CN108882559B - Manufacturing process of metallized half hole - Google Patents
Manufacturing process of metallized half hole Download PDFInfo
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- CN108882559B CN108882559B CN201810739862.4A CN201810739862A CN108882559B CN 108882559 B CN108882559 B CN 108882559B CN 201810739862 A CN201810739862 A CN 201810739862A CN 108882559 B CN108882559 B CN 108882559B
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- insulating organic
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
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Abstract
The invention discloses a manufacturing process of a metallized half hole, which comprises the following steps: A. the half hole is processed clockwise by using a milling machine, and the cutting depth is increased linearly synchronously with the increase of the processing angle; B. reversely machining a half hole anticlockwise by using a milling machine, wherein the cutting depth is synchronously and linearly increased along with the increase of the machining angle; C. adhering an insulating organic coating on the cutting surface, and removing the insulating organic coating on the cutting edge part to expose the metal surface; D. electroplating the hole wall to form a copper plating layer; E. and thoroughly removing the insulating organic coating, and polishing and grinding the copper coating. The invention can improve the defects of the prior art and improve the processing quality of the metallized semi-holes.
Description
Technical Field
The invention relates to the technical field of PCB (printed circuit board) processing, in particular to a manufacturing process of a metallized half hole.
Background
In the processing process of the PCB, the metallized half holes can realize the conducting function of the round holes, and the hole walls of the half holes can be used for welding and fixing, so that the fixing of the chip pins is realized. The conventional processing method of the metallized half hole is to cut and manufacture the metallized half hole through a plate milling machine, and burrs are easily generated at the edge part of the half hole by the method, so that short circuits among components are caused. In the prior art, a technology for reducing burrs is disclosed in a solder filling mode, but other metal components are easily introduced into the wall of a half hole by the method to influence the performance of a circuit board, the strength of filling solder is generally not high, the supporting effect on a cutting edge is generally good, the burrs with larger volume can only be reduced, and the burrs on the cutting edge cannot be eradicated.
Disclosure of Invention
The invention aims to provide a manufacturing process of a metallized semi-hole, which can improve the defects of the prior art and improve the processing quality of the metallized semi-hole.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows.
A manufacturing process of a metallized semi-hole comprises the following steps:
A. the half hole is processed clockwise by using a milling machine, and the cutting depth is increased linearly synchronously with the increase of the processing angle;
B. reversely machining a half hole anticlockwise by using a milling machine, wherein the cutting depth is synchronously and linearly increased along with the increase of the machining angle;
C. adhering an insulating organic coating on the cutting surface, and removing the insulating organic coating on the cutting edge part to expose the metal surface;
D. electroplating the hole wall to form a copper plating layer;
E. and thoroughly removing the insulating organic coating, and polishing and grinding the copper coating.
Preferably, the cutting speed in step B is 1.5 to 2 times the cutting speed in step a.
Preferably, in step C, adhering the insulating organic coating comprises the steps of,
adding 55-75 parts of diphenol propane type epoxy resin, 2-3 parts of allyl glycidyl ether and 3-5 parts of vinyl trimethoxy silane into a mixed solution of ethanol and isopropanol, heating to 65-75 ℃, and uniformly stirring for later use, wherein the mol ratio of ethanol to isopropanol in the mixed solution of ethanol and isopropanol is 1:1;
c2, coating diethylenetriamine on the cutting surface of the half hole,
c3, immersing the circuit board with the half holes into the organic solution prepared by the C1, controlling the temperature at 45-55 ℃ and keeping for 20-30 min,
and C4, taking out the circuit board and air-drying.
In the step C, a groove is formed at the edge of the position where the insulating organic matter coating needs to be removed, fiber filler is filled in the groove, and then acetone is used for scrubbing and removing the insulating organic matter coating on the inner side of the groove.
Preferably, in the step D, the electroplating treatment of the hole wall comprises the following steps,
d1, preparing copper sulfate electroplating solution,
the content of copper sulfate is 100-120 g/L, and the content of sulfuric acid is 30-40 g/L;
and D2, heating the copper sulfate electroplating solution to 42 ℃, immersing the circuit board in the copper sulfate electroplating solution, applying pulse current for electroplating treatment for 5min, wherein the time ratio of the forward peak to the reverse peak of the pulse current is 3:1, the maximum value of the forward peak is 20A, the maximum value of the reverse peak is 4A, and the frequency of the pulse current is 100Hz.
