CN108922860B - Automatic chip mounting clamp for full-array pin ceramic shell - Google Patents
Automatic chip mounting clamp for full-array pin ceramic shell Download PDFInfo
- Publication number
- CN108922860B CN108922860B CN201810980412.4A CN201810980412A CN108922860B CN 108922860 B CN108922860 B CN 108922860B CN 201810980412 A CN201810980412 A CN 201810980412A CN 108922860 B CN108922860 B CN 108922860B
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- Prior art keywords
- carrier
- shell
- cpga
- base
- vacuum
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention belongs to the technical field of semiconductor package manufacturing, and relates to an automatic chip loading fixture of a full-array pin ceramic shell, which comprises an automatic conveying carrier and a base, and is characterized in that the automatic conveying carrier for conveying a CPGA shell to the base is positioned right above the base, and a plurality of carrying boats which are distributed in an array and are used for loading the CPGA shell are arranged on the automatic conveying carrier; the base is provided with a plurality of vacuum chucks which are distributed in an array and used for adsorbing the CPGA shell, and each vacuum chuck comprises a positioning hole used for inserting pins of the CPGA shell, a groove surrounded by the positioning holes and positioned in the center of the vacuum chuck, a vacuum hole communicated with the groove and used for vacuumizing, and a wedge-shaped limiting column positioned at the periphery of the vacuum chuck; the automatic chip loading fixture can realize automatic conveying loading and vacuum fixing of the full-array pin ceramic shell, ensure smooth packaging and improve production efficiency.
Description
Technical Field
The invention relates to an automatic chip mounting fixture, in particular to an automatic chip mounting fixture for a full-array pin ceramic shell, and belongs to the technical field of semiconductor package manufacturing.
Background
The ceramic package shell is mainly applied to the fields of high-reliability military aviation and aerospace and the like, and the full-stitch ceramic package shell (CPGA) has the advantages of high board-level mounting reliability and the like and is widely applied. Because the back of the tube shell is provided with the pins of the full array, the common plane vacuum sucker cannot be adsorbed and fixed in the actual packaging process, automatic chip loading equipment cannot be used for automatic chip loading production, and the chip loading production can only be carried out manually, so that the production efficiency is affected. Therefore, a practical, effective and highly operable workpiece fixture is needed to automatically convey, load and fix the shell in vacuum, and automatic packaging equipment is utilized to ensure automatic production of packaging, improve production efficiency and ensure successful subsequent packaging.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, and provides the automatic chip mounting clamp for the full-array pin ceramic shell, which can realize automatic conveying, loading and vacuum fixing of the full-array pin ceramic shell, ensure the smooth proceeding of packaging and improve the production efficiency.
In order to achieve the technical purpose, the technical scheme of the invention is as follows: the automatic chip loading fixture for the full-array pin ceramic shell comprises an automatic conveying carrier and a base, and is characterized in that the automatic conveying carrier for conveying the CPGA shell to the base is positioned right above the base, and a plurality of carriers distributed in an array and used for loading the CPGA shell are arranged on the automatic conveying carrier; the vacuum chuck comprises a base, wherein a plurality of vacuum chucks which are distributed in an array and used for adsorbing the CPGA shell are arranged on the base, and each vacuum chuck comprises a positioning hole for inserting pins of the CPGA shell, a groove which is surrounded by the positioning hole and is positioned in the center of the vacuum chuck, a vacuum hole which is communicated with the groove and used for vacuumizing, and a wedge-shaped limiting column which is positioned on the periphery of the vacuum chuck.
Further, the automatic conveying carrier is also provided with a carrier bracket for supporting the carrier, and the plurality of carrier brackets are connected together through the carrier bracket.
Further, the center of the carrier boat is provided with a groove, and four corners are provided with corner brackets for carrying the CPGA shell.
Further, the base is provided with a boss and a base support for supporting the boss, and the vacuum chuck is arranged on the boss.
Further, the carrier boats are distributed identically to the arrays of the vacuum chucks, and the number of carrier boats is identical to the number of the vacuum chucks, and the carrier boats are located right above the corresponding vacuum chucks.
Further, the boat has the same size as the CPGA housing.
The invention has the following advantages:
1) The automatic chip loading clamp of the full-array CPGA shell is simple and reasonable in structural design;
2) According to the invention, the automatic conveying carrier for conveying and loading the CPGA shell and the vacuum chuck which corresponds to the carrier boat of the automatic conveying carrier and can adsorb the CPGA shell are designed, so that the CPGA shell can be adsorbed and fixed under vacuum, the smooth proceeding of the packaging process is ensured, and the production efficiency is improved.
Drawings
Fig. 1 is a schematic sectional view of a mounting fixture of the present invention in assembled condition.
Fig. 2 is a schematic structural view of the automatic transfer carrier of the present invention.
FIG. 3 is a schematic cross-sectional view of the structure of A-A in FIG. 2.
