CN108897452A - Touch panel and preparation method thereof, display panel - Google Patents
Touch panel and preparation method thereof, display panel Download PDFInfo
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- CN108897452A CN108897452A CN201810704496.9A CN201810704496A CN108897452A CN 108897452 A CN108897452 A CN 108897452A CN 201810704496 A CN201810704496 A CN 201810704496A CN 108897452 A CN108897452 A CN 108897452A
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- Prior art keywords
- touch panel
- siliceous
- clad
- nano metal
- control layer
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- 238000002360 preparation method Methods 0.000 title claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 229910052751 metal Inorganic materials 0.000 claims description 48
- 239000002184 metal Substances 0.000 claims description 48
- 239000002002 slurry Substances 0.000 claims description 40
- 239000002253 acid Substances 0.000 claims description 15
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 11
- 235000019353 potassium silicate Nutrition 0.000 claims description 10
- 238000000137 annealing Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 238000005253 cladding Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 4
- 229910021419 crystalline silicon Inorganic materials 0.000 claims description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 2
- 239000000243 solution Substances 0.000 description 11
- -1 nano-silver thread) Chemical compound 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 239000002033 PVDF binder Substances 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229920000954 Polyglycolide Polymers 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000002042 Silver nanowire Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001083 polybutene Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000004633 polyglycolic acid Substances 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 229920006380 polyphenylene oxide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002620 polyvinyl fluoride Polymers 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- BKOOMYPCSUNDGP-UHFFFAOYSA-N 2-methylbut-2-ene Chemical group CC=C(C)C BKOOMYPCSUNDGP-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000002070 nanowire Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002480 polybenzimidazole Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 230000005476 size effect Effects 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 238000009331 sowing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000011145 styrene acrylonitrile resin Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
Abstract
Present invention discloses a kind of touch panels and preparation method thereof, display panel.In touch panel provided by the invention and preparation method thereof, including substrate, siliceous clad and touch control layer in the substrate, the siliceous clad have cavity, and the touch control layer is located in the cavity.Touch control layer is coated by siliceous clad as a result, to can not only secure touch control layer, but also peeling can be avoided by the preferable adhesion such as the realization of siliceous clad and substrate.
Description
Technical field
The present invention relates to nano metal wire material and its application fields, more particularly to a kind of touch panel and its preparation side
Method, display panel.
Background technique
Transparent conductor can be applied to such as touch panel (touch panel), liquid crystal display (liquid because of it
Crystal display), thin film photocell (thin film photo voltaic cells) and Organic Light Emitting Diode device
Fields, the demands such as part (organic light emitting diode devices) increase year by year.
Currently, transparent conductive material is based on tin indium oxide (indiumtin oxide, ITO), with excellent light transmission
Rate and electric conductivity.But this kind of transparent conductive material usually utilizes sputtering technology to deposit, preparation temperature is high, and wherein
Make containing scarcity metal expensive, this kind of film is also easy to be broken when being bent, thus is unsuitable for preparing flexible device,
This results in the performance of ITO and yield, and there are many restrictions.Therefore, industry proposes nano metal line such as nano-silver thread
(Silver Nano Wires, SNW) 1 (as shown in Figure 1), the transparent conductor prepared using substituting ITO as conductive material.With ITO
Compare, nano metal line not only has good optics, electricity and a mechanical property, also have metal nanometer line surface area greatly and
The features such as quantum size effect.But the adhesion of nano metal line is poor at present, therefore, how to improve nano metal line
Adhesion is a problem to be solved.
Summary of the invention
The object of the present invention is to provide a kind of touch panels and preparation method thereof, improve the adhesion of nano metal line.
In order to solve the above technical problems, the present invention provides a kind of touch panel, including：
Substrate, and
Siliceous clad and touch control layer in the substrate, the siliceous clad have cavity, the touching
Control layer is located in the cavity.
Optionally, for the touch panel, the thickness of the siliceous clad is less than or equal to 5nm.
Optionally, for the touch panel, the material of the siliceous clad is crystalline silicon.
Optionally, the touch control layer is nano metal layer.
The present invention also provides a kind of preparation methods of touch panel, including：
Touch control layer slurry is provided, the touch control layer slurry is nano metal line slurry；
Waterglass and acid solution are added into the nano metal line slurry, and is stirred, to obtain siliceous clad
The nano metal line slurry of cladding；
One substrate is provided；
It is coated with the nano metal line slurry of the siliceous clad cladding on the substrate；And
The dry nano metal line slurry is to form the touch panel.
Optionally, for the preparation method of the touch panel, by the way that method is added dropwise to the nano metal line slurry
In plus it is described enter waterglass, control the mass ratio of silicon and metal 2%~3%, by be added dropwise acid solution regulate and control pH 7~9 it
Between.
