CN108831627B - Method for manufacturing large-area transparent electrodes based on 3D printing and liquid bridge transfer printing - Google Patents

Abstract

The invention discloses a method for manufacturing a large-area transparent electrode based on 3D printing and liquid bridge transfer printing, which comprises the steps of driving a melting jet deposition 3D printing female die by an electric field; casting a liquid organic polymer material to the female die by vacuum assistance to copy a working die; filling conductive ink into the groove of the working die; and sintering and curing the conductive ink filled in the groove of the working mould, and transferring the conductive ink onto a substrate by using a liquid bridge transfer printing technology. Casting a liquid Polydimethylsiloxane (PDMS) material to the large-size master plate through vacuum assistance to copy a PDMS soft mold (a working mold); transferring the conductive ink filled in the groove of the PDMS soft mold onto a substrate after heating and curing by using a liquid bridge transfer printing technology; the transparent electrode on the substrate is post-treated. Obtain the transparent electrode with large area, large height-width ratio and high resolution.

Description

Method for manufacturing large-area transparent electrodes based on 3D printing and liquid bridge transfer printing

technical field

The invention belongs to the technical field of manufacturing transparent electrodes and ultrafine circuits, and in particular relates to a method for manufacturing large-area transparent electrodes based on 3D printing and liquid bridge transfer printing.

Background technique

Transparent electrodes or transparent conductive films are important components of many optoelectronic devices and products such as touch screens, thin film solar cells (OSCs), OLEDs, LCDs, transparent displays, etc., and have been widely used in many fields and products, especially in recent years with the With the increasing popularity of OLED screen mobile phones, flexible electronics, electronic skin, Internet of Things, and wearable devices, flexible transparent electrodes show broader industrial application prospects.

At present, the transparent conductive film/transparent electrode used in the industry is mainly indium tin oxide (ITO) film, but the indium contained in ITO is a rare metal, and its manufacture requires high-temperature vacuum deposition, resulting in high manufacturing costs; in addition , ITO flexibility, deposition manufacturing requires high temperature, not suitable for flexible substrates such as PET, not suitable for the manufacture of flexible transparent electrodes, which limits its application.

Therefore, in recent years, academia and industry have proposed many ITO alternatives, such as conductive polymer films (such as PEDTO:PSS), metal (gold, silver, copper, etc.) grid transparent conductive films, metal nanowires (silver nanowires, etc.) ), new-generation transparent electrodes such as carbon nanotube- or graphene-based transparent conductive films have attracted increasing attention.

Compared with other technologies and implementations, the metal (silver) grid transparent electrode (Silver Grid) not only has the light transmittance and conductivity comparable to ITO, but also has strong flexibility and is suitable for soft and hard substrates (substrates) , low cost, tailorable performance and other outstanding advantages, it has been considered by academia and industry as one of the most promising technologies for industrial applications.

At present, there are many methods of manufacturing metal mesh transparent electrodes proposed at home and abroad, such as optical lithography, nanoimprinting, inkjet printing, aerosol printing and other manufacturing technologies. High-efficiency, low-cost, and mass-produced metal grids with high resolution and high aspect ratios have deficiencies and limitations, which seriously affect and restrict the wider commercial application of metal grid transparent electrodes. It is urgent to develop new Fabrication methods and strategies to achieve efficient, low-cost, and large-scale fabrication of large-area ultrafine transparent electrodes.

Contents of the invention

In order to solve the above problems, the present invention proposes a method for manufacturing large-area transparent electrodes based on 3D printing and liquid bridge transfer printing, and realizes low-cost mass production of large-area transparent electrodes in combination with electric field-driven fusion jet deposition 3D printing and liquid bridge transfer printing technologies manufacture.

In order to achieve the above object, the present invention adopts the following technical solutions:

A method for manufacturing large-area transparent electrodes based on 3D printing and liquid bridge transfer printing, comprising the following steps:

(1) Using electric field driven melt jet deposition 3D printing to manufacture the master model;

(2) Casting the liquid organic polymer material to the master mold by vacuum assistance to remake the working mold;

(3) Fill the conductive ink into the groove of the working mould;

(4) The conductive ink filled in the groove of the working mold is heated and cured, and transferred to the substrate by using the liquid bridge transfer printing technology.

