preferably
Ground, the ceramic sheet material can be made of content not less than the aluminium oxide ceramics of 99.99% (mass fraction, similarly hereinafter).As a result, can
Enough further increase the biological safety and long-term reliability of constituted ceramic substrate.
In addition, in the manufacturing method of ceramic substrate involved in another aspect of this invention, adjacent each pottery
The through-hole of tile material can arrange with being staggered.In this case, the feed through pole between adjacent ceramic substrate is staggered
And formed and be conductively connected via wiring conductor, it so, it is possible the path for effectively extending air-tightness leakage, to improve ceramic substrate
Air-tightness.
In addition, in another aspect of this invention involved in ceramic substrate manufacturing method in, first conductive paste and
Second conductive paste can respectively by one or more of working as selected from tungsten, molybdenum manganese, silver, gold, platinum and their alloy material
It constitutes.Feed through pole and wiring conductor made of being fired as a result, as the first conductive paste and the second conductive paste, with the ceramic bases
Performance parameter more match, connection structure intensity it is higher, the electrical property of ceramic substrate not only can be improved, further improve
Its long-term reliability.It is highly preferred that first conductive paste can be made of with second conductive paste platinum.In such case
Under, the feed through pole with the wiring conductor is consistent is made of platinum, the consistency can be improved electrical efficiency, promoted it is conductive
Etc. performances, to further improve the electrical property and long-term reliability of ceramic substrate.
In addition, second conductive paste can in the manufacturing method of ceramic substrate involved in another aspect of this invention
To form the wiring pattern by silk-screen printing.In this case, wiring conductor easily efficiently more can be made,
And keep the size of gained wiring conductor and structure more accurate, it is possible to prevente effectively from each wiring conductor in wiring pattern
Inessential connection, so as to avoid the generation of the conductive accident such as short circuit, it is possible thereby to improve the practicability of ceramic substrate and long-term
Use reliability.
Advantageous effect of the invention
In accordance with the invention it is possible to provide the ceramic base that can either reduce sintering temperature again and can improve the airtight feedthrough of air-tightness
Plate and its manufacturing method.
Detailed description of the invention
The attached drawing for constituting a part of the invention is used to provide further understanding of the present invention, schematic reality of the invention
It applies mode and its explanation is used to explain the present invention, do not constitute improper limitations of the present invention.In the accompanying drawings:
Fig. 1 is to show the three-dimensional structure diagram of the ceramic substrate of airtight feedthrough involved in embodiments of the present invention.
Fig. 2 is to show the top view of the ceramic substrate of airtight feedthrough shown in FIG. 1.
Fig. 3 is to show the ceramic substrate of airtight feedthrough shown in Fig. 2 along the cutting structural representation of straight line A-A ' interception
Figure.
Fig. 4 is to show the partial enlarged view of the ceramic substrate of airtight feedthrough shown in Fig. 3.
Fig. 5 is to show the process of the making step of the ceramic substrate of airtight feedthrough involved in embodiments of the present invention
Figure.
Symbol description:
1 ... ceramic substrate, 10 ... ceramic bases, 110 ... ceramic sheet materials, 111 material through-holes, 120 material ceramic sheet materials, 130 materials
Ceramic sheet material, 140 material ceramic sheet materials, 20 ... feed through pole, 30 ... wiring conductors.
Specific embodiment
Hereinafter, the preferred embodiment of the present invention is described in detail with reference made to the accompanying drawings.In the following description, for identical
Component assigns identical symbol, and the repetitive description thereof will be omitted.Scheme in addition, attached drawing is only schematical, the mutual size of component
Ratio or the shape of component etc. can be with actual difference.
Fig. 1 is to show the three-dimensional structure diagram of the ceramic substrate of airtight feedthrough involved in embodiments of the present invention, Fig. 2
It is to show the top view of the ceramic substrate of airtight feedthrough shown in FIG. 1, Fig. 3 is to show the pottery of airtight feedthrough shown in Fig. 2
The cutting structural schematic diagram that porcelain substrate is intercepted along straight line A-A', Fig. 4 are to show the ceramic substrate of airtight feedthrough shown in Fig. 3
Partial enlarged view.
In the present embodiment, as shown in Figures 1 to 4, ceramic substrate 1 may include ceramic bases 10, feed through pole 20
With wiring conductor 30.Wherein, ceramic bases 10 can be laminated by more ceramic sheets material and be fired, and each ceramic sheet material has
There are multiple through-holes 111.In addition, feed through pole 20 can be fired by the first conductive paste, and fill each through-hole 111.Cloth
Line conductor 30 can be fired by the second conductive paste, form wiring pattern between each ceramic sheet material.In addition, being located at adjacent
Ceramic sheet material feed through pole 20 via wiring conductor 30 connect.Each ceramic sheet material and the first conductive paste and the second conductive paste
It is formed in 1450 DEG C to 1600 DEG C of at a temperature of cofiring.
Ceramic substrate 1 involved in present embodiment by carrying out stacking firing using more ceramic sheets material, and utilizes
The feed through pole and wiring conductor of each ceramic sheet material form intraconnection.In this case, due to utilizing more ceramic sheets
Material carries out stacking sintering, and ceramic sheet material is easier to be burnt into, the binding force between feed through pole, wiring conductor and ceramic bases
It can be improved, sintering temperature can either be reduced as a result, also can be improved the air-tightness of ceramic substrate 1.
In addition, the feed through pole of ceramic substrate 1 involved in present embodiment can by function conducting wire (not shown) with
External component such as coil and stimulation component (not shown) are attached, and are handed over to realize the processing of stimulus signal and signal
Mutually.
In the present embodiment, ceramic bases 10 may include the more ceramic sheets material with multiple through-holes, and multi-disc
Ceramic sheet material is stacked gradually and is formed.In some instances, ceramic bases 10 can be by such as four layers of ceramic sheet material 110 to 140
(i.e. ceramic sheet material 110,120,130,140, referring to Fig. 1) constitute, in ceramic bases 10, as shown in Figure 1, ceramic sheet material 110
It can stack gradually and be formed to 140.But present embodiment is without being limited thereto, and the quantity for constituting the ceramic sheet material of ceramic bases 10 does not have
There is special limitation, such as can be made of two layers, three layers or five layers or more of ceramic sheet material.Thus, it is possible to be answered according to different
With demand, setting is less than or greater than four layers of ceramic sheet material layer, so as to meet different implantable medical devices to ceramic base
The requirement of 1 structure of plate.
In the present embodiment, as described above, ceramic bases 10 can be fired by the stacking of more ceramic sheets material.But this
Embodiment is without being limited thereto, can also be prepared certainly by other modes, such as can be pressed by more ceramic sheets material
Type forms.Thus, it is possible to the process requirements under meeting different condition.
In the present embodiment, ceramic bases 10 have upper surface 10a and lower surface 10b (referring to fig. 4).In some examples
In, upper surface 10a can be relatively parallel with lower surface 10b.In the present embodiment, upper surface 10a and lower surface 10b are via feedback
Energization pole 20 and wiring conductor 30 and be electrically connected.That is, the upper surface 10a and lower surface 10b of ceramic bases 10 are via feedthrough electricity
Pole 20 and wiring conductor 30 and form conductive path.As a result, positioned at the side upper surface 10a electronic component can be located at following table
The electronic component of the face side 10b can be electrically connected via feed through pole 20 and wiring conductor 30.
In the present embodiment, each ceramic sheet material can be made of bioceramic.In some instances, each potsherd
Material can be by being selected from aluminium oxide (chemical formula Al2O3Comprising the sapphire and ruby or polycrystalline α sapphire of monocrystalline), oxygen
Change zirconium (chemical formula ZrO2Comprising magnesia partial stabilized zirconia (Mg-PSZ)), the tetragonal zircite of stabilized with yttrium oxide it is more
At least one of tetragonal zirconia polycrystal (Ce-TZP) of brilliant (Y-TZP), ceria stabilized etc. is constituted.Thus, it is possible to meet
Requirement of the implantable medical devices to material biological safety.
In the present embodiment, each ceramic sheet material is preferably by the aluminium oxide of 96% or more (mass fraction, similarly hereinafter)
(Al2O3) constitute.It is highly preferred that aluminium oxide (Al of each ceramic sheet material by 99% or more2O3) constitute.In some instances, respectively
A ceramic sheet material 110 to 140 by 99.99% or more aluminium oxide (Al2O3) constitute.In general, in each ceramic sheet material,
With aluminium oxide (Al2O3) mass fraction increase, principal crystalline phase increases, and the physical property of each ceramic sheet material is also gradually increased, example
If degree, bending strength, elasticity modulus also correspondingly improve before resistance to compression, it is possible thereby to think, the higher aluminium oxide of mass fraction
(Al2O3) better biological safety and long-term reliability can be presented.
In addition, in the present embodiment, each ceramic sheet material can be made of the identical aluminium oxide ceramics of constituent content.?
In some examples, ceramic sheet material 110 to 140 preferably by 99.99% or more aluminium oxide (Al2O3) constitute.But present embodiment is not
It is limited to this, each ceramic sheet material can be made of different types of ceramics, same ceramics that can also be different by constituent content
It constitutes.Thus, it is possible to be adjusted according to actual needs, thus to the different need of ceramic substrate 1 under the conditions of meeting varying environment
It asks.
In the present embodiment, each ceramic sheet material 110 to 140 can be laminated firing and form ceramic bases 10.One
In a little examples, each ceramic sheet material 110 to 140 can be stacked gradually, and the cofiring together with the first conductive paste and the second conductive paste
Form ceramic bases 10, feed through pole 20 (being described later on) and wiring conductor 30 (being described later on).In other examples, it will make pottery
Tile material 110 to 140 stacks gradually, together with the first conductive paste and the second conductive paste 1450 DEG C to 1600 DEG C at a temperature of altogether
Burning forms ceramic bases 10, feed through pole 20 (being described later on) and wiring conductor 30 (being described later on).Preferably, the temperature of cofiring
It can be 1550 DEG C to 1600 DEG C.
In general, the firing temperature needs of existing high-purity type aluminium oxide ceramics (content is 99.9% or more) are up to
1680 DEG C to 1990 DEG C.In contrast, in the present embodiment, by as described above by the firing temperature control of ceramic bases 10
System is at 1450 DEG C to 1600 DEG C, preferably under conditions of 1550 DEG C to 1600 DEG C, on the one hand, be both able to satisfy metal (feed through pole
20 and wiring conductor 30) form by a firing, and can ensure that ceramic (ceramic bases 10) can form by a firing；It on the other hand, can be with
Realize the low temperature co-fired of ceramic sheet material (formed ceramic bases 10) and conductive slurries (formation feed through pole 20 and wiring conductor 30),
To improve the bond strength of ceramic bases 10 and feed through pole 20 and wiring conductor 30 made of firing, and effectively increase pottery
The preparation efficiency of porcelain substrate 1 thereby reduces the production cost of ceramic substrate 1.
Furthermore, it is contemplated that the difference of the expansion index of ceramic sheet material and metal material can also wrap in the present embodiment
Include low-temperature prewarming step.In some instances, (such as 500 DEG C or less) ceramic (ceramic bases can be completed at a lower temperature
10) with the pre- combination of metal (feed through pole 20 and wiring conductor 30), to prevent co-fired temperature excessively high or cofiring rate is too fast draws
Generation phenomena such as sticking up layer, fracture risen.
In general, heating ramp rate is too fast, it is easy in ceramic substrate there are gas or is sintered incomplete phenomenon；Add
Hot rate is excessively slow, will extend the time of sintering process, reduces producing efficiency, increases cost of manufacture.Therefore, in present embodiment
In, it can also include the heating rate during control cofiring.Thus, it is possible to prevent gas or sintering in ceramic substrate 1 endless
Full phenomenon, guarantees the consistency of ceramic substrate 1, and can effectively improve the preparation efficiency of ceramic substrate 1, thereby reduces
The production cost of ceramic substrate 1.
Furthermore, it is contemplated that a certain amount of organic principle and Binder Phase can be added in the preparation process of ceramic substrate 1.
It in the present embodiment, can also include thermal debinding process.In some instances, thermal debinding process is complete under wet hydrogen atmosphere
At.Thus, it is possible to the generation for the phenomenon that removing is incomplete caused by effectivelying prevent organic principle to react too fast, there are residual carbons,
The generation of the defects of to effectively prevent stomata in molding ceramic substrate 1, cracking, deformation.
In addition, can also include burning to guarantee the air-tightness of sintered ceramic substrate 1 in the present embodiment
Insulating process after knot.And it is possible to enhance ceramic bases 10 and feedthrough in ceramic substrate 1 by the way that soaking time is appropriately extended
The bond strength of electrode feed through pole 20 and wiring conductor 30 improves the densified sintering product of ceramic substrate 1.
In addition, in the present embodiment, can also prepare by other means and form ceramic substrate 1, for example, vacuum at
Type.Thus, it is possible to the process requirements under meeting different condition.
In addition, in the present embodiment, the thickness of each ceramic sheet material 110 to 140 is not particularly limited.In some examples
In, the thickness of ceramic sheet material 110 to 140 can be for 0.05mm or more and 0.35mm hereinafter, so that easy to process and punching forms
Effect is good.Under normal conditions, when the thickness of ceramic sheet material is too small, when being, for example, less than 0.05mm, because the smaller processing of its thickness is not square
Just；When the thickness of ceramic sheet material is excessive, when being greater than 0.35mm, because the larger punching molding effect of its thickness is poor.
In addition, in the present embodiment, in some instances, as shown in Figure 1, ceramic bases 10 can be in generally cylindrical body
Shape.In the present embodiment, the shape of ceramic bases 10 is not particularly limited, and can also be Else Rule shape
Such as cube, Elliptic Cylinder, triangulo column etc., it is also possible to irregular shape (including regular shape and irregular shape knot
Shape made of conjunction).Thus, it is possible to meet requirement of the different implantable medical devices to 1 shape of ceramic substrate.
In the present embodiment, as depicted in figs. 1 and 2, it constitutes on each ceramic sheet material of ceramic bases 10 with multiple
Through-hole.In the present embodiment, the arrangement mode of each through-hole can be different on each ceramic sheet material.In some instances, phase
Each through-hole 111 between adjacent ceramic sheet material can arrange with being staggered.Thus, it is possible to fill adjacent ceramic sheet material it
Between each feed through pole 20 (being described later on) of each through-hole arrange with being staggered, to effectively obstruct or extend air-tightness
The walking path of leakage can effectively improve the air-tightness of ceramic substrate 1.
In addition, in the present embodiment, the spread geometry of through-hole 111 is not particularly limited.In some instances, such as Fig. 2
Shown, through-hole 111 can be arranged in the shape such as octagon array of rule.In other examples, through-hole 111 can also be arranged
Arrange into other regular shapes, such as square, circle etc., may be arranged in irregular shape (including regular shape and
The shape that irregular shape is combined into).
In addition, in the present embodiment, the shape of through-hole 111 is not particularly limited.In some instances, as shown in Fig. 2,
The shape of through-hole 111 can be the shape such as cylindrical body of rule.In other examples, the shape of through-hole 111 can also be
Else Rule shape such as cube, Elliptic Cylinder, triangulo column etc., or irregular shape (including regular shape and
The shape that irregular shape is combined into).
In addition, in the present embodiment, aperture and the pitch of holes of through-hole 111 are not particularly limited.In some instances, lead to
The aperture in hole 111 can be 50 μm to 500 μm, and the spacing (pitch of holes) between through-hole 111 can be not less than 25 μm to 500 μm.
In this case, made ceramic substrate 1 can meet miniaturization and the requirement of high density of integration, can be used for example and planting
Enter formula medical instrument ceramic substrate.
In addition, the quantity of through-hole 111 is not particularly limited, can determine according to specific needs, such as the quantity of through-hole
It can be 1, or 2 or more.
In the present embodiment, as shown in Figure 3 and Figure 4, feedback can be filled in the through-hole being arranged on each ceramic sheet material
Energization pole 20.In some instances, each feed through pole 20 can penetrate through the upper and lower surface of ceramic sheet material 110 to 140 respectively, and
It is connected to via wiring conductor 30 (being described later on), forms conducting electrical connection.Thus, it is possible to improve the electrical property of ceramic substrate 1.
In the present embodiment, feed through pole 20 can be fired by the first conductive paste.In some instances, it first leads
Plasma-based can be formed with ceramic sheet material 110 to 140 in 1450 DEG C to 1600 DEG C of at a temperature of cofiring.The feedback of formation is fired as a result,
Energization pole 20 can be bonded as one with ceramic bases 10, avoided the technologies such as ceramics and the welding of metal, simplified technique, and
Further improve the air-tightness and long-term reliability of ceramic substrate 1.
Hereinafter, being formed by the one of conductive path in conjunction with Fig. 4 upper surface 10a and lower surface 10b for describing ceramic bases 10
A example.As shown in Figure 4, by way of example, the upper and lower surface 10a, 10b of ceramic bases 10 can be by four ceramic sheet materials 110, pottery
Tile material 120, ceramic sheet material 130 and ceramic sheet material 140 are constituted.In addition, feed through pole 20 may include feed through pole 21, feedthrough
Electrode 22, feed through pole 23 and feed through pole 24.In addition, wiring conductor 30 may include wiring conductor 31,32 and of wiring conductor
Wiring conductor 33.
Specifically, feed through pole 21 is connect via connection conductor 31 with feed through pole 22 in ceramic bases 10, thus
It is conductively connected ceramic sheet material 110 and ceramic sheet material 120.In addition, feed through pole 22 is via connection conductor 32 and feed through pole 23
Connection, so that ceramic sheet material 120 and ceramic sheet material 130 be made to be conductively connected.In addition, feed through pole 23 is via connection conductor 33 and feedback
Energization pole 24 connects, so that ceramic sheet material 130 and ceramic sheet material 140 be made to be conductively connected.Pass through feed through pole 21,22 as a result,
23,24 and wiring conductor 31,32,33, it is conductively connected so that the upper surface 10a and lower surface 10b of ceramic bases 10 be made to be formed.
In the present embodiment, the first conductive paste that firing forms feed through pole 20 can be made of metal slurries.One
In a little examples, the first conductive paste can be by one of working as selected from tungsten slurries, molybdenum manganese slurries, silver paste liquid, gold paste liquid or platinum slurries
Or more constitute.Preferably, the first conductive paste can be made of platinum slurries.Feed through pole 20 made of firing as a result, can have
There is lesser resistance, more matched with the performance parameter of ceramic bases 10, thus the company between feed through pole 20 and ceramic bases 10
It connects that intensity is higher, the long-term reliability of ceramic substrate 1 can be effectively improved.
In addition, in the present embodiment, constitute feed through pole 20 the first conductive paste can also include inorganic component (such as
Frit) and organic media ingredient.Thus, it is possible to be allowed to be formed convenient for the sintering behavior of control metal slurries such as platinum slurries
Closer to the sintering behavior of ceramic bases 10, and then avoid the generation in fault of construction such as crack or layering.
In addition, in the present embodiment, the first conductive paste for constituting feed through pole 20 can pass through silk-screen printing, transfer etc.
Method is filled into the through-hole of each ceramic sheet material.In this case, feed through pole easily efficiently more can be made,
And keep the size of gained feed through pole and structure more accurate.
In addition, in the present embodiment, the first conductive paste for constituting feed through pole 20 can be by the logical of each ceramic sheet material
Hole is filled up completely, and can also be partially filled with, as long as ensuring that feed through pole 20 is capable of the upper and lower surface of each ceramic sheet material.As a result,
It can be adjusted according to parameter requirements such as the shrinkages of ceramic sheet material or the first conductive paste, thus under meeting different condition
Different demands.
In addition, in the present embodiment, shape, size, arrangement mode of feed through pole 20 etc. can be kept with through-hole 111
Unanimously.Therefore, the ceramic substrate 1 of airtight feedthrough can be formed, to improve the air-tightness of ceramic substrate 1.
In the present embodiment, wiring conductor 30 can form wiring pattern between each ceramic sheet material, and be located at
Feed through pole 20 on adjacent ceramic sheet material is connected via wiring conductor 30.It is possible thereby to form the ceramic base of conducting electrical connection
Plate 1, to improve the electrical property of ceramic substrate 1.
In addition, in the present embodiment, the shape of wiring pattern is not particularly limited.In some instances, wiring pattern
The shape such as linear type, S type, U-shaped etc. that can be rule are also possible to irregular shape (including regular shape and irregular
Shape made of shape cooperation).Thus, it is possible to meet the different demands of different application environment.
In addition, in the present embodiment, wiring conductor 30 can design to form a variety of wirings between each ceramic sheet material
Pattern.To realize a variety of different connection types of feed through pole 20, the electrical property of ceramic substrate 1 is further increased, using model
It encloses more extensively, is able to satisfy the functional requirement increasingly promoted in such as medical implantable medical instrument to ceramic substrate 1, can also keep away
Exempt to access outer lead etc. to the adverse effect of the air-tightness of ceramic substrate 1.
In addition, in the present embodiment, the preparation method of wiring pattern can for either physically or chemically, such as coating or
It deposits (such as physical deposition or chemical deposition).In some instances, wiring pattern can be prepared by the method for silk-screen printing
It obtains.Thereby, it is possible to more efficiently easily be patterned, and keep the structure of gained wiring pattern more accurate, thus
The accuracy of wiring pattern setting is improved, the practicability of ceramic substrate 1 is promoted.
In addition, in the present embodiment, the size of wiring conductor 30 is not particularly limited.In some instances, wiring is led
The size of body 30 can be 0.01mm to 0.1mm, and wiring conductor 30 thus both may be implemented and led with being electrically connected for feed through pole 20
It is logical, and it is possible to prevente effectively from the damage such as rupture caused by stress is excessive.
In the present embodiment, wiring conductor 30 can be fired by the second conductive paste.In some instances, it second leads
Plasma-based can be formed with the first conductive paste, ceramic sheet material 110 to 140 in 1450 DEG C to 1600 DEG C of at a temperature of cofiring.It burns as a result,
The wiring conductor 30 that system is formed can be bonded as one with ceramic bases 10, avoid the technologies such as ceramics and the welding of metal, letter
Change technique, and further improves the air-tightness and long-term reliability of ceramic substrate 1.
In the present embodiment, the second conductive paste that firing forms wiring conductor 30 can be made of metal slurries.One
In a little examples, the second conductive paste can be by one of working as selected from tungsten slurries, molybdenum manganese slurries, silver paste liquid, gold paste liquid or platinum slurries
Or more constitute.Preferably, the second conductive paste can be made of platinum slurries.Wiring conductor 30 made of firing as a result, can have
There is lesser resistance, more matched with the performance parameter of ceramic bases 10, thus the company between wiring conductor 30 and ceramic bases 10
It connects that intensity is higher, the long-term reliability of ceramic substrate 1 can be effectively improved.
In addition, in the present embodiment, constitute wiring conductor 30 the second conductive paste can also include inorganic component (such as
Frit) and organic media ingredient.Thus, it is possible to be allowed to be formed convenient for the sintering behavior of control metal slurries such as platinum slurries
Closer to the sintering behavior of ceramic bases 10, and then avoid the generation in fault of construction such as crack or layering.
Fig. 5 is to show the process of the making step of the ceramic substrate of airtight feedthrough involved in embodiments of the present invention
Figure.Hereinafter, explaining the manufacturing method of ceramic substrate 1 involved in present embodiment in detail with reference to Fig. 5.
Firstly, preparing more ceramic sheets material, and multiple through-holes (step S10) are formed on each ceramic sheet material.Then,
The first conductive paste is filled in each through-hole of each ceramic sheet material as feed through pole (step S20).Then, use second is led
Plasma-based forms defined wiring pattern (step S30) as wiring conductor on each ceramic sheet material.Furthermore by each potsherd
Material stacks gradually, and the feed through pole of adjacent ceramic sheet material is made to connect (step S40) via wiring conductor.After the step s 40,
By each ceramic sheet material in 1450 DEG C to 1600 DEG C of at a temperature of cofiring (step together with the first conductive paste and the second conductive paste
S50), ceramic substrate 1 is formed.
In the present embodiment, in step slo, may include prepare for make each ceramic sheet material have it is multiple
The mold and ceramic powder of guide post.In some instances, mold can be more than two, and multiple guide posts on different molds
Distribution can be different, such as are in staggered distribution.Thus, it is possible to arrange the through-hole 111 on the different ceramic sheet materials being prepared
Difference, for example, it is staggered.
It in the present embodiment, in step slo, may include that ceramic powder is filled into mold.In some examples
In, aluminium oxide ceramics of the ceramic powder by content not less than 99.99% is constituted.Thus, it is possible to make each ceramics being prepared
Aluminium oxide ceramics of the sheet material by content not less than 99.99% is constituted.In general, in each ceramic sheet material, with aluminium oxide
(Al2O3) mass fraction increase, principal crystalline phase increases, and the physical property of each ceramic sheet material is also gradually increased, such as before resistance to compression
Degree, bending strength, elasticity modulus also correspondingly improve, it is possible thereby to think to present better biological safety and reliably and with long-term
Property.
In the present embodiment, in step slo, it can use mold for ceramic powder compression moulding, form each pottery
Tile material, and there are multiple through-holes on each ceramic sheet material.In some instances, adjacent interlayer on ceramic sheet material 110 to 140
Through-hole 111 it is staggered.Thus, it is possible to make the feed through pole 20 for filling adjacent ceramic sheet layer staggered.This
In the case of, the walking path of air-tightness leakage can be obstructed or extend, effectively so as to effectively improve the gas of ceramic substrate 1
Close performance.
It in the present embodiment, may include filling first in each through-hole of each ceramic sheet material in step S20
Conductive paste is as feed through pole.In some instances, the first conductive paste can by selected from tungsten, molybdenum manganese, silver, gold, platinum and they
The material that alloy one or more of is worked as is constituted.Preferably, the first conductive paste can be made of platinum slurries.It is led as a result, by first
Feed through pole 20 made of plasma-based is fired can have lesser resistance, more match with the performance parameter of ceramic bases 10, thus
Bonding strength between feed through pole 20 and ceramic bases 10 is higher, can effectively improve the long-term reliability of ceramic substrate 1.
In addition, in the present embodiment, in step S20, the first conductive paste can pass through the methods of silk-screen printing, transfer
It is filled into the through-hole of each ceramic sheet material.In this case, feed through pole 20 more efficiently can be easily made, and
Keep size and the structure of gained feed through pole 20 more accurate.
In the present embodiment, in step s 30, the second conductive paste can be used as wiring conductor in each potsherd
Wiring pattern as defined in being formed on material.In some instances, the second conductive paste can by selected from tungsten, molybdenum manganese, silver, gold, platinum and it
The material one or more of worked as of alloy constitute.Preferably, and conductive paste can be made of platinum slurries.As a result, by
Wiring conductor 30 made of two conductive pastes are fired can have lesser resistance, more match with the performance parameter of ceramic bases 10,
To keep the bonding strength between wiring conductor 30 and ceramic bases 10 higher, ceramic substrate 1 can be effectively improved reliably and with long-term
Property.
In addition, in the present embodiment, in step s 30, the shape of wiring pattern is not particularly limited.In some examples
In, wiring pattern can be the shape such as linear type, S type, U-shaped etc. of rule, be also possible to irregular shape (including regular shape
The shape that shape and irregular shape are combined into).Thus, it is possible to meet the different demands of different application environment.
In addition, in the present embodiment, in step s 30, wiring conductor 30 can also be set between each ceramic sheet material
Meter is formed simultaneously a variety of wiring patterns.To realize a variety of different connection types of feed through pole 20, ceramic base is further increased
The electrical property of plate 1, application range is more extensive, is able to satisfy the function increasingly promoted in medical implantable medical instrument to ceramic substrate 1
It can require, access outer lead etc. can also be avoided to the adverse effect of the air-tightness of ceramic substrate 1.
In addition, in the present embodiment, in step s 30, the preparation method of wiring pattern can be physically or chemically side
Method, such as coating or deposition (such as physical deposition or chemical deposition).In some instances, wiring pattern can pass through screen printing
The method of brush is prepared.Thereby, it is possible to more efficiently easily be patterned, and make the structure of gained wiring pattern more
Add precisely, to improve the accuracy of wiring pattern setting, promotes the practicability of ceramic substrate 1.
In addition, in the present embodiment, in step s 30, the size of wiring conductor 30 is not particularly limited.Show some
In example, the size of wiring conductor 30 can be 0.01mm, and being electrically connected for wiring conductor 30 and feed through pole 20 thus both may be implemented
Connect conducting, and it is possible to prevente effectively from the damage such as rupture caused by stress is excessive.
It in the present embodiment, in step s 40, may include stacking gradually each ceramic sheet material.In some examples
In, ceramic sheet material may include four layers, for example, ceramic sheet material 110 to 140.But present embodiment is without being limited thereto, constitutes ceramics
The quantity of the ceramic sheet material of substrate 10 is not particularly limited, such as can be by two layers, three layers or five layers or more of ceramic sheet material structure
At.Thus, it is possible to which setting is less than or greater than four layers of ceramic sheet material layer, according to different application demands so as to meet not
Requirement with implantable medical devices to 1 structure of ceramic substrate.
It in the present embodiment, in step s 40, may include making the feed through pole of adjacent ceramic sheet material via wiring
Conductor connection.It is possible thereby to the ceramic substrate 1 of conducting electrical connection be formed, to improve the electrical property of ceramic substrate 1.
It in the present embodiment, in step s 50, may include leading each ceramic sheet material and the first conductive paste and second
Plasma-based is together in 1450 DEG C to 1600 DEG C of at a temperature of cofiring.In some instances, each ceramic sheet material 110 to 140 can be
At a temperature of 1450 DEG C to 1600 DEG C, preferably 1550 DEG C to 1600 DEG C, shape is fired together with the first conductive paste and the second conductive paste
At the ceramic substrate 1 with ceramic bases 10, feed through pole 20 and wiring conductor 30.
In general, the firing temperature needs of existing high-purity type aluminium oxide ceramics (content is 99.9% or more) are up to
1680 DEG C to 1990 DEG C.In contrast, in the present embodiment, by as described above controlling firing temperature at 1450 DEG C extremely
1600 DEG C, preferably under conditions of 1550 DEG C to 1600 DEG C, on the one hand, be both able to satisfy metal (feed through pole 20 and wiring conductor
30) form by a firing, and can ensure that ceramic (ceramic bases 10) can form by a firing；On the other hand, ceramic sheet material can also be realized
(formed ceramic bases 10) and conductive slurries (formation feed through pole 20 and wiring conductor 30) it is low temperature co-fired, to improve firing
Made of ceramic bases 10 and feed through pole 20 and wiring conductor 30 bond strength, and effectively increase the system of ceramic substrate 1
Standby efficiency, thereby reduces the production cost of ceramic substrate 1.
Furthermore, it is contemplated that the difference of the expansion index of ceramic sheet material and metal material, in the present embodiment, in step
It can also include low-temperature prewarming step in S50.In some instances, it (such as 500 DEG C or less) can complete at a lower temperature
The pre- combination of ceramic (ceramic bases 10) and metal (feed through pole 20 and wiring conductor 30), to prevent co-fired temperature excessively high or be total to
Burn the generation of rate too fast caused phenomena such as sticking up layer, fracture.
In general, heating ramp rate is too fast, it is easy in ceramic substrate there are gas or is sintered incomplete phenomenon；Add
Hot rate is excessively slow, will extend the time of sintering process, reduces producing efficiency, increases cost of manufacture.Therefore, in present embodiment
In, it can also include the heating rate during control cofiring in step s 50.Thus, it is possible to prevent gas in ceramic substrate 1
Body or the incomplete phenomenon of sintering, guarantee the consistency of ceramic substrate 1, and can effectively improve the preparation effect of ceramic substrate 1
Rate thereby reduces the production cost of ceramic substrate 1.
Furthermore, it is contemplated that a certain amount of organic principle and Binder Phase can be added in the preparation process of ceramic substrate 1.
It in the present embodiment, in step s 50, can also include thermal debinding process.In some instances, thermal debinding process is in wet hydrogen
It is completed under gas atmosphere.Thus, it is possible to which removing caused by effectivelying prevent organic principle to react too fast is incomplete, showing there are residual carbon
The generation of elephant, thus the generation for the defects of effectively preventing stomata in molding ceramic substrate 1, cracking, deformation.
In addition, in the present embodiment, in step s 50, in order to guarantee the air-tightness of sintered ceramic substrate 1,
It can also include sintered insulating process.And it is possible to enhance ceramics in ceramic substrate 1 by the way that soaking time is appropriately extended
The bond strength of substrate 10 and feed through pole feed through pole 20 and wiring conductor 30 improves the densified sintering product of ceramic substrate 1.
In addition, in the present embodiment, in step s 50, can also prepare by other means and form ceramic substrate
1, such as vacuum forming.Thus, it is possible to the process requirements under meeting different condition.
Although being illustrated in conjunction with the accompanying drawings and embodiments to the present invention above, it will be appreciated that above description
The invention is not limited in any way.Those skilled in the art without departing from the true spirit and scope of the present invention may be used
To deform and change to the present invention as needed, these deformations and variation are within the scope of the present invention.
Claims (10)
1. a kind of ceramic substrate of airtight feedthrough, it is characterised in that:
Include:
Ceramic bases are fired by the stacking of more ceramic sheets material, and each ceramic sheet material has multiple through-holes；
Feed through pole is fired by the first conductive paste, fills each through-hole；And
Wiring conductor is fired by the second conductive paste, forms wiring pattern, and position between each ceramic sheet material
It is connected in the feed through pole of the adjacent ceramic sheet material via the wiring conductor,
Each ceramic sheet material and first conductive paste and second conductive paste 1450 DEG C to 1600 DEG C at a temperature of
Cofiring forms.
2. ceramic substrate as described in claim 1, it is characterised in that:
The feed through pole penetrates through the upper and lower surface of the ceramic sheet material.
3. ceramic substrate as described in claim 1, it is characterised in that:
Aluminium oxide of the ceramic sheet material by content not less than 99.99% is constituted.
4. ceramic substrate as described in claim 1, it is characterised in that:
The through-hole of adjacent each ceramic sheet material arranges with being staggered.
5. ceramic substrate as described in claim 1, it is characterised in that:
First conductive paste and second conductive paste are respectively by tungsten, molybdenum manganese, silver, gold, platinum and their alloy
More than one material constitute.
6. ceramic substrate as described in claim 1, it is characterised in that:
Second conductive paste forms the wiring pattern by silk-screen printing.
7. a kind of manufacturing method of the ceramic substrate of airtight feedthrough, it is characterised in that:
Include:
Prepare more ceramic sheets material, and forms multiple through-holes on each ceramic sheet material；
The first conductive paste is filled as feed through pole in each through-hole of each ceramic sheet material；
Form defined wiring pattern on each ceramic sheet material as wiring conductor using the second conductive paste；
Each ceramic sheet material is stacked gradually, makes the feed through pole of the adjacent ceramic sheet material via the wiring
Conductor connection；And
By each ceramic sheet material at 1450 DEG C to 1600 DEG C together with first conductive paste and second conductive paste
At a temperature of cofiring.
8. manufacturing method as claimed in claim 7, it is characterised in that:
Aluminium oxide ceramics of the ceramic sheet material by content not less than 99.99% is constituted.
9. manufacturing method as claimed in claim 7, it is characterised in that:
The through-hole of adjacent each ceramic sheet material arranges with being staggered.
10. manufacturing method as claimed in claim 7, it is characterised in that:
First conductive paste and second conductive paste are respectively by tungsten, molybdenum manganese, silver, gold, platinum and their alloy
More than one material constitute.
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| CN201711464521 | 2017-12-29 | ||
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| CN201811001832.XA Active CN108966491B (en) | 2017-12-29 | 2018-08-30 | The ceramic substrate and its manufacturing method of airtight feedthrough |
| CN201822255226.2U Active CN209748985U (en) | 2017-12-29 | 2018-12-29 | Ceramic substrate with feed-through electrode |
| CN201811640805.7A Active CN109574637B (en) | 2017-12-29 | 2018-12-29 | Ceramic substrate and its manufacturing method with feed through pole |
| CN202110352676.7A Active CN113068298B (en) | 2017-12-29 | 2018-12-31 | Ceramic substrate for connecting electronic parts and method for manufacturing the same |
| CN201811652362.3A Active CN109688695B (en) | 2017-12-29 | 2018-12-31 | Ceramic substrate and method for manufacturing same |
| CN202110352667.8A Active CN113099603B (en) | 2017-12-29 | 2018-12-31 | Ceramic substrate for implantable medical device and method for manufacturing same |
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| CN201822255226.2U Active CN209748985U (en) | 2017-12-29 | 2018-12-29 | Ceramic substrate with feed-through electrode |
| CN201811640805.7A Active CN109574637B (en) | 2017-12-29 | 2018-12-29 | Ceramic substrate and its manufacturing method with feed through pole |
| CN202110352676.7A Active CN113068298B (en) | 2017-12-29 | 2018-12-31 | Ceramic substrate for connecting electronic parts and method for manufacturing the same |
| CN201811652362.3A Active CN109688695B (en) | 2017-12-29 | 2018-12-31 | Ceramic substrate and method for manufacturing same |
| CN202110352667.8A Active CN113099603B (en) | 2017-12-29 | 2018-12-31 | Ceramic substrate for implantable medical device and method for manufacturing same |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109688699A (en) * | 2018-12-31 | 2019-04-26 | 深圳硅基仿生科技有限公司 | Ceramic circuit board and its manufacturing method |
| CN111769049A (en) * | 2019-03-30 | 2020-10-13 | 深圳硅基仿生科技有限公司 | Sealing method of implantable device |
| CN116212538A (en) * | 2023-04-18 | 2023-06-06 | 米园园 | Natural gas pipeline filter and use method thereof |
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| CN111711890A (en) * | 2020-06-24 | 2020-09-25 | 歌尔股份有限公司 | Dome, loudspeaker monomer and sound generating mechanism |
| CN113851253B (en) * | 2021-08-25 | 2024-11-22 | 复旦大学 | A magnetic resonance imaging compatible conductive paste composite and preparation method thereof |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109688699A (en) * | 2018-12-31 | 2019-04-26 | 深圳硅基仿生科技有限公司 | Ceramic circuit board and its manufacturing method |
| CN111769049A (en) * | 2019-03-30 | 2020-10-13 | 深圳硅基仿生科技有限公司 | Sealing method of implantable device |
| CN111769049B (en) * | 2019-03-30 | 2022-08-05 | 深圳硅基仿生科技有限公司 | Sealing method of implantable device |
| CN115172187A (en) * | 2019-03-30 | 2022-10-11 | 深圳硅基仿生科技有限公司 | Preparation method of sealing structure |
| CN115172188A (en) * | 2019-03-30 | 2022-10-11 | 深圳硅基仿生科技有限公司 | Implantable devices |
| CN115172188B (en) * | 2019-03-30 | 2024-11-26 | 深圳硅基仿生科技股份有限公司 | Implantable Devices |
| CN115172187B (en) * | 2019-03-30 | 2024-12-10 | 深圳硅基仿生科技股份有限公司 | Method for preparing sealing structure |
| CN116212538A (en) * | 2023-04-18 | 2023-06-06 | 米园园 | Natural gas pipeline filter and use method thereof |
| CN116212538B (en) * | 2023-04-18 | 2024-02-06 | 重庆瑞力比燃气设备股份有限公司 | Natural gas pipeline filter and use method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN209748985U (en) | 2019-12-06 |
| CN113099603B (en) | 2022-06-21 |
| CN109688695A (en) | 2019-04-26 |
| CN109574637A (en) | 2019-04-05 |
| WO2019129303A1 (en) | 2019-07-04 |
| CN113068298B (en) | 2022-06-21 |
| CN108966491B (en) | 2019-07-16 |
| CN109574637B (en) | 2019-08-20 |
| CN113068298A (en) | 2021-07-02 |
| CN113099603A (en) | 2021-07-09 |
| CN109688695B (en) | 2021-04-23 |
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