CN108882501A - Combined type LCP high-frequency high-speed FRCC substrate and preparation method thereof - Google Patents
Combined type LCP high-frequency high-speed FRCC substrate and preparation method thereof Download PDFInfo
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- CN108882501A CN108882501A CN201710324814.4A CN201710324814A CN108882501A CN 108882501 A CN108882501 A CN 108882501A CN 201710324814 A CN201710324814 A CN 201710324814A CN 108882501 A CN108882501 A CN 108882501A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of combined type LCP high-frequency high-speed FRCC substrates, including copper foil layer, LCP sandwich layer and extremely low dielectric glue-line；LCP sandwich layer has opposite upper and lower surfaces, and copper foil layer is formed in the upper surface of LCP sandwich layer, and extremely low dielectric glue-line is formed in the lower surface of LCP sandwich layer；Copper foil layer with a thickness of 1-35 μm；LCP sandwich layer with a thickness of 5-50 μm；Extremely low dielectric glue-line with a thickness of 2-50 μm, and the overall thickness of copper foil layer, LCP sandwich layer and extremely low dielectric glue-line is 10-135 μm, extremely low dielectric glue-line refers to that Dk value is 2.0-3.0 (10GHz), and Df value is the glue-line of 0.002-0.010 (10GHz).The present invention is not only electrically good, and has low roughness, high-speed transfer, low thermal coefficient of expansion, dk/df performance stable under high temperature humidity environment, ultralow water absorption rate, good UV laser drilling ability, the low bounce-back power and splendid mechanical performance for being suitble to High Density Packaging；In addition, rubbing method current techniques can only at most apply 50 μm or so of thickness, preparation method of the invention is readily apparent 100 μm or more of thick film.
Description
Technical field
The present invention relates to FPC (flexible circuit board) to use FRCC (flexible adhesive coated foil) substrate and its preparation technical field, special
It is not related to a kind of combined type LCP high-frequency high-speed FRCC substrate.
Background technique
With developing by leaps and bounds for information technology, high-frequency high-speed is transmitted to meet signal, thermally conductive rapid and life of radiating
Minimization of cost is produced, various forms of mixed pressure structures are multiple-plate to be designed and come into being.Printed circuit board is that electronics produces
Indispensable material in product, and with consumer electrical product demand growth, the demand for printed circuit board are also and day
It is all to increase.Since flexible printed wiring board (FPC, Flexible Printed Circuit) has flexibility and can three-dimensional space
The characteristics such as wiring are wide at present in the case where technicalization electronic product emphasizes that light and short, flexibility and high-frequency development drive gesture
It is general to be applied to computer and its peripheral equipment, communication product and consumer electrical product etc..
In high frequency field, radio infrastructure needs to provide sufficiently low Insertion Loss, can just effectively improve energy utilization rate.With
5G communication, the accelerated development of millimeter wave and space flight military project, high-frequency high-speed FPC (flexible circuit board)/PCB (printed circuit board) need
Ask business to arrive, with the emerging industries such as big data, Internet of Things rise and mobile interchange terminal it is universal, rapidly process,
Information is transmitted, communications industry emphasis is become.In communication field, the following 5G network ratio 4G possesses the more bandwidth of high speed, more dense
Micro-base station construction, network speed is faster.Answer the demand of Internet of Things and cloud operation and new era items wideband communication, Developing High-speed
Servomechanism and the mobile phone of more high transmission speed have become the trend in market.In general, FPC/PCB is main in entire transmission process
Bottleneck, if the good design of shortcoming and electrically good associated materials, by significant delays transmission speed or cause signal to lose.
This just proposes very high requirement to circuit board material.In addition, mainly used high frequency substrate is mainly LCP to current industry
(polymeric liquid crystal copolymer) plate, PTFE (polytetrafluoroethylene (PTFE)) fiberboard, however also limited by process technique, manufacture is set
Standby requirement it is high and need higher temperatures environment (>280 DEG C) under can just operate, also result in its membrane thickness unevenness therewith, and
The impedance control that film thickness unevenness will cause circuit board is not easy；In addition, fast press apparatus cannot be used by being encountered by again, cause processing tired
The problems such as difficult.Although and other resinae films are without the above problem, face that electrically bad, adhesion is too weak or mechanical strength
The problems such as bad.
