CN108838280B - Method for installing electronic amplifier in heat dissipation shell - Google Patents
Method for installing electronic amplifier in heat dissipation shell Download PDFInfo
- Publication number
- CN108838280B CN108838280B CN201810569014.3A CN201810569014A CN108838280B CN 108838280 B CN108838280 B CN 108838280B CN 201810569014 A CN201810569014 A CN 201810569014A CN 108838280 B CN108838280 B CN 108838280B
- Authority
- CN
- China
- Prior art keywords
- gasket
- heat dissipation
- electronic amplifier
- bosses
- riveting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000009434 installation Methods 0.000 claims abstract description 12
- 125000006850 spacer group Chemical group 0.000 claims description 6
- 230000008569 process Effects 0.000 abstract description 8
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D39/00—Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Amplifiers (AREA)
Abstract
The invention discloses a method for installing an electronic amplifier in a heat dissipation shell, which comprises the following steps: 1) aligning the riveting hole on the gasket with the salient point on the radiating shell, and installing the gasket in the radiating shell; 2) stamping the salient points through a riveting press machine, and fixing the gasket and the heat dissipation shell together; wherein, the position of installing the gasket at the heat dissipation casing is installed with the boss of at least two equal heights. The boss is arranged at the bottom of the radiating shell, so that the original support is changed into point support, and the influence of easy deformation of the thin wall of the radiating shell on the installation of the gasket during riveting is reduced; in addition, the flatness of the boss is set to be less than 0.1, so that the deformation of the gasket in the riveting process is less than 0.05mm, and the gasket is further prevented from deforming or deviating from the installation position in the riveting process.
Description
Technical Field
The invention relates to the field of machining, in particular to a method for installing an electronic amplifier in a heat dissipation shell.
Background
Spring shim is because bump aperture tolerance is 0.2mm in the installation, spring shim and radiator blank plane contact surface's plane degree 0.5mm, spring shim self plane degree 0.5mm, so spring shim atress is uneven and mutual contact surface plane degree is bad when riveting spring shim to the installation bump, lead to spring shim to produce and warp, finally make spring shim and the planar distance of electronic amplifier out of tolerance, the customer appears can not assemble or assembles the pine phenomenon in the assembling process. When one side wall of the spring gasket is close to the side wall of the radiating shell, the space for installing the electronic amplifier is larger than the volume of the electronic amplifier, and the electronic amplifier cannot be stably installed in the electronic amplifier; on the contrary, if the spring washer is deformed away from the side wall of the heat dissipating case, the space for mounting the electronic amplifier becomes small, so that the electronic amplifier cannot be placed therein.
Disclosure of Invention
Aiming at overcoming the defects of the prior art, the invention mainly aims to overcome the defects of the prior art and discloses a method for installing an electronic amplifier in a radiating shell, which comprises the following steps:
1) aligning a riveting hole on a gasket with a salient point on a heat dissipation shell, and installing the gasket in the heat dissipation shell;
2) stamping the salient points through a riveting press machine, and fixing the gasket and the heat dissipation shell together;
3) the gasket and the heat dissipation shell form an installation area, an electronic amplifier is clamped in the installation area, and the electronic amplifier is fixed through the gasket;
at least two bosses with the same height are arranged at the position of the heat dissipation shell where the gasket is arranged.
Further, two of the bosses are arranged at the positions of the convex points, overlap with the convex points, and have a diameter larger than that of the convex points.
Further, the boss is provided with six.
Further, three of the bosses are distributed in a triangular shape and are turned and symmetrical with the other three bosses.
Further, three of the bosses are distributed in a regular triangle.
Further, the flatness of the boss is less than 0.1 mm.
Further, in step 2), before riveting the bumps, a cushion block is padded between the side wall of the gasket and the side wall of the heat dissipation shell by using a riveting machine, so as to fill a gap between the gasket and the side wall of the heat dissipation shell.
Furthermore, the thickness of the cushion block is that the clearance tolerance between the side wall of the gasket and the side wall of the heat dissipation shell is +/-0.1 mm.
Further, the radial clearance between the riveting hole of the gasket and the salient point is less than 0.05 mm.
The invention has the following beneficial effects:
(1) the boss is arranged at the bottom of the radiating shell, so that the original support is changed into point support, and the influence of easy deformation of the thin wall of the radiating shell on the installation of the gasket during riveting is reduced; in addition, the flatness of the boss is set to be less than 0.1, so that the deformation of the gasket in the riveting process is less than 0.05mm, and the gasket is further prevented from deforming or deviating from the installation position in the riveting process.
(2) The radial clearance between the riveting hole and the salient point is controlled within 0.05mm, the mounting precision of the gasket and the heat dissipation shell is improved, and the deformation of the gasket during mounting is further prevented.
(3) Before riveting, the cushion block is filled between the side wall of the gasket and the side wall of the heat dissipation shell, so that the gasket is supported by the cushion block when being pressed and pressed, and the gasket is prevented from deforming during riveting.
Drawings
FIG. 1 is a top view of a heat dissipation housing of the present invention;
FIG. 2 is a perspective view of the heat dissipation housing of the present invention;
FIG. 3 is a front view of the gasket;
FIG. 4 is a schematic view of the gasket and the heat dissipating housing;
the reference numbers are as follows:
1. gasket, 2, heat dissipation casing, 3, boss, 4, cushion, 11, riveting hole, 21, bump.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The method for installing the electronic amplifier in the heat dissipation shell, as shown in fig. 1-4, comprises the following steps:
1) aligning the riveting hole 11 on the gasket 1 with the salient point 21 on the heat dissipation shell 2, and installing the gasket 1 in the heat dissipation shell 2;
2) stamping the salient points 21 through a riveting press machine, and fixing the gasket 1 and the heat dissipation shell 2 together;
3) the gasket 1 and the heat dissipation shell 2 form a mounting area, an electronic amplifier is clamped in the mounting area, and the electronic amplifier is fixed through the gasket;
wherein, at least two bosses 3 with equal height are arranged at the position where the gasket 1 is arranged on the radiating shell 2. Preferably, six bosses 3 are provided. The six bosses 3 can be arranged at any position in the range corresponding to the gasket arranged on the radiating shell 2; preferably, the six bosses 3 are divided into two groups, wherein three bosses 3 are distributed in a triangular shape and are in turnover symmetry with the other three bosses 3; preferably, the three bosses 3 are distributed in a regular triangle. The gasket 1 is arranged symmetrically by turning, so that three bosses 3 support the gasket 1 when the gasket is installed; in addition, three of the grooves are distributed in a triangular shape, particularly in a regular triangular shape, so that the supporting force of the boss 3 on one side of the gasket is uniform.
In one embodiment, the flatness of the boss 3 is less than 0.1 mm. Through the setting of the flatness of the boss 3, the deformation amount of the gasket 1 in the riveting process is smaller than 0.05 mm.
In an embodiment, two of the bosses 3 are arranged at the positions of the salient points 21, overlapping the salient points 21, and the diameter of the bosses 3 is larger than that of the salient points 21, the other bosses 3 are respectively made according to the above-mentioned embodiment.
In an embodiment, as shown in fig. 4, in step 2), before riveting the bumps 21, the riveting press pads the spacers 4 between the sidewalls of the gasket 1 and the sidewalls of the heat dissipation housing 2 for filling the gap between the gasket 1 and the sidewalls of the heat dissipation housing 2, so that the gasket is supported by the spacers 4 when the gasket is pressed, and the gasket 1 is prevented from deforming during riveting. Preferably, the thickness of the cushion block 4 is +/-0.1 mm of the gap between the side wall of the gasket and the side wall of the heat dissipation shell.
In one embodiment, the radial clearance between the riveting holes of the gasket and the salient points is less than 0.05 mm.
The invention has the following beneficial effects:
(1) the boss is arranged at the bottom of the radiating shell, so that the original support is changed into point support, and the influence of easy deformation of the thin wall of the radiating shell on the installation of the gasket during riveting is reduced; in addition, the flatness of the boss is set to be less than 0.1, so that the deformation of the gasket in the riveting process is less than 0.05mm, and the gasket is further prevented from deforming or deviating from the installation position in the riveting process.
(2) The radial clearance between the riveting hole and the salient point is controlled within 0.05mm, the mounting precision of the gasket and the heat dissipation shell is improved, and the deformation of the gasket during mounting is further prevented.
(3) Before riveting, the cushion block is filled between the side wall of the gasket and the side wall of the heat dissipation shell, so that the gasket is supported by the cushion block when being pressed and pressed, and the gasket is prevented from deforming during riveting.
The above are merely preferred embodiments of the present invention, and are not intended to limit the scope of the invention; it is intended that the following claims be interpreted as including all such alterations, modifications, and equivalents as fall within the true spirit and scope of the invention.
Claims (8)
1. A method of mounting an electronic amplifier in a heat dissipating housing, comprising the steps of:
1) aligning a riveting hole on a gasket with a salient point on a heat dissipation shell, and installing the gasket in the heat dissipation shell;
2) stamping the salient points through a riveting press machine, and fixing the gasket and the heat dissipation shell together;
3) the gasket and the heat dissipation shell form an installation area, an electronic amplifier is clamped in the installation area, and the electronic amplifier is fixed through the gasket;
at least two bosses with the same height are arranged at the position of the heat dissipation shell where the gasket is arranged.
2. A method of mounting an electronic amplifier in a heat sink housing according to claim 1, wherein two of said bosses are provided at the location of said bumps, overlap said bumps, and have a diameter greater than the diameter of said bumps.
3. A method of mounting an electronic amplifier in a heat sink housing as claimed in claim 1, wherein six bosses are provided.
4. A method of mounting an electronic amplifier as set forth in claim 3 in a heat sink housing, wherein three of said bosses are triangularly disposed and inverted with respect to the other three of said bosses.
5. The method of claim 4, wherein three of said bosses are in a regular triangular configuration.
6. A method of mounting an electronic amplifier in a heat sink housing according to claim 1, wherein the bosses are less than 0.1mm planar.
7. The method of claim 1, wherein in step 2), the riveting press inserts a spacer between the spacer side wall and the heat dissipation housing side wall for filling the gap between the spacer and the heat dissipation housing side wall before riveting the bumps.
8. The method of claim 1, wherein the radial clearance between the rivet holes of the spacer and the bumps is less than 0.05 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810569014.3A CN108838280B (en) | 2018-06-05 | 2018-06-05 | Method for installing electronic amplifier in heat dissipation shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810569014.3A CN108838280B (en) | 2018-06-05 | 2018-06-05 | Method for installing electronic amplifier in heat dissipation shell |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108838280A CN108838280A (en) | 2018-11-20 |
| CN108838280B true CN108838280B (en) | 2020-03-27 |
Family
ID=64211476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810569014.3A Active CN108838280B (en) | 2018-06-05 | 2018-06-05 | Method for installing electronic amplifier in heat dissipation shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108838280B (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL71851C (en) * | 1941-03-19 | |||
| US4134334A (en) * | 1977-09-19 | 1979-01-16 | F. J. Littell Machine Company | Automated lock device for press feed belt drives |
| US7100260B2 (en) * | 2002-12-26 | 2006-09-05 | Utica Enterprises, Inc. | Programmable apparatus and method for body panel and clinch nut attachment |
| WO2007029253A2 (en) * | 2005-09-06 | 2007-03-15 | Beyond Blades Ltd. | 3-dimensional multi-layered modular computer architecture |
| US20070152023A1 (en) * | 2005-12-30 | 2007-07-05 | Semx Corporation | Solder deposit method on electronic packages for post-connection process |
| US8995132B2 (en) * | 2010-06-18 | 2015-03-31 | Tetsuji Kataoka | Structure for mounting heat sink, and heat sink mounted using the structure |
| CN102548341A (en) * | 2010-12-10 | 2012-07-04 | 旭丽电子(广州)有限公司 | Heat dissipation shell structure |
-
2018
- 2018-06-05 CN CN201810569014.3A patent/CN108838280B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN108838280A (en) | 2018-11-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110024119B (en) | Semiconductor device and manufacturing method thereof | |
| US20170108286A1 (en) | Heat transfer plate and heat pipe mounting structure and method | |
| JP2012184913A (en) | Radiation device and assembling method of the same | |
| US20080253090A1 (en) | Ic Component Comprising a Cooling Arrangement | |
| CN101573017A (en) | Radiating device | |
| CN101547584B (en) | Heat sink, heat sink combination and fixing device thereof | |
| US9386725B2 (en) | Heat sinking | |
| CN108838280B (en) | Method for installing electronic amplifier in heat dissipation shell | |
| US11460166B2 (en) | Light emitting diode (LED) pad mount system | |
| US20120160455A1 (en) | Heat dissipation device and method for manufacturing same | |
| CN101516170A (en) | Radiation device | |
| CN108598048A (en) | Heat sink assembly | |
| JP6190732B2 (en) | Heat sink and semiconductor device | |
| CN213633810U (en) | Laser radar and heat dissipation device thereof | |
| JP5636908B2 (en) | Socket and electronic device | |
| CN114071874A (en) | Circuit carrier arrangement and method for producing such a circuit carrier arrangement | |
| CN101646330B (en) | Cooling device | |
| CN217155102U (en) | Temperature equalizing plate | |
| CN217095283U (en) | 5G heat pipe positioning and forming structure | |
| US20120160467A1 (en) | Heat sink and assembly method thereof | |
| JP6663545B1 (en) | Press apparatus and method for manufacturing circuit board | |
| TWM586039U (en) | Thermal insulation device and electronic device chassis assembly | |
| CN213915689U (en) | Embedded refrigerator radiator square hole stamping die | |
| CN101340797B (en) | Heat radiating device | |
| JP7511398B2 (en) | Heat sink and method for manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |