CN108857588A - Burnishing device and polishing method - Google Patents

Abstract

The invention discloses a polishing device and a polishing method, and relates to the technical field of polishing. An embodiment of the present invention provides a polishing device, including: a cabin body, a first cavity and a second cavity separated by a partition board are arranged in the cabin body, and the partition board is used to make the first cavity The cavity and the second cavity are connected or isolated, the first cavity is provided with detection equipment for detecting the topographical characteristics of the component to be polished, and the second cavity is provided with a polishing device for polishing the component to be polished. equipment. The invention is mainly used to improve the processing efficiency of the components to be thrown.

Description

Polishing device and polishing method

technical field

The invention relates to the technical field of polishing, in particular to a polishing device and a polishing method.

Background technique

Hard and brittle materials such as silicon carbide, sapphire, and quartz glass are made into optoelectronic components due to their unique physical and chemical properties, and are widely used in scientific and technological fields such as space exploration, electronics, and nuclear energy. However, due to the characteristics of high hardness and brittle fracture during processing, the forming and processing of hard and brittle materials is a major difficulty in the field of precision machining, especially for the polishing of the surface of large and medium-sized hard and brittle materials. High-quality optical components usually require more precise surface profile, smaller surface roughness and less subsurface damage, and the increase in component size makes it more difficult to meet these requirements.

At present, the surface polishing of large and medium-sized hard and brittle optical components is mainly realized through the following steps: milling and grinding, rough grinding with abrasive sand, fine grinding with abrasive sand, polishing with polishing powder, cleaning, drying, surface inspection, and marking surface error , rework, polish and trim the surface again, and so on until the surface meets the requirements. However, traditional bulk polishing is not easy to remove subsurface damage. Therefore, new polishing technologies such as particle beam polishing, magnetorheological polishing, and plasma polishing are used as the last polishing process to repeatedly modify the surface shape and remove subsurface damage at the same time. the goal of. However, since the polishing process and the surface inspection use different equipment, in the component surface finishing stage, the components have to be reciprocated and transported between the polishing equipment and the testing equipment for many times, and the components also need to be clamped and fixed. The process is very time-consuming and the processing efficiency is low.

Contents of the invention

In view of this, embodiments of the present invention provide a polishing device and a polishing method, which are mainly used to improve the processing efficiency of an element to be polished.

In order to achieve the above object, the present invention mainly provides the following technical solutions:

An embodiment of the present invention provides a polishing device, comprising:

A cabin, the cabin is provided with a first cavity and a second cavity separated by an isolation plate, and the isolation plate is used to communicate or communicate between the first cavity and the second cavity In isolation, the first cavity is provided with detection equipment for detecting the components to be polished, and the second cavity is provided with polishing equipment for polishing the components to be polished.

Optionally, the polishing device also includes:

A support platform, the support platform is movably connected to the cabin, so that the support platform can move into the first cavity or the second cavity, and the support platform is used to support the components to be thrown.

Optionally, a first slide rail is provided in the cabin, and the two ends of the first slide rail respectively extend into the first cavity and the second cavity, and the support platform is slidably connected to the first rail.

Optionally, the supporting platform includes a supporting part and a rotating platform, one end of the supporting part is slidably connected to the first slide rail, and the other end is rotatably connected to the rotating platform, and the rotating platform is used to support the Throw components.

Optionally, the support part includes a first base, a second base and a lifter, the first base is slidably connected to the first slide rail, and the first base is provided with a second slide The second base is slidably connected to the second sliding rail, and the second base is connected to the rotating platform through the lifter.

Optionally, the polishing equipment includes a plasma torch and a plasma generating device, the plasma torch is connected to the plasma generating device, and an output port of the plasma torch is used to face the component to be polished.

Optionally, a first camera device is provided in the first cavity, and a second camera device is provided in the second cavity.

Optionally, the second cavity is connected with an exhaust pipe, and the exhaust pipe is used to discharge the gas in the second cavity.

Optionally, the exhaust pipe is connected to an exhaust gas treatment device.

Optionally, the polishing device also includes:

A processing system, the processing system is connected to the detection device and the polishing device, the processing system is used to obtain the detection parameters of the detection device, and control the polishing device to polish the component to be polished according to the detection parameters .

On the other hand, an embodiment of the present invention also provides a polishing method for the polishing device as described, including:

Detecting the component to be thrown, and obtaining the first detection parameter;

performing polishing on the component to be polished according to the first detection parameter;

After the component to be polished is polished, the component to be polished is detected again to obtain a second detection parameter;

judging whether the second detection parameter is within a preset parameter range, and if the time detection parameter is not within the preset parameter range, re-polishing the to-be-polished component according to the second detection parameter.

The embodiment of the present invention provides a polishing device for more convenient and quick detection and polishing of the components to be polished. In the first stage, the components have to be reciprocated and transported between the polishing equipment and the testing equipment many times, which leads to a very time-consuming process of precision trimming and reduces the polishing efficiency. Compared with the prior art, the polishing device provided by the present application includes a cabin body, which is provided with a first cavity and a second cavity separated by an isolation plate, and the isolation plate is used to make the first cavity and the second cavity The two cavities are connected or isolated. During the application process, the component to be thrown can be placed in the first cavity, and the surface shape of the processing surface of the component to be thrown can be detected by the detection equipment in the first cavity, and then the isolation plate can be opened , after transferring the components to be polished into the second cavity, the isolation plate is closed, and the components to be polished are processed by the polishing equipment in the second cavity according to the detection parameters, so that the detection and polishing of the components to be polished in the polishing device can be realized, Improved polishing and inspection efficiency.

Description of drawings

FIG. 1 is a schematic structural view of a polishing device provided by an embodiment of the present invention;

FIG. 2 is a flowchart of a polishing method provided by an embodiment of the present invention.

Detailed ways

In order to further explain the technical means and effects that the present invention takes to achieve the intended purpose of the invention, below in conjunction with the accompanying drawings and preferred embodiments, the specific implementation, structure, features and details of the polishing device and polishing method proposed according to the present invention will be described below. Efficacy, detailed as follows.

As shown in Figure 1, an embodiment of the present invention provides a polishing device, including:

The cabin body 1 is provided with a first cavity 21 and a second cavity 22 separated by an isolation plate 2 in the cabin body 2, and the isolation plate 2 is used to communicate between the first cavity 21 and the second cavity 22 Or isolated, the first cavity 21 is provided with a detection device 4 for detecting the component 3 to be polished, and the second cavity 22 is provided with a polishing device 5 for polishing the component 3 to be polished.

Among them, the cabin body 1 is used to place the components 3 to be thrown away. In order to ensure the service life of the cabin body 1, the cabin body 1 can be made of metal material, and the cabin body 1 is provided with an isolation plate 2, and the isolation plate 2 can be placed in the cabin body. 1, the first cavity 21 and the second cavity 22 in the cabin body 1 are connected or isolated. Optionally, the isolation plate 2 is a telescopic plate. When the isolation plate 2 is in an extended state, the isolation plate 2 can The first cavity 21 and the second cavity 22 are isolated from each other so that the first cavity 21 and the second cavity 22 are in a relatively airtight state. When the isolation plate 2 is in a contracted state, the isolation plate 2 can seal the first cavity 21 and the second cavity 22 communicate with each other, so that the element 3 to be thrown can move between the first cavity 21 and the second cavity 22 .

Wherein, a detection device 4 is provided in the first cavity 21, and a polishing device 5 is provided in the second cavity 22, wherein the detection device 4 can detect the surface size parameters of the processed surface in the component 3 to be polished for detection, preferably , the detection device 4 can be a laser scanning measurement device, which can quickly and accurately obtain the data to be detected; the polishing device 5 can polish the component 3 to be polished, preferably, the polishing device 5 can be an etching polishing device 5, and its etching method A plasma etching method can be used, which can perform more fine polishing on the component to be polished 3 . The above-mentioned detection equipment 4 and the polishing equipment 5 are all prior art, so the specific structures of the above-mentioned polishing equipment 5 and the detection equipment 4 will not be described here.

The polishing device in this embodiment is specifically described below through the working process and principle of the polishing device in this embodiment:

First, the component to be thrown 3 is placed in the first cavity 21, the isolation plate 2 is closed, and the surface size of the component to be thrown 3 is detected by the detection device 4, so as to obtain the actual surface shape data;

Then, compare and analyze the detected actual face data with the preset face data, and obtain the deviation position and deviation value between the actual face data and the preset face data;

Finally, the isolation plate 2 is opened, the isolation plate 2 is closed after moving the component 3 to be polished to the second cavity 22, and the component 3 to be polished is polished by the polishing device 5 according to the above deviation position and deviation value.

