CN108878678A - Conductive adhesive structure production method, conductive adhesive structure and display panel assembly - Google Patents
Conductive adhesive structure production method, conductive adhesive structure and display panel assembly Download PDFInfo
- Publication number
- CN108878678A CN108878678A CN201810613949.7A CN201810613949A CN108878678A CN 108878678 A CN108878678 A CN 108878678A CN 201810613949 A CN201810613949 A CN 201810613949A CN 108878678 A CN108878678 A CN 108878678A
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- conductive adhesive
- adhesive structure
- glue
- metal wire
- line
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention provides a kind of conductive adhesive structure production method, conductive adhesive structure and display panel assemblies.This approach includes the following steps provides a substrate；Processing is patterned in the front of substrate to form multiple grooves；Activation is carried out to multiple groove；Grow corresponding a plurality of metal wire along vertical direction using the groove as basic point；Injecting glue is carried out to the front of the substrate, glue-line is filled at the interval between a plurality of metal wire to be formed；Remove the substrate.The present invention has the beneficial effect for improving conductive stability of the conductive adhesive structure after pressing.
Description
Technical field
The present invention relates to display fields, and in particular to a kind of conductive adhesive structure production method, conductive adhesive structure and display surface
Board group part.
Background technique
Present display panel enters the innovation epoch, and oled panel will be increasingly becoming the mainstream of small size panel, but nothing
By LCD panel or oled panel, panel will be connected on electrical part mainboard by COF (IC) and FPC, to receive signal
Display.The Bonding (pressing) of COF (IC) and FPC will use anisotropic conductive (ACF) glue, to control orientation electric conductivity,
Realize the high display effect of accuracy, clarity.
The ACF glue used now is the structure of package conducting particles inside the organic matters such as UV, and the structure is in Bonding processing procedure
When, when Panel and COF (IC) or COF and FPC terminal pass through ACF glue connection, the conducting particles in ACF glue be can connect
Two parts terminal, and avoid transverse conductance contacted with ions.But the distribution of conducting particles is easily uneven in ACF glue now,
Conductive ion deflection is difficult to control after Bonding processing procedure, and conductive ion is easy laterally contact, etc. disadvantage after Bonding
The yield for resulting in Bonding processing procedure is lower.
Therefore, the prior art is defective, needs to improve.
Summary of the invention
The purpose of the embodiment of the present invention is that providing a kind of conductive adhesive structure production method, conductive adhesive structure and display surface board group
Part has the beneficial effect for keeping conductive stability of the conductive adhesive structure after pressing.
The embodiment of the present invention provides a kind of conductive adhesive structure production method, includes the following steps：
One substrate is provided；
Processing is patterned in the front of substrate to form multiple grooves；
Activation is carried out to multiple groove；
Grow corresponding a plurality of metal wire along vertical direction using the groove as basic point；
Injecting glue is carried out to the front of the substrate, glue-line is filled at the interval between a plurality of metal wire to be formed；
Remove the substrate.
In conductive adhesive structure production method of the present invention, the glue-line is UV glue basis material.
In conductive adhesive structure production method of the present invention, grown along vertical direction using the groove as basic point
During corresponding a plurality of metal wire, using the method for being oriented growth in magnetic field, to control metal wire vertical-growth.
In conductive adhesive structure production method of the present invention, the front of described pair of substrate carry out injecting glue with formed by
Interval between a plurality of metal wire was filled in the step of glue-line, and the method for being in charge of injecting glue is taken so that colloid uniformly flow into it is adjacent
In gap between two wires.
In conductive adhesive structure production method of the present invention, the front of described pair of substrate carry out injecting glue with formed by
In the step of glue-line is filled at interval between a plurality of metal wire, the stable magnetic field is kept.
A kind of conductive adhesive structure, including：
Glue-line；
More wires in the glue-line are set, more wires upwardly extend in the bondline thickness side and
Mutually insulated.
In conductive adhesive structure of the present invention, more wires rectangular array arrangements.
In conductive adhesive structure of the present invention, the material of the glue-line is UV glue.
In conductive adhesive structure of the present invention, the radius of the metal wire is 0.8um-1.2um.
In conductive adhesive structure of the present invention, the both ends of the metal wire protrude from respectively the glue-line top surface and
Bottom surface.
A kind of display panel assembly, including conductive adhesive structure described in any of the above embodiments, flip chip layer and display surface
Plate；The flip chip layer is electrically connected by the conductive adhesive structure with the display panel；
The display panel is provided with multiple first terminals, and the flip chip layer is provided with multiple Second terminals；
The multiple first terminal passes through the metal wire and the multiple Second terminal electricity in the conductive adhesive structure respectively
Connection.
In display panel assembly of the present invention, each first terminal passes through at least two metals respectively
Line is electrically connected with the corresponding Second terminal.
In display panel assembly of the present invention, the glue-line of the conductive adhesive structure includes join domain and interval
Region, the metal wire are set to the join domain, and the width of the interval region is greater than adjacent two gold in join domain
Belong to the spacing distance between line.
In display panel assembly of the present invention, the quantity of the conductive adhesive structure is two, and respectively first leads
Electric plastic structure and the second conductive adhesive structure；
First conductive adhesive structure is connect with the flip chip layer, and the metal wire in first conductive adhesive structure
It is electrically connected with the first terminal；
Second conductive adhesive structure is connect with the display panel, and the metal wire in second conductive adhesive structure with
The Second terminal electrical connection.
From the foregoing, it will be observed that the present invention is by providing a substrate；It is multiple recessed to be formed that processing is patterned in the front of substrate
Slot；Activation is carried out to multiple groove；Grow corresponding a plurality of metal along vertical direction using the groove as basic point
Line；Injecting glue is carried out to the front of the substrate, glue-line is filled at the interval between a plurality of metal wire to be formed；The substrate is removed, thus
The production of conductive adhesive structure is completed, there is the beneficial effect for improving conductive stability of the conductive adhesive structure after pressing.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those skilled in the art, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
Fig. 1 is the flow diagram of the conductive adhesive structure production method in some embodiments of the invention.
Fig. 2-Fig. 5 is the detailed process schematic diagram of the conductive adhesive structure production method in some embodiments of the invention.
Fig. 6 is a kind of structural schematic diagram of the conductive adhesive structure part in some embodiments of the invention.
Fig. 7 is another structural schematic diagram of the conductive adhesive structure part in some embodiments of the invention.
Fig. 8 is a kind of structural schematic diagram of the conducting resinl structure, assembly part in some embodiments of the invention.
Fig. 9 is a kind of structural schematic diagram of the display panel assembly in some embodiments of the invention.
Figure 10 is a kind of partial structural diagram of the display panel assembly in some embodiments of the invention.
Figure 11 is a kind of partial structural diagram of the display panel assembly in some embodiments of the invention.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of
The description present invention and simplified description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with spy
Fixed orientation construction and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.
" first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.?
In description of the invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected or can mutually communicate；It can be directly connected, it can also be by between intermediary
It connects connected, can be the connection inside two elements or the interaction relationship of two elements.For the ordinary skill of this field
For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower"
It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it
Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above "
Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of
First feature horizontal height is less than second feature.
Following disclosure provides many different embodiments or example is used to realize different structure of the invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Referring to Fig. 1, Fig. 1 is the flow chart of the conductive adhesive structure production method in some embodiments of the invention, the conduction
Plastic structure production method includes the following steps：
S101, a substrate is provided.
Wherein, the substrate 10 in the step can may be silicon substrate plate for metal base plate.
S102, processing is patterned to form multiple grooves in the front of substrate.
Wherein, referring to Fig. 2 and Fig. 3, using the method for exposure and development in the first shape in the front of the substrate 10
At multiple rectangles or circle.Then multiple rectangle or circle are etched away using the method for etching, to be formed between more
Every the groove 11 of setting.Certainly, a part of thickness is only etched.Wherein, multiple 11 rectangular array of groove arrangement.The groove 11
Can be rectangular, it can also be in rounded shape.
