CN108957955B - White color resistor, preparation method thereof and array substrate - Google Patents
White color resistor, preparation method thereof and array substrate Download PDFInfo
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- CN108957955B CN108957955B CN201810916012.7A CN201810916012A CN108957955B CN 108957955 B CN108957955 B CN 108957955B CN 201810916012 A CN201810916012 A CN 201810916012A CN 108957955 B CN108957955 B CN 108957955B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- C—CHEMISTRY; METALLURGY
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- G02F1/133509—Filters, e.g. light shielding masks
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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Abstract
The invention discloses a W color resistor and a preparation method thereof, wherein the preparation method comprises the following steps: adding lignin epoxy resin, alkali-soluble resin, an ethylene unsaturated group compound and a photoinitiator into a solvent for dissolving to obtain the photosensitive resin composition W color resistance. The invention also discloses an array substrate, which comprises the following steps: providing a glass substrate; and forming a plurality of pixel units arranged in an array on a glass substrate, wherein each pixel unit comprises an R sub-pixel, a G sub-pixel, a B sub-pixel and a W sub-pixel, and the W sub-pixel is made of the W color resistor. The invention discloses a W color resistor, a preparation method thereof and an array substrate, and aims to solve the problem of color cast in an RGBW display panel.
Description
Technical Field
The invention relates to the technical field of liquid crystal display, in particular to a W color resistor, a preparation method thereof and an array substrate.
Background
The display with fine image quality and low power consumption is always the target of research personnel and consumers in the industry, and most of products with display function in the market, such as televisions, mobile phones, tablet computers, notebook computers, and the like, have the defects of high power consumption, insufficient brightness, and the like. The transmittance and the mixing efficiency of the existing mixed display mode of three primary colors of Red (Red), Green (Green) and Blue (Blue) are low, so that the power consumption of the display panel is high, and the optimization of the display panel is restricted. The RGBW lcd is a display unit which is formed by adding a White (White) Sub-Pixel on the basis of the existing RGB three-primary Sub-Pixel (Sub Pixel) structure and then changing the White (White) Sub-Pixel into a four-primary Sub-Pixel structure. Wherein W is transparent photoresist, and the light transmittance can reach more than 99%. Due to the addition of the W sub-pixel, the light transmittance of the display is greatly improved.
However, in the RGBW display panel, since the white purity mixed by the R, G, B three primary color sub-pixels is different from the white purity of the W sub-pixel, the white color of the whole RGBW display panel is shifted from the white color of the display panel with only the RGB three primary color sub-pixel structure, so that the display effect has a bluish texture. Specifically, as shown in fig. 1, the white color(s) of the RGBW display panel is a mixture of the white color (s1) composed of three R + G + B sub-pixels and the white color (s2) of the W sub-pixel, and when s2 is different from s1, the white point coordinate of s and the white point coordinate (s') of the RGB display panel are shifted, and the x and y values of the white point coordinate are both small. Generally speaking, in the CIE1931 coordinate system, the white point coordinate of s pure color shifts to blue than the white point coordinate of s', thereby affecting the quality of RGBW panel display.
Disclosure of Invention
In view of the defects in the prior art, the invention provides a W color resistor, a preparation method thereof and an array substrate, so as to solve the problem of color cast in an RGBW display panel.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention aims to provide a preparation method of W color resistance, which comprises the following steps:
adding lignin epoxy resin, alkali-soluble resin, an ethylene unsaturated group compound and a photoinitiator into a solvent for dissolving to obtain the photosensitive resin composition W color resistance.
Preferably, the step further comprises adding a surfactant to the solvent for dissolution.
Preferably, the solvent is propylene glycol methyl ether acetate; and/or the presence of a gas in the gas,
the ethylenically unsaturated group compound is a combination of p-cumylphenyl (meth) acrylate and 5-ethyl-5- (acryloyloxymethyl) -1, 3-dioxane; and/or the presence of a gas in the gas,
the photoinitiator is 1- [ 9-ethyl-6- (2-methylbenzoyl) -9H-carbazole-3-substituent ] -ethane ketone-1- (O-acetyl oxime).
