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CN108949078A - A kind of method of modified phenolic resin adhesive - Google Patents

A kind of method of modified phenolic resin adhesive Download PDF

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Publication number
CN108949078A
CN108949078A CN201710358550.4A CN201710358550A CN108949078A CN 108949078 A CN108949078 A CN 108949078A CN 201710358550 A CN201710358550 A CN 201710358550A CN 108949078 A CN108949078 A CN 108949078A
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CN
China
Prior art keywords
phenolic resin
resin adhesive
modified phenolic
temperature
lignin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710358550.4A
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Chinese (zh)
Inventor
施晓旦
孙海强
邵威
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jining Ming Sheng New Material Co Ltd
Original Assignee
Jining Ming Sheng New Material Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jining Ming Sheng New Material Co Ltd filed Critical Jining Ming Sheng New Material Co Ltd
Priority to CN201710358550.4A priority Critical patent/CN108949078A/en
Publication of CN108949078A publication Critical patent/CN108949078A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/04Condensation polymers of aldehydes or ketones with phenols only
    • C09J161/06Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Phenolic Resins Or Amino Resins (AREA)

Abstract

The present invention provides a kind of methods of modified phenolic resin adhesive, comprising the following steps: phenolic resin adhesive is added into reaction kettle, stirs, heat temperature raising, and keep the temperature;Liquid alkaline is added into reaction kettle and adjusts pH to alkalinity, after heat temperature raising, adds lignin, and keep the temperature;Cooling, discharging.The method integrated artistic of the modified phenolic resin adhesive is simple, and operating procedure is few, is suitable for industrialization large-scale production;Preparing modified phenolic resin adhesive according to the present invention, cost is relatively low; it is reacted by lignin with traditional the further of phenolic resin adhesive; bonding strength further increases; free phenolic aldehyde is greatly lowered simultaneously; substantially reduce the discharge of aldehyde, phenolic compound; be conducive to environmental protection, therefore, there is good market and application prospect.

Description

A kind of method of modified phenolic resin adhesive
Technical field
The invention belongs to adhesive technology fields, and in particular to a kind of method of modified phenolic resin adhesive.
Background technique
As one of renewable resource the most abundant on the earth, lignin is widely present in seed plant, with cellulose The basic framework of plant is constituted with hemicellulose.For content, tellurian lignin accounts for about plant next in number only to cellulose The 20%~30% of weight of object is the second largest natural organic matter.Existing quantity is very huge in nature for lignin, estimates It counts the annual whole world and 150,000,000,000 t lignin can produce by plant growth, wherein generated in the cooking waste liquor of pulp and paper industry Industrial wood is known as 30,000,000 t.But current lignin is utilized well not yet, the whole world only about 6% lignin obtain To effective recycling.By-product of the lignin as wood hydrolysis industry and paper industry will be by if being not fully utilized One of the primary pollution source in paper industry is crossfaded into, then not only causes serious environmental pollution, but also also results in the huge of resource Big waste.
With the rapid development of China's industry of artificial boards, the yield of wood-based plate is prepared also on constantly using phenolic resin It rises.Synvaren adhesive strength is high, and has many advantages, such as excellent water resistance and weatherability, is suitable for production outdoor use Wood-based plate.But simultaneously and there are hot pressing time length, solidification temperature and cost of material height and there is harmful substance release.With Raw material phenol and formaldehyde to produce phenolic resin have the characteristics that non-renewable from petrochemical industry.Study renewable, performance The raw material that high energy substitutes phenol or formaldehyde to produce phenolic resin is always the target of adhesive industry.Especially, traditional phenolic aldehyde The preferable phenolic resin gluing of glue performance is made through polycondensation after a period of time under alkaline environment using formaldehyde, phenol in glue Agent, but since phenol price is higher, and phenol is larger to human injury, to limit the development of phenolic resin adhesive and answer With popularization.
Summary of the invention
In order to obtain the high-performance pnenolic aldehyde glue that a kind of bonding strength is high and free phenol aldehyde concentration is low, the present invention provides one kind The phenolic resin gluing traditional with modification is compounded with appropriate lignin by phenolic resin adhesive appropriate under alkaline condition The method of agent, the compound process react lignin further with free phenolic aldehyde, and it is (dense to can obviously reduce free phenolic content Degree), while improving bonding strength.
Therefore, the present invention provides following technical schemes:
A kind of method of modified phenolic resin adhesive, comprising the following steps:
S1: phenolic resin adhesive being added into reaction kettle, stirring, heat temperature raising, and keeps the temperature;
S2: liquid alkaline is added into reaction kettle and adjusts pH to alkalinity, after heat temperature raising, adds lignin, and keep the temperature;
S3: cooling, discharging.
Preferably, in the method for above-mentioned modified phenolic resin adhesive, the phenolic resin adhesive with it is described wooden The dry weight ratio of element is 1:3~1:8.For example, the dry weight ratio of the phenolic resin adhesive and the lignin is 1: 3, the dry weight ratio of the phenolic resin adhesive and the lignin is 1:4, further preferably 1:5, further excellent It is selected as 1:6, is still more preferably 1:7, is still more preferably 1:8.
Preferably, the range of the pH value of the alkalinity described in the step S2 of the method for above-mentioned modified phenolic resin adhesive It is 8 to 13, it is further preferred that the range of the pH value of the alkalinity is 9~12, most preferably 10~11.
Preferably, in the step S1 of the method for above-mentioned modified phenolic resin adhesive, 30 DEG C~50 DEG C are heated to, And 5~20min is kept the temperature at 30 DEG C~50 DEG C;It is highly preferred that being heated to 35 DEG C~45 DEG C, and protected at 35 DEG C~45 DEG C 5~20min of temperature.In addition, in step sl, the duration of stirring is 10~15min.
Preferably, in the step S2 of the method for above-mentioned modified phenolic resin adhesive, 40 DEG C~120 DEG C are heated to Afterwards, lignin is added, and keeps the temperature 20~90min at 40 DEG C~120 DEG C, further preferably 30~80min of heat preservation, more into one Step 40~70min of preferred heat preservation, most preferably 50~60min of heat preservation.
Preferably, in the step S3 of the method for above-mentioned modified phenolic resin adhesive, 20~25 DEG C is cooled to, is then gone out Material.
Therefore, compared with prior art, technical solution provided by the present invention at least has following advantageous effects: (1) the method integrated artistic of modified phenolic resin adhesive of the present invention is simple, and operating procedure is few, to reaction environment require compared with It is low, be suitable for industrialization large-scale production lower to worker's technical operation Capability Requirement;(2) wood used in the present invention Quality rises new material (Shandong) Co., Ltd by east and provides, and can be directly used for various experiment reactions, without carrying out any pretreatment, Meet Workshop Production requirement;(3) modified phenolic resin adhesive is prepared according to the present invention cost is relatively low, pass through lignin and tradition The further reaction of phenolic resin adhesive, bonding strength further increase, while free phenolic aldehyde is greatly lowered, and substantially reduces The discharge of aldehyde, phenolic compound is conducive to environmental protection, therefore, has good market and application prospect.
Specific embodiment
The present invention is further elaborated With reference to embodiment, but the present invention is not limited to following embodiment party Formula.
A kind of method of modified phenolic resin adhesive, comprising the following steps:
S1: phenolic resin adhesive being added into reaction kettle, stirring, heat temperature raising, and keeps the temperature;
S2: liquid alkaline is added into reaction kettle and adjusts pH to alkalinity, after heat temperature raising, adds lignin, and keep the temperature;
S3: cooling, discharging.
In a preferred embodiment, the dry weight ratio of the phenolic resin adhesive and the lignin be 1:3~ 1:8。
In a preferred embodiment, the range of the pH value of alkalinity described in step S2 is 8 to 13.
In a preferred embodiment, in step sl, 30 DEG C~50 DEG C are heated to, and is protected at 30 DEG C~50 DEG C 5~20min of temperature.
In a preferred embodiment, in step s 2, after being heated to 40 DEG C~120 DEG C, lignin is added, and 20~90min is kept the temperature at 40 DEG C~120 DEG C.
In a preferred embodiment, in step s3,20~25 DEG C are cooled to, is then discharged.
Phenolic resin adhesive rises new material (Shandong) Co., Ltd by east and provides, and solid content is 50wt% viscosity 450; Lignin rises new material (Shandong) Co., Ltd by east and provides;Adjusting liquid alkaline content used in pH is 32%;Free phenol is according to GB/ 3.13 detections in T14074-2006;Free aldehyde is according to 3.16 detections in GB/T14074-2006;Bonding strength uses poplar Wood is pressed into three-ply board, and is detected according to a) the I class glued board in 4.15 in 17567-1999;Burst size of methanal is according to GB/ 4.59 condensed steam waters detection in T17657-2013.
Embodiment 1
Modified phenolic resin adhesive is prepared according to the following steps:
S1: 150g phenolic resin adhesive being added into reaction kettle, and stirring is heated to 30 DEG C, and at this temperature Keep the temperature 10min;
S2: being added liquid alkaline into reaction kettle and adjust pH to 12, after being heated to 80 DEG C, add 50g lignin, and 90min is kept the temperature at a temperature of this;
S3: 25 DEG C of dischargings are cooled to get modified phenolic resin adhesive 1.
Embodiment 2
Modified phenolic resin adhesive is prepared according to the following steps:
S1: 160g phenolic resin adhesive being added into reaction kettle, and stirring is heated to 30 DEG C, and at this temperature Keep the temperature 10min;
S2: being added liquid alkaline into reaction kettle and adjust pH to 12, after being heated to 80 DEG C, add 40g lignin, and 90min is kept the temperature at a temperature of this;
S3: 25 DEG C of dischargings are cooled to get modified phenolic resin adhesive 2.
Embodiment 3
Modified phenolic resin adhesive is prepared according to the following steps:
S1: 167g phenolic resin adhesive being added into reaction kettle, and stirring is heated to 30 DEG C, and at this temperature Keep the temperature 10min;
S2: being added liquid alkaline into reaction kettle and adjust pH to 12, after being heated to 80 DEG C, add 33g lignin, and 90min is kept the temperature at a temperature of this;
S3: 25 DEG C of dischargings are cooled to get modified phenolic resin adhesive 3.
Embodiment 4
Modified phenolic resin adhesive is prepared according to the following steps:
S1: 171g phenolic resin adhesive being added into reaction kettle, and stirring is heated to 30 DEG C, and at this temperature Keep the temperature 10min;
S2: being added liquid alkaline into reaction kettle and adjust pH to 12, after being heated to 80 DEG C, add 29g lignin, and 90min is kept the temperature at a temperature of this;
S3: 25 DEG C of dischargings are cooled to get modified phenolic resin adhesive 4.
Embodiment 5
Modified phenolic resin adhesive is prepared according to the following steps:
S1: 175g phenolic resin adhesive being added into reaction kettle, and stirring is heated to 30 DEG C, and at this temperature Keep the temperature 10min;
S2: being added liquid alkaline into reaction kettle and adjust pH to 12, after being heated to 80 DEG C, add 25g lignin, and 90min is kept the temperature at a temperature of this;
S3: 25 DEG C of dischargings are cooled to get modified phenolic resin adhesive 5.
Embodiment 6
Modified phenolic resin adhesive is prepared according to the following steps:
S1: 178g phenolic resin adhesive being added into reaction kettle, and stirring is heated to 30 DEG C, and at this temperature Keep the temperature 10min;
S2: being added liquid alkaline into reaction kettle and adjust pH to 12, after being heated to 80 DEG C, add 22g lignin, and 90min is kept the temperature at a temperature of this;
S3: 25 DEG C of dischargings are cooled to get modified phenolic resin adhesive 6.
Meanwhile inventor has detected modified phenolic resin obtained in above embodiments 1~6 according further to relevant criterion respectively The free phenol of rouge adhesive 1~6, dissociate aldehyde, bonding strength, Form aldehyde release figureofmerit, and testing result see the table below 1:
Table 1
Note: bonding strength is the average strength of 12 sample planks.
Specific embodiments of the present invention are described in detail above, but it is merely an example, the present invention is simultaneously unlimited It is formed on particular embodiments described above.To those skilled in the art, any couple of present invention carries out equivalent modifications and Substitution is also all among scope of the invention.Therefore, without departing from the spirit and scope of the invention made by equal transformation and Modification, all should be contained within the scope of the invention.

Claims (6)

1. a kind of method of modified phenolic resin adhesive, which comprises the following steps:
S1: phenolic resin adhesive being added into reaction kettle, stirring, heat temperature raising, and keeps the temperature;
S2: liquid alkaline is added into reaction kettle and adjusts pH to alkalinity, after heat temperature raising, adds lignin, and keep the temperature;S3: cooling, Discharging.
2. the method for modified phenolic resin adhesive according to claim 1, which is characterized in that the phenolic resin gluing The dry weight ratio of agent and the lignin is 1:3~1:8.
3. the method for modified phenolic resin adhesive according to claim 1, which is characterized in that alkali described in step S2 Property pH value range be 8 to 13.
4. the method for modified phenolic resin adhesive according to claim 1, which is characterized in that in step sl, heating 30 DEG C~50 DEG C are warming up to, and keeps the temperature 5~20min at 30 DEG C~50 DEG C.
5. the method for modified phenolic resin adhesive according to claim 1, which is characterized in that in step s 2, heating After being warming up to 40 DEG C~120 DEG C, lignin is added, and keeps the temperature 20~90min at 40 DEG C~120 DEG C.
6. the method for modified phenolic resin adhesive according to claim 1, which is characterized in that in step s3, cooling To 20~25 DEG C, then discharge.
CN201710358550.4A 2017-05-19 2017-05-19 A kind of method of modified phenolic resin adhesive Pending CN108949078A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109680537A (en) * 2018-12-12 2019-04-26 济宁明升新材料有限公司 A kind of novel Coating combination glue and preparation method and its application in papermaking interlayer spray
WO2020132738A1 (en) * 2018-12-28 2020-07-02 Suzano S.A. Resole phenolic resins, processes of synthesis of said resins and use thereof
CN113322035A (en) * 2021-05-31 2021-08-31 江西亚太化工有限公司 Environment-friendly modified resin and application thereof in bamboo forming
CN113717673A (en) * 2021-09-28 2021-11-30 上海昶法新材料有限公司 Method for improving opening time of phenolic resin adhesive
US12122882B2 (en) 2020-11-13 2024-10-22 Wilsonart Llc Multi-part lignin-based resin system for decorative laminates

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101348698A (en) * 2008-09-12 2009-01-21 中国林业科学研究院林产化学工业研究所 Preparation method of alkali lignin-phenolic composite adhesive for wood industry
CN105754527A (en) * 2016-03-21 2016-07-13 常州大学 Phenolic resin adhesive containing demethylated lignin and preparation method of phenolic resin adhesive
US20160304757A1 (en) * 2015-04-15 2016-10-20 Fpinnovations High residual content (hrc) kraft/soda lignin as an ingredient in wood adhesives

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101348698A (en) * 2008-09-12 2009-01-21 中国林业科学研究院林产化学工业研究所 Preparation method of alkali lignin-phenolic composite adhesive for wood industry
US20160304757A1 (en) * 2015-04-15 2016-10-20 Fpinnovations High residual content (hrc) kraft/soda lignin as an ingredient in wood adhesives
CN105754527A (en) * 2016-03-21 2016-07-13 常州大学 Phenolic resin adhesive containing demethylated lignin and preparation method of phenolic resin adhesive

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109680537A (en) * 2018-12-12 2019-04-26 济宁明升新材料有限公司 A kind of novel Coating combination glue and preparation method and its application in papermaking interlayer spray
CN109680537B (en) * 2018-12-12 2021-06-15 济宁明升新材料有限公司 Novel interlayer bonding adhesive and preparation method thereof and application of novel interlayer bonding adhesive in spraying between papermaking layers
WO2020132738A1 (en) * 2018-12-28 2020-07-02 Suzano S.A. Resole phenolic resins, processes of synthesis of said resins and use thereof
CN113728052A (en) * 2018-12-28 2021-11-30 苏扎诺有限公司 Resol-type phenolic resin, synthesis method and application thereof
US12122882B2 (en) 2020-11-13 2024-10-22 Wilsonart Llc Multi-part lignin-based resin system for decorative laminates
CN113322035A (en) * 2021-05-31 2021-08-31 江西亚太化工有限公司 Environment-friendly modified resin and application thereof in bamboo forming
CN113717673A (en) * 2021-09-28 2021-11-30 上海昶法新材料有限公司 Method for improving opening time of phenolic resin adhesive

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Application publication date: 20181207