S103, activation is carried out to multiple groove.
It wherein, can be using to multiple groove 11 injection activating ion for example, when the substrate 10 is silicon substrate plate
Mode is come so that being activated to multiple groove 11.After activation processing, when deposition, metal wire can be made with the groove 11
It is deposited for basic point, and is deposited along vertical direction.
S104, corresponding a plurality of metal wire is grown along vertical direction using the groove as basic point.
Referring to Fig. 4, wherein in this step, in order to keep the vertical of a plurality of metal wire 20, can add
Growth metal wire 20 is carried out in the environment of stationary magnetic field, thus oriented growth metal wire 20.Physical vapor deposition can be used,
To deposit the metal wire 20.
S105, injecting glue is carried out to the front of the substrate to be formed the interval filling glue-line between a plurality of metal wire.
Referring to Fig. 5, wherein in this step, take the method for being in charge of injecting glue so that colloid uniformly flow into it is adjacent
In gap between two wires.The glue filling device 60 of the injecting glue is provided with multiple injecting glues and is in charge of 61, each adjacent two gold
Belonging to the gap between line 20 use an injecting glue to be in charge of 61 to carry out injecting glue to form the package a plurality of metal wire 20 and will be any
The glue-line 30 of gap filling between adjacent two metal line 20.The glue-line 30 is UV glue basis material, using epoxide resin type
Matrix body is the polycondensation production of epoxychloropropane and bisphenol-A or polyalcohol.Wherein, during injecting glue, keep the magnetic field steady
It is fixed, to avoid because the pressure of colloid causes metal wire to deform.
S106, the substrate is removed.
Wherein, in some embodiments, after removing the substrate, one towards the first substrate in the glue-line is needed
Face carries out the operation of injecting glue again, so that glue-line is flushed with the end of the metal wire.
Referring to Fig. 6, wherein the substrate 10 can be removed using physical method or chemical method.
It is to be appreciated that in some embodiments, please referring to Fig. 7, the both ends of the metal wire 20 can slightly stretch respectively
For the both ends of the glue-line 30, in order to it is subsequent using the conductive adhesive structure when electrical connection.
From the foregoing, it will be observed that the present invention is by providing a substrate；It is multiple recessed to be formed that processing is patterned in the front of substrate
Slot；Activation is carried out to multiple groove；Grow corresponding a plurality of metal along vertical direction using the groove as basic point
Line；Injecting glue is carried out to the front of the substrate, glue-line is filled at the interval between a plurality of metal wire to be formed；The substrate is removed, thus
The production of conductive adhesive structure is completed, there is the beneficial effect for improving conductive stability of the conductive adhesive structure after pressing.
Fig. 6 or Fig. 7 is please referred to, the present invention also provides a kind of conductive adhesive structure, uses the method in above-described embodiment
It is made.The conductive adhesive structure includes：More wires 20 and glue-line 30.More wires 20, which are parallel to each other and are spaced, to be set
It sets；The glue-line 30 is for wrapping up more wires 20 and filling the gap between two metal line 20 of arbitrary neighborhood.
More wires 20 are parallel and interval setting, more wires 20 can be arranged with rectangular array.In order to protect
The vertical of a plurality of metal wire is held, growth metal wire can be carried out in the environment for having added stationary magnetic field, so that oriented growth is golden
Belong to line.Physical vapor deposition can be used, to deposit the metal wire.The method for being in charge of injecting glue can be taken, so that colloid is equal
Uniform flow enters in the gap between adjacent two wires 20.Gap between each adjacent two wires 20 uses an injecting glue
It is in charge of to carry out injecting glue.The glue-line is UV glue basis material, is epoxychloropropane and bis-phenol using epoxide resin type matrix body
The polycondensation of A or polyalcohol produces.Wherein, during injecting glue, the stable magnetic field is kept, to avoid because the pressure of colloid causes
Metal wire deformation.