Optionally, for the preparation method of the touch panel, the acid solution includes that molar concentration is 0.01mol/L
The dilute sulfuric acid or dilute hydrochloric acid of~0.5mol/L.
Optionally, for the preparation method of the touch panel, whipping temp range is 15 DEG C~60 DEG C, stirring rate
1000 revs/min~5000 revs/min, time 0.5h-5h, 1h~3h is aged after the completion of stirring.
Optionally, for the preparation method of the touch panel, after the drying step, further include：It carries out at annealing
Reason, annealing temperature are between 200 DEG C~500 DEG C.
The present invention also provides a kind of display panels, including：
Touch panel as described above.
In touch panel provided by the invention and preparation method thereof, including substrate, it is siliceous in the substrate
Clad and touch control layer, the siliceous clad have cavity, and the touch control layer is located in the cavity.As a result, by siliceous
Clad coats touch control layer, to can not only secure touch control layer, but also can be realized by siliceous clad preferable with substrate etc.
Adhesion, avoid peeling.
Further, the thickness of the siliceous clad is less than or equal to 5nm, can provide preferable conductive capability, thus
On the basis of ensuring that adhesion improves, guarantee conductive capability；
Further, the siliceous clad is also by annealing, preferably to improve electric conductivity.
Detailed description of the invention
Fig. 1 is the microstructure figure of nano metal line；
Fig. 2 is the flow chart of the preparation method of touch panel in one embodiment of the invention；
Fig. 3 is the schematic diagram of the preparation method of touch panel in one embodiment of the invention；
Fig. 4 is the schematic diagram that touch control layer is coated by siliceous clad in one embodiment of the invention；
Fig. 5 is the diagrammatic cross-section of the touch panel formed in one embodiment of the invention.
Specific embodiment
Touch panel and preparation method thereof of the invention is described in more detail below in conjunction with schematic diagram, wherein table
Showing the preferred embodiment of the present invention, it should be appreciated that those skilled in the art can modify invention described herein, and still
Realize advantageous effects of the invention.Therefore, following description should be understood as the widely known of those skilled in the art, and
It is not intended as limitation of the present invention.
The present invention is more specifically described by way of example referring to attached drawing in the following passage.It is wanted according to following explanation and right
Book is sought, advantages and features of the invention will become apparent from.It should be noted that attached drawing is all made of very simplified form and using non-
Accurately ratio, only for the purpose of facilitating and clarifying the purpose of the embodiments of the invention.
In the following description, it should be appreciated that when layer (or film), region, pattern or structure be referred to as substrate, layer (or
Film), region and/or when pattern "upper", it can be on another layer or substrate, and/or there may also be insert layers.
In addition, it is to be appreciated that when layer is referred to as at another layer of "lower", it can be under another layer, and/or can be with
There are one or more insert layers.Furthermore it is possible to be carried out based on attached drawing about the reference in each layer "up" and "down".
As shown in Figures 1 to 5, the embodiment of the present invention proposes a kind of touch panel, including：
Substrate 6, siliceous clad 5 and touch control layer 2', the siliceous clad 5 in the substrate 6 have
Cavity, the touch control layer 2' are located in the cavity.
Further, as shown in Fig. 2, the embodiment of the present invention also proposed a kind of preparation method of touch panel, including it is as follows
Step：
Step S11, provides touch control layer slurry, and the touch control layer slurry is nano metal line slurry；
Waterglass and acid solution are added into the nano metal line slurry, and is stirred by step S12, to be contained
The nano metal line slurry of silicon clad cladding；
Step S13 provides a substrate；
Step S14 is coated with the nano metal line slurry of the siliceous clad cladding on the substrate；And
Step S15, the dry nano metal line slurry is to form the touch panel.
Using the above method, siliceous clad cladding touch control layer is formed, to can not only secure touch control layer, but also can be led to
The preferable adhesion such as siliceous clad realization and substrate is crossed, peeling is avoided.
It is exemplified below the preferred embodiment of described touch panel and preparation method thereof, clearly to illustrate in of the invention
Hold, it is understood that, the contents of the present invention are not restricted to following embodiment, other pass through those of ordinary skill in the art's
The improvement of conventional technical means is also within thought range of the invention.
Referring to FIG. 3, providing touch control layer slurry for step S11, the touch control layer slurry is nano metal line slurry 2.
Such as it can be and the nano metal line slurry 2 is provided in a mixing plant 1.
There are several nano metal lines, these nano metal lines are distributed in solvent in the nano metal line slurry 2.
Nano metal line in the nano metal line slurry 2 can be gold (Au), silver (Ag), platinum (Pt), copper (Cu), cobalt
(Co), the nano wire of palladium (Pd) etc..Due to the features such as silver is conductive and translucency is good, the nano metal line is preferably silver
Nano wire (i.e. nano-silver thread), then the nano metal line slurry 2 is preferably nano-silver thread slurry 2.