Preferably, in step E, acetone is used to completely remove the residual insulating organic coating on the circuit board.
Preferably, in the step E, the polishing and grinding of the copper plating layer comprises the following steps,
e1, polishing and grinding the center part of the copper plating layer by using a polisher;
e2, after the thickness of the area to be polished is the same as that of the external surface, the polisher is moved in a spiral mode, and polishing are carried out on other parts of the copper plating layer, so that the thickness of the whole polishing area is the same as that of the external surface.
The beneficial effects brought by adopting the technical scheme are as follows: the invention firstly uses a twice reverse cutting mode to process the half hole, and can improve the supporting property of the cutting position in each feeding process, thereby improving the cutting and pulling force on the copper layer in the high-speed rotary cutting process and reducing the occurrence of burrs. Then, the residual burrs can be thoroughly removed by electroplating and polishing the cutting edge, so that the influence of the edge burrs on the quality of the metallized half hole is fundamentally solved. The insulating organic coating used in the invention is convenient for later cleaning by adding allyl glycidyl ether and vinyl trimethoxy silane, and has strong tolerance to pulse current in the electroplating process.
Drawings
FIG. 1 is a flow chart of one embodiment of the present invention.
Fig. 2 is a block diagram of a polisher according to one embodiment of the present invention.
In the figure: 1. a top plate; 2. a cylinder; 3. a first driving motor; 4. polishing rollers; 5. a second driving motor; 6. an annular plate; 7. polishing strips.
Detailed Description
Standard parts used in the invention can be purchased from the market, special-shaped parts can be customized according to the description of the specification and the drawings, and the specific connection modes of the parts adopt conventional means such as mature bolts, rivets, welding, pasting and the like in the prior art, and the detailed description is omitted.
Referring to fig. 1, one embodiment of the present invention includes the steps of:
A. the half hole is processed clockwise by using a milling machine, and the cutting depth is increased linearly synchronously with the increase of the processing angle;
B. reversely machining a half hole anticlockwise by using a milling machine, wherein the cutting depth is synchronously and linearly increased along with the increase of the machining angle;
C. adhering an insulating organic coating on the cutting surface, and removing the insulating organic coating on the cutting edge part to expose the metal surface;
D. electroplating the hole wall to form a copper plating layer;
E. and thoroughly removing the insulating organic coating, and polishing and grinding the copper coating.
The cutting speed in step B is 2 times the cutting speed in step a.
In step C, adhering the insulating organic coating includes the steps of,
adding 65 parts of diphenol propane type epoxy resin, 2 parts of allyl glycidyl ether and 5 parts of vinyl trimethoxy silane into a mixed solution of ethanol and isopropanol, heating to 70 ℃, and uniformly stirring for later use, wherein the molar ratio of ethanol to isopropanol in the mixed solution of ethanol and isopropanol is 1:1;
c2, coating diethylenetriamine on the cutting surface of the half hole,
c3, immersing the circuit board with the half holes into the organic matter solution prepared by the C1, controlling the temperature at 50 ℃, keeping for 30min,
and C4, taking out the circuit board and air-drying.
In the step C, grooves are formed in the edges of the positions where the insulating organic matter coating needs to be removed, fiber fillers are filled in the grooves, and then acetone is used for scrubbing and removing the insulating organic matter coating on the inner sides of the grooves.
In the step D, the electroplating treatment of the hole wall comprises the following steps,
d1, preparing copper sulfate electroplating solution,
copper sulfate content is 105g/L, sulfuric acid content is 35g/L;
and D2, heating the copper sulfate electroplating solution to 42 ℃, immersing the circuit board in the copper sulfate electroplating solution, applying pulse current for electroplating treatment for 5min, wherein the time ratio of the forward peak to the reverse peak of the pulse current is 3:1, the maximum value of the forward peak is 20A, the maximum value of the reverse peak is 4A, and the frequency of the pulse current is 100Hz.
And E, thoroughly removing the residual insulating organic coating on the circuit board by using acetone.
