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CN108833204A - A Network-on-Chip Test Encapsulation Based on Bidirectional Transmission Path - Google Patents

A Network-on-Chip Test Encapsulation Based on Bidirectional Transmission Path Download PDF

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CN108833204A
CN108833204A CN201810516677.9A CN201810516677A CN108833204A CN 108833204 A CN108833204 A CN 108833204A CN 201810516677 A CN201810516677 A CN 201810516677A CN 108833204 A CN108833204 A CN 108833204A
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test
transmission path
chip
network
bidirectional transmission
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詹俊楷
黄乐天
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University of Electronic Science and Technology of China
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University of Electronic Science and Technology of China
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04LTRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L43/00Arrangements for monitoring or testing data switching networks
    • H04L43/08Monitoring or testing based on specific metrics, e.g. QoS, energy consumption or environmental parameters
    • H04L43/0805Monitoring or testing based on specific metrics, e.g. QoS, energy consumption or environmental parameters by checking availability
    • H04L43/0817Monitoring or testing based on specific metrics, e.g. QoS, energy consumption or environmental parameters by checking availability by checking functioning
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04LTRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L43/00Arrangements for monitoring or testing data switching networks
    • H04L43/50Testing arrangements
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04LTRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L41/00Arrangements for maintenance, administration or management of data switching networks, e.g. of packet switching networks
    • H04L41/06Management of faults, events, alarms or notifications

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Environmental & Geological Engineering (AREA)
  • Data Exchanges In Wide-Area Networks (AREA)

Abstract

With the progress of semiconductor fabrication process, the more processor cores of multicore system on chip, reliability is with greater need for being taken seriously.The present invention is a kind of network-on-chip test encapsulation based on bidirectional transmission path.The test is encapsulated using bidirectional transmission path as test object, and bidirectional transmission path is used to replace router and link as the basic component units of network-on-chip, wherein bidirectional transmission path is defined as bi-directional data access and its close control logic circuit of Function Coupling between adjacent network-on-chip resource node.It is encapsulated based on the test, on-line testing can be carried out to network-on-chip idle route, fixed present in detection circuit and bridge type failure, Accurate Diagnosis abort situation will not have a negative impact to the application run in system while Test coverage data path and control logic circuit.The test encapsulates the measurability and observability for effectively improving the multicore system on chip based on network-on-chip, and then improves the reliability of digital display circuit.

Description

一种基于双向传输路径的片上网络测试封装A Network-on-Chip Test Encapsulation Based on Bidirectional Transmission Path

技术领域technical field

本发明是一种基于双向传输路径的片上网络测试封装,属于片上网络测试封装领域。The invention relates to an on-chip network test encapsulation based on a bidirectional transmission path, and belongs to the field of on-chip network test encapsulation.

背景技术Background technique

随着半导体制造工艺的进步,为了满足高性能并行计算的需求,多核片上系统集成了更多的处理器核等资源。随之而来的大量的通信量需求使得片上网络成为多核系统一种重要的互连通信结构。相比于基于总线的通信结构,片上网络拥有更大的地址空间,允许多个数据包同时传输,因而拥有更大的带宽和灵活性。With the advancement of semiconductor manufacturing technology, in order to meet the requirements of high-performance parallel computing, multi-core system-on-chip integrates more resources such as processor cores. The ensuing large amount of traffic demand makes the network on chip become an important interconnection communication structure of the multi-core system. Compared with the bus-based communication structure, the network on chip has a larger address space, allowing multiple data packets to be transmitted at the same time, so it has greater bandwidth and flexibility.

不断缩小的特征尺寸使得现代集成电路对温度、电压和工艺等变量变得越发敏感。在生产和使用过程中,工艺参数的变化、粒子撞击、老化现象等会对集成电路引入物理缺陷。及早地检测这些故障并采取治愈措施,可以使得电路避免出现短路或者开路等错误,最终避免片上网络中出现数据包丢失、数据包损坏甚至死锁等失效行为。Shrinking feature sizes make modern integrated circuits increasingly sensitive to temperature, voltage, and process variables. In the process of production and use, changes in process parameters, particle impact, aging phenomena, etc. will introduce physical defects to integrated circuits. Detecting these faults early and taking curative measures can make the circuit avoid errors such as short circuit or open circuit, and ultimately avoid failure behaviors such as packet loss, packet corruption, and even deadlock in the network on chip.