Preferably, the preparation process of the lignin epoxy resin comprises the following steps:
adding bisphenol A into epichlorohydrin or methyl epichlorohydrin or epoxypropanol, and dissolving to obtain a reaction system; wherein the ratio of the amount of epichlorohydrin or methyl epichlorohydrin or epoxypropanol to the amount of hydroxyl in the bisphenol A is 5: 1-10: 1;
preparing a lignin alkali solution;
adding the lignin alkali solution into the reaction system, uniformly mixing, keeping at 55-60 ℃ for 2-5 h, and separating to obtain crude resin;
and dissolving the crude resin in a first alkali solution after dissolving, uniformly mixing, keeping the mixture at the temperature of 60-65 ℃ for 2-5 hours, and neutralizing and purifying to obtain the lignin epoxy resin.
Preferably, the preparation method of the lignin alkali solution comprises the following steps: adding lignin into a second alkali solution with the mass concentration of 2-8%, and uniformly mixing to obtain a lignin alkali solution, wherein the mass concentration of alkali in the lignin alkali solution is 2-8%.
Preferably, the mass concentration of the first alkali solution is 2-8%.
The invention also aims to provide the W color resist, which comprises a solvent, lignin epoxy resin, alkali soluble resin, an ethylene unsaturated group compound and a photoinitiator dissolved in the solvent.
Preferably, the solvent is propylene glycol methyl ether acetate; and/or the presence of a gas in the gas,
the ethylenically unsaturated group compound is a combination of p-cumylphenyl (meth) acrylate and 5-ethyl-5- (acryloyloxymethyl) -1, 3-dioxane; and/or the presence of a gas in the gas,
the photoinitiator is 1- [ 9-ethyl-6- (2-methylbenzoyl) -9H-carbazole-3-substituent ] -ethane ketone-1- (O-acetyl oxime).
Preferably, the lignin epoxy resin is an epoxy resin polymerized with lignin.
The invention further provides an array substrate, which comprises a glass substrate and a plurality of pixel units arrayed on the glass substrate, wherein each pixel unit comprises an R sub-pixel, a G sub-pixel, a B sub-pixel and a W sub-pixel, and the W sub-pixel is made of the W color resistance.
Compared with the prior art, according to the W color resistor, the preparation method thereof and the array substrate, lignin is added into a W photoresist system, and on the premise of keeping the original total light transmittance unchanged, the W color resistor light transmittance spectrum moves towards the long wave direction, so that the blue light transmittance part in the W color resistor light transmittance spectrum is reduced, W is slightly yellowish, the blue white point coordinate compensation effect is achieved, and the color shift problem in an RGBW display panel is solved. And the lignin is widely available, the storage capacity of the lignin is second to that of cellulose in nature, and the lignin is regenerated at the speed of 500 hundred million tons every year. Meanwhile, as the lignin has more phenolic hydroxyl groups and higher chemical activity, the lignin can directly react with Epoxy Chloropropane (ECH) to prepare the soluble epoxy resin without purification and modification.
Drawings
FIG. 1 is a coordinate value of a white point in RGBW in the prior art;
FIG. 2 is a flow chart of the preparation of lignin epoxy resin in the preparation method of W color resists according to the embodiment of the invention;
FIG. 3 is a graph comparing the transmission spectra of films with and without lignin added.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The W color resistance comprises a solvent, lignin epoxy resin, alkali soluble resin, an ethylene unsaturated group compound and a photoinitiator which are dissolved in the solvent, and preferably, a surfactant can be added. Wherein the lignin epoxy resin is an epoxy resin polymerized with lignin. Adding lignin polymer into the W color resistance raw material system, and further forming high polymer with epoxy resin. The lignin structure contains conjugated double bond groups, so that the maximum absorption peak of the light transmittance of the polymer is shifted from 360nm red to 460nm, the blue light-transmitting part (refer to fig. 3) in the W color-resistance light transmittance spectrum is reduced, W is slightly yellowish, and the effect of blue white point coordinates can be compensated.
Preferably, 100 parts by weight of lignin epoxy resin, 50-200 parts by weight of alkali-soluble resin, 5-50 parts by weight of compound with ethylene unsaturated group, 1-5 parts by weight of photoinitiator and 0-5 parts by weight of surfactant are dissolved in 300-500 parts by weight of solvent to obtain the photosensitive resin composition W color resistance.
Preferably, the solvent is propylene glycol methyl ether acetate; the ethylenically unsaturated group compound is a combination of p-cumylphenyl (meth) acrylate and 5-ethyl-5- (acryloyloxymethyl) -1, 3-dioxane; the photoinitiator is 1- [ 9-ethyl-6- (2-methylbenzoyl) -9H-carbazole-3-substituent ] -ethane ketone-1- (O-acetyl oxime). The surfactant is SF-8427.
Specifically, 100 parts by weight of lignin epoxy resin, 100 parts by weight of alkali-soluble resin, 15 parts by weight of p-cumylphenyl (meth) acrylate, 5 parts by weight of 5-ethyl-5- (acryloyloxymethyl) -1, 3-dioxane, 5 parts by weight of 1- [ 9-ethyl-6- (2-methylbenzoyl) -9H-carbazole-3-substituent ] -methanone-1- (O-acetyl oxime), and 1 part by weight of SF-8427 were added to 400 parts by weight of propylene glycol monomethyl ether acetate, and stirred uniformly by a shaking stirrer, thereby obtaining a photosensitive resin composition W transparent color resist material.
Illustratively, the alkali-soluble resin may also be: acrylate compounds having a tricyclodecane skeleton such as dicyclopentanyl (meth) acrylate (trade name FA-513A, FA-513M, manufactured by Hitachi chemical industries, Ltd.), tricyclo [5.2.1.02,6] dec-8-yl acrylate (trade name FA-511A, manufactured by Hitachi chemical industries, Ltd.), 2- (tricyclo [5.2.1.02,6] dec-3-en-8 (9) -oxy) ethyl (dicyclopentenyloxyethyl (meth) acrylate, trade name FA-512A, FA-512M, manufactured by Hitachi chemical industries, Ltd.), and the like,
illustratively, the ethylenically unsaturated group compound may also be: trimethylolpropane triacrylate, ethylene oxide modified trimethylolpropane triacrylate, propylene oxide modified trimethylolpropane triacrylate, pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate, dipentaerythritol pentaacrylate, dipentaerythritol tetraacrylate, caprolactone modified dipentaerythritol hexaacrylate, ditrimethylolpropyl tetraacrylate, propylene oxide modified glycerol triacrylate, trimethylolpropane triacrylate, dipentaerythritol tetraacrylate, dipentaerythritol hexaacrylate, or any combination of the foregoing.
Illustratively, the photoinitiator may also be: 2-hydroxy-2-methyl-1-phenyl-1-acetone, 1-hydroxy-cyclohexyl phenyl ketone and 2-methyl-1- [ 4-methylthiophenyl ] -2-morpholinyl-1-acetone are respectively mixed with benzophenone.
Illustratively, the surfactant may also be: polyethoxyalkyl ethers (polyoxylethylene alkyl ethers) such as polyethoxyethyl lauryl ether, polyethoxy stearyl ether and polyethoxy base oil ether; polyethoxyalkylphenyl ethers such as polyethoxyoctylphenyl ether and polyethoxynonylphenyl ether; polyethylene glycol diesters such as polyethylene glycol dilaurate and polyethylene glycol distearate; sorbitan fatty acid esters; fatty acid modified polyesters; or tertiary amine modified polyurethanes. The above surfactants may be used alone or in combination of plural kinds.