In the step E, polishing and grinding the copper plating layer comprises the following steps,
e1, polishing and grinding the center part of the copper plating layer by using a polisher;
e2, after the thickness of the area to be polished is the same as that of the external surface, the polisher is moved in a spiral mode, and polishing are carried out on other parts of the copper plating layer, so that the thickness of the whole polishing area is the same as that of the external surface.
To verify the performance of the insulating organic coating used in the present invention, two comparative tests were designed using the insulating organic coating used in the present invention and a comparative coating (containing only diphenol propane type epoxy resin).
Immersing a metal plate adhered with an insulating organic matter coating and a contrast coating into acetone, standing for 3min, then taking out, flushing with pure water, and respectively measuring the weight difference before and after the test to obtain the dissolution ratio of the acetone to the coating:
| group of | Acetone dissolution ratio (wt%) |
| Insulating organic coating | 55.3 |
| Contrast coating | 21.8 |
The metal plate to which the insulating organic coating and the comparative coating are adhered is subjected to an electroplating treatment by the electroplating method in step D of the present invention. Wherein the electroplating time is increased to 1h, the maximum value of the forward wave peak of the pulse current is 100A, and the maximum value of the reverse wave peak is 20A. And then thoroughly cleaning the residual coating by using acetone, then heating and evaporating the acetone, and respectively measuring the weight of the residues to obtain the corrosion degree of electroplating on the coating:
| group of | Electroplating corrosion ratio (wt%) |
| Insulating organic coating | 0.12 |
| Contrast coating | 0.33 |
In addition, referring to fig. 2, in order to improve polishing accuracy, the present invention provides a polisher. The polishing device comprises a top plate 1, wherein the bottom of the top plate 1 is connected with a first driving motor 3 through a cylinder 2, and the first driving motor 3 is connected with a polishing roller 4. The side of the top plate 1 is connected with a second driving motor 5, the bottom surface of the top plate 1 is slidably connected with an annular plate 6 through a sliding groove, the second driving motor 5 drives the annular plate 6 to rotate, and a plurality of polishing strips 7 are uniformly fixed on the bottom surface of the annular plate 6. The ratio of the roughness of the polishing roller 4 to the polishing strip 7 is 10:1, and the ratio of the rotational speeds of the first driving motor 3 to the second driving motor 5 is 1:2. In the polishing process, the polishing roller is used for rapidly polishing the center position, and then the polishing bars on the periphery are used for precisely grinding, so that rapid and accurate polishing operation can be realized. The polishing roller 4 can be moved up and down so as to adjust the polishing pressure at the polishing position.
In the description of the present invention, it should be understood that the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present invention, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
The foregoing has shown and described the basic principles and main features of the present invention and the advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The manufacturing process of the metallized semi-hole is characterized by comprising the following steps of:
A. the half hole is processed clockwise by using a milling machine, and the cutting depth is increased linearly synchronously with the increase of the processing angle;
B. reversely machining a half hole anticlockwise by using a milling machine, wherein the cutting depth is synchronously and linearly increased along with the increase of the machining angle;
C. adhering an insulating organic coating on the cutting surface, and removing the insulating organic coating on the cutting edge part to expose the metal surface;
D. electroplating the hole wall to form a copper plating layer;
E. thoroughly removing the insulating organic coating, and polishing and grinding the copper coating;
in step C, adhering the insulating organic coating includes the steps of,
adding 55-75 parts of diphenol propane type epoxy resin, 2-3 parts of allyl glycidyl ether and 3-5 parts of vinyl trimethoxy silane into a mixed solution of ethanol and isopropanol, heating to 65-75 ℃, and uniformly stirring for later use, wherein the mol ratio of ethanol to isopropanol in the mixed solution of ethanol and isopropanol is 1:1;
c2, coating diethylenetriamine on the cutting surface of the half hole,
c3, immersing the circuit board with the half holes into the organic solution prepared by the C1, controlling the temperature at 45-55 ℃ and keeping for 20-30 min,
and C4, taking out the circuit board and air-drying.
2. The process for producing a metallized semi-hole according to claim 1, wherein: the cutting speed in the step B is 1.5-2 times of the cutting speed in the step A.
3. The process for producing a metallized semi-hole according to claim 1, wherein: in the step C, grooves are formed in the edges of the positions where the insulating organic matter coating needs to be removed, fiber fillers are filled in the grooves, and then acetone is used for scrubbing and removing the insulating organic matter coating on the inner sides of the grooves.