With continued reference to FIG. 3, and combining Fig. 4 that waterglass is added into the nano metal line slurry 2 for step S12
3 and acid solution 4, and be stirred, to obtain the nano metal line slurry 2 that siliceous clad 5 coats.
For example, the waterglass 3 can use the aqueous solution of sodium metasilicate.
For example, the acid solution 4 can use molar concentration for the dilute sulfuric acid of 0.01mol/L~0.5mol/L or dilute salt
Acid.Such as 0.05mol/L, 0.1mol/L etc..The acid solution 4 is for adjusting pH, and the acid solution 4 in the concentration range exists
It is easy to control when adjusting pH.
In one embodiment, enter waterglass 3, control described in adding by dropwise addition method into the nano metal line slurry 2
The mass ratio of silicon and metal processed is 2%~3%.
In one embodiment, regulate and control pH between 7~9 by the way that acid solution 4 is added dropwise.
The amount of raw material addition can be preferably controlled by the way of dropwise addition, obtain better quality (such as even film layer, compared with
It is thin etc.) siliceous clad 5 coat nano metal line slurry 2.
This step can be is added waterglass 3 and acid solution 4 on one side, is stirred on one side.It is also possible to that water glass is first added
Glass 3 is simultaneously stirred, and is added acid solution 4 later and is stirred.
In one embodiment, temperature range when this step is stirred is 15 DEG C~60 DEG C, for example, 23 DEG C, 30 DEG C,
50 DEG C etc., 1000 revs/min~5000 revs/min of stirring rate, such as 2000 revs/min, 3000 revs/min, 4000 revs/min
Clock etc., time 0.5h-5h, such as 1h, 2h, 3h, 4h etc. are aged 1h~3h after the completion of stirring.
As a result, as shown in figure 4, the nano metal line slurry 2 that siliceous clad 5 coats can be obtained.
The material of the siliceous clad 5 is, for example, silica gel.
By the condition setting in this step S12, the thickness that can obtain siliceous clad 5 is being less than or equal to 5nm, and
Thickness is relatively uniform, so as to provide preferable conductive capability.
Later, referring to FIG. 5, for step S13, a substrate 6 is provided.In one embodiment, the substrate 6 can be
Rigid material, such as substrate of glass, silicon base, metallic substrates etc..In one embodiment, the substrate 6 is also possible to flexibility
Material, the material of the substrate 6 can be, but not limited to as acryl, polymethyl methacrylate (PMMA), polyacrylonitrile-fourth two
Alkene-styrene (ABS), polyamide (PA), polyimides (PI), polybenzimidazoles polybutene (PB), poly terephthalic acid fourth two
Alcohol ester (PBT), polycarbonate (PC), polyether-ether-ketone (PEEK), polyetherimide (PEI), polyether sulfone (PES), polyethylene (PE),
Polyethylene terephthalate (PET), polyethylene tetrafluoroethene (ETFE), polyethylene oxide, polyglycolic acid (PGA), poly- first
Base amylene (PMP), polyformaldehyde (POM), polyphenylene oxide (PPE), polypropylene (PP), polystyrene (PS), polytetrafluoroethylene (PTFE) (PTFE),
Polyurethane (PU), polyvinyl chloride (PVC), polyvinyl fluoride (PVF), polyvinylidene chloride (PVDC), polyvinylidene fluoride (PVDF)
Or styrene-acrylonitrile (SAN) etc..In the present embodiment, the substrate 6 is, for example, polyimide substrate etc..It is of the present invention
Substrate 6 is not limited to the example above, can also be made of other materials.
It is understood that the substrate 6 is by pretreatment, in preferred embodiment to remove particle, organic matter and gold thereon
Belong to the impurity such as ion.
Later, with continued reference to FIG. 5, for step S14, it is coated with what the siliceous clad 5 coated in the substrate 6
Nano metal line slurry.
The coating for the nano metal line slurry that the siliceous clad 5 coats can be completed using the prior art.For example, institute
The method for stating coating includes but is not limited to：Ink-jet, broadcast sowing, intaglio printing, letterpress, flexo, nano impression, silk-screen printing,
Blade coating, rotary coating, needle draw (stylus plotting), slit type coating or flow coat.
Due to passing through above-mentioned steps S12, nano metal line slurry is coated by siliceous clad 5, therefore siliceous clad 5 can
To contact well with the substrate 6, there is preferable adhesion.
Later, for step S15, the dry nano metal line slurry is to form the touch panel.
Dry method can be naturally dry, simply toast or be heating and curing.In one embodiment, it can use
The forms such as vacuum decompression or infrared heating or Hot-blast Heating are dried, and the time is about 50s~100s, such as 55s, 60s, 70s
Deng.
