CN108962830A - A kind of hydrolyzable plane routing shell for transient circuit - Google Patents
A kind of hydrolyzable plane routing shell for transient circuit Download PDFInfo
- Publication number
- CN108962830A CN108962830A CN201810612982.8A CN201810612982A CN108962830A CN 108962830 A CN108962830 A CN 108962830A CN 201810612982 A CN201810612982 A CN 201810612982A CN 108962830 A CN108962830 A CN 108962830A
- Authority
- CN
- China
- Prior art keywords
- lead
- hydrolyzable
- shell
- housing base
- plane routing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Connection Of Batteries Or Terminals (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses a kind of hydrolyzable plane routing shells for transient circuit, which includes: housing base, which is made of the water-soluble material insoluble in organic solvent；Two package leads are connected to the opposite two sides of housing base.The package lead includes middle layer, and the middle layer two sides are close to that transition zone is arranged respectively, and setting clad is close in the transition zone side, and the middle layer and clad constitute primary battery in the environment of electrolyte.The present invention provides a kind of hydrolyzable plane routing shell, structural strength meets transient state encapsulation and requires, and uses planar structure and insoluble in organic solvent, compatibility transient state chip transfer printing process and transient state lead wiring technique.Meanwhile with after contact with normal saline can fast hydrolyzing disappear, to ensure the whole transient response of circuit.Structure design, material selection, the processing process design of the shell, provide the thinking that can be referred to for the design of other transient state package casings.
Description
Technical field
It is a kind of transient circuit package casing that the present invention, which relates to the present invention, for constituting transient state encapsulation.More particularly to a kind of use
In the hydrolyzable plane routing shell of transient circuit.
Background technique
" transient circuit " technology of preparing is broken through dependent on material and the revolutionary of electronics subject, is a completely new scientific skill
Art field has very strong innovative and subversiveness.After requiring circuit in certain time steady operation, playing effect, object
Reason form and function can environmental stimuli triggering under occur immediately partial disappearance perhaps completely disappear realize it is few or complete
The residual of full untraceable.Corresponding custom circuit, it can be understood as " steady state circuit " is stablized not in pursuit performance
Become, is physically solid and reliable.
The controllable transition that has due to transient circuit, controllably disappear characteristic, in Military Information Security, electronic waste and ring
In terms of border protection, implanted electronic equipment and biologic medical, demand is had important application.
The difference of type is triggered according to environmental stimuli, transient circuit can be divided into: water triggers transient circuit, light triggering transient state electricity
Road, heat triggering transient circuit etc..
In the prior art, package casing generallys use ceramic matrix and iron-based or acid bronze alloy outer lead, mainly chases after
Electrical property and mechanical performance are asked, cannot achieve the partial disappearance of package casing in physiological saline environment or is completely disappeared, no
Has mapping.
Summary of the invention
In view of the foregoing deficiencies of prior art, what the purpose of the present invention is to provide a kind of for transient circuit can water
Plane routing shell is solved, structural strength meets transient state encapsulation and requires, and uses planar structure and does not dissolve in organic solvent, simultaneous
Hold transient state chip transfer printing process and transient state lead wiring technique.Meanwhile with after contact with normal saline can fast hydrolyzing disappear
It loses, to ensure the whole transient response of circuit.
In order to achieve the above objects and other related objects, the present invention provides a kind of hydrolyzable planar cloth for transient circuit
Line shell, the shell include:
Housing base, the housing base are made of the water-soluble material insoluble in organic solvent；
Two package leads are connected to the opposite two sides of housing base.
Preferably, the package lead includes middle layer, and the middle layer two sides are close to that transition zone, the mistake is arranged respectively
It crosses layer side and is close to setting clad, the middle layer and clad constitute primary battery in the environment of electrolyte.
Preferably, the material of the middle layer is magnesium, and the material of the clad is gold；The material of the transition zone is
Titanium.
Preferably, the housing base material is polyvinyl alcohol.
Preferably, the housing base is cuboid.
Preferably, the package lead includes lead frame, and the distance of two package leads is drawing for two package leads
The distance between line frame.
Preferably, several lead wire units are extended to form from the side frame of the lead frame to the direction far from side frame.
Preferably, it is parallel to each other between several lead wire units.
Preferably, the lead includes lead ontology and wire ends, and the size of wire ends is greater than lead ontology；It is described
Wire ends are connected on housing base.
Preferably, the top end face of the lead is lower than the top end face of housing base.