4. The process for producing a metallized semi-hole according to claim 1, wherein: in the step D, the electroplating treatment of the hole wall comprises the following steps,
d1, preparing copper sulfate electroplating solution,
the content of copper sulfate is 100-120 g/L, and the content of sulfuric acid is 30-40 g/L;
and D2, heating the copper sulfate electroplating solution to 42 ℃, immersing the circuit board in the copper sulfate electroplating solution, applying pulse current for electroplating treatment for 5min, wherein the time ratio of the forward peak to the reverse peak of the pulse current is 3:1, the maximum value of the forward peak is 20A, the maximum value of the reverse peak is 4A, and the frequency of the pulse current is 100Hz.
5. The process for manufacturing a metallized semi-hole according to claim 4, wherein: and E, thoroughly removing the residual insulating organic coating on the circuit board by using acetone.
6. The process for manufacturing a metallized semi-hole according to claim 5, wherein: in the step E, polishing and grinding the copper plating layer comprises the following steps,
e1, polishing and grinding the center part of the copper plating layer by using a polisher;
e2, after the thickness of the area to be polished is the same as that of the external surface, the polisher is moved in a spiral mode, and polishing are carried out on other parts of the copper plating layer, so that the thickness of the whole polishing area is the same as that of the external surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810739862.4A CN108882559B (en) | 2018-07-06 | 2018-07-06 | Manufacturing process of metallized half hole |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810739862.4A CN108882559B (en) | 2018-07-06 | 2018-07-06 | Manufacturing process of metallized half hole |
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| CN108882559A CN108882559A (en) | 2018-11-23 |
| CN108882559B true CN108882559B (en) | 2023-06-02 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112291930A (en) * | 2019-08-07 | 2021-01-29 | 宏华胜精密电子(烟台)有限公司 | Method for manufacturing metallized semi-hole of circuit board |
| CN110602878A (en) * | 2019-08-15 | 2019-12-20 | 鹤山市中富兴业电路有限公司 | Direct forming method for metallized semi-hole |
| CN112074095B (en) * | 2020-10-10 | 2021-08-31 | 黄石星河电路有限公司 | Thin plate processing method with 0.4MM metal half-holes designed around |
| CN112312680B (en) * | 2020-10-29 | 2022-02-22 | 惠州市特创电子科技股份有限公司 | Method for processing metallized half hole of circuit board |
Citations (5)
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|---|---|---|---|---|
| US6071398A (en) * | 1997-10-06 | 2000-06-06 | Learonal, Inc. | Programmed pulse electroplating process |
| CN106793575A (en) * | 2016-12-16 | 2017-05-31 | 江苏博敏电子有限公司 | A kind of manufacture craft of half bore pcb board |
| CN107396550A (en) * | 2017-08-31 | 2017-11-24 | 惠东县建祥电子科技有限公司 | A kind of hole-drilling system and method for improving the heavy copper half bore burr of pcb board |
| CN108200726A (en) * | 2018-02-08 | 2018-06-22 | 深圳市昶东鑫线路板有限公司 | Wiring board 0.3mm metallized semi-pore processing technologys |
| CN108207090A (en) * | 2017-12-29 | 2018-06-26 | 广州兴森快捷电路科技有限公司 | The production method of printed circuit board |
-
2018
- 2018-07-06 CN CN201810739862.4A patent/CN108882559B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6071398A (en) * | 1997-10-06 | 2000-06-06 | Learonal, Inc. | Programmed pulse electroplating process |
| CN106793575A (en) * | 2016-12-16 | 2017-05-31 | 江苏博敏电子有限公司 | A kind of manufacture craft of half bore pcb board |
| CN107396550A (en) * | 2017-08-31 | 2017-11-24 | 惠东县建祥电子科技有限公司 | A kind of hole-drilling system and method for improving the heavy copper half bore burr of pcb board |
| CN108207090A (en) * | 2017-12-29 | 2018-06-26 | 广州兴森快捷电路科技有限公司 | The production method of printed circuit board |
| CN108200726A (en) * | 2018-02-08 | 2018-06-22 | 深圳市昶东鑫线路板有限公司 | Wiring board 0.3mm metallized semi-pore processing technologys |
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