Composite substrate also has the characteristics that excellent workability, low cost, low energy consumption other than function admirable, Chinese special
Benefit " Double-sided copper clad laminate " utility model CN 201590948U and patent " a kind of Composite double-face copper foil substrate and use the base
The flexible printed circuit board structure of plate ", platform (M377823), day (JP2010-7418A) and beautiful (US2011/0114371) three state
This structure is referred in patent, (novel C N 202276545U/ invents CN in patent " high-frequency substrate structure "
103096612B, TW M422159) and an another piece " high-frequency substrate structure " (TW M531056) in then with this structure matching fluorine system
The high frequency materials such as material, powder make high frequency substrate, apply for a patent (" transmission of PI type high-frequency high-speed with Double-sided copper clad laminate and
Preparation method, application number 201710085366.7 ") in also refer to a kind of do sandwich layer using polyimides and arrange in pairs or groups low dielectric glue
The composite structure substrate of layer.
General epoxy resin product shows simultaneously under small-bore (being less than 100um) radium-shine processing of UV of downstream industry
It is undesirable, it be easy to cause through-hole (PTH, Plating Through Hole) hole to inside contract, is only suitable for the machine used in larger aperture
Tool bore mode.
In the preparation of multi-layer board and Rigid Flex, due to general PI (polyimides) type and TPI type copper clad laminate
High-hygroscopicity (1-2%), has plate bursting problem, has seriously affected yield.
In terms of cost, efficiency and workability, LCP, TPI (Thermocurable polyimide) method prepares high frequency substrate, and production needs
High-temperature laminating, pressing-in temp is between 280-330 DEG C, especially in production transmission performance preferably 38 μm or more thickness products
When, low efficiency is at high cost.
Summary of the invention
The invention mainly solves the technical problem of providing a kind of combined type LCP high-frequency high-speed FRCC substrates, and the present invention is not
But it is electrically good, and have low roughness, high-speed transfer, low thermal coefficient of expansion, dk/ stable under high temperature humidity environment
Df performance, ultralow water absorption rate, good UV laser drilling ability, the low bounce-back power for being suitble to High Density Packaging and splendid machinery
Performance；In addition, rubbing method current techniques can only at most apply 50 μm or so of thickness, preparation method of the invention is readily apparent
100 μm or more of thick film.
In order to solve the above technical problems, one technical scheme adopted by the invention is that：It is high to provide a kind of combined type LCP high frequency
Fast FRCC substrate, including copper foil layer, LCP sandwich layer and extremely low dielectric glue-line；The LCP sandwich layer has opposite upper and lower surfaces, institute
The upper surface that copper foil layer is formed in the LCP sandwich layer is stated, the extremely low dielectric glue-line is formed in the lower surface of the LCP sandwich layer；
The copper foil layer with a thickness of 1-35 μm；The LCP sandwich layer with a thickness of 5-50 μm；The extremely low dielectric glue-line
With a thickness of 2-50 μm, and the overall thickness of the copper foil layer, LCP sandwich layer and extremely low dielectric glue-line is 10-135 μm.
Preferably, the copper foil layer with a thickness of 6-18 μm；The LCP sandwich layer with a thickness of 12.5-50 μm；It is described extremely low
The thickness of dielectric glue-line is all 12.5-50 μm.
It further says, the extremely low dielectric glue-line refers to that Dk value is 2.0-3.0 (10GHz), and Df value is 0.002-
The glue-line of 0.010 (10GHz).
Preferably, the extremely low dielectric glue-line refers to that Dk value is the glue-line of 2.2-3.0 (10GHz).
It further says, it is 0.4-1.0 μm of low profile copper foil layer that the copper foil layer, which is Rz value, and the copper foil layer and institute
The Rz value for stating the one side of LCP sandwich layer adhesion is 0.4-1.0 μm, and the Rz value of the outer surface of the copper foil layer is 0.4-0.7 μm, institute
Stating copper foil layer is rolled copper foil layer or electrodeposited copper foil layer.
It further says, the water absorption rate of the LCP sandwich layer is 0.01-0.1%；The water absorption rate of the extremely low dielectric glue-line is
0.01-0.1%；The whole water absorption rate of the FRCC substrate is 0.01-0.5%.
Preferably, the water absorption rate of the LCP sandwich layer is 0.01-0.04%；The water absorption rate of the extremely low dielectric glue-line is
0.01-0.08%；The whole water absorption rate of the FRCC substrate is 0.01-0.1%.
It further says, the Bonding strength of the extremely low dielectric glue-line>0.7kgf/cm2。
It further says, the resin material in the extremely low dielectric glue-line is fluorine resin, epoxy resin, acrylic acid series tree
Rouge, silicon rubber system resin, gathers to ring diformazan benzene series resin, bismaleimide amine system resin and polyamides amido formate system resin
At least one of imide resin.
