CN108841236A - A kind of UV rapid curing solder mask and preparation method thereof - Google Patents
A kind of UV rapid curing solder mask and preparation method thereof Download PDFInfo
- Publication number
- CN108841236A CN108841236A CN201810486596.9A CN201810486596A CN108841236A CN 108841236 A CN108841236 A CN 108841236A CN 201810486596 A CN201810486596 A CN 201810486596A CN 108841236 A CN108841236 A CN 108841236A
- Authority
- CN
- China
- Prior art keywords
- parts
- agent
- solder mask
- rapid curing
- double methacrylate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 30
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 36
- 239000004593 Epoxy Substances 0.000 claims abstract description 31
- 239000000178 monomer Substances 0.000 claims abstract description 31
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims abstract description 30
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000004814 polyurethane Substances 0.000 claims abstract description 18
- 229920002635 polyurethane Polymers 0.000 claims abstract description 18
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 16
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 15
- FPVGTPBMTFTMRT-NSKUCRDLSA-L fast yellow Chemical compound [Na+].[Na+].C1=C(S([O-])(=O)=O)C(N)=CC=C1\N=N\C1=CC=C(S([O-])(=O)=O)C=C1 FPVGTPBMTFTMRT-NSKUCRDLSA-L 0.000 claims abstract description 11
- 235000019233 fast yellow AB Nutrition 0.000 claims abstract description 11
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000003054 catalyst Substances 0.000 claims abstract description 5
- 238000006243 chemical reaction Methods 0.000 claims abstract description 5
- 239000011261 inert gas Substances 0.000 claims abstract description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000003112 inhibitor Substances 0.000 claims abstract description 4
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 4
- 238000001723 curing Methods 0.000 claims description 34
- 238000003756 stirring Methods 0.000 claims description 23
- 239000002253 acid Substances 0.000 claims description 13
- 239000007788 liquid Substances 0.000 claims description 9
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical group C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 8
- 239000012965 benzophenone Substances 0.000 claims description 8
- 239000006185 dispersion Substances 0.000 claims description 8
- 238000001914 filtration Methods 0.000 claims description 8
- 239000012467 final product Substances 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical class CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 claims description 6
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 4
- 239000003999 initiator Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N acetone Substances CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 2
- 150000007513 acids Chemical class 0.000 claims 1
- 239000002552 dosage form Substances 0.000 claims 1
- 125000000524 functional group Chemical group 0.000 claims 1
- 238000007711 solidification Methods 0.000 abstract description 8
- 230000008023 solidification Effects 0.000 abstract description 8
- 239000000853 adhesive Substances 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- 238000007639 printing Methods 0.000 abstract description 5
- 239000011347 resin Substances 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 abstract description 2
- 230000002195 synergetic effect Effects 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 7
- 235000021050 feed intake Nutrition 0.000 description 7
- JRWNODXPDGNUPO-UHFFFAOYSA-N oxolane;prop-2-enoic acid Chemical compound C1CCOC1.OC(=O)C=C JRWNODXPDGNUPO-UHFFFAOYSA-N 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- FSDNTQSJGHSJBG-UHFFFAOYSA-N piperidine-4-carbonitrile Chemical compound N#CC1CCNCC1 FSDNTQSJGHSJBG-UHFFFAOYSA-N 0.000 description 3
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- 229960002887 deanol Drugs 0.000 description 2
- 239000012972 dimethylethanolamine Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- RDHSUTIDSFVNJL-UHFFFAOYSA-N OC(=O)C=C.CCCCCCCCCCCC(O)=O Chemical compound OC(=O)C=C.CCCCCCCCCCCC(O)=O RDHSUTIDSFVNJL-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- -1 hexanediyl ester Chemical class 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920005646 polycarboxylate Polymers 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- General Chemical & Material Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Epoxy Resins (AREA)
Abstract
The present invention discloses a kind of UV rapid curing solder mask and preparation method thereof; including 35~45 parts of modified epoxy double methacrylate; 10~18 parts of polyurethane curing agent; 8~16 parts of acrylic monomers; first 2~5 parts of photoinitiator; second 1~4 part of photoinitiator; 10~25 parts of azo everbright fast yellow; 1~3 part of defoaming agent; 1~3 part of water-reducing agent; 1~3 part of levelling agent, the modified epoxy double methacrylate is obtained by the way that epoxy double methacrylate, maleic anhydride, concentrated sulfuric acid catalyst and polymerization inhibitor are placed in reaction in the container of inert gas shielding.The present invention is organically combined using modified epoxy double methacrylate, polyurethane curing agent and acrylic monomers three, it cooperates using between its molecular structure, synergistic effect, it is prepared for the UV solidification solder mask that a kind of cure times are short, compatibility is high, its adhesive force is significantly improved compared to single resin ink, significantly improves the precision of ultraviolet curing printing.
Description
Technical field
The present invention relates to a kind of UV rapid curing solder masks and preparation method thereof, belong to solder mask field.
Background technique
Solder mask divides several kinds：Such as liquid photosensitive development solder mask, heat curing type solder mask, ultraviolet hardening
Solder mask etc. is a kind of ink being exclusively used on pcb board.The UV cured anti-solder paste developed for printed circuit board
Ink, is free of solvent, and pollution-free and hardening quickly, has excellent adhesive force, heat resistance and insulating properties after hardening.
Existing UV solidification solder mask curing time is long, solidification temperature is high, and printed pattern tolerance is ± 0.2mm, mainly
It applies on the simple product of single side, the complexity of dual platen is generally higher than single sided board, and precision requirement is also higher, institute
Doubling plate is not suitable for general UV solidification solder mask.
Summary of the invention
The technical problem to be solved by the present invention is in view of the deficiencies of the prior art, provide, a kind of curing time is short, prints
Precision is high, and the strong UV of adhesive force solidifies solder mask.
The technical solution adopted by the present invention is as follows：
A kind of UV rapid curing solder mask, the component including following parts by weight：
35~45 parts of modified epoxy double methacrylate,
10~18 parts of polyurethane curing agent,
8~16 parts of acrylic monomers,
First 2~5 parts of photoinitiator,
Second 1~4 part of photoinitiator,
10~25 parts of azo everbright fast yellow,
1~3 part of defoaming agent,
1~3 part of water-reducing agent,
1~3 part of levelling agent,
The modified epoxy double methacrylate is by by epoxy double methacrylate, maleic anhydride, concentrated sulfuric acid catalyst and resistance
Poly- agent is placed in the container of inert gas shielding, is heated to half of 80~100 DEG C of reactions to acid value for initial acid value, is cooled to
50~70 DEG C of addition dimethylethanolamines and water, are cooled to room temperature to obtain after being stirred to react 0.5~0.6h.
Preferably, the polyurethane curing agent is TDI-TMP polyurethane curing agent, wherein-NCO content is greater than 10wt%,
TDI content is less than 4.5wt%.
The acrylic monomers is by difunctional acrylic monomers and monofunctional acrylates' monomer composition, the difunctionality
The weight ratio of group's acrylic monomers and monofunctional acrylates' monomer is 0.8~1:1.
First photoinitiator is benzophenone.
The second photoinitiator model 2- hydroxy-2-methyl -1- phenyl -1- acetone (1173).
The defoaming agent is Germany's 057 defoaming agent of BYK.
The water-reducing agent is polycarboxylate water-reducer.
The levelling agent is Germany's 307 levelling agent of BYK.
The preparation method of above-mentioned UV rapid curing solder mask, includes the following steps：
Step 1：By modified epoxy double methacrylate, polyurethane curing agent, acrylic monomers, the first photoinitiator and
Two photoinitiators feed intake in channel；
Step 2：With high speed disperser under the revolving speed of 800~1200r/min, in 50~80 DEG C of 0.5~0.8h of dispersion,
Stop stirring and keeping the temperature；
Step 3：Azo everbright fast yellow, defoaming agent, water-reducing agent and levelling agent are added in feed liquid obtained in step 2, continues
0.3~0.5h is stirred with 500~800r/min；
Step 4：After stirring and evenly mixing, being ground to partial size with hydraulic three-roller machine is 300 nanometers or less；
Step 5：After being filtered using 1 μm of filter element filtering machine to obtain the final product.
The invention firstly uses maleic anhydrides to be modified epoxy double methacrylate, so that the double propylene of modified epoxy
Acid esters double bond content at least improves twice, and in the case where being illuminated by the light excitation, fracture, which occurs, for these unsaturated double-bonds makes linear polymeric wink
Between crosslinking become reticular structure, therefore modified epoxy double methacrylate cure times significantly shorten.
- NCO linkage content is not less than 10wt% in TDI-TMP polyurethane curing agent, and TDI content is less than 4.5wt%, and it can be with
It arranges in pairs or groups with modified epoxy double methacrylate and acrylic monomers, under the irradiation of ultraviolet light, further shortens and solidify the time.
Acrylic monomers can be interspersed in modification by difunctional acrylic monomers and monofunctional acrylates' monomer composition
Between epoxy double methacrylate, so that system combines more secured.
Solidification component is more sensitive to water, by introducing water-reducing agent to improve the preservation and working performance of solder mask.
Beneficial effect：
The present invention is organically combined using modified epoxy double methacrylate, polyurethane curing agent and acrylic monomers three, benefit
It is cooperated between its molecular structure, synergistic effect is prepared for the UV solidification that a kind of cure times are short, compatibility is high
Solder mask, adhesive force are significantly improved compared to single resin ink, significantly improve the precision of ultraviolet curing printing.
Specific embodiment
According to following embodiments, the present invention may be better understood.
Embodiment 1
By epoxy double methacrylate, maleic anhydride, concentrated sulfuric acid catalyst and di-tert-butyl p-cresol polymerization inhibitor according to mole
Than 3:1:0.3:0.2 is placed in the container of inert gas shielding, is heated to half of 95 DEG C of reactions to acid value for initial acid value, drop
To 65 DEG C of addition dimethylethanolamines and water, (molar ratio of epoxy double methacrylate, dimethylethanolamine and water is 3 to temperature:2:1),
It being cooled to room temperature to obtain modified epoxy double methacrylate after being stirred to react 0.6h, measurement C=C double bond content is 0.354 (bromine number),
Acid value 10.89mgg.
Embodiment 2
By epoxy double methacrylate, maleic anhydride, concentrated sulfuric acid catalyst and di-tert-butyl p-cresol polymerization inhibitor according to mole
Than 3:2:0.3:0.2 is placed in the container of inert gas shielding, is heated to half of 100 DEG C of reactions to acid value for initial acid value,
Being cooled to 70 DEG C of addition dimethylethanolamines and water, (molar ratio of epoxy double methacrylate, dimethylethanolamine and water is 3:3:
1) it is cooled to room temperature to obtain modified epoxy double methacrylate after, being stirred to react 0.6h, measurement C=C double bond content is 0.248 (bromine
Value), acid value 16.89mgg.
Embodiment 3
Step 1：42 parts of modified epoxy double methacrylate of the preparation of Example 1,14 parts of TDI-TMP polyurethane curing agent,
15 parts of acrylic monomers (dipropylene glycol diacrylate and tetrahydrofuran acrylate monomer, weight ratio 1:1), the first light draws
It sends out in (1173) 2 parts of channels that feed intake of 4 parts of agent benzophenone and the second photoinitiator；
Step 2：With high speed disperser under the revolving speed of 1000r/min, in 65 DEG C of dispersion 0.6h, stop stirring and keeping the temperature；
Step 3：23 parts of azo everbright fast yellow, 2 parts of defoaming agent, 2 parts of water-reducing agent and stream are added in feed liquid obtained in step 2
2 parts of flat agent continues to stir 0.4h with 800r/min；
Step 4：After stirring and evenly mixing, being ground to partial size with hydraulic three-roller machine is 300 nanometers or less；
Step 5：After being filtered using 1 μm of filter element filtering machine to obtain the final product.
Embodiment 4
Step 1：35 parts of modified epoxy double methacrylate of the preparation of Example 1,10 parts of TDI-TMP polyurethane curing agent,
(dipropylene glycol diacrylate and lauric acid acrylate weight ratio are 0.8 to 8 parts of acrylic monomers:1), the first photoinitiator two
In (1173) 4 parts of channels that feed intake of 2 parts of Benzophenone and the second photoinitiator；
Step 2：With high speed disperser under the revolving speed of 800r/min, in 50 DEG C of dispersion 0.8h, stop stirring and keeping the temperature；
Step 3：10 parts of azo everbright fast yellow, 1 part of defoaming agent, 1 part of water-reducing agent and stream are added in feed liquid obtained in step 2
1 part of flat agent continues to stir 0.5h with 500r/min；
Step 4：After stirring and evenly mixing, being ground to partial size with hydraulic three-roller machine is 300 nanometers or less；
Step 5：After being filtered using 1 μm of filter element filtering machine to obtain the final product.
Embodiment 5
Step 1：45 parts of modified epoxy double methacrylate of the preparation of Example 1,18 parts of TDI-TMP polyurethane curing agent,
16 parts of acrylic monomers (hexanediyl ester and tetrahydrofuran acrylate monomer, weight ratio 1:1), first is light-initiated
In (1173) 1 parts of channels that feed intake of 5 parts of agent benzophenone and the second photoinitiator；
Step 2：With high speed disperser under the revolving speed of 1200r/min, in 80 DEG C of dispersion 0.5h, stop stirring and keeping the temperature；
Step 3：25 parts of azo everbright fast yellow, 3 parts of defoaming agent, 3 parts of water-reducing agent and stream are added in feed liquid obtained in step 2
3 parts of flat agent continues to stir 0.3h with 500r/min；
Step 4：After stirring and evenly mixing, being ground to partial size with hydraulic three-roller machine is 300 nanometers or less；
Step 5：After being filtered using 1 μm of filter element filtering machine to obtain the final product.
Comparative example 1
Step 1：42 parts of modified epoxy double methacrylate of the preparation of Example 1,14 parts of TDI-TMP polyurethane curing agent,
In (1173) 2 parts of channels that feed intake of first 4 parts of photoinitiator benzophenone and the second photoinitiator；
Step 2：With high speed disperser under the revolving speed of 1000r/min, in 65 DEG C of dispersion 0.6h, stop stirring and keeping the temperature；
Step 3：23 parts of azo everbright fast yellow, 2 parts of defoaming agent, 2 parts of water-reducing agent and stream are added in feed liquid obtained in step 2
2 parts of flat agent continues to stir 0.4h with 800r/min；
Step 4：After stirring and evenly mixing, being ground to partial size with hydraulic three-roller machine is 300 nanometers or less；
Step 5：After being filtered using 1 μm of filter element filtering machine to obtain the final product.
Comparative example 2
Step 1：42 parts of modified epoxy double methacrylate of the preparation of Example 1,15 parts of (dipropylene glycol of acrylic monomers
Diacrylate and tetrahydrofuran acrylate monomer, weight ratio 1:1), 4 parts of the first photoinitiator benzophenone and the second light
In (1173) 2 parts of channels that feed intake of initiator；
Step 2：With high speed disperser under the revolving speed of 1000r/min, in 65 DEG C of dispersion 0.6h, stop stirring and keeping the temperature；
Step 3：23 parts of azo everbright fast yellow, 2 parts of defoaming agent, 2 parts of water-reducing agent and stream are added in feed liquid obtained in step 2
2 parts of flat agent continues to stir 0.4h with 800r/min；
Step 4：After stirring and evenly mixing, being ground to partial size with hydraulic three-roller machine is 300 nanometers or less；
Step 5：After being filtered using 1 μm of filter element filtering machine to obtain the final product.
Comparative example 3
Step 1：42 parts of epoxy double methacrylate are taken, 15 parts of 14 parts of polyurethane curing agent, acrylic monomers (dipropylene glycol
Diacrylate and tetrahydrofuran acrylate monomer, weight ratio 1:1), 4 parts of the first photoinitiator benzophenone and the second light
In (1173) 2 parts of channels that feed intake of initiator；
Step 2：With high speed disperser under the revolving speed of 1000r/min, in 65 DEG C of dispersion 0.6h, stop stirring and keeping the temperature；
Step 3：23 parts of azo everbright fast yellow, 2 parts of defoaming agent, 2 parts of water-reducing agent and stream are added in feed liquid obtained in step 2
2 parts of flat agent continues to stir 0.4h with 800r/min；
Step 4：After stirring and evenly mixing, being ground to partial size with hydraulic three-roller machine is 300 nanometers or less；
Step 5：After being filtered using 1 μm of filter element filtering machine to obtain the final product.
The solder mask that above-described embodiment 3~5 and comparative example 1~3 are prepared carries out conventional performance test, as a result
It is shown in Table 1：Pcb board spray printing is carried out using UV ink-jet screen printer, solidification ultraviolet source power is 250W/cm, under 25 DEG C of environment
The viscosity of test ink, adhesive force are measured according to GB/T 9286-1998 test method, hardness according to GB/T6739-2006, resistance
It welds performance condition and is 288 DEG C of solder furnace four times dippings 10 seconds, seeing whether to fall off enters phenomenon with scolding tin, and no discoloration, is floated at removing
It rises and scolding tin infiltration is excellent.It can be seen from the data in Table 1 that epoxy double methacrylate light-cured performance after modified is shown
It writes and improves, better light-cured performance can be reached with the use of polyurethane curing agent and acrylic monomers, curing time is significant
Shorten, adhesive force is strong, printing precision is high.
Table 1
| Embodiment 3 | Embodiment 4 | Embodiment 5 | Comparative example 1 | Comparative example 2 | Comparative example 3 | |
| Viscosity cP | 16.4 | 17.3 | 16.9 | 19.8 | 21.4 | 23.8 |
| Adhesive force | 1 grade | 1 grade | 1 grade | 3 grades | 4 grades | 4 grades |
| Hardness | 6H | 6H | 6H | 4H | 4H | 3H |
| Solidification rate m/min | 25 | 24 | 23 | 15 | 12 | 6 |
| Welding resistance performance | It is excellent | It is excellent | It is excellent | Slight removing | Slightly float | Scolding tin penetrates into |
| Printing precision mm | ±0.09 | ±0.10 | ±0.12 | ±0.15 | ±0.17 | ±0.25 |
The present invention provides the thinking and method of a kind of UV rapid curing solder mask and preparation method thereof, specific implementation should
There are many method and approach of technical solution, the above is only a preferred embodiment of the present invention, it is noted that for this technology
For the those of ordinary skill in field, various improvements and modifications may be made without departing from the principle of the present invention, this
A little improvements and modifications also should be regarded as protection scope of the present invention.Existing skill can be used in each component part being not known in the present embodiment
Art is realized.
Claims (9)
1. a kind of UV rapid curing solder mask, which is characterized in that the component including following parts by weight：
35~45 parts of modified epoxy double methacrylate,
10~18 parts of polyurethane curing agent,
8~16 parts of acrylic monomers,
First 2~5 parts of photoinitiator,
Second 1~4 part of photoinitiator,
10~25 parts of azo everbright fast yellow,
1~3 part of defoaming agent,
1~3 part of water-reducing agent,
1~3 part of levelling agent,
The modified epoxy double methacrylate is by by epoxy double methacrylate, maleic anhydride, concentrated sulfuric acid catalyst and polymerization inhibitor
It is placed in the container of inert gas shielding, is heated to the half that 80~100 DEG C of reactions are initial acid value to acid value, it is cooled to 50~
70 DEG C of addition dimethylethanolamines and water, are cooled to room temperature to obtain after being stirred to react 0.5~0.6h.
2. a kind of UV rapid curing solder mask according to claim 1, which is characterized in that the polyurethane curing agent is
TDI-TMP polyurethane curing agent, wherein-NCO content is greater than 10wt%, and TDI content is less than 4.5wt%.
3. a kind of UV rapid curing solder mask according to claim 1, which is characterized in that the acrylic monomers is by double
Functional group's acrylic monomers and monofunctional acrylates' monomer composition, the difunctional acrylic monomers and simple function group propylene
The weight ratio of acid monomers is 0.8~1:1.
4. a kind of UV rapid curing solder mask according to claim 1, which is characterized in that first photoinitiator is
Benzophenone.
5. a kind of UV rapid curing solder mask according to claim 1, which is characterized in that the second light-initiated dosage form
Number be 2- hydroxy-2-methyl -1- phenyl -1- acetone (1173).
6. a kind of UV rapid curing solder mask according to claim 1, which is characterized in that the defoaming agent is Germany
057 defoaming agent of BYK.
7. a kind of UV rapid curing solder mask according to claim 1, which is characterized in that the water-reducing agent is polycarboxylic acids
Water-reducing agent.
8. a kind of UV rapid curing solder mask according to claim 1, which is characterized in that the levelling agent is Germany
307 levelling agent of BYK.
9. the preparation method of UV rapid curing solder mask described in claim 1~8 any one, which is characterized in that including such as
Lower step：
Step 1：By modified epoxy double methacrylate, polyurethane curing agent, acrylic monomers, the first photoinitiator and the second light
Initiator feeds intake in channel；
Step 2：With high speed disperser under the revolving speed of 800~1200r/min, in 50~80 DEG C of 0.5~0.8h of dispersion, stop
It stirs and keeps the temperature；
Step 3：Azo everbright fast yellow, defoaming agent, water-reducing agent and levelling agent are added in feed liquid obtained in step 2, continues with 500
~800r/min stirs 0.3~0.5h；
Step 4：After stirring and evenly mixing, being ground to partial size with hydraulic three-roller machine is 300 nanometers or less；
Step 5：After being filtered using 1 μm of filter element filtering machine to obtain the final product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810486596.9A CN108841236A (en) | 2018-05-16 | 2018-05-16 | A kind of UV rapid curing solder mask and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810486596.9A CN108841236A (en) | 2018-05-16 | 2018-05-16 | A kind of UV rapid curing solder mask and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108841236A true CN108841236A (en) | 2018-11-20 |
Family
ID=64213211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810486596.9A Pending CN108841236A (en) | 2018-05-16 | 2018-05-16 | A kind of UV rapid curing solder mask and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108841236A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113881282A (en) * | 2021-11-10 | 2022-01-04 | 东莞市新志新材料有限公司 | UV ink-jet ink for power battery aluminum alloy surface protection |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101295142A (en) * | 2007-04-27 | 2008-10-29 | 太阳油墨制造株式会社 | Printed circuit board and manufacturing method thereof |
| CN101349865A (en) * | 2007-07-17 | 2009-01-21 | 富士胶片株式会社 | Photosensitive compositions, curable compositions, novel compounds, photopolymerizable compositions, color filters, and planographic printing plate precursors |
| CN101393394A (en) * | 2007-09-21 | 2009-03-25 | 太阳油墨制造株式会社 | Photo-cured and heat-cured resin composition and pcondensate thereof |
| CN104277519A (en) * | 2014-10-28 | 2015-01-14 | 成都纳硕科技有限公司 | Ultraviolet curable antifouling flame-retardant coating for plastic circuit board |
| CN106133602A (en) * | 2014-03-27 | 2016-11-16 | 富士胶片株式会社 | Photosensitive polymer combination, cured film, the manufacture method of cured film and semiconductor device |
