CN108958545B - Conductive laminated structure, preparation method thereof, display panel and display device - Google Patents
Conductive laminated structure, preparation method thereof, display panel and display device Download PDFInfo
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- CN108958545B CN108958545B CN201810703635.6A CN201810703635A CN108958545B CN 108958545 B CN108958545 B CN 108958545B CN 201810703635 A CN201810703635 A CN 201810703635A CN 108958545 B CN108958545 B CN 108958545B
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- G—PHYSICS
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
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- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
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Abstract
The invention discloses a conductive laminated structure, a preparation method thereof, a display panel and a display device. The invention provides a conductive laminated structure and a preparation method thereof, comprising a substrate; and a nano-metal wire layer on the substrate, the nano-metal wire layer being doped with an optically transparent resin not containing a photoinitiator. Therefore, the adhesive force of the nano metal wire layer can be improved, the stripping phenomenon is prevented, and the ultraviolet resistance of the nano metal wire layer can be improved.
Description
Technical Field
The invention relates to the field of nano metal wire materials and application thereof, in particular to a conductive laminated structure, a preparation method thereof, a display panel and a display device.
Background
The demand for transparent conductors has been increasing year by year because they can be applied to the fields such as touch panels (touch panels), liquid crystal displays (liquid crystal displays), thin film photovoltaic cells (thin film photovoltaic cells), and organic light emitting diode devices (organic light emitting diode devices).
Currently, the transparent conductive material is mainly Indium Tin Oxide (ITO), and has excellent light transmittance and conductivity. However, such transparent conductive materials are generally deposited by a sputtering process, the preparation temperature is high, and the rare metals contained therein are expensive, and such thin films are easily broken when they are bent, and thus are not suitable for preparing flexible devices, which causes limitations in performance and yield of ITO. Therefore, it is proposed to use a Nano metal wire such as a Silver Nano Wire (SNW) 1 (as shown in fig. 3) as a transparent conductor made of a conductive material instead of ITO. Compared with ITO, the nano metal wire not only has good optical, electrical and mechanical properties, but also has the characteristics of large surface area of the metal nano wire, quantum size effect and the like. However, the adhesion of the present nano-metal wires is poor.
Disclosure of Invention
The invention aims to provide a conductive laminated structure, a preparation method thereof, a display panel and a display device, so as to improve the adhesion of a nano metal wire and improve the ultraviolet resistance of the nano metal wire layer.
To solve the above technical problem, the present invention provides a conductive laminated structure, including:
a substrate; and
a layer of nano-metal wires on the substrate, the layer of nano-metal wires doped with an optically transparent resin that does not contain a photoinitiator.
Optionally, for the conductive laminated structure, the dielectric constant of the optically transparent resin without the photoinitiator is between 3 and 4.5.
Optionally, for the electrically conductive laminated structure, the photoinitiator-free optically transparent resin is a one-component polyurethane foam.
Optionally, for the conductive laminated structure, the conductive laminated structure further includes: a routing layer disposed on the nanowire layer.
Optionally, for the conductive stack, the substrate is plasma treated.
The invention also provides a preparation method of the conductive laminated structure, which comprises the following steps:
providing a substrate; and
forming a layer of a nanowire doped with an optically transparent resin without a photoinitiator on the substrate.
Alternatively, for the method of preparing the conductive stacked structure, the step of forming a nano-metal wire layer doped with an optically transparent resin without a photoinitiator on the substrate includes:
coating a nano-metal wire solution on the substrate;
coating optically transparent resin on the substrate coated with the nano metal wire solution, wherein the volume ratio of the optically transparent resin to the nano metal wire solution is 2: 1-3: 1; and
heating and cooling to solidify, obtaining the nanowire layer.
Optionally, with respect to the method for preparing a conductive stacked structure, after obtaining the nanowire layer, the method further includes:
patterning the layer of nanowire metal layers; and
a routing layer is disposed at an upper edge of the patterned layer of nanometal lines.
Optionally, for the method for preparing a conductive stacked structure, after providing a substrate, before forming a nanowire layer on the substrate, the method further includes:
and carrying out plasma treatment on the substrate.
The present invention also provides a display panel including:
a cover plate;
a glue layer; and
the adhesive layer bonds the cover plate and the conductive laminated structure as described above.
The present invention also provides a display device including:
the conductive laminated structure as described above.