After the above-mentioned component to be polished 3 is polished, it can move again into the first cavity 21 and be detected by the detection device 4. If the detected actual surface data conforms to the range of the preset surface data, the processing will be stopped. If If not, continue processing according to the deviation position and deviation value until the detected actual surface data conforms to the range of the preset surface data.

The embodiment of the present invention provides a polishing device for more convenient and quick detection and polishing of the components to be polished. In the first stage, the components have to be reciprocated and transported between the polishing equipment and the testing equipment many times, which leads to a very time-consuming process of precision trimming and reduces the polishing efficiency. Compared with the prior art, the polishing device provided by the present application includes a cabin body, which is provided with a first cavity and a second cavity separated by an isolation plate, and the isolation plate is used to make the first cavity and the second cavity The two cavities are connected or isolated. During the application process, the component to be thrown can be placed in the first cavity, and the surface shape of the processing surface of the component to be thrown can be detected by the detection equipment in the first cavity, and then the isolation plate can be opened , after transferring the components to be polished into the second cavity, the isolation plate is closed, and the components to be polished are processed by the polishing equipment in the second cavity according to the detection parameters, so that the detection and polishing of the components to be polished in the polishing device can be realized, Improved polishing and inspection efficiency.

In order to facilitate the transfer of the components to be thrown 3 in the cabin body 1, further, the above-mentioned polishing device also includes a support platform 6, and the support platform 6 is movably connected in the cabin body 1, so that the support platform 6 can move to In the first cavity 21 or the second cavity 22 , the support platform 6 is used to support the components 3 to be thrown. In this embodiment, the element 3 to be thrown can be set on the support platform 6, and the element to be thrown can be transferred to the first cavity 21 or the second cavity 22 on the support platform 6, which improves the convenience of transferring the element 3 to be thrown. Wherein, the table top of support platform 6 can be circular or rectangular etc.; There can be multiple flexible connection modes between support platform 6 and the bottom of cabin body 1, for example: support platform 6 can be slidably connected to the slideway at the bottom of cabin body 1 , to realize the activity between the first cavity 21 and the second cavity 22, and for example: the supporting platform 6 is connected to the bottom of the cabin body 1 through the rotating platform, so that the supporting platform 6 will Rotate between the first cavity 21 and the second cavity 22 .

In some embodiments, the cabin body 1 is provided with a first slide rail 7, and the two ends of the first slide rail 7 respectively extend into the first cavity 21 and the second cavity 22, The support platform 6 is slidably connected to the first slide rail 7 . In this embodiment, since the two ends of the first slide rail 7 respectively extend into the first cavity 21 and the second cavity 22, the support platform 6 can be slidably connected to the first slide rail 7, and then the support platform 6 can move along the Slide along the first slide rail 7 into the first cavity 21 or the second cavity 22 to realize the transfer of the component to be thrown 3, so that the component to be polished 3 can complete the detection and polishing work, and the transfer efficiency is improved. In addition, the automation level of the polishing process of optical components has been improved, and the polishing precision and polishing quality have been improved.

In some embodiments, the supporting platform 6 includes a supporting part and a rotating platform 61, one end of the supporting part is slidably connected to the first slide rail 7, and the other end is rotatably connected to the rotating platform 61, and the rotating platform 61 is used for To support the component 3 to be thrown. In this embodiment, the element 3 to be thrown is arranged on the rotating platform 61. Since the rotating platform 61 is rotatably connected to the support part, the element 3 to be thrown rotates during the etching process, and because the etched shape of the element 3 to be thrown is uniform It is an axisymmetric structure, so that the etching process is performed on the element 3 to be polished during the rotation process, which can ensure the uniformity of etching and improve the polishing quality. In addition, the automation level of the polishing process of optical components has been improved, and the polishing precision and polishing quality have been improved.

In some embodiments, the support part includes a first base 62, a second base 63 and a lifter 64, the first base 62 is slidably connected to the first slide rail 7, and the first base 62 is provided with There is a second slide rail, the second base 63 is slidably connected to the second slide rail, and the second base 63 is connected to the rotating platform 61 through the lifter 64 . In this embodiment, after the rotating platform 61 moves to the second cavity 22, the polishing device 5 can be used to polish the component 3 to be polished. For precision adjustment, in this embodiment, the first base 62 is slidably connected to the first slide rail 7, and the rotating platform 61 can be moved into the first cavity 21 or the second cavity 22 through the first base 62, After the first base 62 moves to the second cavity 22, make the second base 63 slide on the second slide rail of the first base 62 to adjust the horizontal position of the rotating platform 61; 64 is lifted to adjust the vertical position of the rotating platform 61. According to the above-mentioned embodiment, the element 3 to be thrown on the rotating platform 61 can be adjusted vertically and horizontally through the support portion, which improves the polishing process. Accuracy.

In some embodiments, the polishing device 5 includes a plasma torch 51 and a plasma generating device 52, the plasma torch 51 is connected to the plasma generating device 52, and the output port of the plasma torch 51 is used to face the component to be polished 3. In this embodiment, the plasma generating device 52 is used to generate plasma, and transmit the plasma to the plasma torch 51, and spray it on the component 3 to be polished by the plasma torch 51, so as to realize the etching and polishing of the component 3 to be polished, Improve the polishing quality of the component 3 to be polished.

In some embodiments, a first camera device 71 is provided in the first cavity 21 , and a second camera device 72 is provided in the second cavity 22 . In this embodiment, the detection situation of the components 3 to be thrown in the first cavity 21 can be obtained in real time by the first camera 71, and the detection of the components 3 to be thrown in the second cavity 22 can be obtained in real time by the second camera 72. For the polishing situation, the first camera device 71 and the second camera device 72 can be used to know the situation of the components 3 to be polished in the first cavity 21 and the second cavity 22 in real time, so as to avoid problems in the detection or polishing process.

In some embodiments, the second chamber 22 is connected with an exhaust pipe 81 , and the exhaust pipe 81 is used to discharge the gas in the second chamber 22 . In this embodiment, since the polishing equipment 5 is etched by plasma, a large amount of exhaust gas will be generated in the second cavity 22. In order to prevent the exhaust gas from affecting the safety of polishing, the second cavity 22 can be drained through the exhaust pipe. The exhaust gas is discharged to improve the safety of the polishing device.

In some embodiments, the exhaust pipe 81 is connected to an exhaust gas treatment device 82 . In this embodiment, the exhaust gas discharged from the exhaust pipe 81 can be purified by the exhaust gas treatment device 82 to avoid polluting the environment and improve the environmental protection of the polishing device.

In some embodiments, the polishing device further includes: a processing system 9, the processing system 9 is connected to the detection device 4 and the polishing device 5, and the processing system 9 is used to obtain the detection device 4, and control the polishing device 5 to polish the component 3 to be polished according to the detection parameters. In this embodiment, the detection parameters of the detection equipment 4 can be obtained through the processing system 9, and the polishing equipment 5 is controlled to polish the component 3 to be polished according to the detection parameters. Component 3 machining accuracy.

On the other hand, as shown in FIG. 2, an embodiment of the present invention also provides a polishing method for the above-mentioned polishing device, including:

Step 101, detecting the component to be thrown, and obtaining the first detection parameter;

Among them, the first detection parameter is mainly the surface size parameter of the processed surface in the component to be polished, and the component to be polished can be detected by the detection equipment in the above-mentioned polishing device. The detection equipment can be a laser scanning measurement device, which can quickly and accurately Get the first detection parameter.

Step 102. Perform polishing on the component to be polished according to the first detection parameter;

Wherein, in the polishing process of the component to be polished, the polishing equipment in the above-mentioned polishing device can be used for polishing process, and the parameters of the polishing process can be set according to the first detection parameter, for example: the difference between the first detection parameter and the standard parameter The value can be used as the polishing amount of the component to be polished. In order to ensure the processing accuracy, the above-mentioned polishing equipment can use plasma etching equipment, which can polish the component to be polished more finely.

Step 103, after the polishing of the component to be polished, detect the component to be polished again to obtain a second detection parameter;

Among them, in order to ensure the precision of the polishing process, after the polishing process, the component to be polished needs to be tested again to determine whether the precision of the polishing process meets the requirements. The content of the test is the same as the test data in step 101, and will not be repeated here .