-
2018
- 2018-05-16 CN CN201810486596.9A patent/CN108841236A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101295142A (en) * | 2007-04-27 | 2008-10-29 | 太阳油墨制造株式会社 | Printed circuit board and manufacturing method thereof |
| CN101349865A (en) * | 2007-07-17 | 2009-01-21 | 富士胶片株式会社 | Photosensitive compositions, curable compositions, novel compounds, photopolymerizable compositions, color filters, and planographic printing plate precursors |
| CN101393394A (en) * | 2007-09-21 | 2009-03-25 | 太阳油墨制造株式会社 | Photo-cured and heat-cured resin composition and pcondensate thereof |
| CN106133602A (en) * | 2014-03-27 | 2016-11-16 | 富士胶片株式会社 | Photosensitive polymer combination, cured film, the manufacture method of cured film and semiconductor device |
| CN104277519A (en) * | 2014-10-28 | 2015-01-14 | 成都纳硕科技有限公司 | Ultraviolet curable antifouling flame-retardant coating for plastic circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113881282A (en) * | 2021-11-10 | 2022-01-04 | 东莞市新志新材料有限公司 | UV ink-jet ink for power battery aluminum alloy surface protection |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108359312B (en) | High-temperature-resistant UV-LED ink-jet printing solder resist ink and preparation method and application thereof | |
| CN107216715B (en) | A kind of UV-LED inkjet printing character ink and preparation method thereof | |
| US20120229583A1 (en) | Photocurable ink composition, ink jet recording method, and recording matter | |
| US8158214B2 (en) | Photocurable ink composition set, ink jet recording method, and recorded matter | |
| CN102079899B (en) | Photoconductive ink as well as preparation method and use method thereof | |
| KR101850590B1 (en) | Curable composition for inkjet, and method for producing electronic part | |
| EP1624001A4 (en) | Photocuring/thermosetting inkjet composition and printed wiring board using same | |
| CN108219589B (en) | A kind of UV-LED inkjet printing solder resist ink and its preparation method and application | |
| KR20150043514A (en) | Curable composition for inkjet, and method for producing electronic component | |
| KR101485225B1 (en) | Curable composition for inkjet and process for producing electronic component | |
| CN104877446B (en) | A kind of ultraviolet hot dual cure glass ink and preparation method thereof | |
| JP2019093639A (en) | Composition for model material | |
| CN102924630A (en) | UV light curing application system containing amino ketone compound 1-([1,1'-biphenyl]-4-yl)-2-methyl-2-morpholinopropan-1-one | |
| US12077677B2 (en) | Method for manufacturing cured film, method for manufacturing electronic component, and electronic component | |
| CN110144140A (en) | Suitable for the cured mixing photocuring ink jet ink composition of LED light and mixing machine | |
| CN109943145A (en) | A kind of UV-LED inkjet printing soft board character ink and preparation method thereof | |
| CN108841236A (en) | A kind of UV rapid curing solder mask and preparation method thereof | |
| CN108641469A (en) | A kind of ultraviolet curing solder mask and preparation method thereof | |
| KR20180086144A (en) | Curable inkjet composition, cured product, and printed wiring board | |
| JP2012087284A (en) | Curable composition for inkjet and method for producing printed wiring board | |
| KR20120046126A (en) | Process for the preparation of radiation curable compositions | |
| CN107384109A (en) | A kind of high reliability UV solidifications conformal coating and preparation method thereof | |
| TWI802963B (en) | Recording method and printing method | |
| JP2017179006A (en) | Active energy ray curable inkjet ink composition | |
| CN110093066A (en) | A kind of conductive ink can be used for inkjet printing and preparation method thereof, purposes |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20181120 |
|
| WD01 | Invention patent application deemed withdrawn after publication |