Wherein, more 20 rectangular array of wires arrangements.
The radius of metal wire is 0.8um-1.2um.Preferably 1um.
In some embodiments, the both ends of the metal wire 20 flush (such as Fig. 6) with the top and bottom of glue-line 30 respectively.
In some embodiments, the both ends of the metal wire 20 protrude from the top and bottom (such as Fig. 7) of glue-line 30 respectively.
Please refer to Fig. 8, in some embodiments, additionally provide a kind of conducting resinl component, conducting resinl component include multilayer into
The conductive adhesive structure of row superposition.The conductive adhesive structure includes：More wires 20 and glue-line 30.More wires 20 are mutually
Parallel and interval setting；The glue-line 30 is for wrapping up more wires 20 and filling between two metal line 20 of arbitrary neighborhood
Gap, certainly in practice, more wires 20 be unable to reach it is absolute parallel, it is possible that certain bending or inclination,
But it is utilized in growth metal wire in magnetic field and makes its growth vertical as far as possible, realize as far as possible parallel.
More wires 20 are parallel and interval setting, more wires 20 can be arranged with rectangular array.In order to protect
The vertical of a plurality of metal wire is held, growth metal wire can be carried out in the environment for having added stationary magnetic field, so that oriented growth is golden
Belong to line.Physical vapor deposition can be used, to deposit the metal wire.The method for being in charge of injecting glue can be taken, so that colloid is equal
Uniform flow enters in the gap between adjacent two wires 20.Gap between each adjacent two wires 20 uses an injecting glue
It is in charge of to carry out injecting glue.The glue-line is UV glue basis material, is epoxychloropropane and bis-phenol using epoxide resin type matrix body
The polycondensation of A or polyalcohol produces.Wherein, during injecting glue, the stable magnetic field is kept, to avoid because the pressure of colloid causes
Metal wire deformation.
Wherein, more 20 rectangular array of wires arrangements.The both ends of the metal wire 20 top surface with glue-line 30 respectively
It is flushed with bottom surface.
Fig. 9 is please referred to, the present invention also provides a kind of display panel assemblies, including conductive adhesive structure 200, flip chip layer
300 and display panel 100；The flip chip layer 300 passes through the conductive adhesive structure 200 and 100 electricity of display panel
Connection.
Wherein, which is provided with multiple first terminals 101, and the flip chip layer 300 is provided with multiple
Two-terminal 301；The multiple first terminal 101 respectively by metal wire 20 in the conductive adhesive structure 200 with it is the multiple
Second terminal 301 is electrically connected.
In display panel assembly of the present invention, each first terminal 101 passes through at least two respectively
Metal wire 20 is electrically connected with the corresponding Second terminal 30.In other words, the spacing distance of adjacent two wires 20 is less than
The width of first terminal or Second terminal.Wherein, the metal wire 20 in conductive adhesive structure in detail in this figure is in crimping process
In it is curved, metal wire row to extending vertically before crimping.
Specifically, the glue-line 10 of conductive adhesive structure includes join domain and interval region, and metal wire 20 is set to described
Join domain, the width of the interval region are greater than the spacing distance in join domain between adjacent two wires 20.
In some embodiments, the quantity of conductive adhesive structure is two, and respectively the first conductive adhesive structure and second are led
Electric plastic structure；First conductive adhesive structure is connect with the flip chip layer, and the metal wire in the first conductive adhesive structure with it is described
First terminal electrical connection；Second conductive adhesive structure is connect with the display panel, and the metal in second conductive adhesive structure
Line is electrically connected with the Second terminal.The metal wire of first conductive adhesive structure and the second conductive adhesive structure connects correspondingly
It connects, can be end face and abut (such as Figure 11), be also possible to side and abut (such as Figure 10).
Conductive adhesive structure production method provided in an embodiment of the present invention and conductive adhesive structure are described in detail above,
Used herein a specific example illustrates the principle and implementation of the invention, and the explanation of above embodiments is only used
The present invention is understood in help.Meanwhile for those skilled in the art, according to the thought of the present invention, in specific embodiment and
There will be changes in application range, in conclusion the contents of this specification are not to be construed as limiting the invention.
Claims (14)
1. a kind of conductive adhesive structure production method, which is characterized in that include the following steps：
One substrate is provided；
Processing is patterned in the front of substrate to form multiple grooves；
Activation is carried out to multiple groove；
Grow corresponding a plurality of metal wire along vertical direction using the groove as basic point；
Injecting glue is carried out to the front of the substrate, glue-line is filled at the interval between a plurality of metal wire to be formed；
Remove the substrate.
2. conductive adhesive structure production method according to claim 1, which is characterized in that the glue-line is UV matrix body material
Material.
3. conductive adhesive structure production method according to claim 1, which is characterized in that be basic point along perpendicular using the groove
Histogram is to during growing corresponding a plurality of metal wire, using the method for being oriented growth in magnetic field, to control gold
Belong to line vertical-growth.
4. conductive adhesive structure production method according to claim 3, which is characterized in that the front of the described pair of substrate carries out
Injecting glue takes the method for being in charge of injecting glue, so that colloid to be formed in the step of glue-line is filled at the interval between a plurality of metal wire
It uniformly flows into the gap between adjacent two wires.
5. conductive adhesive structure production method according to claim 4, which is characterized in that the front of the described pair of substrate carries out
Injecting glue keeps the stable magnetic field to be formed in the step of glue-line is filled at the interval between a plurality of metal wire.
6. a kind of conductive adhesive structure, which is characterized in that including：
Glue-line；
More wires in the glue-line are set, and more wires upwardly extend and mutually in the bondline thickness side
Insulation.
7. conductive adhesive structure according to claim 6, which is characterized in that more wires rectangular array arrangements.
8. conductive adhesive structure according to claim 6, which is characterized in that the material of the glue-line is UV glue.
9. conductive adhesive structure according to claim 6, which is characterized in that the radius of the metal wire is 0.8um-1.2um.
10. a kind of conductive adhesive structure according to claim 8, which is characterized in that protrude respectively at the both ends of the metal wire
In the top and bottom of the glue-line.
11. a kind of display panel assembly, which is characterized in that including the described in any item conductive adhesive structures of claim 6-10, cover
Polycrystalline thin film layer and display panel；The flip chip layer is electrically connected by the conductive adhesive structure with the display panel；
The display panel is provided with multiple first terminals, and the flip chip layer is provided with multiple Second terminals；
The multiple first terminal is electrically connected by the metal wire in the conductive adhesive structure with the multiple Second terminal respectively.
12. display panel assembly according to claim 11, which is characterized in that each first terminal passes through respectively
At least two wires are electrically connected with the corresponding Second terminal.
13. display panel assembly according to claim 11, which is characterized in that the glue-line of the conductive adhesive structure includes connection
Region and interval region, the metal wire are set to the join domain, and the width of the interval region is greater than join domain
Spacing distance between interior adjacent two wires.
14. display panel assembly according to claim 11, which is characterized in that the quantity of the conductive adhesive structure is two,
Respectively the first conductive adhesive structure and the second conductive adhesive structure；
First conductive adhesive structure is connect with the flip chip layer, and metal wire and institute in first conductive adhesive structure
State first terminal electrical connection；
Second conductive adhesive structure is connect with the display panel, and the metal wire in second conductive adhesive structure with it is described
Second terminal electrical connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810613949.7A CN108878678A (en) | 2018-06-14 | 2018-06-14 | Conductive adhesive structure production method, conductive adhesive structure and display panel assembly |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810613949.7A CN108878678A (en) | 2018-06-14 | 2018-06-14 | Conductive adhesive structure production method, conductive adhesive structure and display panel assembly |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113284649A (en) * | 2021-06-17 | 2021-08-20 | 京东方科技集团股份有限公司 | Conductive adhesive tape, display module and display device |
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