在使用基于片上网络的多核片上系统上运行多个应用之前,通常会将这些应用分别划分成若干个任务,按照一定的映射规则分配到多核片上系统的一系列节点上,每一个资源节点包含了一个处理器及其邻接路由器。这个过程被称为映射。映射是一种多核片上系统资源的调度手段。当完成映射之后,片上网络中将存在大量的空闲链路和部分空闲的路由器。不同应用占用的资源节点之间的链路是空闲的,因为它们没有通信负载;其次,同一个应用占用的资源节点内部有存在部分通信链路是空闲的;而那些没有被应用占用的路由器的外围链路同样也是空闲的。这为无负面影响的片上网络在线测试提供了可能。Before running multiple applications on a multi-core system-on-chip based on network-on-chip, these applications are usually divided into several tasks and assigned to a series of nodes of the multi-core system-on-chip according to certain mapping rules. Each resource node contains A processor and its adjacent routers. This process is called mapping. Mapping is a means of scheduling system resources on a multi-core chip. After the mapping is completed, there will be a large number of idle links and some idle routers in the network-on-chip. The links between the resource nodes occupied by different applications are idle because they have no communication load; secondly, there are some communication links inside the resource nodes occupied by the same application are idle; while those of the routers not occupied by applications Peripheral links are also idle. This enables in-circuit testing of the network on chip without negative effects.

当前面向片上网络的测试方法主要是基于路由器和基于链路的测试。传统的片上网络由路由器、链路和片上网络接口组成。基于路由器的测试方法通常需要占用正在运行的资源节点来进行测试,或者通过多个资源节点的配合来完成测试和故障定位。这种测试能覆盖网络中的数据通路和控制逻辑电路,但会对运行的应用产生负面影响。此外,基于链路的测试方法通常只对相邻资源节点之间的链路进行测试,无法覆盖到位于路由器中的控制逻辑电路,使得测试不够全面。The current test methods for network-on-chip are mainly router-based and link-based tests. A traditional network-on-chip consists of routers, links, and network-on-chip interfaces. The router-based test method usually needs to occupy a running resource node for testing, or complete testing and fault location through the cooperation of multiple resource nodes. This type of testing can cover the data path and control logic circuits in the network, but can negatively affect the running application. In addition, the link-based test method usually only tests the links between adjacent resource nodes, and cannot cover the control logic circuits located in the router, making the test not comprehensive enough.

发明内容Contents of the invention

为了提高片上网络的可测性和可观测性,同时不对在基于片上网络的多核系统上运行的应用产生负面影响,本发明提出了一种基于双向传输路径的片上网络测试封装。该测试封装用双向传输路径代替路由器和链路来作为片上网络的基本组成单元,并将双向传输路径作为测试对象,其中传输路径定义为相邻片上网络资源节点之间的数据通路及其功能耦合紧密的控制电路。本发明的测试封装的内容包括了基于双向传输路径的片上网络结构、传输路径结构、被测试电路的封装器、内建自测试平台以及测试控制台。In order to improve the testability and observability of an on-chip network without negatively affecting applications running on an on-chip network-based multi-core system, the invention proposes an on-chip network test package based on a bidirectional transmission path. The test package uses a bidirectional transmission path instead of a router and a link as the basic unit of the network on chip, and takes the bidirectional transmission path as the test object, where the transmission path is defined as the data path between adjacent network resource nodes and its functional coupling tight control circuit. The content of the test package of the present invention includes the on-chip network structure based on the bidirectional transmission path, the transmission path structure, the packager of the tested circuit, the built-in self-test platform and the test console.

基于双向传输路径的片上网络结构如图1所示。在这种结构中,使用传输路径作为片上网络的基本组成单元,在邻接传输路径交汇的地方形成连接点。该结构的片上网络跟传统的基于路由器的片上网络功能一致。处理器和存储器等控制器通过片上网络接口(Network Interface,NI)与传输路径连接,传输路径在连接点与其他传输路径进行交互。不同传输路径的功能是相互独立的。此外,在本发明的测试封装中,为了节省测试电路的面积和功耗,测试组件放置在连接点处,并由连接到该连接点的传输路径共享。测试组件包括了内建自测试平台和测试控制台。The structure of the network on chip based on the two-way transmission path is shown in Fig. 1 . In this structure, transmission paths are used as the basic building blocks of the on-chip network, and connection points are formed where adjacent transmission paths meet. The network-on-chip of this structure has the same function as the traditional router-based network-on-chip. Controllers such as a processor and a memory are connected to a transmission path through an on-chip network interface (Network Interface, NI), and the transmission path interacts with other transmission paths at the connection point. The functions of the different transmission paths are independent of each other. In addition, in the test package of the present invention, in order to save the area and power consumption of the test circuit, the test components are placed at the connection point and shared by the transmission path connected to the connection point. The test suite includes the built-in self-test platform and the test console.

本发明的整体结构如图2所示。每一个传输路径包含了独立的相邻资源节点之间的数据通路及其功能耦合紧密的控制逻辑电路。如图所示,传输路径结构可以划分为两个端口和端口之间的链路。每一个端口分为通道控制单元和通道数据单元,这么划分方便采用不同的测试方法对不同的单元进行测试,即使用预设测试数据包测试通道数据的单元,使用伪随机测试序列测试通道控制单元。传输路径中包含的数据通路涉及的硬件结构为通道数据单元和端口之间的链路,控制逻辑电路涉及的硬件结构为通道控制单元。通道数据单元有一级输出寄存器级和输入缓存队列,通道控制单元中有有限状态机(finite statemachine,FSM)、路由计算单元(routing calculation unit,RC)、虚拟通道分配单元(virtual-channel allocator,VA)、开关分配器(switch allocator,SA)和多路复用器。其中FSM负责当前端口输入数据包之后的传输控制,RC负责计算当前端口输入缓存队列最先进的数据包的路由方向,VA负责处理来自连接点其他方向的数据包的虚拟通道分配请求,SA负责来自连接点其他方向的数据包的传输使能控制,多路复用器负责不同方向进来数据包的通道选择。The overall structure of the present invention is shown in Figure 2. Each transmission path includes an independent data path between adjacent resource nodes and its functionally tightly coupled control logic. As shown in the figure, the transmission path structure can be divided into two ports and links between ports. Each port is divided into a channel control unit and a channel data unit, so that it is convenient to use different test methods to test different units, that is, use the preset test data packet to test the channel data unit, and use the pseudo-random test sequence to test the channel control unit . The hardware structure involved in the data path included in the transmission path is the link between the channel data unit and the port, and the hardware structure involved in the control logic circuit is the channel control unit. The channel data unit has a first-level output register level and an input buffer queue. The channel control unit has a finite state machine (finite state machine, FSM), a routing calculation unit (routing calculation unit, RC), and a virtual channel allocation unit (virtual-channel allocator, VA ), switch allocator (switch allocator, SA) and multiplexer. Among them, FSM is responsible for the transmission control after the current port input data packet, RC is responsible for calculating the routing direction of the most advanced data packet in the current port input buffer queue, VA is responsible for processing the virtual channel allocation request of data packets from other directions of the connection point, and SA is responsible for data packets from other directions. The transmission enable control of data packets in other directions of the connection point, and the multiplexer is responsible for the channel selection of incoming data packets in different directions.

本发明中的测试封装器如图3所示。图3中(a)子图展示的是通道数据单元的测试封装器。该封装器主要由多路复用器组成,对通道数据单元进行半隔离,即输出寄存器级与传输路径另一端的输入缓存队列保留直接连接,而与本地端口的控制信号被隔离。当隔离使能时,输出寄存器级接受来自通道数据单元内建自测试平台的测试数据包,输入缓存队列的数据将会进入通道数据单元内建自测试平台作为测试响应,同时采用固定信号屏蔽输入缓存队列的状态信息。图3中(b)子图展示的是通道控制单元的测试封装器。该封装器同样由多路复用器组成,对通道控制单元进行全隔离,即通道控制单元的所有输入输出信号都会经过该封装器。当隔离使能时,通道控制单元接受来自通道控制单元内建自测试平台的测试序列和控制信号,同时同样采用固定信号的方式来屏蔽对其他控制请求的响应。以上封装器的使能顺序和使能信号均有测试控制台来控制,测试控制台是整个测试过程的管理者。The test packager in the present invention is shown in FIG. 3 . The sub-figure (a) in Fig. 3 shows the test wrapper of the channel data unit. The wrapper mainly consists of a multiplexer that semi-isolates the channel data unit, that is, the output register stage remains directly connected to the input buffer queue at the other end of the transmission path, while the control signals from the local port are isolated. When isolation is enabled, the output register stage accepts the test data packets from the channel data unit’s built-in self-test platform, and the data in the input buffer queue will enter the channel data unit’s built-in self-test platform as a test response, and a fixed signal is used to shield the input Status information of the cache queue. The sub-figure (b) in Fig. 3 shows the test wrapper of the channel control unit. The encapsulator is also composed of a multiplexer, which fully isolates the channel control unit, that is, all input and output signals of the channel control unit will pass through the encapsulator. When the isolation is enabled, the channel control unit accepts the test sequences and control signals from the channel control unit’s built-in self-test platform, and also uses fixed signals to shield responses to other control requests. The enabling sequence and enabling signals of the above wrappers are controlled by the test console, which is the manager of the entire testing process.

本发明中的通道控制单元内建自测试平台如图4所示。该内建自测试平台以传统的STUMP(Self-Testing Using MISR and Parallel SRSG)结构为基础。平台使用线性反馈移位寄存器(linear feedback shift register,LFSR)基于预设种子产生一系列伪随机测试序列。为了节省LFSR的面积,移相器被用来对伪随机序列进行超前移相以产生更多的随机序列。在本发明中,对被测试电路插入了多条扫描链,这样可以节约大量的测试时间。在内建自测试的响应捕获端,使用能够容纳不定值X的测试响应压缩器(X-tolerant testresponse compactor)对测试响应进行压缩,之后将压缩值输入到多输入特征值寄存器(multiple input signature register,MISR)以产生唯一的特征值。最后在测试响应分析器(test response analyzer,TRA)中将实际的测试响应特征值与理想的响应特征值进行比对,用来判断被测试电路是否存在故障。整个内建自测试平台由内部的内建自测试控制器来控制。The built-in self-test platform of the channel control unit in the present invention is shown in FIG. 4 . The built-in self-test platform is based on the traditional STUMP (Self-Testing Using MISR and Parallel SRSG) structure. The platform uses a linear feedback shift register (LFSR) to generate a series of pseudo-random test sequences based on preset seeds. In order to save the area of the LFSR, the phase shifter is used to advance the phase shift of the pseudo-random sequence to generate more random sequences. In the present invention, multiple scan chains are inserted into the tested circuit, which can save a lot of testing time. At the response capture end of the built-in self-test, use the test response compressor (X-tolerant testresponse compactor) that can accommodate the variable value X to compress the test response, and then input the compressed value to the multiple input signature value register (multiple input signature register, MISR) to generate unique eigenvalues. Finally, in a test response analyzer (Test Response Analyzer, TRA), the actual test response characteristic value is compared with the ideal response characteristic value to judge whether there is a fault in the circuit under test. The entire BIST platform is controlled by an internal BIST controller.

通道数据单元内建自测试平台使用状态机通过移位操作产生预设数据包对数据单元进行测试。当前通道数据单元内建自测试平台产生的数据包经过当前端口的输出寄存器级,通过数据链路输入到被测试路径另外一端的输入缓存队列,并由另一端的内建自测试平台与理想数据包进行内容比对,以判断当前输入数据通路是否存在故障。The channel data unit built-in self-test platform uses the state machine to generate preset data packets through shift operations to test the data unit. The data packet generated by the built-in self-test platform of the current channel data unit passes through the output register level of the current port, and is input to the input buffer queue at the other end of the tested path through the data link, and is sent by the built-in self-test platform at the other end with the ideal data The content of the packet is compared to determine whether there is a fault in the current input data path.

附图说明Description of drawings

图1为本发明的片上网络结构示例。Fig. 1 is an example of the network on chip structure of the present invention.

图2为本发明的整体结构。Fig. 2 is the overall structure of the present invention.

图3为本发明的测试封装器。Fig. 3 is a test wrapper of the present invention.

图4为本发明的内建自测试平台。FIG. 4 is a BIST platform of the present invention.

图5为本发明的测试流程。Fig. 5 is the test flow of the present invention.

具体实施方式Detailed ways

图5展示了本发明的测试流程,该流程由本发明中测试控制台的有限状态机的状态转移图来表示。在对测试组件进行初始化之前,状态机处于空闲状态。当测试控制台接收到测试使能触发,会进入测试组件的隔离握手阶段。首先测试封装器会对被测试传输路径的输出寄存器级进行隔离,同时等待被测试路径另一端的相同操作。之后对当前端口的输入缓存器进行清空,同时等待并确认被测试路径另外一端的组件是否已进入相同阶段。被测试路径两端确认完毕表示测试同步握手成功,进而进入测试的触发阶段。在触发测试阶段,测试控制台会分别触发通道控制和数据单元的内建自测试平台对被测路径进行测试,其中对通道数据单元会进行多次测试以覆盖间歇性故障。当所有电路测试完毕之后,进入测试结果分析阶段,最终回到空闲状态,被测试路径恢复正常运行模式。FIG. 5 shows the test flow of the present invention, which is represented by the state transition diagram of the finite state machine of the test console in the present invention. The state machine is idle until the test components are initialized. When the test console receives the test enable trigger, it will enter the isolation handshake phase of the test component. First the test wrapper isolates the output register stage of the transmission path under test while waiting for the same operation at the other end of the path under test. Then clear the input buffer of the current port, and wait and confirm whether the component at the other end of the tested path has entered the same stage. The completion of the confirmation at both ends of the tested path indicates that the test synchronization handshake is successful, and then enters the triggering stage of the test. In the trigger test stage, the test console will trigger the built-in self-test platforms of the channel control and data units to test the path under test, and the channel data unit will be tested multiple times to cover intermittent faults. After all the circuits are tested, it enters the test result analysis stage, and finally returns to the idle state, and the tested path returns to the normal operation mode.

Claims (4)

1. a kind of network-on-chip based on bidirectional transmission path tests encapsulation, it is characterised in that the test of network-on-chip is double with one It is minimum test object to transmission path, and using bidirectional transmission path as the basic component units of network-on-chip, using being directed to Property build-in self-test method to transmission path carry out on-line testing.
2. bidirectional transmission path as described in claim 1, it is characterised in that function is mutually indepedent between transmission path, covers The data path and its close control logic circuit of Function Coupling between network-on-chip Adjacent resource node have been covered, and has shared and puts Set the test suite in tie point position.
3. targetedly build-in self-test method as described in claim 1, it is characterised in that draw the port of transmission path It is divided into data cell and control unit, functional test is carried out using the method for default test data packet transmission to data cell, Structural testing is carried out using Pseudo random test sequences to control unit.
4. test suite as described in claim 2, it is characterised in that test suite includes that data cell built-in self-test is flat Platform, control unit built-in self-test platform and test console, and the shared use of the transmission path by being connected to identical tie point, And test process is uniformly controlled by same test console.
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110365530A (en) * 2019-07-11 2019-10-22 电子科技大学 A network-independent test token-passing network
CN110597722A (en) * 2019-09-17 2019-12-20 深圳市及响科技有限公司 An online debugging method for an online development platform
CN115695292A (en) * 2021-07-30 2023-02-03 北京希姆计算科技有限公司 Broadcast transmission circuit based on network on chip
CN115934429A (en) * 2022-12-01 2023-04-07 电子科技大学 Cross-chip interconnection-oriented parallel data online calibration system and method
CN118567883A (en) * 2024-08-02 2024-08-30 北京开源芯片研究院 Component communication method, device, equipment and storage medium in verification environment

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110365530A (en) * 2019-07-11 2019-10-22 电子科技大学 A network-independent test token-passing network
CN110597722A (en) * 2019-09-17 2019-12-20 深圳市及响科技有限公司 An online debugging method for an online development platform
CN115695292A (en) * 2021-07-30 2023-02-03 北京希姆计算科技有限公司 Broadcast transmission circuit based on network on chip
CN115695292B (en) * 2021-07-30 2025-03-11 广州希姆半导体科技有限公司 Broadcast transmission circuit and method based on network on chip
CN115934429A (en) * 2022-12-01 2023-04-07 电子科技大学 Cross-chip interconnection-oriented parallel data online calibration system and method
CN115934429B (en) * 2022-12-01 2024-04-19 电子科技大学 A parallel data online calibration system and calibration method for cross-chip interconnection
CN118567883A (en) * 2024-08-02 2024-08-30 北京开源芯片研究院 Component communication method, device, equipment and storage medium in verification environment
CN118567883B (en) * 2024-08-02 2024-11-01 北京开源芯片研究院 Component communication method, device, equipment and storage medium in verification environment

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