It further says, the extremely low dielectric glue-line includes fused silica, Teflon, fluorine resin, the resistance to combustion of phosphorus system
Agent and polyimide resin, and the fused silica, the Teflon, the fluorine resin and phosphorus system flame retardant
The sum of ratio is the 8-50% (weight percent) of total solid content, and the ratio of the polyimide resin content is 40%-90%
(weight percent).
It further says, the ratio of the fused silica is the 2-15% (weight percent) of total solid content, described
The ratio of Teflon is the 2-10% (weight percent) of total solid content, and the ratio of the fluorine resin is the 2- of total solid content
10% (weight percent), the ratio of phosphorus system flame retardant are the 2-15% (weight percent) of total solid content.
It further says, further includes release layer, the release layer is formed in the lower surface of the extremely low dielectric glue-line, described
Release layer is release film or release paper, and the material of the release film is polypropylene, Biaxially oriented polypropylene and poly terephthalic acid
At least one of glycol ester.
The present invention also provides the preparation method of the combined type LCP high-frequency high-speed FRCC substrate described in one kind, including it is following
Step：
Step 1: LCP varnish is coated on to the one side of copper foil layer, prior to 60-100 DEG C removal solvent, then at 300 DEG C
10hr reacts its yellow, that is, generates the LCP sandwich layer；
Step 2: extremely low dielectric glue to be coated on to the surface of the LCP sandwich layer, and dried to get extremely low Jie
Electric glue-line；
Step 3: pressing release layer on the surface of the extremely low dielectric glue-line；
Step 4: winding curing is to get finished product.
The beneficial effects of the invention are as follows：The present invention includes copper foil layer, LCP sandwich layer and extremely low dielectric glue-line, structurally reasonable, therefore
The present invention has at least the following advantages：
One, since the present invention uses from top to bottom for copper foil layer, the folded structure of LCP sandwich layer and extremely low dielectric glue-line, compared to
Traditional Bond Ply (heat-conducting insulation material) product in downstream industry using when need to remove release layer then press copper foil layer,
And the present invention can directly arrange in pairs or groups other LCP plates after removing release layer or PI dual platen directly uses, and does not need again plus one layer of use
In the pure glue of bonding, Downstream processing process is saved, and then saves production cost, improves production efficiency；And it can be as needed
By the FRCC substrate superposition of the invention of any multilayer, do not need by the pure glue for bonding, save the cost improves efficiency；
Two, the copper foil layer that the present invention uses has kelvin effect, due to low for low profile copper foil layer in signals transmission
Profile copper foil surface roughness is lower, and crystallization is fine and smooth, and surface is preferable, thus signal is able to achieve high-speed transfer, while pole
Low dielectric glue-line has lower and stable Dk/Df performance, can reduce the loss in signals transmission, further increase signal
Transmission quality is entirely capable of the needs of competent FPC high-frequency high-speed, thermally conductive rapid and cost minimization development of radiating；
Three, the extremely low dielectric glue-line in the present invention refers to that Dk value is 2.0-3.0 (10G Hz), and Df value is 0.002-
The glue-line of 0.010 (10G Hz), extremely low and stable under high temperature humidity environment Dk/Df value so that the present invention be suitble to it is low
Temperature (being lower than 180 DEG C) quick pressing, technique processability is strong, and low to making apparatus requirement, and then reduces production cost, sets
Standby operability and processability are superior to existing LCP substrate and PTFE fiber plate；More preferably, due to being suitble to low temperature pressing, greatly
The risk that route aoxidizes during preparing FPC is reduced greatly；
Four, extremely low dielectric glue-line of the invention can be polyimide resin layer, using polyimide resin collocation LCP core
The structure of layer, therefore the present invention is compared to traditional epoxy resin product, be more suitable for downstream industry small-bore (<100μm)UV
Radium-shine processing, it is not easy to cause through-hole (PTH, Plating Through Hole) or hole to inside contract, uniform film thickness when pressing, resistance
Anti- control is good, is not only suitable for the processing method of the machine drilling using larger aperture singly, and Technological adaptability is stronger；
Five, the present invention has lower bounce, the only half or so of LCP plate bounce compared with common LCP plate, fits
Close downstream High Density Packaging processing procedure；
Six, the present invention has LCP sandwich layer, and contains polyimide resin, sintering two in the formula of extremely low dielectric glue-line
Silica, Teflon, fluorine resin and phosphorus system flame retardant, since each raw material has low water absorption, therefore entirety of the invention absorbs water
Rate is in 0.01-0.5%, even lower than 0.1%, and due to ultralow water absorption rate, performance is stablized after water suction, has preferable electrical resistance
Can, the plate bursting risk of multi-layer board and Rigid Flex can be substantially reduced, signal is reduced and transmits insertion loss；
Seven, the present invention also has many advantages, such as good thermal expansivity, good flexibility, soldering resistance height and splendid mechanical performance,
And the Bonding strength of extremely low dielectric glue-line is good, Bonding strength>0.7kgf/cm2；
As long as eight, 50-130 DEG C of pressing section temperature of the invention, greatly reduces energy consumption and cost, improves workability,
The combined type LCP high-frequency high-speed FRCC substrate that suitable depth can not only be manufactured, is more readily apparent 100 μm of substrate.