Further, in the step (1), the substrate is cleaned and dried, and the surface of the substrate is subjected to plasma bombardment treatment with a plasma processor; according to the structure of the designed transparent conductive electrode, the electric field-driven fusion jet deposition 3D printing technology is used to print The material prints out the micro-nano characteristic structure or pattern required by the transparent conductive electrode on the substrate.

Preferably, the substrate includes but not limited to glass, plastic and silicon wafer.

Preferably, the printing material includes but not limited to polycaprolactone and polymethyl methacrylate.

Preferably, the transparent conductive electrodes include wire grid electrodes, various grid electrodes, etc. Of course, the connection relationship of each electrode is subject to design.

Further, described step (2) the method for turning over working mold comprises:

(2-1) Spin coating or casting process is used to spread the vacuum-treated organic polymer material on the master mold;

(2-2) heating and curing the organic polymer material;

(2-3) Additional backing support layer, with resin as the support layer, first coat a layer of transparent coupling agent material on the resin or perform surface adhesion treatment, and attach it to the organic polymer material ;

(2-4) heating the multilayer composite structure as a whole, so that the organic polymer material is completely cured, so as to ensure that the backing support layer and the organic polymer material layer are firmly combined;

(2-5) The resin and organic polymer material layers are completely separated from the master mold by using the uncovering demoulding method to complete the manufacture of the working mold.

Preferably, the organic polymer material is liquid polydimethylsiloxane, and the coating thickness is 500nm-5mm.

Furthermore, in the step (2-2), heat curing is performed at 30°C-45°C for 8-12 hours.

Furthermore, in the step (2-3), polyethylene terephthalate is used as the support layer, and the thickness is 0.1-1 mm.

Furthermore, in the step (2-4), heat curing at 40°C-60°C for 10-18 hours.

Further, the conductive ink of the step (3) includes nano-silver conductive ink, nano-copper conductive ink, silver nanowire, graphene conductive ink or/and carbon nanotube conductive ink, and the surface free energy of the ink is between 30mJ/m ² -70mJ/ ^m2 between.

Nano silver conductive ink is preferred.

Further, in the step (3), the conductive ink is passed through the microstructure on the surface of the working mold by scraping or pulling process, and the conductive ink filled in the microstructure groove is filled under the action of discontinuous dehumidification and capillary action. The ink remains, while the conductive ink at the top of the groove is removed, allowing the conductive ink to fill.

Further, the curing temperature of the step (4): 100°C-150°C; curing time: 10-20 minutes.

Further, in the specific step of the step (4), a layer of liquid adhesive layer is constructed between the working mold and the target substrate. As the liquid volatilizes, the capillary force gradually increases, and the two surfaces are pulled into contact to make them Forms a good conformal contact.

Preferably, the liquid bridge medium of the liquid adhesive layer is a polar liquid, such as methanol, ethanol and isopropanol.

Further, the method also includes step (5), further solidifying the conductive structure, specifically, making the dispersed silver particles form silver simple substance in a certain way to form a conductive path.

Furthermore, for heat-resistant substrates, thermal sintering is used to obtain electrodes with excellent electrical conductivity; for plastic substrates used in flexible electronic products, low-temperature sintering, electrical sintering or chemical sintering are used.

Compared with prior art, the beneficial effect of the present invention is:

The invention combines the advantages of electric field-driven fused jet deposition 3D printing and liquid bridge transfer printing technology, and realizes efficient and low-cost batch manufacturing of large-area and ultra-fine transparent electrodes. Has the following significant advantages:

(1) Efficient and low-cost large-scale manufacturing of transparent electrodes on ultra-large (meter-scale) substrates can be realized.

(2) The fabrication of submicroscale and nanoscale ultrafine transparent electrodes can be realized.

(3) It can realize the manufacture of transparent electrodes with large aspect ratio (with low square resistance and high light transmittance at the same time), realize the manufacture of high-performance transparent electrodes, and solve the problem that the existing technology is difficult to achieve low square resistance and high light transmittance at the same time. Difficulties in electrode fabrication.

(4) It is suitable for the manufacture of transparent electrodes on various soft and hard substrates (substrates), especially suitable for the manufacture of transparent electrodes on non-flat and fragile substrates. Has a very wide range of applications.

(5) The manufactured transparent electrode has good consistency and high reliability.