Illustratively, the solvent may also be: ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, diethylene glycol mono-n-propyl ether, diethylene glycol mono-n-butyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol mono-n-propyl ether, dipropylene glycol mono-n-butyl ether, tripropylene glycol monomethyl ether or tripropylene glycol monoethyl ether or the like, ethylene glycol methyl ether acetate, ethylene glycol ethyl ether acetate or propylene glycol methyl ether acetate or propylene glycol ethyl ether acetate, specific examples of diethylene glycol alkyl ethers include diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether or the like and tetrahydrofuran or the like, specific examples of ketones include methyl ethyl ketone, cyclohexanone, 2-heptanone, 3-heptanone, diacetone alcohol or the like, one or more of the above substances.
The embodiment also provides a method for preparing the W color resistor, and specifically, the method for preparing the W color resistor comprises the following steps:
adding lignin epoxy resin, alkali-soluble resin, an ethylene unsaturated group compound and a photoinitiator into a solvent for dissolving to obtain the photosensitive resin composition W color resistance. Wherein, the lignin epoxy resin, the alkali soluble resin, the compound of ethylene unsaturated group and the photoinitiator can be respectively added into the solvent in the adding process, and can be added into the solvent together.
Preferably, the surfactant is added to the lignin epoxy resin, the alkali-soluble resin, the ethylenically unsaturated compound, and the photoinitiator for dissolution.
Referring to fig. 2, the preparation process of the lignin epoxy resin comprises the following steps:
s11, adding bisphenol A into epichlorohydrin or methyl epichlorohydrin or epoxypropanol, and dissolving to obtain a reaction system; wherein the ratio of the amount of epichlorohydrin or methyl epichlorohydrin or epoxypropanol to the amount of hydroxyl in the bisphenol A is 5: 1-10: 1;
s12, preparing a lignin alkali solution; specifically, the preparation method of the lignin alkali solution comprises the following steps: adding lignin into a second alkali solution with the mass concentration of 2% -8%, and uniformly mixing to obtain a lignin alkali solution, wherein the mass concentration of alkali in the lignin alkali solution is 2% -8%, and the environment ensures that fewer byproducts are obtained.
S13, adding the lignin alkali solution into the reaction system, uniformly mixing, keeping the mixture at the temperature of 55-60 ℃ for 2-5 hours, and separating to obtain crude resin; the reaction environment in the range enables the reaction activity to be highest and byproducts to be less.
And S14, dissolving the crude resin in a first alkali solution, uniformly mixing, keeping the mixture at the temperature of 60-65 ℃ for 2-5 hours, and carrying out liquid separation, neutralization, washing and distillation to obtain the lignin epoxy resin. Wherein the mass concentration of the first alkali solution is 2-8%.
Wherein the chemical structure of the lignin in step S12 is:
lignin is a natural high molecular polymer with a three-dimensional structure, benzene rings and side chains of structural units of the lignin are connected with various groups, namely methoxy, phenolic hydroxyl, alcoholic hydroxyl, aromatic groups and other various active groups, and the groups are introduced into an epoxy resin polymer structure, and the maximum absorption peak of the light transmittance of the polymer is red-shifted from 360nm to 460nm due to conjugated double bond-containing groups (such as (3) and (6) marked in the chemical structure of the lignin) in the lignin structure.
Wherein in step S14:
neutralizing: by adding an acid (e.g. HCl/H)2SO4/HNO3Etc.) to perform acid-base neutralization reaction with redundant alkali in the system;
washing: dissolving and removing redundant impurities in a reaction system by using distilled water and the like;
liquid separation: is a method of operation in which two immiscible liquids are separated, the purpose here being to remove the water from the alkaline solution;
and (3) distillation: separating by utilizing different boiling points of the mixtures in the reaction system to obtain a target product, namely lignin epoxy resin; the low-boiling micromolecule by-products are removed; (the specific process can refer to the following steps of performing molecular distillation on the epoxy resin to be purified to obtain the low total chlorine epoxy resin, wherein the molecular distillation comprises the first-stage molecular distillation for removing substances with low boiling points in the resin to be purified and preheating for the second-stage molecular distillation, and the second-stage molecular distillation for separating a light component from a heavy component and removing a heteroterminal group to obtain the low total chlorine epoxy resin).
In the preparation method of the W color resist of this embodiment, for specific selections and specific dissolution ratios of the lignin epoxy resin alkali-soluble resin, the ethylenically unsaturated compound, the photoinitiator, the surfactant, and the solvent, reference may be made to the specific description of the W color resist, and further description thereof is omitted.
The red shift of the maximum absorption peak of the light transmittance is realized by using the stronger conjugated double bonds of the lignin structure, so that the problem of RGBW color cast can be solved on the premise of not reducing the light transmittance of the whole W transparent photoresist. Meanwhile, the lignin has more phenolic hydroxyl groups and higher chemical activity, can directly react with Epichlorohydrin (ECH) to prepare the soluble epoxy resin without purification and modification, and has the advantages of simple process, stability, low consumption, environmental protection and the like. Lignin is widely available, in nature, next to cellulose in reserves and is regenerated at a rate of 500 million tons per year.
The invention also provides an array substrate, which comprises a glass substrate and a plurality of pixel units arrayed on the glass substrate, wherein each pixel unit comprises an R sub-pixel, a G sub-pixel, a B sub-pixel and a W sub-pixel, and the W sub-pixel is made of the W color resistance.
Example 1
The W color resistance of the present embodiment includes: 100 parts by weight of lignin epoxy resin, 100 parts by weight of alkali-soluble resin, 15 parts by weight of p-cumylphenyl (meth) acrylate, 5 parts by weight of 5-ethyl-5- (acryloyloxymethyl) -1, 3-dioxane, 5 parts by weight of 1- [ 9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-substituent ] -methanone-1- (O-acetyloxime), and 1 part by weight of SF-8427 dissolved in 400 parts by weight of propylene glycol methyl ether acetate.
Correspondingly, the preparation method of the W color resistance of the embodiment includes:
100 parts by weight of the above lignin epoxy resin, 100 parts by weight of an alkali-soluble resin, 15 parts by weight of p-cumylphenyl (meth) acrylate, 5 parts by weight of 5-ethyl-5- (acryloyloxymethyl) -1, 3-dioxane, 5 parts by weight of 1- [ 9-ethyl-6- (2-methylbenzoyl) -9H-carbazole-3-substituent ] -methanone-1- (O-acetyloxime), and 1 part by weight of SF-8427 were dissolved in 400 parts by weight of propylene glycol monomethyl ether acetate and stirred uniformly by a shaking stirrer, to obtain a photosensitive resin composition W transparent color resist.
The preparation method of the lignin epoxy resin of the embodiment comprises the following steps:
adding bisphenol A (BPA) into a proper amount of Epoxy Chloropropane (ECH), wherein n (ECH) and n (-OH) are 8 in a preferred proportion, heating and dissolving at the temperature of 55-60 ℃, slowly adding an alkali solution of lignin into a reaction system, keeping the optimal alkali concentration at 5%, and keeping at the temperature of 55-60 ℃ for 4 hours after the addition is finished.
After removing the aqueous layer by liquid separation, excess ECH and water were distilled off under reduced pressure, and the crude resin was dissolved in a solvent. Adding alkali for the second time and keeping the temperature at 60-65 ℃ for 3 hours. And neutralizing, washing, separating and distilling to obtain the lignin epoxy resin.
Correspondingly, the array substrate of the embodiment comprises a glass substrate and a plurality of pixel units arranged on the glass substrate in an array manner, wherein each pixel unit comprises an R sub-pixel, a G sub-pixel, a B sub-pixel and a W sub-pixel, and the W sub-pixel is made of the W color resistance.
Referring to fig. 3, to further illustrate that the W color resistance with lignin added according to the present invention solves the problem of blue bias of RGBW display, the present embodiment forms two sets of thin films on a glass substrate by the same manufacturing method, wherein one set of thin film is formed by the W color resistance material with lignin added according to the present embodiment (i.e. W color resistance with lignin added), and the other set of thin film is formed by the ordinary W color resistance (i.e. W color resistance without lignin added), and the specific manufacturing steps are as follows:
a W transparent color resist film is obtained by coating on a glass substrate, wherein the coating method is not limited, and includes coating methods such as spray coating, roll coating, spin coating (spin coating), slit coating, bar coating, and ink jet coating, and preferably, the photosensitive resin composition is coated on a substrate to a thickness of 3 to 5 μm by using spin coating or slit coating.
Then, the solvent is removed by prebaking (prebake) to form a prebaked coating film. The prebaking conditions vary according to the kinds and mixing ratio of the components, and the temperature is usually 60-110 deg.C for 30 s-15 min.
After prebaking, exposing the coating film under a photomask by using but not limited to ultraviolet rays, far ultraviolet rays, X rays and charged particle beams as light rays for exposure; the ultraviolet ray may be, for example, g-line (wavelength: 436nm), h-line, i-line (wavelength: 365nm), etc. When ultraviolet rays are selected, ultraviolet irradiation means such as, but not limited to, high mercury lamps, ultra-high mercury lamps and metal halide lamps; preferably, the exposure amount is 40 to 100J/m2。
The development is carried out by immersing in a developer for 30 seconds to 2 minutes depending on the composition of the composition to remove unnecessary portions to form a specific pattern, and the developer component is preferably a KOH solution with a concentration of 0.042%.
Subsequently, a post bake (postbake) treatment is performed using a device such as a hot plate or an oven, and the coating film is cured. The post-bake temperature is typically 120 to 250 ℃. The post-baking time is adjusted depending on the type of the heating machine, and for example, the heating time using a hot plate is 5 to 30 minutes, and the heating time using an oven is 30 to 90 minutes. After the above treatment steps, a thin film can be formed.
Referring to fig. 3, a Lambda850 uv-vis spectrophotometer (manufactured by PERKINELMER usa) is used to measure the light transmittance spectra of two sets of thin films formed on a glass substrate, and the maximum transmittance peak position of the thin films is red shifted from about 360nm to 460nm after lignin is added, that is, only a small amount of light is transmitted in the blue region (380-480 nm) compared to the thin films without lignin, thereby solving the problem that the RGBW display is blue before the present invention.
According to the W color resistor, the preparation method thereof and the array substrate, lignin is added into a W photoresist system, and on the premise of keeping the original total light transmittance unchanged, the light transmittance spectrum of the W color resistor moves towards the long wave direction, so that the blue light transmittance part in the light transmittance spectrum of the W color resistor is reduced, W is slightly yellowish, the blue white point coordinate effect is compensated, and the problem of color cast in an RGBW display panel is solved. And the lignin is widely available, the storage capacity of the lignin is second to that of cellulose in nature, and the lignin is regenerated at the speed of 500 hundred million tons every year. Meanwhile, as the lignin has more phenolic hydroxyl groups and higher chemical activity, the lignin can directly react with Epoxy Chloropropane (ECH) to prepare the soluble epoxy resin without purification and modification.
The foregoing is merely a detailed description of the present application, and it should be noted that modifications and embellishments could be made by those skilled in the art without departing from the principle of the present application, and these should also be considered as the protection scope of the present application.
Claims (10)
1. A preparation method of white color resists is characterized by comprising the following steps:
adding lignin epoxy resin, alkali soluble resin, an ethylene unsaturated group compound and a photoinitiator into a solvent for dissolving to obtain a white color resistance of the photosensitive resin composition; the lignin is added, so that the white color resistance light transmission spectrum moves towards the long wave direction on the premise of keeping the original total light transmission rate unchanged, the blue light transmission part in the white color resistance light transmission spectrum is reduced, the white color is slightly yellow, and the white point coordinate is compensated to be blue.
2. The method for preparing white color resists according to claim 1, characterized in that the steps further comprise adding a surfactant to the solvent for dissolution.
3. The method for preparing white color resists according to claim 1, characterized in that the solvent is propylene glycol methyl ether acetate; and/or the presence of a gas in the gas,
the ethylenically unsaturated group compound is a combination of p-cumylphenyl (meth) acrylate and 5-ethyl-5- (acryloyloxymethyl) -1, 3-dioxane; and/or the presence of a gas in the gas,
the photoinitiator is 1- [ 9-ethyl-6- (2-methylbenzoyl) -9H-carbazole-3-substituent ] -ethane ketone-1- (O-acetyl oxime).
4. The method for preparing the white color resists according to any one of claims 1 to 3, wherein the preparation process of the lignin epoxy resin comprises the following steps:
adding bisphenol A into epichlorohydrin or methyl epichlorohydrin or epoxypropanol, and dissolving to obtain a reaction system; wherein the ratio of the amount of epichlorohydrin or methyl epichlorohydrin or epoxypropanol to the amount of hydroxyl in the bisphenol A is 5: 1-10: 1;
preparing a lignin alkali solution;
adding the lignin alkali solution into the reaction system, uniformly mixing, keeping at 55-60 ℃ for 2-5 h, and separating to obtain crude resin;
and dissolving the crude resin in a first alkali solution after dissolving, uniformly mixing, keeping the mixture at the temperature of 60-65 ℃ for 2-5 hours, and neutralizing and purifying to obtain the lignin epoxy resin.
5. The method for preparing white color resists according to claim 4, wherein the method for preparing the lignin alkali solution comprises: adding lignin into a second alkali solution with the mass concentration of 2% -8%, and uniformly mixing to obtain a lignin alkali solution, wherein the mass concentration of alkali in the lignin alkali solution is 2% -8%.
6. The method for preparing white color resists according to claim 4, wherein the mass concentration of the first alkali solution is 2-8%.
7. A white color resist is characterized in that the white color resist comprises a solvent, lignin epoxy resin, alkali soluble resin, an ethylene unsaturated group compound and a photoinitiator, wherein the lignin epoxy resin, the alkali soluble resin, the ethylene unsaturated group compound and the photoinitiator are dissolved in the solvent; the lignin is added, so that the white color resistance light transmission spectrum moves towards the long wave direction on the premise of keeping the original total light transmission rate unchanged, the blue light transmission part in the white color resistance light transmission spectrum is reduced, the white color is slightly yellow, and the white point coordinate is compensated to be blue.
8. The white color resist of claim 7, wherein the solvent is propylene glycol methyl ether acetate; and/or the presence of a gas in the gas,
the ethylenically unsaturated group compound is a combination of p-cumylphenyl (meth) acrylate and 5-ethyl-5- (acryloyloxymethyl) -1, 3-dioxane; and/or the presence of a gas in the gas,
the photoinitiator is 1- [ 9-ethyl-6- (2-methylbenzoyl) -9H-carbazole-3-substituent ] -ethane ketone-1- (O-acetyl oxime).
9. The white color resist of claim 7 or 8, wherein the lignin epoxy resin is an epoxy resin polymerized with lignin.
10. An array substrate, comprising a glass substrate and a plurality of pixel units arranged on the glass substrate in an array, wherein each pixel unit comprises an R sub-pixel, a G sub-pixel, a B sub-pixel and a white sub-pixel, and the white sub-pixel is made of the white resist according to any one of claims 7 to 9.
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| CN108255017A (en) * | 2016-12-29 | 2018-07-06 | 株式会社东进世美肯 | Negative photosensitive resin composition |
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| JP2017032789A (en) * | 2015-07-31 | 2017-02-09 | 株式会社Ｄｎｐファインケミカル | White colored composition for color filter, method for producing color filter, method for producing display device, color filter and display device |
| CN105304469A (en) * | 2015-09-25 | 2016-02-03 | 京东方科技集团股份有限公司 | Polyimide substrate, preparation method of polyimide substrate and flexible displayer |
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