Above description of the invention is only the general introduction of technical solution of the present invention, in order to better understand skill of the invention
Art means, and being implemented in accordance with the contents of the specification with presently preferred embodiments of the present invention and cooperate attached drawing specifically below
It is bright as after.
Detailed description of the invention
Fig. 1 is one of structural schematic diagram of the invention (without release layer)；
Fig. 2 is second structural representation of the invention (containing release layer)；
Each section label is as follows in attached drawing：
The extremely low dielectric glue-line of 100- copper foil layer, 200-LCP sandwich layer, 300- and 400- release layer.
Specific embodiment
Illustrate a specific embodiment of the invention below by way of particular specific embodiment, those skilled in the art can be by this
The revealed content of specification understands advantages of the present invention and effect easily.The present invention can also give in further, different ways
Implement, that is, under the scope of without departing substantially from disclosed, different modification and change can be given.
Embodiment：A kind of combined type LCP high-frequency high-speed FRCC substrate, as depicted in figs. 1 and 2, including copper foil layer 100, LCP
Sandwich layer 200 and extremely low dielectric glue-line 300；The LCP sandwich layer 200 has opposite upper and lower surfaces, the formation of copper foil layer 100
In the upper surface of the LCP sandwich layer 200, the extremely low dielectric glue-line 300 is formed in the lower surface of the LCP sandwich layer 200；
The copper foil layer 100 with a thickness of 1-35 μm；The LCP sandwich layer 200 with a thickness of 5-50 μm；The extremely low dielectric
Glue-line 300 with a thickness of 2-50 μm, and the overall thickness of the copper foil layer, LCP sandwich layer and extremely low dielectric glue-line be 10-135 μm.
Preferably, the copper foil layer with a thickness of 6-18 μm；The LCP sandwich layer with a thickness of 12.5-50 μm；It is described extremely low
The thickness of dielectric glue-line is all 12.5-50 μm.
The extremely low dielectric glue-line 300 refer to Dk (dielectric constant) value be 2.0-3.0 (10GHz), and Df (dielectric loss because
Son) value be 0.002-0.010 (10GHz) glue-line.
Preferably, the extremely low dielectric glue-line refers to that Dk value is the glue-line of 2.2-3.0 (10GHz).
It is 0.4-1.0 μm of low profile copper foil layer that the copper foil layer 100, which is Rz (surface roughness) value, and the copper foil layer
The Rz value of 100 one sides adhered with the LCP sandwich layer 200 is 0.4-1.0 μm, and the Rz value of the outer surface of the copper foil layer 200
It is 0.4-0.7 μm, the copper foil layer is rolled copper foil layer (RA/HA/HAV2) or electrodeposited copper foil layer (ED).
The Rz value of the copper foil layer and the one side of LCP sandwich layer adhesion is such as 0.4 μm, 0.5 μm, 0.6 μm, 0.7 μm,
0.8 μm, 0.9 μm or 1.0 μm, and the Rz value of the outer surface of the copper foil layer is such as 0.4 μm, 0.5 μm, 0.6 μm or 0.7 μm.
The water absorption rate of the LCP sandwich layer 200 is 0.01-0.1%；The water absorption rate of the extremely low dielectric glue-line 300 is 0.01-
0.1%；The whole water absorption rate of the FRCC substrate is 0.01-0.5%.
Preferably, the water absorption rate of the LCP sandwich layer is 0.01-0.04%；The water absorption rate of the extremely low dielectric glue-line is
0.01-0.08%；The whole water absorption rate of the FRCC substrate is 0.01-0.1%.