(6) The process is simple, no special equipment is needed, and the manufacturing cost is low.

(7) Strong process adaptability.

(8) The applicable conductive materials are wide, and the present invention can be widely used in many fields such as touch screens, thin film solar cells, OLEDs, LCDs, transparent displays, electronic papers, flexible electronics, and wearable devices.

(9) the present invention provides a kind of brand-new solution that has extensive industrialized application prospect for the manufacture of large-size and large-area electrodes (transparent electrodes) and ultra-fine circuits required in fields such as solar cells, touch screens, OLEDs, and LCDs, and has The unique advantages of high precision, super large size, low cost and high efficiency.

Description of drawings

The accompanying drawings constituting a part of the present application are used to provide further understanding of the present application, and the schematic embodiments and descriptions of the present application are used to explain the present application, and do not constitute improper limitations to the present application.

Figure 1 is a schematic diagram of the process flow of the present invention in combination with electric field-driven melt jet deposition 3D printing and liquid bridge transfer printing technology to manufacture large-area transparent electrodes;

2 is a schematic diagram of a method for manufacturing a transparent electrode according to an embodiment of the present invention;

Fig. 3 is a schematic diagram of the principle of manufacturing a master model by using electric field-driven fusion jet deposition 3D printing technology in the present invention.

Detailed ways:

The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

It should be pointed out that the following detailed description is exemplary and intended to provide further explanation to the present application. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

It should be noted that the terminology used here is only for describing specific implementations, and is not intended to limit the exemplary implementations according to the present application. As used herein, unless the context clearly dictates otherwise, the singular is intended to include the plural, and it should also be understood that when the terms "comprising" and/or "comprising" are used in this specification, they mean There are features, steps, operations, means, components and/or combinations thereof.

In the present invention, terms such as "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "side", "bottom" etc. indicate The orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, and is only a relative term determined for the convenience of describing the structural relationship of the various components or elements of the present invention, and does not specifically refer to any component or element in the present invention, and cannot be understood as a reference to the present invention. Invention Limitations.

In the present invention, terms such as "fixed", "connected" and "connected" should be understood in a broad sense, which means that they can be fixedly connected, integrally connected or detachably connected; they can be directly connected or can be connected through the middle The medium is indirectly connected. For relevant researchers or technical personnel in the field, the specific meanings of the above terms in the present invention can be determined according to specific situations, and should not be construed as limitations on the present invention.

As introduced in the background, various manufacturing technologies such as optical lithography, nanoimprinting, inkjet printing, and aerosol printing in the prior art face many shortcomings and limitations in realizing large-area transparent electrodes, such as processing costs, manufacturing Period, maximum graphical area, etc. In order to solve the above technical problems, the present application proposes a method for preparing a large-area transparent electrode based on electric field-driven melt jet deposition and liquid bridge transfer technology.

The working principle of the present invention is to use electric field-driven fusion jet deposition 3D printing to manufacture large-size master plates (mother molds); through vacuum-assisted casting of liquid polydimethylsiloxane (PDMS) materials to large-size master plates to reproduce PDMS soft molds (working mould); use the liquid bridge transfer technology to transfer the conductive ink filled in the groove of the PDMS soft mold to the substrate after sintering and solidification; perform post-processing on the transparent electrode on the substrate. Obtain large area, high aspect ratio, high resolution transparent electrodes.

In the present invention, large area, large aspect ratio, and high resolution are meter-level scales commonly referred to by those skilled in the art, and have low square resistance, high light transmittance, and high resolution at the same time. Of course, the present invention The technical solution can also be used in the preparation of transparent electrodes for general requirements or indicators.

The manufacturing method of the present invention will be further described below in conjunction with the accompanying drawings.

Implementation example 1

In this embodiment, a large-area master mold structure is manufactured by electric field-driven fusion jet deposition technology, and then the master mold structure is transferred to the PDMS working mold through a graphic replication process, and then the PDMS working mold is filled with nano-silver ink, and finally the liquid bridge transfer The silver wire is transferred to the target substrate (hard substrate) by printing, and the pattern structure manufactured is a wire grid structure. The manufacturing process is shown in Figure 2, and the specific preparation steps include:

(1) Manufacture of the master mold: using electric field-driven fusion jet deposition 3D printing to manufacture large-scale master molds (master plates)

Ordinary glass is used as the substrate (substrate). Firstly, the glass substrate was cleaned, deionized water was ultrasonically treated for 10 minutes, and then dried with nitrogen gas, and then the glass surface was subjected to plasma bombardment treatment with a plasma processor to improve the adhesion between the printing material and the glass substrate. Using PMMA as the printing material, according to the pattern structure of the micro-nano mold to be manufactured, the PMMA structure is manufactured on the glass substrate by electric field-driven melt jet deposition, as shown in Figure 3.

The outer casing of the storage barrel of the printing device is provided with a heater to preheat the printing material in the storage barrel. A heater may also be provided at the printing needle at the end of the printer.

Since the printing device and the like are existing devices, their structure will not be described in detail here.

The printed PMMA structure pattern is: a wire grid structure with a line width of 5 μm, a period of 150 μm, and a height of 2 μm, and the effective pattern area is 200mm X 200mm.

(2) Turn over the working mold: use PDMS material to transfer the graphics

Spread a layer of PDMS polymer on the surface of the prepared master mold, select an appropriate amount of Dow Corning 184 canned glue, and scrape a layer of PDMS with a thickness of about 0.5-2 mm on the upper surface of the master mold by using a scraper machine, and apply it in a vacuum environment. The PDMS is cured by heating, the heating temperature is set at 30-40°C, and the heating time is set at 8-12h. Then coat a layer of coupling agent (such as KH550, KH560, KH570, KH792, DL602, DL171) or adhesive on the PET with a thickness of 0.3mm, and stick it to the PMDS, and then put the master mold, PDMS replication structure, PET back The whole lining is placed in a vacuum heating oven, and heated and cured at 30-40°C for 10 hours. After the PDMS is completely cured, the "opening" demoulding method is used to completely separate the PET and PDMS composite soft mold (working mold) from the master mold to complete the manufacture of the working mold.

(3) Filling nano-silver ink: Filling nano-silver ink inside the PDMS working mold groove

Fill the groove of the PDMS working mold with nano-silver ink, and use the dipping and pulling process to make the nano-silver ink pass through the microstructure on the surface of the PDMS working mold. Under the action of discontinuous dehumidification, the nano-silver ink will be filled into the groove of the PDMS working mold in the groove without remaining on the top surface of the template.

(4) Heat curing: heat and cure the ink completely filled in the working mold

The solvent in the nano-silver ink is volatilized by heating to achieve curing. Since different nano-silver inks have different curing properties, the nano-silver ink used in this embodiment is cured by heating at 100° C. for 10 minutes.

(5) Liquid bridge transfer printing silver wire

Ordinary glass is selected as the target substrate. After pretreatment such as cleaning and drying, a layer of isopropanol is sprayed on the glass surface as a liquid bridge medium, and the template filled with silver wires is fully in contact with the substrate, and the relative position of the two is properly adjusted. Make sure there are no air bubbles between the PDMS working mold and the glass substrate. At 60°C, due to the high volatility of isopropanol, it will quickly penetrate into the atmosphere from the edge of PDMS or PDMS itself. As the isopropanol decreases, the curvature of the isopropanol surface of the liquid layer in the groove will continue to decrease, thereby increasing the capillary force, and finally pulling the cured silver wire to the surface of the substrate, realizing the cured silver wire from PDMS. Transfer of the working mold to the substrate.

As a more preferred embodiment, step (6) post-processing is also included.

In order to improve the conductivity of the silver wire, it is necessary to make the dispersed silver particles form a silver substance in a certain way to form a conductive path. The transferred silver wire is placed on a heating platform for high-temperature sintering. The sintering temperature is 250°C-350°C, and the sintering time is Not less than 30min.

Implementation example 2

In this embodiment, a large-area master mold structure is manufactured by electric field-driven fusion jet deposition technology, and then the master mold structure is transferred to PDMS through a graphic replication process, and then the PDMS working mold is filled with nano-silver ink, and finally liquid bridge transfer is used to transfer the master mold structure to PDMS. The silver wires are transferred to the target substrate PET (flexible substrate), and the fabricated pattern structure is a grid structure. The manufacturing process is shown in Figure 2, and the specific preparation steps include:

(1) Manufacture of the master mold: using electric field-driven fusion jet deposition 3D printing to manufacture large-scale master molds (master plates)

Ordinary glass is used as the substrate (substrate). Firstly, the glass substrate was cleaned, ultrasonically treated with deionized water for 10 min, and then blown dry with nitrogen. Using polycaprolactone (PCL) as the printing material, according to the micro-nano mold pattern structure to be manufactured, the PCL structure was manufactured on the glass substrate by electric field-driven melt jet deposition, as shown in Figure 3.

The printed PCL structure pattern is: a grid structure with a line width of 2 μm, a period of 200 μm, and a height of 0.8 μm, and the effective graphics area is 80mm X 80mm.

(2) Turn over the working mold: use PDMS material to transfer the graphics

Spread a layer of PDMS polymer on the surface of the prepared master mold, select an appropriate amount of Dow Corning 184 canned glue, and scrape a layer of PDMS with a thickness of about 0.5-2 mm on the upper surface of the master mold by using a scraper machine, and apply it in a vacuum environment. The PDMS is cured by heating, the heating temperature is set at 40°C, and the heating time is set at 8-12h. Then coat a layer of coupling agent (such as KH550, KH560, KH570, KH792, DL602, DL171) or adhesive on the PET with a thickness of 0.3mm, and stick it to the PMDS, and then put the master mold, PDMS replication structure, PET back The whole lining is placed in a vacuum heating oven, and heated and cured at 40°C for 10 hours. After the PDMS is completely cured, the "opening" demoulding method is used to completely separate the PET and PDMS composite soft mold (working mold) from the master mold to complete the manufacture of the working mold.

(3) Filling nano-silver ink: filling nano-silver ink inside the groove of the working mold

Fill the groove of the PDMS working mold with nano-silver ink, and use the dipping and pulling process to make the nano-silver ink pass through the microstructure on the surface of the PDMS working mold. Under the action of discontinuous dehumidification, the nano-silver ink will be filled into the groove of the PDMS working mold in the groove without remaining on the top surface of the template.

(4) Heat curing: heat and cure the ink completely filled in the working mold

The solvent in the nano-silver ink is volatilized by heating to achieve curing. Since different nano-silver inks have different curing properties, the nano-silver ink used in this embodiment is cured by heating at 100° C. for 10 minutes.

(5) Liquid bridge transfer printing silver wire

Select PET as the target substrate, after pretreatment such as cleaning and drying, spray a layer of ethanol on the glass surface as a liquid bridge medium, fully contact the working mold filled with silver wires with the substrate, adjust the relative position of the two appropriately, and ensure that the PDMS There are no air bubbles between the working mold and the glass substrate. At 80°C, due to the high volatilization rate of ethanol, it will quickly penetrate into the atmosphere from the edge of PDMS or PDMS itself. With the decrease of ethanol, the curvature of the ethanol surface of the liquid layer in the groove will continue to decrease and the capillary force will continue to increase, and finally the cured silver wire will be pulled to the surface of the substrate, so that the cured silver wire will move from the PDMS working mold to the substrate. transfer.

As a more preferred embodiment, step (6), that is, a post-processing step, is also included.

In this step, in order to improve the conductivity of the silver wire, it is necessary to make the dispersed silver particles form a silver substance in a certain way to form a conductive path. Since the heat resistance of the PET material is poor, low-temperature sintering, electrical sintering, chemical sintering, etc. are usually used. The transferred silver wire was placed in an electric sintering machine for sintering for 3 minutes, so as to obtain a silver wire with good electrical conductivity.

Of course, the above two embodiments are only to make those skilled in the art understand the two typical implementations of the technical solutions. The selection of the above-mentioned specific materials or specific parameters, such as temperature, time and thickness, etc., can be used in the present invention. Within the given range, changes may be made according to the specific printing environment, selected materials, and printing requirements, and are not limited to the specific materials and parameters given in the above two embodiments.

The above descriptions are only preferred embodiments of the present application, and are not intended to limit the present application. For those skilled in the art, there may be various modifications and changes in the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of this application shall be included within the protection scope of this application.

Although the specific implementation of the present invention has been described above in conjunction with the accompanying drawings, it does not limit the protection scope of the present invention. Those skilled in the art should understand that on the basis of the technical solution of the present invention, those skilled in the art do not need to pay creative work Various modifications or variations that can be made are still within the protection scope of the present invention.