As described above, a kind of hydrolyzable plane routing shell for transient circuit of the invention, has below beneficial to effect
Fruit:
The present invention provides a kind of hydrolyzable plane routing shell, structural strength meets transient state encapsulation and requires, and uses
Planar structure and organic solvent is not dissolved in, is compatible with transient state chip transfer printing process and transient state lead wiring technique.Meanwhile with
After contact with normal saline can fast hydrolyzing disappear, to ensure the whole transient response of circuit.The structure design of the shell, material
Material selection, processing process design, provide the thinking that can be referred to for the design of other transient state package casings.
Detailed description of the invention
Fig. 1 is the schematic diagram of integrated package lead；
Fig. 2 is the schematic diagram of discrete package lead；
Fig. 3 is the connection schematic diagram of housing base and package lead；
Fig. 4 is planar structure schematic diagram of the present invention；
Fig. 5 is the side view of Fig. 3；
Fig. 6 is the metal laminated structural schematic diagram of package lead.
Specific embodiment
Illustrate embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this specification
Other advantages and efficacy of the present invention can be easily understood for disclosed content.The present invention can also pass through in addition different specific realities
The mode of applying is embodied or practiced, the various details in this specification can also based on different viewpoints and application, without departing from
Various modifications or alterations are carried out under spirit of the invention.It should be noted that in the absence of conflict, following embodiment and implementation
Feature in example can be combined with each other.
It should be noted that illustrating the basic structure that only the invention is illustrated in a schematic way provided in following embodiment
Think, only shown in schema then with related component in the present invention rather than component count, shape and size when according to actual implementation
Draw, when actual implementation kenel, quantity and the ratio of each component can arbitrarily change for one kind, and its assembly layout kenel
It is likely more complexity.
As shown in Figure 2,3, the present embodiment provides a kind of hydrolyzable plane routing shells for transient circuit, comprising:
Housing base 3, the housing base are made of the water-soluble material insoluble in organic solvent；
Two package leads 2 are connected to the opposite two sides of housing base.
Specifically, package lead includes middle layer 21, and middle layer two sides are close to that transition zone, i.e. First Transition layer is arranged respectively
22 and second transition zone 23, transition zone side be close to setting clad, i.e. the first clad 24 and the second clad 25, middle layer
Primary battery is constituted in the environment of electrolyte (specially physiological saline) with clad.The material of middle layer is magnesium, clad
Material is gold；The material of transition zone be titanium, housing base material be polyvinyl alcohol, the material in water can with fast hydrolyzing, but
Insoluble in organic solvent.
Housing base 3, surface are plane and the self-adhesiveness energy with polyvinyl alcohol material, can be very good to transfer and glue
It connects transient state chip 4 (10 microns of thickness or less), and its bonding interface 5 is without applying other bonding agents.Meanwhile housing base can be with
It can be connect between package lead by the self-adhesiveness of polyvinyl alcohol material.
In this present embodiment, housing base is cuboid.
As shown in Fig. 2, package lead includes lead frame 221, the distance of two package leads is two package leads
The distance between lead frame.
In this present embodiment, package lead includes lead frame, from the side frame of lead frame to the side far from side frame
To extending to form several lead wire units, mutual lead wire unit between several leads.
In this present embodiment, lead wire unit includes lead ontology 222 and wire ends 223, and the size of wire ends is greater than
Lead ontology；Wire ends are connected on housing base, the top end face of lead lower than housing base top end face (housing base
Top end face can be defined as the face far from package lead).
Due to transient state chip 4, housing base 3, package lead 2 upper surface generally within same plane, be conducive to use
Transient state printing ink to manufacture transient state lead 6, to realize the electric interconnection and encapsulation function of transient state chip 4 Yu package lead 2.Shell
The top end face of lead 2 is lower than the top end face of polyvinyl alcohol shell housing base 3, can be broken because of assembling deviation to avoid package lead 2
The flatness of bad transient state chip attachment surface.
The present invention provides a kind of hydrolyzable plane routing shell, structural strength meets transient state encapsulation and requires, and uses
Planar structure and organic solvent is not dissolved in, is compatible with transient state chip transfer printing process and transient state lead wiring technique.Meanwhile with
After contact with normal saline can fast hydrolyzing disappear, to ensure the whole transient response of circuit.
The present embodiment also provides a kind of production method of hydrolyzable plane routing shell for transient circuit, this method tool
Body are as follows:
1, obtaining has integrated casing lead 1 as shown in Figure 1, and is cut into discrete package lead 2 as shown in Figure 2
(with a thickness of 0.25 millimeter) is stand-by.
Wherein, package lead includes lead frame 221, and by the side frame of lead frame, (width is 1.5 millimeters, length is
14.3 millimeters) to far from the direction of side frame several lead wire units are extended to form, it is parallel to each other between several lead wire units.Into one
Step, lead wire unit include lead ontology 222 and wire ends 223, and the size of wire ends is greater than lead ontology；Wire ends connect
It is connected on housing base, (top end face of housing base can define lower than the top end face of housing base for the top end face of lead wire unit
For the face far from package lead).In this present embodiment, the both ends of the side frame of lead frame are respectively by the side by lead frame
Frame extends to form upper side frame and lower frame to the direction far from side frame.Upper side frame and lower frame are isometric, are 4.5 millimeters, and
With the equal length of lead ontology, the width of lead ontology is 0.5 millimeter.
As shown in Figure 1, 2, in this present embodiment, lead ontology is a rectangular parallelepiped structure, the length is 4.5 millimeters, width
It is 0.5 millimeter, with a thickness of 0.25 millimeter.Wire ends are a trapezium structure, and shorter bottom edge is connected with lead ontology, wide
Degree is 0.5 millimeter, and the length on longer bottom edge is 1.2 millimeters.
2, as shown in Figure 2: processing polyvinyl alcohol housing base 3 first, and soak it with deionized water and connect with package lead 2
The surface 4 of touching is assembled using the bonding that mold carries out discrete package lead 2, realizes the outer of discrete package lead 2 and polyvinyl alcohol
The integrated molding of housing base 3.
Specifically, the length of housing base is 10.16 millimeters, width is 7.37 millimeters, with a thickness of 2.1 millimeters.
(width of wire ends i.e. above-mentioned is 1.2 to 1.2 millimeters of the contact portion width of package lead 2 and housing base 3
Millimeter), 1.8 millimeters of distance of contact (length of the wire ends contact with housing base 3 be 1.8 millimeters), two adjacent draw
Distance between line is 2.54 millimeters (distance for specifically referring to the long symmetry axis of two lead ontologies).The top end face of package lead 2 is low
In 0.3 millimeter of the top end face (top of plane and housing base where referring specifically to the longer bottom edge of wire ends of housing base 3
The distance in face), generally within same plane.It can guarantee the smooth implementation of transient state packaging technology process by above-mentioned design.
As shown in figure 5, the outside (non-lead unit where side) of the side frame of lead frame and housing base outside (with
The non-contact side of package lead) distance be 9 millimeters.
As shown in Figure 4: shell uses planar structure, compatible transient state chip transfer printing process and transient state lead wiring technique.
Polyvinyl alcohol housing base 3, surface are plane and the self-adhesiveness energy with polyvinyl alcohol material, can be very good to transfer and glue
It connects transient state chip 4 (10 microns of thickness or less), and its bonding interface 5 is without applying other bonding agents.Due to transient state chip 4, gather
Vinyl alcohol housing base 3, discrete package lead 2 upper surface generally within same plane, be conducive to using transient state printing ink to manufacture
Transient state lead 6, to realize the electric interconnection and encapsulation function of transient state chip 4 Yu package lead 2.Discrete package lead 2
Top end face is lower than 0.3 millimeter 7 of top end face of polyvinyl alcohol shell housing base 3, the purpose of the design be avoid package lead 2 because
The flatness that deviation destroys transient state chip attachment surface 8 is assembled, meanwhile, transient state lead 6 can be compatible with the ladder of height 0.3mm.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology all without departing from the spirit and scope of the present invention, carries out modifications and changes to above-described embodiment.Cause
This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as
At all equivalent modifications or change, should be covered by the claims of the present invention.
Claims (10)
1. a kind of hydrolyzable plane routing shell for transient circuit, which is characterized in that the shell includes:
Housing base, the housing base are made of the water-soluble material insoluble in organic solvent；
Two package leads are connected to the opposite two sides of housing base.
2. a kind of hydrolyzable plane routing shell for transient circuit according to claim 1, which is characterized in that described
Package lead includes middle layer, and the middle layer two sides are close to that transition zone is arranged respectively, and setting packet is close in the transition zone side
Coating, the middle layer and clad constitute primary battery in the environment of electrolyte.
3. a kind of hydrolyzable plane routing shell for transient circuit according to claim 2, which is characterized in that described
The material of middle layer is magnesium, and the material of the clad is gold；The material of the transition zone is titanium.
4. a kind of hydrolyzable plane routing shell for transient circuit according to claim 3, which is characterized in that described
Housing base material is polyvinyl alcohol.
5. a kind of hydrolyzable plane routing shell for transient circuit according to claim 1, which is characterized in that described
Housing base is rectangular parallelepiped structure.
6. a kind of hydrolyzable plane routing shell for transient circuit according to claim 5, which is characterized in that described
Package lead includes lead frame, and the distance of two package leads is the distance between the lead frame of two package leads.
7. a kind of hydrolyzable plane routing shell for transient circuit according to claim 6, which is characterized in that by institute
The side frame for stating lead frame extends to form several lead wire units to the direction far from side frame.