Fig. 4 is a schematic front view of the base of the present invention.
Fig. 5 is a schematic side view of the base of the present invention.
Fig. 6 is a schematic structural view of the vacuum chuck of the present invention.
Reference numerals illustrate: 1-automatic conveying carrier, 11-carrier boat, 12-carrier bracket, 112-angle frame, 2-base, 21-vacuum chuck, 22-boss, 23-base bracket, 211-locating hole, 212-groove, 213-far wedge limit column and 214-vacuum hole.
Detailed Description
The invention will be further described with reference to the following specific drawings and examples.
As shown in fig. 1, an automatic chip mounting fixture for full-array pin ceramic shells comprises an automatic conveying carrier 1, a base 2 and a full-array pin ceramic shell 3 (CPGA shell), wherein the automatic conveying carrier 1 for conveying the CPGA shell to the base 2 is positioned right above the base 2, and the automatic conveying carrier 1 with the CPGA shell is conveyed to the upper part of the base 2 of the automatic chip mounting device through an automatic conveying device;
as shown in fig. 2 and fig. 3, the automatic conveying carrier 1 is provided with carrier boats 11 for loading CPGA shells and carrier boat supports 12 for supporting the carrier boats 11, wherein the carrier boats 11 are distributed in a 2 x 4 array, and the 8 carrier boats 11 are connected together through the carrier boat supports 12; the center of each carrier 11 is slotted, and four corners are provided with corner brackets 112 for carrying CPGA shells;
as shown in fig. 4 to 6, the base 2 is provided with a boss 22 and a base support 23 for supporting the boss 22, the boss 22 is provided with vacuum chucks 21 distributed in a 2 x 4 array for adsorbing the CPGA shell, the vacuum chucks 21 include positioning holes 211 for inserting pins of the CPGA shell, a groove 212 surrounded by the positioning holes 211 and positioned in the center of the vacuum chucks 21, vacuum holes 214 communicated with the groove 212 for vacuumizing, and wedge-shaped limiting columns 213 positioned at the periphery of the vacuum chucks 21, and all the vacuum holes 214 are mutually communicated.
In this embodiment, the carrier 11 distributed in the 2×4 array is located directly above the vacuum chuck 21 distributed in the corresponding 2×4 array, the size of the carrier 11 is the same as that of the CPGA housing, and the shape and size of the alignment distribution of the positioning holes 211 of the vacuum chuck 21 are the same as those of the CPGA housing.
The working engineering of the invention is that, as shown in fig. 1, the back of the CPGA shell is covered with outer pins, the back of the CPGA shell is downward placed on a carrier boat 11 of an automatic conveying carrier 1 in the packaging process, corner brackets 112 for supporting the CPGA shell are arranged on four corners of the carrier boat 11, the carrier boat 11 is designed as a matrix of 2 x 4, 8 CPGA shells can be simultaneously placed, in the assembly process, the automatic conveying carrier 11 with the CPGA shells placed thereon is conveyed above a base 2 of an automatic chip loading device through an automatic conveying device, and the base 2 is designed with 8 vacuum sucking discs 21 corresponding to 2 x 4;
in specific implementation, when the automatic conveying carrier 1 is conveyed to the position right above the base 2, the 8 carrier boats 11 are in one-to-one correspondence with the 8 vacuum chucks 21, the conveying track in the automatic conveying device can vertically drop down with the automatic conveying carrier 1, the automatic conveying carrier 1 can drop on the base 2, CPGA shells on the carrier boats 11 of the automatic conveying carrier 1 can be placed on the vacuum chucks 21 at corresponding positions on the base 2, pins on the back surfaces of the CPGA shells can be inserted into positioning holes 211 on the corresponding vacuum chucks 21, a groove 212 with a certain area is reserved in the middle area of the vacuum chucks 21, and vacuum pumping is carried out through vacuum holes 214 communicated with the groove 212, so that a vacuum cavity can be formed in the groove 212, and the CPGA shells can be fixedly adsorbed, and the adsorption stability is ensured; if the position of the automatic conveying carrier 1 is offset above the base 2 or the CPGA shell is not at the center of the vacuum chuck 21 in the falling process, the wedge-shaped limiting columns 213 around the vacuum chuck 21 can enable the CPGA shell to enter the vacuum chuck 21 along a wedge-shaped slope for vacuum fixation, then automatic packaging production of subsequent chip packaging is carried out, and production efficiency is improved.
The invention and its embodiments have been described above with no limitation, and the actual construction is not limited to the embodiments of the invention as shown in the drawings. In summary, if one of ordinary skill in the art is informed by this disclosure, a structural manner and an embodiment similar to the technical solution should not be creatively devised without departing from the gist of the present invention.