The invention provides a conductive laminated structure and a preparation method thereof, comprising a substrate; and a nano-metal wire layer on the substrate, the nano-metal wire layer being doped with an optically transparent resin not containing a photoinitiator. Therefore, the adhesive force of the nano metal wire layer can be improved, the stripping phenomenon is prevented, and the ultraviolet resistance of the nano metal wire layer can be improved.
Furthermore, the dielectric constant of the optical transparent resin without the photoinitiator is between 3 and 4.5, so that the conductivity of the nano metal wire layer and the routing can be improved;
further, the adhesion of the nanowire layer may be enhanced by plasma treatment of the substrate.
Drawings
Fig. 1 is a schematic cross-sectional view of a conductive stacked structure formed in an embodiment of the invention.
Fig. 2 is a schematic cross-sectional view of a conductive stack structure formed in another embodiment of the present invention.
FIG. 3 is a micrograph of a nano-metal wire;
FIG. 4 is a flow chart of a method for fabricating a conductive stack structure according to an embodiment of the present invention;
fig. 5-11 are schematic diagrams illustrating steps in a method for manufacturing a conductive stacked structure according to an embodiment of the invention.
Detailed Description
The conductive laminate structure and the method of making the same of the present invention will now be described in more detail with reference to the schematic drawings, in which preferred embodiments of the invention are shown, it being understood that one skilled in the art may modify the invention herein described while still achieving the advantageous effects of the invention. Accordingly, the following description should be construed as broadly as possible to those skilled in the art and not as limiting the invention.
The invention is described in more detail in the following paragraphs by way of example with reference to the accompanying drawings. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
In the description that follows, it will be understood that when a layer (or film), region, pattern, or structure is referred to as being "on" a substrate, layer (or film), region, and/or pattern, it can be directly on another layer or substrate, and/or intervening layers may also be present. In addition, it will be understood that when a layer is referred to as being "under" another layer, it can be directly under the other layer, and/or one or more intervening layers may also be present. In addition, references to "on" and "under" layers may be made based on the drawings.
As shown in fig. 1, in one embodiment of the present invention, there is provided a conductive laminated structure including: a substrate; and a nano-metal wire layer 12 doped with an optically transparent resin without a photoinitiator on the substrate.
In one embodiment, the substrate comprises a glass substrate 10, and a flexible material substrate 11 on the glass substrate 10. The flexible material substrate 11 is subjected to plasma treatment. The specific choice of the substrate will be described below, and is not particularly limited herein.
In one embodiment, the dielectric constant of the optically transparent resin without the photoinitiator is between 3 and 4.5. For example, the photoinitiator-free optically transparent resin is a one-component polyurethane foam. The photo-initiator-free optically transparent resin is doped in the nano metal wire layer 12, so that the adhesive force of the nano metal wire layer 12 can be improved, the peeling phenomenon can be prevented, and the ultraviolet resistance of the nano metal wire layer 12 can be improved.
As shown in fig. 2, the conductive laminated structure further includes: a routing layer 13, the routing layer 13 being disposed on the nanowire layer 12. The dielectric constant of the optical transparent resin without the photoinitiator is between 3 and 4.5, so that the conductivity of the nano metal wire layer 12 and the routing wire 13 can be improved.
The nano-metal wires in the nano-metal wire layer 12 may be nano-wires of gold (Au), silver (Ag), platinum (Pt), copper (Cu), cobalt (Co), palladium (Pd), etc. The nano metal wire is preferably a silver nanowire (i.e., nano silver wire) 1, as shown in fig. 3, because silver has characteristics of good conductivity and light transmittance.
Further, as shown in fig. 4, an embodiment of the present invention further provides a method for manufacturing a conductive stacked structure, including the following steps:
step S11, providing a substrate; and
step S12, forming a nano-metal wire layer doped with an optically transparent resin not containing a photoinitiator on the substrate.
By adopting the method, the adhesive force of the nano metal wire layer can be improved, the stripping phenomenon can be prevented, and the ultraviolet resistance of the nano metal wire layer can be improved.
The following examples of the conductive laminated structure and the method for manufacturing the same are given to clearly illustrate the contents of the present invention, and it should be understood that the contents of the present invention are not limited to the following examples, and other modifications by conventional technical means of those skilled in the art are also within the scope of the idea of the present invention.