8. a kind of hydrolyzable plane routing shell for transient circuit according to claim 7, which is characterized in that described
It is parallel to each other between several lead wire units.
9. a kind of hydrolyzable plane routing shell for transient circuit according to claim 7, which is characterized in that described
Lead includes lead ontology and wire ends, and the size of wire ends is greater than lead ontology；The wire ends are connected to shell
On matrix.
10. a kind of hydrolyzable plane routing shell for transient circuit according to claim 7~9 any one,
It is characterized in that, the top end face of the lead is lower than the top end face of housing base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810612982.8A CN108962830B (en) | 2018-06-14 | 2018-06-14 | Hydrolyzable plane wiring shell for transient circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810612982.8A CN108962830B (en) | 2018-06-14 | 2018-06-14 | Hydrolyzable plane wiring shell for transient circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108962830A true CN108962830A (en) | 2018-12-07 |
| CN108962830B CN108962830B (en) | 2020-09-04 |
Family
ID=64488812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810612982.8A Active CN108962830B (en) | 2018-06-14 | 2018-06-14 | Hydrolyzable plane wiring shell for transient circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108962830B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202259432U (en) * | 2011-09-05 | 2012-05-30 | 高攀宁 | Red LED lamp bead and indoor lamp adopting same |
| CN104472023A (en) * | 2011-12-01 | 2015-03-25 | 伊利诺伊大学评议会 | Transient devices designed to undergo programmable transitions |
| US20160233269A1 (en) * | 2014-08-21 | 2016-08-11 | The University Of Hong Kong | Flexible gan light-emitting diodes |
| CN206697471U (en) * | 2017-04-12 | 2017-12-01 | 合肥富芯元半导体有限公司 | A kind of encapsulating structure of semiconductor integrated circuit |
-
2018
- 2018-06-14 CN CN201810612982.8A patent/CN108962830B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202259432U (en) * | 2011-09-05 | 2012-05-30 | 高攀宁 | Red LED lamp bead and indoor lamp adopting same |
| CN104472023A (en) * | 2011-12-01 | 2015-03-25 | 伊利诺伊大学评议会 | Transient devices designed to undergo programmable transitions |
| US20160233269A1 (en) * | 2014-08-21 | 2016-08-11 | The University Of Hong Kong | Flexible gan light-emitting diodes |
| CN206697471U (en) * | 2017-04-12 | 2017-12-01 | 合肥富芯元半导体有限公司 | A kind of encapsulating structure of semiconductor integrated circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108962830B (en) | 2020-09-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3758678B2 (en) | High performance integrated circuit package | |
| TWI499493B (en) | A wireless antenna module and method of fabricating the same | |
| US10917973B1 (en) | Method of direct embedding a lithium ion battery on a flexible printed circuit board | |
| WO2020103587A1 (en) | Encapsulation module based on pins of pcb body and preparation method therefor | |
| CN102105894A (en) | Chip card having a plurality of components | |
| CN102324637A (en) | Electrical-connector plug and socket, double-surfaced U disk, card reader and interface converter | |
| CN103489655B (en) | A kind of Novel planar array multi-core series-parallel solid tantalum capacitor and manufacture method thereof | |
| CN205670539U (en) | A kind of organic substrate superintegrated three-dimensional microwave circuit structure | |
| CN105789142B (en) | A kind of three-dimensional microwave circuit structure of organic substrate High Density Integration | |
| CN108962830A (en) | A kind of hydrolyzable plane routing shell for transient circuit | |
| CN101416206A (en) | IC module, IC inlet and IC encapsulation body | |
| CN208284472U (en) | A kind of SIP module, chip, circuit board and electronic equipment | |
| CN209691747U (en) | Antenna packages structure with air chamber | |
| CN209691746U (en) | Antenna packages structure with air chamber | |
| CN104218015A (en) | Encapsulating structure and manufacturing method thereof | |
| CN202384522U (en) | Electric connector plug and socket, double-faced U disk, convenient slot card reader and convenient interface converter | |
| CN202998643U (en) | Printed circuit board with a plurality of blind holes and two buried holes | |
| CN102306641B (en) | Storage module and packaging method | |
| CN206789535U (en) | A kind of fan-out package structure of power electronic devices | |
| CN206541821U (en) | Functional circuit module vertical interconnecting structure | |
| CN111916583A (en) | Bluetooth headset battery | |
| CN214203674U (en) | Integrated component with four groups of ESD protection channels | |
| CN221634042U (en) | Electronic device and ultra-thin mobile power supply | |
| CN202998660U (en) | Printed circuit board with crossed blind and buried structures | |
| CN220189624U (en) | Semiconductor packaging device and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |