CN108933151B - Packaging structure and packaging method of image sensing chip - Google Patents

Abstract

The invention discloses a packaging structure and a packaging method of an image sensing chip, wherein the image sensing chip and a bracket structure for installing a lens module are respectively fixed on two sides of a light passing window, so that on one hand, the front surface of the image sensing chip is directly fixed with the surface of a packaging substrate, the front surface of the image sensing chip has better flatness relative to the back surface, the fixing and circuit interconnection of the front surface of the image sensing chip and the packaging substrate can be realized directly through a welding process, and the thickness of a fixing layer between the front surface of the image sensing chip and the packaging substrate can be accurately controlled, so that the imaging distance of the lens module relative to the image sensing chip can be accurately controlled; on the other hand, the light transmission window can be used as a reference position, so that the lens module and the image sensing chip can be arranged in a right opposite way. Therefore, the technical scheme of the invention can accurately align the lens module and the image sensing chip and improve the imaging quality of the packaging structure.

Description

A packaging structure and packaging method of an image sensing chip

Technical field

The present invention relates to the field of chip packaging technology, and more specifically, to a packaging structure and packaging method of an image sensing chip.

Background technique

With the continuous advancement of science and technology, more and more electronic devices with image acquisition functions are widely used in people's daily life and work, which has brought great convenience to people's daily life and work and has become an indispensable thing for people today. An essential tool that is indispensable. The main component of electronic equipment to realize the image acquisition function is the image sensor chip. In order to ensure the reliability and service life of the image sensor chip and avoid damage by external factors, the image sensor chip needs to be packaged and protected.

The image sensor chip needs to be packaged and protected together with the lens module. In the existing technology, when the image sensor chip and the lens module are integrated into the package, the image sensor chip is usually bound to the circuit board, and then the image sensor chip is bound to the circuit board. The lens module bracket is fixedly installed on the same side. The existing technology cannot accurately align the image sensor chip and the lens module when packaging the image sensor chip.

Contents of the invention

In order to solve the above problems, the technical solution of the present invention provides a packaging structure and packaging method of an image sensor chip, which can improve the alignment accuracy of the lens module and the image sensor chip, and improve the imaging quality of the package structure of the image sensor chip. .

In order to achieve the above objects, the present invention provides the following technical solutions:

A packaging structure of an image sensing chip, the packaging structure includes:

The packaging substrate has an opposite first surface and a second surface, and a light-transmitting window penetrating the first surface and the second surface; the packaging substrate also has an interconnection circuit, and the interconnection circuit is For connecting external circuits;

Image sensor chip, the image sensor chip is bound to the first surface and covers the light window; the image sensor chip has a photosensitive area, and the photosensitive area is directly opposite to the light window set up;

A bracket structure, the bracket structure is fixed on the second surface;

A lens module is installed on the bracket structure and faces the light window.

Preferably, in the above package structure, the interconnection circuit includes:

a first contact end provided on the first surface, the first contact end being used to connect the external circuit;

A second contact end is provided on the first surface, the second contact end is used to connect the image sensor chip, and the second contact end is connected to the first contact end through a first wiring circuit.

Preferably, in the above package structure, the first wiring circuit is provided on the first surface, or is located between the first surface and the second surface.

Preferably, in the above package structure, the bracket structure includes:

a first cylindrical side wall, the first cylindrical side wall is fixed on the second surface and surrounds the light-transmitting window;

The lens module is fixed inside the first cylindrical side wall;

Wherein, the first cylindrical side wall on which the lens module is mounted and the packaging substrate on which the image sensor chip is bound form a first sealed cavity.

Preferably, in the above package structure, the bracket structure further includes:

a second cylindrical side wall, the second cylindrical side wall having a top opening and a bottom opening;

The packaging substrate bound with the image sensing chip is located in the second cylindrical side wall;

The top opening of the second cylindrical side wall has a top wall, the top wall has an opening fixed to the outside of the first cylindrical side wall, and the opening surrounds the outside of the first cylindrical side wall;

The bottom opening is used for fixing with a circuit board having the external circuit;

When the bottom opening and the circuit board are fixed, the second cylindrical side wall and the circuit board form a second sealed cavity.

Preferably, in the above package structure, the circuit board is PCB or FPC.

Preferably, in the above packaging structure, the second cylindrical side wall and the top wall are an integrally formed structure;

Or, the second cylindrical side wall and the top wall are separate components, and the top wall is fixed to the top opening of the second cylindrical side wall.

Preferably, the above packaging structure also includes:

An optical filter located between the lens module and the image sensor chip.

Preferably, in the above package structure, the optical filter is fixed on the second surface and covers the light-transmitting window.

Preferably, the above packaging structure further includes an anti-reflection layer disposed on the surface of the optical filter.

Preferably, in the above package structure, the interconnection circuit further includes:

A third contact end provided on the second surface, the third contact end is used to bind external components;

The third contact terminal is connected to the corresponding first contact terminal through a second wiring circuit provided in the packaging substrate.

The invention also provides a packaging method, which includes:

A packaging substrate is provided, the packaging substrate has an opposite first surface and a second surface, the packaging substrate has a plurality of chip bonding areas, and there is a cutting channel between two adjacent chip bonding areas, so The chip bonding area has a light window penetrating the first surface and the second surface, the chip bonding area also has an interconnection circuit, and the interconnection circuit is used to connect an external circuit;

An image sensor chip is bound to the chip binding area, and the image sensor chip is bound to the first surface and covers the light window; the image sensor chip has a photosensitive area, and the photosensitive chip The area is arranged directly opposite the light-transmitting window;

The packaging substrate is divided based on the cutting trench to form a plurality of separate chip binding areas, and the image sensing chip is bound to the chip binding area;

A lens module is provided on the side of the chip binding area away from the image sensing chip. The lens module is installed on the bracket structure and faces the light window. The bracket structure is fixed on the second surface.

Preferably, in the above packaging method, the interconnection circuit includes: a first contact terminal provided on the first surface, the first contact terminal being used to connect the external circuit; and a first contact terminal provided on the first surface. The second contact terminal is used to connect to the image sensor chip, and the second contact terminal is connected to the first contact terminal through a first wiring circuit.

The binding of the image sensing chip in the chip binding area includes welding the image sensing chip to the second contact end.

Preferably, in the above packaging method, the first wiring circuit is provided on the first surface, or is located between the first surface and the second surface.

Preferably, in the above packaging method, the bracket structure includes:

a first cylindrical side wall, the first cylindrical side wall is fixed on the second surface and surrounds the light-transmitting window;

The lens module is fixed inside the first cylindrical side wall;

Wherein, the first cylindrical side wall on which the lens module is mounted and the packaging substrate on which the image sensor chip is bound form a first sealed cavity.

Preferably, in the above packaging method, the bracket structure further includes:

a second cylindrical side wall, the second cylindrical side wall having a top opening and a bottom opening;

The packaging substrate bound with the image sensing chip is located in the second cylindrical side wall;

The top opening of the second cylindrical side wall has a top wall, the top wall has an opening fixed to the outside of the first cylindrical side wall, and the opening surrounds the outside of the first cylindrical side wall;

The bottom opening is used for fixing with a circuit board having the external circuit;

When the bottom opening and the circuit board are fixed, the second cylindrical side wall and the circuit board form a second sealed cavity.

Preferably, in the above packaging method, the packaging method further includes:

Before installing the bracket structure, a light filter is fixed on a side of the chip binding area facing away from the image sensing chip, and the light filter covers the light window.

Preferably, in the above packaging method, the optical filter is fixed before dividing the packaging substrate.

Preferably, in the above packaging method, an anti-reflective layer is provided on the surface of the filter.

Preferably, in the above packaging method, the interconnection circuit further includes: a third contact terminal provided on the second surface, the third contact terminal is used to bind external components; the third contact terminal is provided by The second wiring circuit in the packaging substrate is connected to the corresponding first contact terminal.

The packaging method further includes: before installing the bracket structure, binding the plug-in component in the chip binding area, and the plug-in component is disposed on the second surface.

As can be seen from the above description, in the packaging structure and packaging method of the image sensor chip provided by the technical solution of the present invention, the image sensor chip and the bracket structure for installing the lens module are respectively fixed on both sides of the light window. In this way, on the one hand, the front side of the image sensing chip is directly fixed to the surface of the packaging substrate. The front side of the image sensing chip is relatively flat compared to the back side. It can be directly fixed and interconnected with the packaging substrate through the welding process, which can be more accurate. The thickness of the fixed layer between the front side of the image sensor chip and the packaging substrate is controlled to accurately control the imaging distance of the lens module relative to the image sensor chip; on the other hand, the light-clearing window can be used as a reference position, This allows the lens module and the image sensor chip to be placed facing each other. Therefore, the technical solution of the present invention can accurately align the lens module and the image sensor chip, and improve the imaging quality of the packaging structure.

Description of the drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are only These are embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on the provided drawings without exerting creative efforts.

Figure 1 is a schematic diagram of the packaging principle of an image sensing chip in the prior art;

Figure 2 is a schematic diagram of the packaging structure of an image sensing chip provided by an embodiment of the present invention;

Figure 3 is a schematic diagram of the packaging structure of another image sensing chip provided by an embodiment of the present invention;

Figure 4 is a schematic diagram of the packaging structure of another image sensing chip provided by an embodiment of the present invention;

Figures 5-9 are schematic flow diagrams of a packaging method for an image sensor chip provided by an embodiment of the present invention;

Figures 10-14 are schematic flow charts of another packaging method for image sensing chips provided by embodiments of the present invention;

Figure 15 is a schematic structural diagram of an image sensor chip provided by an embodiment of the present invention;

Figures 16-18 are flow charts of a method for manufacturing an image sensor chip according to an embodiment of the present invention.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.

As shown in Figure 1, Figure 1 is a schematic diagram of the packaging principle of an image sensing chip in the prior art. The image sensing chip 13 needs to be packaged and protected together with the lens module 11. In the prior art, the image sensing chip 13 and the lens module 11 are integrated into the package, usually the image sensor chip 13 is bound to the circuit board 15, and then the bracket 12 is fixed on the same side of the circuit board 15, and the lens module 11 is installed on the bracket 12. Among them, in the method shown on the left side of Figure 1, the image sensor chip 13 is fixed on the surface of the circuit board 15 through an adhesive layer, and its front pad is connected to the interconnection circuit on the circuit board through the wire 14. The interconnection circuit is used to connect to the external circuit. ; In the method shown on the right, the image sensor chip has a back electrical interconnection structure formed on the back through the TSV process. The back electrical interconnection structure is connected to the front pad of the image sensor chip 13, and is connected to the circuit board through the back electrical interconnection structure. interconnection circuit connections.

As can be seen from Figure 1, when the image sensor chip 13 and the lens 11 are integrated in the existing technology, on the one hand, it is impossible to accurately control the thickness of the fixed layer between the back of the image sensor chip 13 and the circuit board 15. In this way, in the vertical The distance between the image sensor chip 13 and the lens module 11 cannot be accurately controlled in the direction of the circuit board 15, so the imaging distance of the lens module 11 relative to the image sensor chip 13 cannot be accurately adjusted; on the other hand, the lens module 11 is generally It is directly fixed on the spacer 12 and then fixed with the circuit board 15. In this way, after the image sensor chip 13 is bound to the circuit board 15, the lens module 11 and the image sensor chip 12 cannot be accurately controlled perpendicular to the circuit. The plates 15 are arranged facing each other in the direction.

Therefore, the existing technology cannot accurately align the image sensor chip 13 and the lens module 11 when packaging the image sensor chip, which may result in poor imaging quality of the package structure of the image sensor chip 13 .

In order to solve the above problems, embodiments of the present invention provide a packaging structure and packaging method for an image sensor chip. The image sensor chip and the bracket structure for installing the lens module are respectively fixed on both sides of the light window. , In this way, on the one hand, the front side of the image sensing chip is directly fixed to the surface of the packaging substrate. The front side of the image sensing chip is relatively flat compared to the back side. It can be fixed and circuit interconnected with the packaging substrate directly through the welding process, which can be more convenient. Accurately control the thickness of the fixed layer between the front side of the image sensor chip and the packaging substrate to accurately control the imaging distance of the lens module relative to the image sensor chip; on the other hand, the light-clearing window can be used as a reference position , so that the lens module and the image sensor chip can be set up facing each other. Therefore, the technical solution of the present invention can accurately align the lens module and the image sensor chip, and improve the imaging quality of the packaging structure.

In order to make the above objects, features and advantages of the present invention more obvious and understandable, the present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments.

Referring to FIG. 1 , FIG. 1 is a schematic diagram of a packaging structure of an image sensing chip provided by an embodiment of the present invention. The packaging structure includes: a packaging substrate 24 , an image sensing chip 23 , a bracket structure 22 and a lens module 21 .

The packaging substrate 24 has an opposite first surface and a second surface, and a light-transmitting window K penetrating the first surface and the second surface. The packaging substrate 24 also has an interconnection circuit for connecting to external circuits. In order to avoid the imaging quality of the image sensor chip 23 due to the reflected light formed on the side wall surface of the light window K, the side wall surface of the light window K may be provided with an anti-reflection film.

The image sensor chip 23 is bound to the first surface and covers the light window K. The image sensor chip 23 has a photosensitive area 231, and the photosensitive area 231 is disposed directly opposite the light window K. The image sensor chip 23 has an opposite front and a back, and the photosensitive area 231 is located on the front. The front surface of the image sensor chip 23 is fixed to the first surface. Optionally, the image sensor chip 23 can be fixedly connected to the first surface through a welding process. In this way, on the one hand, the image sensor chip 23 and the packaging substrate 24 can be relatively fixed, and on the other hand, the image sensor chip 23 can be fixed relatively to the packaging substrate 24 . The image sensor chip 23 is electrically connected to the interconnection circuit.

The bracket structure 22 is fixed on the second surface. The lens module 21 is installed on the bracket structure 22 and faces the light window K.

In the packaging structure of the embodiment of the present invention, the image sensor chip 23 and the bracket structure 22 for installing the lens module 21 are respectively fixed on both sides of the light window K. In this way, on the one hand, the image sensor chip The front side of the chip 23 is directly fixed to the surface of the packaging substrate 24. The front side of the image sensor chip 23 is relatively flat compared to the back side. It can be directly fixed and interconnected with the packaging substrate 24 through the welding process, and the image sensing can be controlled more accurately. The thickness of the fixed layer between the front side of the chip 23 and the packaging substrate 24 is used to accurately control the imaging distance of the lens module 21 relative to the image sensor chip 23; on the other hand, the light-transmitting window K can be used as a reference position, Therefore, the lens module 21 and the image sensor chip 23 can be arranged facing each other. Therefore, the packaging structure described in the embodiment of the present invention can accurately align the lens module 21 and the image sensor chip 23, thereby improving the imaging quality of the packaging structure.

As shown in Figure 2, the interconnection circuit includes: a first contact terminal 241 provided on the first surface, the first contact terminal 241 being used to connect the external circuit; a third contact terminal 241 provided on the first surface. Two contact terminals 242. The second contact terminal 242 is used to connect to the image sensor chip 23. The second contact terminal 242 is connected to the first contact terminal 241 through a first wiring circuit 243. Optionally, the first wiring circuit 243 is provided on the first surface, or is located between the first surface and the second surface. In the embodiment shown in FIG. 2 , the first wiring circuit 243 is disposed between the second surface and the second surface, that is, it is disposed inside the packaging substrate 24 to avoid It has been damaged by external forces.

In the packaging structure of the embodiment of the present invention, the structure of the image sensor chip 23 is shown in Figure 15. Figure 15 is a schematic structural diagram of an image sensor chip provided by the embodiment of the present invention. The image sensor chip The front side of 23 has a photosensitive area 231, and the front side is also provided with a plurality of soldering pads 232 connected to the photosensitive area 231. The soldering pad 232 is soldered to the second contact end 242 so that the image sensor chip 23 is connected to the interconnection circuit. The front side of the image sensor chip 23 is also covered with a protective layer 200 for protecting the photosensitive area 231 . An opening may be provided in the protective layer 200 at a position corresponding to the soldering pad 232 to expose the soldering pad 232 to facilitate welding of the soldering pad 232 to the second contact end 242 , or the protective layer 200 may cover the soldering pad 232 . The soldering pad 232 and the protective layer 200 are thin films, and the protective layer 200 can be directly melted by the temperature in the soldering process, thereby connecting the soldering pad 232 to the second contact end 242 .

As shown in Figure 2, in the packaging structure according to the embodiment of the present invention, the bracket structure 22 includes: a first cylindrical side wall 221, the first cylindrical side wall 221 is fixed on the second surface and surrounds The light window K; the lens module 21 is fixed on the inside of the first cylindrical side wall 221; wherein, the first cylindrical side wall 221 on which the lens module 21 is installed is bound to The packaging substrate 24 with the image sensor chip 23 forms a first sealed cavity. The lens module 21 has at least one lens element and a fixed base, and the lens element is located in the fixed base. The mounting base and the first cylindrical side wall 221 are fixed by threads to facilitate precise adjustment of the imaging distance of the lens module 21 relative to the image sensor chip 23 . In other ways, it is also possible to directly fix the at least one lens element on the inner wall of the first cylindrical side wall 221 without providing the fixing seat, and fix it through the groove on the inner side of the first cylindrical side wall 221 . The lens element.

The space between the front surface of the image sensor chip 23 and the lens module 21 can be sealed and protected by the first sealed cavity to prevent the space from being contaminated. In order to avoid the image quality of the image sensor chip 23 caused by the reflected light formed on the inner surface of the first cylindrical side wall 221 , the inner surface of the first cylindrical side wall 221 may be provided with an anti-reflection film.

Referring to Figure 3, Figure 3 is a schematic diagram of the packaging structure of another image sensor chip provided by an embodiment of the present invention. The difference between the implementation shown in Figure 3 and the implementation shown in Figure 2 is that the implementation shown in Figure 3 also includes Filter 25. The optical filter 25 is disposed between the lens module 21 and the image sensor chip 23 . The optical filter 25 can be disposed on the second surface and cover the light-transmitting window K. There is a set spatial distance between the lens module 21 and the first surface, so that it has a set imaging distance relative to the image sensor chip 23. This spatial distance is reused to set the optical filter 25 without increasing the package. The thickness of the structure. The filter 25 is used to filter out other light waves outside the wavelength band of the light sensed by the image sensor chip, so as to avoid the influence of other light waves on the imaging quality.

Optionally, the packaging structure further includes: an anti-reflection layer provided on the surface of the filter 25 . The anti-reflective layer is not shown in Figure 3 . The anti-reflection layer is used to reduce reflection and avoid the impact of reflected light on imaging quality.

In the package structure according to the embodiment of the present invention, the bracket structure 22 further includes: a second cylindrical side wall 222, the second cylindrical side wall 222 has a top opening and a bottom opening. The packaging substrate 24 with the image sensor chip 23 bound thereto is located in the second cylindrical side wall 222 . The top opening of the second cylindrical side wall 222 has a top wall 223. The top wall 223 has an opening fixed to the outside of the first cylindrical side wall 221, and the opening surrounds the first cylindrical side wall. 221 outside.

As shown in Figure 4, Figure 4 is a schematic diagram of another packaging structure of an image sensor chip provided by an embodiment of the present invention. In the packaging structure of the embodiment of the present invention, the bottom of the second cylindrical side wall 222 is open. For fixing with the circuit board 26 having the external circuit. When the bottom opening and the circuit board 26 are fixed, the second cylindrical side wall 222 and the circuit board form a second sealed cavity. The circuit board 26 is a PCB or FPC. The space of the second cylindrical side wall 222 can be sealed and protected by the second sealed cavity to prevent the space from being contaminated. The first contact end 241 may be directly soldered to the circuit board 26 so that the interconnection circuit on the package substrate 24 is connected to the external circuit. The height of the first contact end 241 is greater than the thickness of the image sensor chip 23 so that the first contact end 241 and the circuit board 26 can be welded and fixed.

Optionally, the second cylindrical side wall 222 and the top wall 223 are integrally formed structures; or the second cylindrical side wall 222 and the top wall 223 are separate components, and the top wall 223 It is fixed on the top opening of the second cylindrical side wall 222 .

Optionally, the interconnection circuit further includes: a third contact end provided on the second surface, and the third contact end is used to bind external components. The third contact terminal is connected to the corresponding first contact terminal 241 through a second wiring circuit provided in the packaging substrate 24 . The third contact terminal, the second wiring circuit and the external component are not shown in the drawings of the embodiment of the present invention. The external component may include one or more of a resistor, a capacitor, a memory, and a compensation light source. The plug-in element may be disposed outside the first cylindrical side wall 221 and located in the second sealed cavity. When the external component includes the compensation light source, the top wall 223 has a light hole corresponding to the position of the compensation light source, so that the compensation light can emit.

As can be seen from the above description, in the packaging structure of the embodiment of the present invention, the image sensor chip 23 and the bracket structure 22 for installing the lens module 21 are respectively fixed on both sides of the light window K. In this way, on the one hand, , the front side of the image sensing chip 23 is directly fixed to the surface of the packaging substrate 24. The front side of the image sensing chip 23 is relatively flat compared to the back side, and can be directly fixed and circuit interconnected with the packaging substrate 24 through a welding process, which can be more accurate. The thickness of the fixed layer between the front surface of the image sensor chip 23 and the packaging substrate 24 is controlled to accurately control the imaging distance of the lens module 21 relative to the image sensor chip 23; on the other hand, the light-transmitting window can be K is used as a reference position so that the lens module 21 and the image sensor chip 23 can be placed directly opposite each other. Therefore, the packaging structure described in the embodiment of the present invention can accurately align the lens module 21 and the image sensor chip 23, thereby improving the imaging quality of the packaging structure.

In the packaging structure of the embodiment of the present invention, the lens module 21 and the image sensor chip 23 are respectively arranged on both sides of the packaging substrate 24, and the packaging substrate 24 is arranged in the space corresponding to the imaging distance, reducing the the thickness of the package structure. When the filter 25 is disposed in the light window K, contamination of the image sensor chip 23 during subsequent fixation of the bracket structure 22 can be avoided.

Based on the above packaging structure embodiment, another embodiment of the present invention also provides a packaging method of an image sensor chip. The packaging method is shown in Figures 5 to 9. Figures 5 to 9 are provided by the embodiment of the present invention. A schematic flow chart of a packaging method for an image sensing chip. The packaging method includes:

Step S11: As shown in Figure 5, a packaging substrate 24 is provided.

The packaging substrate 24 has an opposite first surface and a second surface. The packaging substrate 24 has a plurality of chip bonding areas. There is a cutting channel 100 between two adjacent chip bonding areas. The chip The bonding area has a light-transmitting window K that penetrates the first surface and the second surface. The chip bonding area also has an interconnection circuit, and the interconnection circuit is used to connect an external circuit.

The interconnection circuit includes: a first contact terminal 241 provided on the first surface, the first contact terminal 241 being used to connect the external circuit; a second contact terminal 242 provided on the first surface, so The second contact terminal 242 is used to connect to the image sensor chip 23 , and the second contact terminal 242 is connected to the first contact terminal 241 through a first wiring circuit 243 .

As mentioned above, the first wiring circuit 243 is provided on the first surface, or between the first surface and the second surface.

Step S12: As shown in Figure 6, the image sensor chip 23 is bound in the chip binding area.

The image sensor chip 23 is bound to the first surface and covers the light window K; the image sensor chip 23 has a photosensitive area 231, and the photosensitive area 231 is directly opposite the light window K. pair settings.

In this step, binding the image sensor chip 23 in the chip binding area includes welding the image sensor chip 23 to the second contact end 242 .

Step S13: As shown in FIG. 7 , the packaging substrate 24 is divided based on the cutting trench 100 to form multiple separate chip binding areas, and the image sensor chip 23 is bound in the chip binding area.

Step S13: As shown in FIGS. 8 and 9 , a lens module 21 is provided on the side of the chip binding area away from the image sensing chip 23 .

The lens module 21 is installed on the bracket structure 22 and faces the light window K. The bracket structure 22 is fixed on the second surface. The image sensor chip 23 can be as shown in FIG. 15 , which will not be described again here.

As mentioned above, the bracket structure 22 includes: a first cylindrical side wall 221, which is fixed on the second surface and surrounds the light window K; the lens module 21 Fixed inside the first cylindrical side wall 221; wherein the first cylindrical side wall 221 on which the lens module 21 is installed and the packaging substrate on which the image sensor chip 23 is bound are 24 forms the first sealed cavity. Optionally, the bracket structure 22 also includes: an opening and a bottom opening; the packaging substrate 24 bound with the image sensing chip 23 is located in the second cylindrical side wall 222; the second cylinder The top opening of the side wall 222 has a top wall 223, and the top wall 223 has an opening fixed to the outside of the first cylindrical side wall 221, and the opening surrounds the outside of the first cylindrical side wall 221; The bottom opening is used to be fixed with a circuit board having the external circuit; when the bottom opening is fixed with the circuit board, the second cylindrical side wall and the circuit board form a second seal cavity.

Through the manufacturing methods shown in Figures 5-9, the packaging structure shown in Figure 2 can be formed. In this packaging method, the lens module 21 includes a fixed base, and the fixed base and the bracket structure 22 are fixed by threads. Therefore, in this packaging method, the bracket structure can be fixed on the surface of the packaging substrate 24 first. 22. Then fix the lens module 21 on the bracket structure 22 through threads. In other ways, the bracket structure 22 with the lens module 21 can also be fixedly mounted directly on the packaging substrate 24 .

Referring to Figures 10 to 14, Figures 10 to 14 are schematic flow charts of a packaging method for fixing another image sensor chip according to an embodiment of the present invention. This packaging method is different from the above packaging method in that the packaging method also includes:

First, as shown in FIG. 10 , before installing the bracket structure 22 , fix the optical filter 25 on the side of the chip binding area away from the image sensing chip 23 , and the optical filter 25 covers the Light window K. Optionally, the optical filter 25 can be fixed before dividing the packaging substrate 24 .

Then, as shown in FIG. 11 , the package substrate 24 is divided. An anti-reflective layer is provided on the surface of the filter 25 .

As shown in FIG. 12 , the bracket structure 22 is fixed on the second surface of the divided packaging substrate 24 .

As shown in FIG. 13 , a fixed lens module 21 is installed on the bracket 22 . At this time, a packaging structure as shown in Figure 3 can be formed.

Finally, as shown in Figure 14, the circuit board 26 is bound. At this time, a packaging structure as shown in Figure 4 can be formed.

As mentioned above, the interconnection circuit further includes: a third contact terminal provided on the second surface, the third contact terminal is used to bind external components; the third contact terminal is provided on the packaging substrate 24 The second wiring circuit inside is connected to the corresponding first contact terminal 241. At this time, the packaging method further includes: before installing the bracket structure 22 , binding the plug-in component in the chip binding area, and the plug-in component is disposed on the second surface.

In the embodiment of the present invention, the manufacturing method of the image sensor chip 23 can be shown in Figures 16 to 18. Figures 16 to 18 are flow charts of the manufacturing method of the image sensor chip provided by the embodiment of the present invention. The production method includes:

First, as shown in Figures 16 and 17, Figure 17 is a cross-sectional view of Figure 16 in the PP' direction, and a wafer 43 is provided. The wafer 43 has a plurality of chip areas 42 , and each chip area 42 is used to form an image sensor chip 23 . There are cutting trenches 41 between the chip areas 42 . A protective layer 200 is provided on the surface of the wafer 43 .

In the present invention, the image sensor chip 23 can be formed by dividing the wafer 43 based on the cutting trench 41 .

The packaging method described in the above embodiment is used to form the packaging structure described in the above embodiment. The process steps are simple, the production cost is low, and the lens module 21 and the image sensor chip can be accurately aligned. The formed packaging structure has Better image quality.

Each embodiment in this specification is described in a progressive manner. Each embodiment focuses on its differences from other embodiments. The same and similar parts between the various embodiments can be referred to each other. As for the packaging method disclosed in the embodiment, since it corresponds to the packaging structure disclosed in the embodiment, the description is relatively simple. For relevant information, please refer to the corresponding description of the packaging structure.

The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be practiced in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (14)

1. An image sensor chip packaging structure, wherein the packaging structure comprises:

a package substrate having opposing first and second surfaces, and a light passing window extending through the first and second surfaces; the packaging substrate is also provided with an interconnection circuit, and the interconnection circuit is used for being connected with an external circuit;

wherein, interconnection circuit includes:

the first contact end is arranged on the first surface and is used for being connected with the external circuit;

the second contact end is arranged on the first surface and used for being connected with the image sensing chip, and the second contact end is connected with the first contact end through a first wiring circuit;

the image sensing chip is bound on the first surface and covers the light transmission window; the image sensing chip is provided with a photosensitive area, and the photosensitive area is arranged opposite to the light transmission window;

the bracket structure is fixed on the second surface;

the lens module is arranged on the support structure and is opposite to the light transmission window;

wherein, the support structure includes:

the first cylindrical side wall is fixed on the second surface and surrounds the light transmission window; wherein the inner surface of the first cylindrical side wall is provided with an antireflection film;

the lens module is fixed on the inner side of the first cylindrical side wall;

the first cylindrical side wall provided with the lens module and the packaging substrate bound with the image sensing chip form a first sealing cavity;

a second cylindrical sidewall having a top opening and a bottom opening;

the packaging substrate bound with the image sensing chip is positioned in the second cylindrical side wall;

the top opening of the second cylindrical side wall is provided with a top wall, the top wall is provided with an opening fixed with the outer side of the first cylindrical side wall, and the opening surrounds the outer side of the first cylindrical side wall;

the bottom opening is used for being fixed with a circuit board, and the circuit board is provided with the external circuit;

the first contact end is welded with the circuit board; the height of the first contact end is larger than the thickness of the image sensing chip;

when the bottom opening and the circuit board are fixed, the second cylindrical side wall and the circuit board form a second sealing cavity.

2. The package structure of claim 1, wherein the first wiring circuit is disposed on the first surface or between the first surface and the second surface.

3. The package structure of claim 1, wherein the circuit board is a PCB or an FPC.

4. The package structure of claim 1, wherein the second cylindrical side wall is an integral structure with the top wall;

or, the second cylindrical side wall and the top wall are separate components, and the top wall is fixed at the top opening of the second cylindrical side wall.

5. The package structure of claim 1, further comprising:

and the optical filter is positioned between the lens module and the image sensing chip.

6. The package structure of claim 5, wherein the optical filter is fixed on the second surface and covers the light-transmitting window.

7. The package structure of claim 5, further comprising an anti-reflection layer disposed on a surface of the optical filter.

8. The package structure of claim 1, wherein the interconnect circuit further comprises:

the third contact end is arranged on the second surface and is used for binding the externally hung element;

the third contact terminal is connected with the corresponding first contact terminal through a second wiring circuit arranged in the packaging substrate.

9. A packaging method, characterized in that the packaging method comprises:

providing a packaging substrate, wherein the packaging substrate is provided with a first surface and a second surface which are opposite, the packaging substrate is provided with a plurality of chip binding areas, a cutting channel is arranged between two adjacent chip binding areas, the chip binding areas are provided with light passing windows penetrating through the first surface and the second surface, and the chip binding areas are also provided with interconnection circuits which are used for connecting external circuits;

binding and fixing an image sensing chip in the chip binding area, wherein the image sensing chip is bound on the first surface and covers the light transmission window; the image sensing chip is provided with a photosensitive area, and the photosensitive area is arranged opposite to the light transmission window;

wherein, interconnection circuit includes: the first contact end is arranged on the first surface and is used for being connected with the external circuit; the second contact end is arranged on the first surface and used for being connected with the image sensing chip, and the second contact end is connected with the first contact end through a first wiring circuit;

the binding and fixing the image sensing chip in the chip binding area comprises the following steps: welding the image sensing chip with the second contact end;

dividing the packaging substrate based on the cutting channel to form a plurality of separated chip binding areas, wherein the chip binding areas are bound with the image sensing chip;

a lens module is arranged on one side, away from the image sensing chip, of the chip binding area, the lens module is arranged on a support structure and faces the light transmission window, and the support structure is fixed on the second surface;

wherein, the support structure includes:

the first cylindrical side wall is fixed on the second surface and surrounds the light transmission window; wherein the inner surface of the first cylindrical side wall is provided with an antireflection film;

the lens module is fixed on the inner side of the first cylindrical side wall;

the first cylindrical side wall provided with the lens module and the packaging substrate bound with the image sensing chip form a first sealing cavity;

a second cylindrical sidewall having a top opening and a bottom opening;

the packaging substrate bound with the image sensing chip is positioned in the second cylindrical side wall;

the top opening of the second cylindrical side wall is provided with a top wall, the top wall is provided with an opening fixed with the outer side of the first cylindrical side wall, and the opening surrounds the outer side of the first cylindrical side wall;

the bottom opening is used for being fixed with a circuit board, and the circuit board is provided with the external circuit;

the first contact end is welded with the circuit board; the height of the first contact end is larger than the thickness of the image sensing chip;

when the bottom opening and the circuit board are fixed, the second cylindrical side wall and the circuit board form a second sealing cavity.

10. The packaging method of claim 9, wherein the first wiring circuit is disposed on the first surface or between the first surface and the second surface.

11. The packaging method of claim 9, further comprising:

and before the bracket structure is installed, fixing an optical filter on one side of the chip binding area, which is away from the image sensing chip, and covering the light transmission window by the optical filter.

12. The packaging method of claim 11, wherein the filter is fixed prior to singulating the package substrate.

13. The packaging method according to claim 11, wherein the filter surface is provided with an anti-reflection layer.

14. The packaging method of claim 9, wherein the interconnect circuit further comprises: the third contact end is arranged on the second surface and is used for binding the externally hung element; the third contact end is connected with the corresponding first contact end through a second wiring circuit arranged in the packaging substrate;

the packaging method further comprises the following steps: before the bracket structure is installed, the externally hung element is bound in the chip binding area, and the externally hung element is arranged on the second surface.