Claims (8)

1. a kind of method based on 3D printing and liquid bridge transfer manufacture large-area transparent electrode, it is characterized in that: the following steps are included:

(1) using polymethyl methacrylate as printed material, master mold is manufactured using electric field driven melting jet deposition 3D printing；

(2) work mold processed is turned over to master mold casting liquid organic polymer material by vacuum aided；

(3) it fills in nanometer conductive ink to the groove of work mold；

(4) it will be filled in the heated solidification of the conductive ink in work mold trench, and is transferred to base using liquid bridge transfer technique On material；

The method that the step (2) turns over work mold processed includes:

(2-1) uses spin coating or casting process, and the organic polymer material painting after vacuumize process is taped against on master mold；

(2-2) is heating and curing to organic polymer material；

(2-3) adds backing support, and using resin as supporting layer, the coupling agent material of layer of transparent is coated first on resin Or surface adhesive processing is carried out, it is fitted on organic polymer material；

(2-4) integrally heats multi-layer compound structure, and organic polymer material is fully cured, guarantee backing support and The firm connection of organic polymer material layer；

(2-5) uses open-type release method, and resin and organic polymer material layer are kept completely separate with master mold, completes Working mould The manufacture of tool；

In the step (3), using blade coating or czochralski process, conductive ink is made to pass through the micro-structure of work die surface, Under the effect and capillarity of discontinuous dehumidifying, being filled in the conductive ink inside microstructured groove can be remained, and be in The conductive ink of groove top can be removed, to realize the filling of conductive ink.

2. a kind of method based on 3D printing and liquid bridge transfer manufacture large-area transparent electrode as described in claim 1, special Sign is: in the step (1), cleaning and dry substrate, and plasma bombardment is carried out to substrate surface using plasma processor Processing；According to the structure of the transparent conductive electrode of design, jet deposition 3D printing technique is melted using electric field driven, to print material Material prints micro-nano feature structure or pattern required for the transparent conductive electrode on substrate.

3. a kind of method based on 3D printing and liquid bridge transfer manufacture large-area transparent electrode as described in claim 1, special Sign is: the organic polymer material is liquid dimethyl silicone polymer, and coating thickness is 500nm-5mm.

4. a kind of method based on 3D printing and liquid bridge transfer manufacture large-area transparent electrode as described in claim 1, special Sign is: in the step (2-2), being heating and curing at 30 DEG C -45 DEG C 8-12 hours；

Or, using polyethylene terephthalate as supporting layer in the step (2-3), and with a thickness of 0.1-1mm；

Or, being heating and curing at 40 DEG C -60 DEG C 10-18 hours in the step (2-4).

5. a kind of method based on 3D printing and liquid bridge transfer manufacture large-area transparent electrode as described in claim 1, special Sign is: the conductive ink of the step (3), including nano silver conductive ink, nano-copper conductive ink, silver nanowires, graphene Conductive ink or/and carbon nanotube conducting ink, ink pellet surface free energy is between 30mJ/m²-70mJ/m²Between.

6. a kind of method based on 3D printing and liquid bridge transfer manufacture large-area transparent electrode as described in claim 1, special Sign is: the solidification temperature of the step (4): 100 DEG C -150 DEG C；Curing time: 10-20 minutes.

7. a kind of method based on 3D printing and liquid bridge transfer manufacture large-area transparent electrode as described in claim 1, special Sign is: the specific steps of the step (4), one layer of liquid adhesive layer is constructed between work mold and target substrate, with liquid Body volatilization, capillary force gradually increase, and pull two surface contacts, make to form good bringing into conformal contact between them；

Further, the liquid bridge medium of liquid adhesive layer is polar liquid.

8. a kind of method based on 3D printing and liquid bridge transfer manufacture large-area transparent electrode as described in claim 1, special Sign is: the method also includes step (5), further curing conductive structure is specific: making the Argent grain of dispersion in a certain way It forms silver-colored simple substance and forms conductive path；

For heat resistant substrate, the excellent electrode of electric conductivity is obtained using the method for thermal sintering；Flexible electronic product is used Plastic-substrates, using low-temperature sintering, electricity sintering or chemically sintered mode carry out.