After the drying, solvent is removed, and obtains the siliceous clad 5 of touch control layer 2' and the cladding touch control layer 2'.It can
See, siliceous clad 5 has cavity, and touch control layer 2' is located in the cavity.
In addition, after the drying step, further including：It is made annealing treatment, annealing temperature is between 200 DEG C~500 DEG C.
By annealing process, it can make siliceous clad 5 is some or all of to be changed into crystalline silicon, it is possible thereby to more preferably
Raising electric conductivity.
In addition, the embodiment of the invention also provides a kind of display panel, the display panel includes：
Cover board；
Glue-line；And
Touch panel as described above, the glue-line bond the cover board and the touch panel.
The display panel can be applied in mobile phone, tablet computer, television set, display, laptop, digital phase
In any products or components having a display function such as frame, navigator.
In conclusion in touch panel provided by the invention and preparation method thereof, including substrate, located immediately at the substrate
On siliceous clad and touch control layer, the siliceous clad there is cavity, the touch control layer is located in the cavity.As a result,
Touch control layer is coated by siliceous clad, to can not only secure touch control layer, but also can be realized by siliceous clad and base
The preferable adhesion such as bottom, avoids peeling.
Further, the thickness of the siliceous clad is less than or equal to 5nm, can provide preferable conductive capability, thus
On the basis of ensuring that adhesion improves, guarantee conductive capability；
Further, the siliceous clad is also by annealing, preferably to improve electric conductivity.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
Mind and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to include these modifications and variations.
Claims (10)
1. a kind of touch panel, which is characterized in that including：
Substrate；And
Siliceous clad and touch control layer in the substrate, the siliceous clad have cavity, the touch control layer
In the cavity.
2. touch panel as described in claim 1, which is characterized in that the thickness of the siliceous clad is less than or equal to 5nm.
3. touch panel as described in claim 1, which is characterized in that the material of the siliceous clad is crystalline silicon.
4. touch panel as described in claim 1, which is characterized in that the touch control layer is nano metal layer.
5. a kind of preparation method of touch panel, which is characterized in that including：
Touch control layer slurry is provided, the touch control layer slurry is nano metal line slurry；
Waterglass and acid solution are added into the nano metal line slurry, and is stirred, to obtain siliceous clad cladding
Nano metal line slurry；
One substrate is provided；
It is coated with the nano metal line slurry of the siliceous clad cladding on the substrate；And
The dry nano metal line slurry is to form the touch panel.
6. the preparation method of touch panel as claimed in claim 4, which is characterized in that by the way that method is added dropwise to the nanogold
Belong to and enter waterglass described in adding in line slurry, controls the mass ratio of silicon and metal 2%~3%, regulate and control pH by the way that acid solution is added dropwise
Between 7~9.
7. the preparation method of touch panel as claimed in claim 6, which is characterized in that the acid solution includes that molar concentration is
The dilute sulfuric acid or dilute hydrochloric acid of 0.01mol/L~0.5mol/L.
8. the preparation method of touch panel as claimed in claim 4, which is characterized in that whipping temp range is 15 DEG C~60
DEG C, 1000 revs/min~5000 revs/min of stirring rate, time 0.5h-5h, 1h~3h is aged after the completion of stirring.
9. the preparation method of the touch panel as described in any one of claim 4 to 8, which is characterized in that drying steps it
Afterwards, further include：It is made annealing treatment, annealing temperature is between 200 DEG C~500 DEG C.
10. a kind of display panel, which is characterized in that including：
Touch panel according to any one of claims 1 to 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810704496.9A CN108897452B (en) | 2018-06-30 | 2018-06-30 | Touch panel, preparation method thereof and display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810704496.9A CN108897452B (en) | 2018-06-30 | 2018-06-30 | Touch panel, preparation method thereof and display panel |
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| Publication Number | Publication Date |
|---|---|
| CN108897452A true CN108897452A (en) | 2018-11-27 |
| CN108897452B CN108897452B (en) | 2021-06-25 |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104599746A (en) * | 2015-01-27 | 2015-05-06 | 京东方科技集团股份有限公司 | Touch element, preparation method thereof and touch screen |
| CN105930010A (en) * | 2016-05-11 | 2016-09-07 | 华勤通讯技术有限公司 | Wiring method of sensor of touch screen and sensor of touch screen |
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| US20160313837A1 (en) * | 2013-12-27 | 2016-10-27 | Kunshan New Flat Panel Display Technology Center Co., Ltd. | Touch control display device and a preparation method thereof |
| CN104599746A (en) * | 2015-01-27 | 2015-05-06 | 京东方科技集团股份有限公司 | Touch element, preparation method thereof and touch screen |
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