The Bonding strength of the extremely low dielectric glue-line 300>0.7kgf/cm2。
Resin material in the extremely low dielectric glue-line is fluorine resin, epoxy resin, acrylic resin, amidocarbonic acid
Ester system resin, gathers in ring diformazan benzene series resin, bismaleimide amine system resin and polyimide resin silicon rubber system resin
It is at least one.
The extremely low dielectric glue-line 300 includes fused silica, Teflon, fluorine resin, phosphorus system flame retardant and polyamides
Imide resin, and the sum of the fused silica, the Teflon, the fluorine resin and ratio of phosphorus system flame retardant
For the 8-50% (weight percent) of total solid content, the ratio of the polyimide resin content is 40%-90% (weight percent
Than).
The ratio of the fused silica is the 2-15% (weight percent) of total solid content, the ratio of the Teflon
For the 2-10% (weight percent) of total solid content, the ratio of the fluorine resin is the 2-10% (weight percent of total solid content
Than), the ratio of phosphorus system flame retardant is the 2-15% (weight percent) of total solid content.
It further include release layer 400, the release layer is formed in the lower surface of the extremely low dielectric glue-line, and the release layer is
Release film or release paper, the material of the release film are polypropylene, Biaxially oriented polypropylene and polyethylene terephthalate
At least one of.
A kind of preparation method of the combined type LCP high-frequency high-speed FRCC substrate, includes the following steps：
Step 1: LCP varnish (such as Sumitomo Chemical.VR400) is coated on the one side of copper foil layer, prior to 60-
100 DEG C of removal solvents, then 10hr reacts its yellow at 300 DEG C, that is, generates the LCP sandwich layer；
Step 2: extremely low dielectric glue to be coated on to the surface of the LCP sandwich layer, and dried to get extremely low Jie
Electric glue-line；
Step 3: in the surface of extremely low dielectric glue-line pressing release layer, 50-130 DEG C of pressing-in temp；
Step 4: winding curing is to get finished product.
In the embodiment of the present invention, the fused silica of extremely low dielectric glue-line, Teflon, fluorine resin, the resistance to combustion of phosphorus system
The weight percentage of agent and polyimide resin, as shown in table 1.
Table 1:
The embodiment of the present invention is compared with the LCP plate of the prior art carries out basic performance, as the following table 2 records.
Table 2：
Note：The test method of 2 performance indicator of table executes《Soft board assembles important item test philosophy》(TPCA-F-002).
As shown in Table 2, combined type LCP high-frequency high-speed FRCC substrate of the invention has splendid high-speed transfer, low-heat
The coefficient of expansion, ultralow water absorption rate, good UV laser drilling ability, is suitble to dk/df performance stable under high temperature humidity environment
The low bounce-back power and splendid mechanical performance of High Density Packaging.
The present invention is better than LCP film and common PI type Bond Sheet (bonding sheet), is suitable for 5G smartphone, Apple
The wearable devices such as watch (smartwatch).
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant technical fields, similarly
It is included within the scope of the present invention.
Claims (10)
1. a kind of combined type LCP high-frequency high-speed FRCC substrate, it is characterised in that：Including copper foil layer, LCP sandwich layer and extremely low dielectric glue
Layer；The LCP sandwich layer has opposite upper and lower surfaces, and the copper foil layer is formed in the upper surface of the LCP sandwich layer, the pole
Low dielectric glue-line is formed in the lower surface of the LCP sandwich layer；
The copper foil layer with a thickness of 1-35 μm；The LCP sandwich layer with a thickness of 5-50 μm；The thickness of the extremely low dielectric glue-line
It is 2-50 μm, and the overall thickness of the copper foil layer, LCP sandwich layer and extremely low dielectric glue-line is 10-135 μm.
2. combined type LCP high-frequency high-speed FRCC substrate according to claim 1, it is characterised in that：The extremely low dielectric glue
Layer refers to that Dk value is 2.0-3.0 (10GHz), and Df value is the glue-line of 0.002-0.010 (10GHz).
3. combined type LCP high-frequency high-speed FRCC substrate according to claim 1, it is characterised in that：The copper foil layer is Rz
The low profile copper foil layer that value is 0.4-1.0 μm, and the Rz value of the copper foil layer and the one side of LCP sandwich layer adhesion is 0.4-
1.0 μm, the Rz value of the outer surface of the copper foil layer is 0.4-0.7 μm, and the copper foil layer is rolled copper foil layer or electrolytic copper foil
Layer.