Step 104, judging whether the second detection parameter is within the preset parameter range, and if the time detection parameter is not within the preset parameter range, perform re-polishing on the to-be-polished component according to the second detection parameter .

Wherein, by comparing the second detection parameter with the preset parameter range, it can be judged whether the polishing accuracy of the polishing element meets the standard. If the second detection parameter is within the preset parameter range, it meets the processing standard, and the processing can be ended. If the parameters are not within the preset parameter range, then the processing standard is not met, and the component to be polished needs to be polished again until it meets the processing standard position.

The embodiment of the present invention provides a polishing method, which is used to realize the detection and polishing of the components to be polished more conveniently and quickly. In the first stage, the components have to be reciprocated and transported between the polishing equipment and the testing equipment many times, which leads to a very time-consuming process of precision trimming and reduces the polishing efficiency. Compared with the prior art, the polishing method provided by the present application includes: first, detecting the component to be polished, and obtaining a first detection parameter; secondly, performing polishing on the component to be polished according to the first detection parameter; and then , after the polishing of the component to be polished, detect the component to be polished again to obtain the second detection parameter; finally, judge whether the second detection parameter is within the preset parameter range, if the time detection parameter is not within the If the parameter range is preset, the component to be polished is re-polished according to the second detection parameter. However, in the polishing process of the above-mentioned polishing device, in the conversion process between the detection process and the polishing process, until the components to be polished need to be transferred from the first cavity to the second cavity, it can be realized The detection and polishing process of the component to be polished in the polishing device improves the efficiency of polishing and detection.

The above is only a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Anyone skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present invention. Should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be determined by the protection scope of the claims.

Claims (11)

1. A polishing device, characterized in that, comprising: A cabin, the cabin is provided with a first cavity and a second cavity separated by an isolation plate, and the isolation plate is used to communicate or communicate between the first cavity and the second cavity In isolation, the first cavity is provided with detection equipment for detecting the topographical features of the components to be polished, and the second cavity is provided with polishing equipment for polishing the components to be polished. 2. The polishing device according to claim 1, further comprising: A support platform, the support platform is movably connected to the cabin, so that the support platform can move into the first cavity or the second cavity, and the support platform is used to support the components to be thrown. 3. The polishing device according to claim 2, characterized in that, The cabin is provided with a first slide rail, the two ends of the first slide rail respectively extend into the first cavity and the second cavity, and the support platform is slidably connected to the first slide rail . 4. The polishing device according to claim 3, characterized in that, The supporting platform includes a supporting part and a rotating platform, one end of the supporting part is slidably connected to the first slide rail, and the other end is connected to the rotating platform, and the rotating platform is used to support the components to be thrown. 5. The polishing device according to claim 4, characterized in that, The support part includes a first base, a second base and a lifter, the first base is slidably connected to the first slide rail, the first base is provided with a second slide rail, the The second base is slidably connected to the second slide rail, and the second base is connected to the rotating platform through the lifter. 6. The polishing device according to claim 1, wherein: The polishing equipment includes a plasma torch and a plasma generating device, the plasma torch is connected to the plasma generating device, and the output port of the plasma torch faces the component to be polished. 7. The polishing device according to claim 1, characterized in that, A first camera device is arranged in the first cavity, and a second camera device is arranged in the second cavity. 8. The polishing apparatus according to claim 1, wherein: The second cavity is connected with an exhaust pipe, and the exhaust pipe is used to discharge the gas in the second cavity. 9. The polishing device according to claim 8, characterized in that, The exhaust pipe is connected to the exhaust gas treatment device. 10. The polishing device according to claim 1, further comprising: A processing system, the processing system is connected to the detection device and the polishing device, the processing system is used to obtain the detection parameters of the detection device, and control the polishing device to polish the component to be polished according to the detection parameters . 11. A polishing method for the polishing device according to any one of claims 1 to 10, characterized in that it comprises: Detecting the component to be thrown, and obtaining the first detection parameter; performing polishing on the component to be polished according to the first detection parameter; After the component to be polished is polished, the component to be polished is detected again to obtain a second detection parameter; judging whether the second detection parameter is within a preset parameter range, and if the time detection parameter is not within the preset parameter range, re-polishing the to-be-polished component according to the second detection parameter.