CN108963030A - 硅基纳米结构光伏材料的制备方法 - Google Patents
硅基纳米结构光伏材料的制备方法 Download PDFInfo
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 74
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 74
- 239000010703 silicon Substances 0.000 title claims abstract description 74
- 239000000463 material Substances 0.000 title claims abstract description 35
- 239000002086 nanomaterial Substances 0.000 title claims abstract description 19
- 238000002360 preparation method Methods 0.000 title claims description 11
- 235000012431 wafers Nutrition 0.000 claims abstract description 48
- 238000000034 method Methods 0.000 claims abstract description 17
- 239000011261 inert gas Substances 0.000 claims abstract description 16
- 239000012535 impurity Substances 0.000 claims abstract description 9
- 238000005498 polishing Methods 0.000 claims abstract description 6
- 238000002791 soaking Methods 0.000 claims abstract description 6
- 238000003756 stirring Methods 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 239000010408 film Substances 0.000 claims description 16
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 14
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 claims description 14
- 239000000243 solution Substances 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 12
- 238000010884 ion-beam technique Methods 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 11
- 239000010409 thin film Substances 0.000 claims description 10
- XTEGARKTQYYJKE-UHFFFAOYSA-M Chlorate Chemical compound [O-]Cl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-M 0.000 claims description 8
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 claims description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- 239000012670 alkaline solution Substances 0.000 claims description 6
- 238000009388 chemical precipitation Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- 238000005057 refrigeration Methods 0.000 claims description 5
- 239000012286 potassium permanganate Substances 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 239000003518 caustics Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 239000001307 helium Substances 0.000 claims description 3
- 229910052734 helium Inorganic materials 0.000 claims description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 3
- 229910052743 krypton Inorganic materials 0.000 claims description 3
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 229910052754 neon Inorganic materials 0.000 claims description 3
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 claims description 3
- 229910052724 xenon Inorganic materials 0.000 claims description 3
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 239000000969 carrier Substances 0.000 abstract description 6
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 238000011031 large-scale manufacturing process Methods 0.000 abstract description 5
- 230000003287 optical effect Effects 0.000 abstract description 5
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- 230000001590 oxidative effect Effects 0.000 description 6
- 239000007800 oxidant agent Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- AKEJUJNQAAGONA-UHFFFAOYSA-N sulfur trioxide Chemical compound O=S(=O)=O AKEJUJNQAAGONA-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- -1 sodium Chemical class 0.000 description 3
- HIFJUMGIHIZEPX-UHFFFAOYSA-N sulfuric acid;sulfur trioxide Chemical compound O=S(=O)=O.OS(O)(=O)=O HIFJUMGIHIZEPX-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 241000894006 Bacteria Species 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 244000005700 microbiome Species 0.000 description 2
- 239000005543 nano-size silicon particle Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 238000005424 photoluminescence Methods 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000000746 purification Methods 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910004613 CdTe Inorganic materials 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- 241000233866 Fungi Species 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 241000700605 Viruses Species 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000002421 anti-septic effect Effects 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000007844 bleaching agent Substances 0.000 description 1
- 229910000085 borane Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000012824 chemical production Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- OIDPCXKPHYRNKH-UHFFFAOYSA-J chrome alum Chemical compound [K]OS(=O)(=O)O[Cr]1OS(=O)(=O)O1 OIDPCXKPHYRNKH-UHFFFAOYSA-J 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000006298 dechlorination reaction Methods 0.000 description 1
- 238000004042 decolorization Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000000645 desinfectant Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000005188 flotation Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 231100001240 inorganic pollutant Toxicity 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
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- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- JTJMJGYZQZDUJJ-UHFFFAOYSA-N phencyclidine Chemical compound C1CCCCN1C1(C=2C=CC=CC=2)CCCCC1 JTJMJGYZQZDUJJ-UHFFFAOYSA-N 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- VKJKEPKFPUWCAS-UHFFFAOYSA-M potassium chlorate Chemical compound [K+].[O-]Cl(=O)=O VKJKEPKFPUWCAS-UHFFFAOYSA-M 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000002760 rocket fuel Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000011856 silicon-based particle Substances 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000009967 tasteless effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/121—The active layers comprising only Group IV materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Weting (AREA)
- Photovoltaic Devices (AREA)
Abstract
硅基纳米结构光伏材料的制备方法,它涉及光伏材料技术领域。它包含如下步骤:依据实际需求裁剪一定规格的硅片,对硅片裁剪处进行抛光处理,抛光后将其放入事先调制好的溶液中浸泡3H‑4.5H,在浸泡期间每隔20Min搅拌一次;将浸泡后的硅片取出,放置在高温炉中用于去除杂质,炉内温度调整范围为650摄氏度‑750摄氏度,时长为0.3H‑0.5H,之后用惰性气体将其冷却至常温;在硅片的背面用化学沉淀法。采用上述技术方案后,本发明有益效果为:工艺便捷,使用价值高,原料简单,生产成本较低,有利于大规模生产,能有效制备出规格的硅基纳米结构光伏材料,具有良好的光学和电学性质,具有良好接触电性,能提高载流子的输运能力,能实现光伏材料转换效率。
Description
技术领域
本发明涉及光伏材料技术领域,具体涉及硅基纳米结构光伏材料的制备方法。
背景技术
随着科技的迅猛发展和环保意识的日益增强,新能源产业发展势头强劲。作为间歇性新能源,太阳能需要高性能光伏材料进行存储。
光伏材料又称太阳电池材料,可做太阳电池材料的材料有单晶硅、多晶硅、非晶硅、GaAs、GaAlAs、InP、CdS、CdTe等。
纳米硅指的是直径小于5纳米(10亿(1G)分之一米)的晶体硅颗粒。纳米硅粉具有纯度高,粒径小,分布均匀等特点。具有表面积大,高表面活性,松装密度低的特点,该产品具有无毒,无味。纳米硅粉是新一代光电半导体材料,具有较宽的间隙能半导体,也是高功率光源材料。
在硅衬底上设计了十来种硅/氧化硅纳米结构,实现了从近紫外到近红外的各主要波段(包括1.54和1.62μm)的光致发光和正向或反向偏压下的低阈值电压电致发光,并提出了受到广泛支持的光致发光和电致发光模型,这为最终实现硅基光电集成打下一定的基础。具有重要的科学意义和巨大的应用前景。
目前的硅基纳米结构光伏材料制备工艺繁琐,使用价值不高,原料复杂,生产成本巨大,不利于大规模生产,不能有效制备出规格的硅基纳米结构光伏材料,不具有良好的光学和电学性质,不具有良好接触电性,不能提高载流子的输运能力,难以实现光伏材料转换效率。
发明内容
本发明的目的在于针对现有技术的缺陷和不足,提供硅基纳米结构光伏材料的制备方法,工艺便捷,使用价值高,原料简单,生产成本较低,有利于大规模生产,能有效制备出规格的硅基纳米结构光伏材料,具有良好的光学和电学性质,具有良好接触电性,能提高载流子的输运能力,能实现光伏材料转换效率。
为实现上述目的,本发明采用以下技术方案,它包含如下步骤:
步骤一、依据实际需求裁剪一定规格的硅片,对硅片裁剪处进行抛光处理,抛光后将其放入事先调制好的溶液中浸泡3H-4.5H,在浸泡期间每隔20Min搅拌一次;
步骤二、将浸泡后的硅片取出,放置在高温炉中用于去除杂质,炉内温度调整范围为650摄氏度-750摄氏度,时长为0.3H-0.5H,之后用惰性气体将其冷却至常温;
步骤三、在硅片的背面用化学沉淀法,沉淀一层氧化硅薄膜,氧化硅薄膜的厚度为100nm~300nm;
步骤四、在硅片的正面镀上一层金属薄膜层,金属薄膜层厚度为200nm~400mm;
步骤五、用强腐蚀剂处理硅片正表面四周,去除由步骤四产生的表面损伤;
步骤六、用离子束刻蚀金属薄膜层,刻蚀出所需要的电极图形,刻蚀深度为150nm~170mm;
步骤七、将硅片放置在碱性溶液中温煮,温煮温度为120摄氏度-200摄氏度,温煮时长为2H-3.5H,用于去除步骤六产生的损伤;
步骤八、再次用惰性气体对温煮后的硅片进行吹干;
步骤九、依循电极图形,在其中灌入金属液,并迅速制冷,制冷温度为-30摄氏度--50摄氏度,完成硅基纳米结构光伏材料的制备。
所述步骤一中的硅片规格为5厘米×5厘米×2厘米、10厘米×10厘米×2厘米、15厘米×15厘米×2厘米。
所述步骤一中的溶液为过醋酸、双氧水的混合物,过醋酸的摩尔浓度范围为3-15%、双氧水的摩尔浓度范围为15-20%。
所述步骤二和步骤八中的惰性气体为氦气、氖气、氩气、氪气、氙气。
所述步骤五中的强腐蚀剂为重铬酸钾、氯酸盐、高锰酸钾、发烟硫酸。
所述步骤七中碱性溶液为碱水。
本发明的工作原理:依据实际需求裁剪一定规格的硅片,对硅片裁剪处进行抛光处理,抛光后将其放入事先调制好的溶液中浸泡3H-4.5H,在浸泡期间每隔20Min搅拌一次;将浸泡后的硅片取出,放置在高温炉中用于去除杂质,炉内温度调整范围为650摄氏度-750摄氏度,时长为0.3H-0.5H,之后用惰性气体将其冷却至常温;在硅片的背面用化学沉淀法,沉淀一层氧化硅薄膜,氧化硅薄膜的厚度为100nm~300nm;在硅片的正面镀上一层金属薄膜层,金属薄膜层厚度为200nm~400mm;用强腐蚀剂处理硅片正表面四周,去除由步骤四产生的表面损伤;用离子束刻蚀金属薄膜层,刻蚀出所需要的电极图形,刻蚀深度为150nm~170mm;将硅片放置在碱性溶液中温煮,温煮温度为120摄氏度-200摄氏度,温煮时长为2H-3.5H,用于去除步骤六产生的损伤;再次用惰性气体对温煮后的硅片进行吹干;依循电极图形,在其中灌入金属液,并迅速制冷,制冷温度为-30摄氏度--50摄氏度,完成硅基纳米结构光伏材料的制备。
采用上述技术方案后,本发明有益效果为:工艺便捷,使用价值高,原料简单,生产成本较低,有利于大规模生产,能有效制备出规格的硅基纳米结构光伏材料,具有良好的光学和电学性质,具有良好接触电性,能提高载流子的输运能力,能实现光伏材料转换效率。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。
图1是本发明的流程示意框图。
具体实施方式
参看图1所示,本具体实施方式采用的技术方案,它包含如下步骤:
步骤一、依据实际需求裁剪一定规格的硅片,对硅片裁剪处进行抛光处理,抛光后将其放入事先调制好的溶液中浸泡3H-4.5H,在浸泡期间每隔20Min搅拌一次;硅片的生产中须经严格清洗,微量污染也会导致器件失效。清洗的目的在于清除表面污染杂质,包括有机物和无机物。这些杂质有的以原子状态或离子状态,有的以薄膜形式或颗粒形式存在于硅片表面。有机污染包括光刻胶、有机溶剂残留物、合成蜡和人接触器件、工具、器皿带来的油脂或纤维。无机污染包括重金属金、铜、铁、铬等,严重影响少数载流子寿命和表面电导;碱金属如钠等,引起严重漏电;颗粒污染包括硅渣、尘埃、细菌、微生物、有机胶体纤维等,会导致各种缺陷;
步骤二、将浸泡后的硅片取出,放置在高温炉中用于去除杂质,炉内温度调整范围为650摄氏度-750摄氏度,时长为0.3H-0.5H,之后用惰性气体将其冷却至常温;
步骤三、在硅片的背面用化学沉淀法,沉淀一层氧化硅薄膜,氧化硅薄膜的厚度为100nm~300nm;
步骤四、在硅片的正面镀上一层金属薄膜层,金属薄膜层厚度为200nm~400mm;
步骤五、用强腐蚀剂处理硅片正表面四周,去除由步骤四产生的表面损伤;
步骤六、用离子束刻蚀金属薄膜层,刻蚀出所需要的电极图形,刻蚀深度为150nm~170mm;离子束刻蚀是指当定向高能离子向固体靶撞击时,能量从入射离子转移到固体表面原子上,如果固体表面原子间结合能低于入射离子能量时,固体表面原子就会被移开或从表面上被除掉。通常离子束刻蚀所用的离子来自惰性气体;离子束最小直径约10nm,离子束刻蚀的结构最小可能不会小于10nm。目前聚焦离子束刻蚀的束斑可达100nm以下,最少的达到10nm,获得最小线宽12nm的加工结果。相比电子与固体相互作用,离子在固体中的散射效应较小,并能以较快的直写速度进行小于50nm的刻蚀,故而聚焦离子束刻蚀是纳米加工的一种理想方法;此外聚焦离子束技术的另一优点是在计算机控制下的无掩膜注入,甚至无显影刻蚀,直接制造各种纳米器件结构;
步骤七、将硅片放置在碱性溶液中温煮,温煮温度为120摄氏度-200摄氏度,温煮时长为2H-3.5H,用于去除步骤六产生的损伤;
步骤八、再次用惰性气体对温煮后的硅片进行吹干;
步骤九、依循电极图形,在其中灌入金属液,并迅速制冷,制冷温度为-30摄氏度--50摄氏度,完成硅基纳米结构光伏材料的制备。
所述步骤一中的硅片规格为5厘米×5厘米×2厘米、10厘米×10厘米×2厘米、15厘米×15厘米×2厘米。