4. combined type LCP high-frequency high-speed FRCC substrate according to claim 1, it is characterised in that：The suction of the LCP sandwich layer
Water rate is 0.01-0.1%；The water absorption rate of the extremely low dielectric glue-line is 0.01-0.1%；The whole water suction of the FRCC substrate
Rate is 0.01-0.5%.
5. combined type LCP high-frequency high-speed FRCC substrate according to claim 1, it is characterised in that：The extremely low dielectric glue
The Bonding strength of layer>0.7kgf/cm2。
6. combined type LCP high-frequency high-speed FRCC substrate according to claim 1, it is characterised in that：The extremely low dielectric glue
Layer in resin material be fluorine resin, epoxy resin, acrylic resin, amido formate system resin, silicon rubber system resin,
Gather at least one of ring diformazan benzene series resin, bismaleimide amine system resin and polyimide resin.
7. combined type LCP high-frequency high-speed FRCC substrate according to claim 1, it is characterised in that：The extremely low dielectric glue
Layer includes fused silica, Teflon, fluorine resin, phosphorus system flame retardant and polyimide resin, and the sintering titanium dioxide
The sum of ratio of silicon, the Teflon, the fluorine resin and phosphorus system flame retardant is the 8-50% (weight hundred of total solid content
Divide ratio), the ratio of the polyimide resin content is 40%-90% (weight percent).
8. combined type LCP high-frequency high-speed FRCC substrate according to claim 7, it is characterised in that：The sintering titanium dioxide
The ratio of silicon is the 2-15% (weight percent) of total solid content, and the ratio of the Teflon is the 2-10% (weight of total solid content
Measure percentage), the ratio of the fluorine resin is the 2-10% (weight percent) of total solid content, the ratio of phosphorus system flame retardant
Example is the 2-15% (weight percent) of total solid content.
9. combined type LCP high-frequency high-speed FRCC substrate according to claim 1, it is characterised in that：It further include release layer, institute
The lower surface that release layer is formed in the extremely low dielectric glue-line is stated, the release layer is release film or release paper, the release film
Material be at least one of polypropylene, Biaxially oriented polypropylene and polyethylene terephthalate.
10. a kind of preparation method of combined type LCP high-frequency high-speed FRCC substrate according to claim 1, it is characterised in that：
Include the following steps：
Step 1: LCP varnish to be coated on to the one side of copper foil layer, prior to 60-100 DEG C removal solvent, the then 10hr at 300 DEG C
Its yellow is reacted, that is, generates the LCP sandwich layer；
Step 2: extremely low dielectric glue to be coated on to the surface of the LCP sandwich layer, and dried to get the extremely low dielectric glue
Layer；
Step 3: pressing release layer on the surface of the extremely low dielectric glue-line；
Step 4: winding curing is to get finished product.
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| CN201710324814.4A CN108882501A (en) | 2017-05-10 | 2017-05-10 | Combined type LCP high-frequency high-speed FRCC substrate and preparation method thereof |
| TW106134733A TWI635952B (en) | 2017-05-10 | 2017-10-11 | Compound metal substrate structure |
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| CN201710324814.4A CN108882501A (en) | 2017-05-10 | 2017-05-10 | Combined type LCP high-frequency high-speed FRCC substrate and preparation method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109699132A (en) * | 2018-12-28 | 2019-04-30 | 广州市香港科大霍英东研究院 | Multilayer LCP low temperature compression method and the product of preparation |
| TWI696024B (en) * | 2019-03-21 | 2020-06-11 | 亞洲電材股份有限公司 | Flexible resin coated copper foil substrate and methods thereof |
| CN113103710A (en) * | 2021-04-02 | 2021-07-13 | 宁波聚嘉新材料科技有限公司 | LCP composite film suitable for high frequency and high speed and preparation method thereof |
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| CN109699132A (en) * | 2018-12-28 | 2019-04-30 | 广州市香港科大霍英东研究院 | Multilayer LCP low temperature compression method and the product of preparation |
| TWI696024B (en) * | 2019-03-21 | 2020-06-11 | 亞洲電材股份有限公司 | Flexible resin coated copper foil substrate and methods thereof |
| CN113103710A (en) * | 2021-04-02 | 2021-07-13 | 宁波聚嘉新材料科技有限公司 | LCP composite film suitable for high frequency and high speed and preparation method thereof |
| CN113103710B (en) * | 2021-04-02 | 2022-01-07 | 宁波聚嘉新材料科技有限公司 | LCP composite film suitable for high frequency and high speed and preparation method thereof |
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