Referring to fig. 5-6, for step S11, a substrate is provided. In one embodiment, the substrate may be a rigid material, such as a glass substrate, a silicon substrate, a metal substrate, or the like. In one embodiment, the substrate may also be a flexible material, and the material of the substrate may be, but is not limited to, acryl, polymethyl methacrylate (PMMA), polyacrylonitrile-butadiene-styrene (ABS), Polyamide (PA), Polyimide (PI), polybenzimidazole Polybutylene (PB), polybutylene terephthalate (PBT), Polycarbonate (PC), polyether ether ketone (PEEK), Polyetherimide (PEI), polyether sulfone (PES), Polyethylene (PE), polyethylene terephthalate (PET), polyethylene tetrafluoroethylene (ETFE), polyethylene oxide, polyglycolic acid (PGA), polymethylpentene (PMP), Polyoxymethylene (POM), polyphenylene ether (PPE), polypropylene (PP), Polystyrene (PS), Polytetrafluoroethylene (PTFE), Polyurethane (PU), polyvinyl chloride (PVC), polyvinyl fluoride (PVF), or polyvinyl chloride (PVF), Polyvinylidene chloride (PVDC), polyvinylidene fluoride (PVDF), or styrene-acrylonitrile (SAN), and the like. In this embodiment, for example, a glass substrate 10 is provided, and then a flexible material substrate 11 is formed on the glass substrate 10. The substrate of the present invention is not limited to the above examples, and may be made of other materials.
It will be appreciated that in a preferred embodiment, the substrate is pre-treated to remove impurities such as particulates, organics and metal ions therefrom.
Referring to fig. 7, after the substrate is provided, the substrate is subjected to a plasma treatment 20. For example, the flexible material substrate 11 is subjected to plasma treatment, so that the adhesion of the subsequently formed nanowire layer can be enhanced.
In one embodiment, the plasma treatment is to use nitrogen and/or compressed air, generate high-energy disordered plasma by a radio frequency power supply, and bombard the surface of a treated product (here, the substrate, such as the flexible material substrate 11) by the plasma, so as to achieve the purpose of cleaning, so as to improve the adhesion of a subsequently formed nano-metal wire layer. For example: for the case of using a mixture comprising nitrogen and compressed air, the volume ratio of nitrogen to compressed air may be about 450:1 to 550:1, such as 500: 1. The cleaning height can be 5-10 mm, the cleaning time can be 5-10 s, and the moving speed of the substrate and the plasma emission end in the relative transverse movement parallel to the plane of the top surface of the substrate in the plasma treatment process can be 20-30 mm/s, such as 22mm/s, 25mm/s, 27mm/s and the like, so as to obtain better treatment effect.
Referring to fig. 8 to 9, for step S12, a nano-metal wire layer 12 is formed on the substrate, and the nano-metal wire layer 12 is doped with an optically transparent resin without a photoinitiator.
Specifically, this step S12 includes:
coating a nano-metal wire solution 30 on the substrate;
coating an optically transparent resin 40 on the substrate coated with the nano-metal wire solution 30; and
heated and cooled to be solidified, and the nanowire layer 12 is obtained.
The nano-metal wire solution 30 has a plurality of nano-metal wires therein, and the nano-metal wires are distributed in a solvent.
The concentration of the nano-wire solution 30 may be 0.01mg/m L-10 mg/m L, such as 0.05mg/m L0, 0.1mg/m L1, 0.5mg/m L2, 1mg/m L3, 2mg/m L, 3mg/m L, 4mg/m L, 5mg/m L, 6mg/m L, 7mg/m L, 8mg/m L, 9mg/m L, etc. those skilled in the art can flexibly select the concentration of the nano-wire solution 30 according to actual process capability and product requirements.
The solvent may be water, aqueous solution, organic solvent, inorganic solvent, ionic solution, salt-containing solution, supercritical fluid, oil, or a mixture thereof, and the like. The solvent may also contain other additives, such as, but not limited to, dispersants, surfactants, cross-linking agents, wetting agents, or thickeners.
The nano-metal wires in the nano-metal wire solution 30 may be nano-wires of gold (Au), silver (Ag), platinum (Pt), copper (Cu), cobalt (Co), palladium (Pd), etc. Since silver has characteristics of good conductivity and light transmittance, the nano metal wire is preferably a silver nanowire (i.e., a nano silver wire), and the nano metal wire solution 30 is preferably a nano silver wire solution.