Claims (6)
1. The automatic chip loading fixture for the full-array pin ceramic shell comprises an automatic conveying carrier (1) and a base (2), and is characterized in that the automatic conveying carrier (1) for conveying the CPGA shell to the base (2) is positioned right above the base (2), and a plurality of carrying boats (11) which are distributed in an array and used for loading the CPGA shell are arranged on the automatic conveying carrier (1); the vacuum chuck comprises a base (2), and is characterized in that a plurality of vacuum chucks (21) which are distributed in an array and used for adsorbing a CPGA shell are arranged on the base, wherein each vacuum chuck (21) comprises a positioning hole (211) used for inserting pins of the CPGA shell, a groove (212) which is surrounded by the positioning holes (211) and is positioned in the center of the vacuum chuck (21), a vacuum hole (214) which is communicated with the groove (212) and used for vacuumizing, and a wedge-shaped limiting column (213) which is positioned at the periphery of the vacuum chuck (21).
2. The automated die attach jig of a full array pin ceramic housing of claim 1, wherein: the automatic conveying carrier (1) is also provided with a carrier bracket (12) for supporting the carrier boats (11), and the carrier boats (11) are connected together through the carrier bracket (12).
3. The automated die attach jig of a full array pin ceramic housing of claim 1, wherein: the center of the carrier boat (11) is provided with a slot, and four corners are provided with corner brackets (112) for bearing CPGA shells.
4. The automated die attach jig of a full array pin ceramic housing of claim 1, wherein: the base (2) is provided with a boss (22) and a base bracket (23) for supporting the boss (22), and the vacuum chuck (21) is arranged on the boss (22).
5. The automated die attach jig of a full array pin ceramic housing of claim 1, wherein: the carrier boats (11) are distributed in the same manner as the arrays of the vacuum chucks (21), the number of the carrier boats (11) is the same as the number of the vacuum chucks (21), and the carrier boats (11) are located right above the corresponding vacuum chucks (21).
6. The automated die attach jig of a full array pin ceramic housing of claim 1, wherein: the size of the carrier boat (11) is the same as that of the CPGA shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810980412.4A CN108922860B (en) | 2018-08-27 | 2018-08-27 | Automatic chip mounting clamp for full-array pin ceramic shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810980412.4A CN108922860B (en) | 2018-08-27 | 2018-08-27 | Automatic chip mounting clamp for full-array pin ceramic shell |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108922860A CN108922860A (en) | 2018-11-30 |
| CN108922860B true CN108922860B (en) | 2023-12-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810980412.4A Active CN108922860B (en) | 2018-08-27 | 2018-08-27 | Automatic chip mounting clamp for full-array pin ceramic shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108922860B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110434030B (en) * | 2019-08-22 | 2021-08-10 | 中国电子科技集团公司第四十四研究所 | A point gum machine fixture device for ceramic tube optoelectronic coupler |
| CN112885767A (en) * | 2021-03-24 | 2021-06-01 | 希烽光电科技(南京)有限公司 | Accurate anchor clamps are used in TO product encapsulation |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5000697A (en) * | 1990-03-27 | 1991-03-19 | R.H. Murphy Co., Inc. | Carrier system for PGA electrical components |
| JPH08255849A (en) * | 1994-12-08 | 1996-10-01 | Nippon Avionics Co Ltd | Jig for temporarily fixing cap of package containing chip, cap joining device and method |
| KR20000008817A (en) * | 1998-07-16 | 2000-02-15 | 윤종용 | Precentering device for handler for pin grid array package and precentering method using the same |
| KR20010056361A (en) * | 1999-12-15 | 2001-07-04 | 윤종용 | Jig for fixing semiconductor device |
| CN1819136A (en) * | 2005-01-07 | 2006-08-16 | 先进自动器材有限公司 | Device and method for positioning a device on a carrier |
| CN208738204U (en) * | 2018-08-27 | 2019-04-12 | 无锡中微高科电子有限公司 | A kind of auto loading fixture of full array pin ceramic shell |
-
2018
- 2018-08-27 CN CN201810980412.4A patent/CN108922860B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5000697A (en) * | 1990-03-27 | 1991-03-19 | R.H. Murphy Co., Inc. | Carrier system for PGA electrical components |
| JPH08255849A (en) * | 1994-12-08 | 1996-10-01 | Nippon Avionics Co Ltd | Jig for temporarily fixing cap of package containing chip, cap joining device and method |
| KR20000008817A (en) * | 1998-07-16 | 2000-02-15 | 윤종용 | Precentering device for handler for pin grid array package and precentering method using the same |
| KR20010056361A (en) * | 1999-12-15 | 2001-07-04 | 윤종용 | Jig for fixing semiconductor device |
| CN1819136A (en) * | 2005-01-07 | 2006-08-16 | 先进自动器材有限公司 | Device and method for positioning a device on a carrier |
| CN208738204U (en) * | 2018-08-27 | 2019-04-12 | 无锡中微高科电子有限公司 | A kind of auto loading fixture of full array pin ceramic shell |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108922860A (en) | 2018-11-30 |
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