所述步骤一中的溶液为过醋酸、双氧水的混合物,过醋酸的摩尔浓度范围为3-15%、双氧水的摩尔浓度范围为15-20%。过醋酸是强氧化剂,可以杀灭一切微生物,对病毒、细菌、真菌及芽孢均能迅速杀灭,可广泛应用于各种器具及环境消毒;双氧水在不同的情况下可有氧化作用或还原作用,可用氧化剂、漂白剂、消毒剂、脱氯剂,并供火箭燃料、有机或无机过氧化物、泡沫塑料和其他多孔物质等。
所述步骤二和步骤八中的惰性气体为氦气、氖气、氩气、氪气、氙气。利用惰性气体极不活动的化学性质,在半导体工业中硅的生产中常用它们来作保护气。
所述步骤五中的强腐蚀剂为重铬酸钾、氯酸盐、高锰酸钾、发烟硫酸。重铬酸钾是强氧化剂,在实验室和工业中都有很广泛的应用;用于制铬矾、火柴、铬颜料、并供鞣革、电镀、有机合成等;氯酸盐具有强氧化作用,加热后放出氧,同时放热;与易燃物,如硫、碳、磷混合后,撞击时会有剧烈爆炸发生;不可同还原剂或易燃物质堆放在一起,一般易溶于水,但氯酸钾的溶解度较小;高锰酸钾溶于水、碱液,微溶于甲醇、丙酮、硫酸在化学品生产中,广泛用作为氧化剂,在水质净化及废水处理中,作水处理剂,以氧化硫化氢、酚、铁、锰和有机、无机等多种污染物,控制臭味和脱色;在气体净化中,可除去痕量硫、砷、磷、硅烷、硼烷及硫化物;在采矿冶金方面,用于从铜中分离钼,从锌和镉中除杂,以及化合物浮选的氧化剂;还用于作特殊织物、蜡、油脂及树脂的漂白剂,防毒面具的吸附剂,木材及铜的着色剂等;发烟硫酸当它与水相混合时,三氧化硫即与水结合成硫酸;相对密度约1.9(含20%三氧化硫);有强烈腐蚀性。
所述步骤七中碱性溶液为碱水。碱水是天然碱,主要的成分是碳酸钠和碳酸钾;是一种具有很强腐蚀性的碱性化学品,适当的碱可以使粉状在受热分解时,吸收水份,达到良好的黏弹性;碱水还有防腐作用、中和酸性等功能。
本发明的工作原理:依据实际需求裁剪一定规格的硅片,对硅片裁剪处进行抛光处理,抛光后将其放入事先调制好的溶液中浸泡3H-4.5H,在浸泡期间每隔20Min搅拌一次;将浸泡后的硅片取出,放置在高温炉中用于去除杂质,炉内温度调整范围为650摄氏度-750摄氏度,时长为0.3H-0.5H,之后用惰性气体将其冷却至常温;在硅片的背面用化学沉淀法,沉淀一层氧化硅薄膜,氧化硅薄膜的厚度为100nm~300nm;在硅片的正面镀上一层金属薄膜层,金属薄膜层厚度为200nm~400mm;用强腐蚀剂处理硅片正表面四周,去除由步骤四产生的表面损伤;用离子束刻蚀金属薄膜层,刻蚀出所需要的电极图形,刻蚀深度为150nm~170mm;将硅片放置在碱性溶液中温煮,温煮温度为120摄氏度-200摄氏度,温煮时长为2H-3.5H,用于去除步骤六产生的损伤;再次用惰性气体对温煮后的硅片进行吹干;依循电极图形,在其中灌入金属液,并迅速制冷,制冷温度为-30摄氏度--50摄氏度,完成硅基纳米结构光伏材料的制备。
采用上述技术方案后,本发明有益效果为:工艺便捷,使用价值高,原料简单,生产成本较低,有利于大规模生产,能有效制备出规格的硅基纳米结构光伏材料,具有良好的光学和电学性质,具有良好接触电性,能提高载流子的输运能力,能实现光伏材料转换效率。
以上所述,仅用以说明本发明的技术方案而非限制,本领域普通技术人员对本发明的技术方案所做的其它修改或者等同替换,只要不脱离本发明技术方案的精神和范围,均应涵盖在本发明的权利要求范围当中。
Claims (6)
1.硅基纳米结构光伏材料的制备方法,其特征在于它包含如下步骤:
步骤一、依据实际需求裁剪一定规格的硅片,对硅片裁剪处进行抛光处理,抛光后将其放入事先调制好的溶液中浸泡3H-4.5H,在浸泡期间每隔20Min搅拌一次;
步骤二、将浸泡后的硅片取出,放置在高温炉中用于去除杂质,炉内温度调整范围为650摄氏度-750摄氏度,时长为0.3H-0.5H,之后用惰性气体将其冷却至常温;
步骤三、在硅片的背面用化学沉淀法,沉淀一层氧化硅薄膜,氧化硅薄膜的厚度为100nm~300nm;
步骤四、在硅片的正面镀上一层金属薄膜层,金属薄膜层厚度为200nm~400mm;
步骤五、用强腐蚀剂处理硅片正表面四周,去除由步骤四产生的表面损伤;
步骤六、用离子束刻蚀金属薄膜层,刻蚀出所需要的电极图形,刻蚀深度为150nm~170mm;
步骤七、将硅片放置在碱性溶液中温煮,温煮温度为120摄氏度-200摄氏度,温煮时长为2H-3.5H,用于去除步骤六产生的损伤;
步骤八、再次用惰性气体对温煮后的硅片进行吹干;
步骤九、依循电极图形,在其中灌入金属液,并迅速制冷,制冷温度为-30摄氏度--50摄氏度,完成硅基纳米结构光伏材料的制备。
2.根据权利要求1所述的硅基纳米结构光伏材料的制备方法,其特征在于:所述步骤一中的硅片规格为5厘米×5厘米×2厘米、10厘米×10厘米×2厘米、15厘米×15厘米×2厘米。
3.根据权利要求1所述的硅基纳米结构光伏材料的制备方法,其特征在于:所述步骤一中的溶液为过醋酸、双氧水的混合物,过醋酸的摩尔浓度范围为3-15%、双氧水的摩尔浓度范围为15-20%。
4.根据权利要求1所述的硅基纳米结构光伏材料的制备方法,其特征在于:所述步骤二和步骤八中的惰性气体为氦气、氖气、氩气、氪气、氙气。
5.根据权利要求1所述的硅基纳米结构光伏材料的制备方法,其特征在于:所述步骤五中的强腐蚀剂为重铬酸钾、氯酸盐、高锰酸钾、发烟硫酸。
6.根据权利要求1所述的硅基纳米结构光伏材料的制备方法,其特征在于:所述步骤七中碱性溶液为碱水。
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