The coating of the nanowire solution 30 may be accomplished using conventional techniques. For example, methods of coating include, but are not limited to: inkjet, broadcast, gravure, letterpress, flexography, nanoimprint, screen printing, blade coating, spin coating, pin drawing (stylus), slot coating, or flow coating.
The optically transparent resin 40 is optically transparent resin without photoinitiator, such as OCF (one-component polyurethane foam), and the dielectric constant of the optically transparent resin 40 without photoinitiator is between 3 and 4.5.
The optically transparent resin 40 may be applied by any of the above-described methods of applying the nanowire solution 30.
After coating, the optically transparent resin 40 and the nano-metal wire solution 30 can be mutually infiltrated and fused, and after curing, the desired nano-metal wire layer 12 can be obtained.
After the optically transparent resin 40 is coated, the electrical conductivity between the formed nano-wire layer 12 and the trace formed later can be improved.
In one embodiment, in order to obtain a better doping effect, i.e., better adhesion of the doped nano-metal wire layer 12, the optically transparent resin 40 and the nano-metal wire solution 30 may be used in a volume ratio of 2:1 to 3:1, which is obtained before coating, the volume of the optically transparent resin 40 is converted according to the volume of the applied nano-metal wire solution 30, and a corresponding volume of the optically transparent resin 40 is coated on the nano-metal wire layer 12. .
The nanowire layer 12 is obtained in a solidified form by heating and cooling in the present invention. In one embodiment, the heating may be performed by direct heating or hot air heating, and the like, the heating temperature is about 50 ℃ to 60 ℃, for example, 55 ℃, and the like, the heating time may be 3min to 5min, for example, 200s, 220s, 250s, 280s, and the like, and the heating may be performed in an incubator; after the heating is completed, the mixture may be naturally cooled to room temperature (e.g., a standard temperature range in a clean room), or may be cooled to room temperature by blowing air or the like, thereby achieving solidification.
During heating, the nano metal wires and the optically transparent resin 40 can be fused more uniformly, so that after curing, the nano metal wires can be fixed better, and the nano metal wires are not easy to delaminate or peel.
The heating and cooling curing method can avoid the interference of ultraviolet rays on the nano metal wires, thereby improving the ultraviolet resistance of the nano metal wire layer 12. Namely, the ultraviolet curing mode is not needed in the invention.
Referring to fig. 10 and 11, after obtaining the nanowire layer 12, the method further includes:
patterning the nanowire layer 12; and
a routing layer 13 is provided at the upper edge of the patterned nanowire layer 12.
The patterning process and the arrangement of the routing layer 13 may be performed by the prior art and will not be described in detail here.
In addition, in the invention, the adhesive force of the nano metal wire layer 12 is improved by introducing the optical transparent resin without containing the photoinitiator, so that an optical adhesive layer is not required to be arranged between the nano metal wire layer 12 and the wiring layer 13, so that the nano metal wire layer 12 is directly contacted with the wiring layer 13, the contact resistance is reduced, and the conductive capability is improved.
In addition, the embodiment of the invention also provides a display panel, which comprises a cover plate; a glue layer; and the conductive laminated structure is as described above, and the glue layer is used for bonding the cover plate and the conductive laminated structure.
The display panel can be applied to any product or component with a display function, such as a mobile phone, a tablet personal computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.
The embodiment of the invention also provides a touch panel which comprises the conductive laminated structure.
The touch panel can be applied to any product or component with a touch operation function, such as a mobile phone, a tablet personal computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.
The display panel may include the touch panel, for example.
An embodiment of the present invention further provides a display device, including the conductive laminated structure described above. For example, the display device may be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, and a navigator.
In summary, the conductive stacked structure and the method for manufacturing the same provided by the invention include a substrate; and a nano-metal wire layer on the substrate, the nano-metal wire layer being doped with an optically transparent resin not containing a photoinitiator. Therefore, the adhesive force of the nano metal wire layer can be improved, the stripping phenomenon is prevented, and the ultraviolet resistance of the nano metal wire layer can be improved.
Furthermore, the dielectric constant of the optical transparent resin without the photoinitiator is between 3 and 4.5, so that the conductivity of the nano metal wire layer and the routing can be improved;
further, the adhesion of the nanowire layer may be enhanced by plasma treatment of the substrate.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (6)
1. An electrically conductive laminated structure, comprising:
the substrate is subjected to plasma treatment, the plasma treatment adopts nitrogen and compressed air, and the volume ratio of the nitrogen to the compressed air is 450: 1-550: 1, the distance between the substrate and a plasma emission end is 5-10 mm, the moving speed of the plasma emission end in the relative transverse movement parallel to the plane of the top surface of the substrate is 20-30 mm/s, and the cleaning time is 5-10 s; and
the nano metal wire layer is positioned on the substrate and doped with optical transparent resin without photoinitiator, the dielectric constant of the optical transparent resin without photoinitiator is between 3 and 4.5, and the optical transparent resin without photoinitiator is single-component polyurethane foam.
2. The conductive laminate structure of claim 1, further comprising: a routing layer disposed on the nanowire layer.
3. A method of making a conductive laminate structure, comprising:
providing a substrate, and carrying out plasma treatment on the substrate, wherein the plasma treatment adopts nitrogen and compressed air, and the volume ratio of the nitrogen to the compressed air is 450: 1-550: 1, the distance between the substrate and a plasma emission end is 5-10 mm, the moving speed of the plasma emission end in the relative transverse movement parallel to the plane of the top surface of the substrate is 20-30 mm/s, and the cleaning time is 5-10 s; and
forming a nano metal wire layer on the substrate, wherein the nano metal wire layer is doped with optical transparent resin without a photoinitiator, the dielectric constant of the optical transparent resin without the photoinitiator is between 3 and 4.5, and the optical transparent resin without the photoinitiator is single-component polyurethane foam.
4. The method of preparing a conductive laminate structure according to claim 3, wherein the step of forming a layer of nanometal lines on the substrate comprises:
coating a nano-metal wire solution on the substrate;
coating optically transparent resin on the substrate coated with the nano metal wire solution, wherein the volume ratio of the optically transparent resin to the nano metal wire solution is 2: 1-3: 1; and
heating and cooling to solidify, obtaining the nanowire layer.
5. A display panel, comprising:
a cover plate;
a glue layer; and
the conductive laminate structure of any one of claims 1-2, the glue layer bonding the cover sheet and the conductive laminate structure.
6. A display device, comprising:
the conductive laminate structure of any one of claims 1-2.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103985434A (en) * | 2014-05-05 | 2014-08-13 | 清华大学深圳研究生院 | Manufacturing method of transparent conducting film and transparent conducting film |
| CN104637570A (en) * | 2015-01-29 | 2015-05-20 | 深圳市东丽华科技有限公司 | Flexible transparent conductive thin film and preparation method thereof |
| CN105955530A (en) * | 2016-04-29 | 2016-09-21 | 信利光电股份有限公司 | Touch screen manufacturing method, touch screen and touch display device |
| CN106279740A (en) * | 2016-08-19 | 2017-01-04 | 清华大学深圳研究生院 | A kind of resin compound, nesa coating and preparation method thereof |
| CN107993747A (en) * | 2017-11-23 | 2018-05-04 | 清华大学深圳研究生院 | A kind of nesa coating, conductive structure and preparation method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI230832B (en) * | 2003-01-24 | 2005-04-11 | Sipix Imaging Inc | Novel adhesive and sealing layers for electrophoretic displays |
| WO2010114793A2 (en) * | 2009-04-03 | 2010-10-07 | Ciba Corporation | Devices containing compositions comprising cathodically coloring electrochromic polymers and binder polymers |
| DE102010045149A1 (en) * | 2010-09-11 | 2012-03-15 | Bayer Material Science Ag | Coating based on polyurethane for display areas |
-
2018
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103985434A (en) * | 2014-05-05 | 2014-08-13 | 清华大学深圳研究生院 | Manufacturing method of transparent conducting film and transparent conducting film |
| CN104637570A (en) * | 2015-01-29 | 2015-05-20 | 深圳市东丽华科技有限公司 | Flexible transparent conductive thin film and preparation method thereof |
| CN105955530A (en) * | 2016-04-29 | 2016-09-21 | 信利光电股份有限公司 | Touch screen manufacturing method, touch screen and touch display device |
| CN106279740A (en) * | 2016-08-19 | 2017-01-04 | 清华大学深圳研究生院 | A kind of resin compound, nesa coating and preparation method thereof |
| CN107993747A (en) * | 2017-11-23 | 2018-05-04 | 清华大学深圳研究生院 | A kind of nesa coating, conductive structure and preparation method thereof |
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