CN108811310A - Form the forming method of the protection structure and wiring board of the copper foil layer of wiring board - Google Patents
Form the forming method of the protection structure and wiring board of the copper foil layer of wiring board Download PDFInfo
- Publication number
- CN108811310A CN108811310A CN201811023645.1A CN201811023645A CN108811310A CN 108811310 A CN108811310 A CN 108811310A CN 201811023645 A CN201811023645 A CN 201811023645A CN 108811310 A CN108811310 A CN 108811310A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- protective layer
- layer
- foil layer
- sealing structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 170
- 239000011889 copper foil Substances 0.000 title claims abstract description 165
- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000010410 layer Substances 0.000 claims abstract description 184
- 239000011241 protective layer Substances 0.000 claims abstract description 139
- 238000007789 sealing Methods 0.000 claims abstract description 82
- 230000002093 peripheral effect Effects 0.000 claims description 15
- 239000003292 glue Substances 0.000 claims description 12
- 238000000926 separation method Methods 0.000 claims description 11
- 239000002390 adhesive tape Substances 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000003825 pressing Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000011888 foil Substances 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- -1 meanwhile Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The present invention provides a kind of forming method of the protection structure and wiring board of the copper foil layer forming wiring board, and protection structure includes：Protective layer and sealing structure, and the sealing structure at least covers the part-skirt of the protective layer and/or the copper foil layer.In the protection structure; provided with protective layer; due to being sealing space or part confined space in the gap of copper foil layer and protective layer; therefore; the surface of foreign matter and foreign substance pollution copper foil layer can effectively be completely cut off; meanwhile protective layer can play cushioning effect, and surface when circuit board pressing is avoided to generate pit.
Description
Technical field
The present invention relates to copper foil of circuit board technical field more particularly to a kind of protection structures for the copper foil layer forming wiring board
With the forming method of wiring board.
Background technology
The pressing of wiring board at present is mainly based upon the superposition pressing of copper foil conductive layer, by long-term production practices, hair
There may be small ruts for the product outermost layer copper foil of existing the method production, are only applicable in the lower product of flatness requirement.To production
When the appearance of product has strict demand, such as：When having golden finger, it is necessary to after the completion of production, to there is the gold of conductive contact
The flatness of finger is strictly screened, it is to be understood that this can cause additional cost of labor or cause product rejection；
And the wiring board directly produced at present using copper foil cannot keep copper face to clean, and be protected without buffer layer.
Therefore, how designing one kind can either keep copper face to clean, and the protection structure with buffer layer, just become one
Urgent problem to be solved.
Invention content
The purpose of the present invention is to provide a kind of molding sides of the protection structure and wiring board of the copper foil layer forming wiring board
Method.
One of in order to achieve the above-mentioned object of the invention, an embodiment of the present invention has provided a kind of copper foil forming wiring board
The protection structure of layer, the protection structure include：Protective layer and sealing structure, it is described protective layer used in carrying the copper foil layer,
And the sealing structure at least covers the part-skirt of the protective layer and/or the copper foil layer.
As being further improved for an embodiment of the present invention, the sealing structure, the protective layer and the copper foil layer
Form a confined space.
As being further improved for an embodiment of the present invention, the protective layer has at least one through the protective layer
First positioning hole, the copper foil layer have at least second location hole through the copper foil layer, first positioning hole and described the
Two location holes are correspondingly arranged, and the sealing structure is located in first positioning hole and/or second location hole.
As being further improved for an embodiment of the present invention, the opening bore of second location hole is more than first positioning hole
Be open bore.
As being further improved for an embodiment of the present invention, the protective layer has the first surface towards copper foil layer,
There is the copper foil layer second surface away from protective layer, the sealing structure to extend to first table by the second surface
Face.
As being further improved for an embodiment of the present invention, the outer edge of the copper foil layer is respectively positioned on the protective layer
Outer peripheral inside；The first surface is close to the outer peripheral part of the copper foil layer and the second surface close to institute
The outer peripheral part for stating copper foil layer is covered by the sealing structure；The first surface correspond to second location hole part,
And the second surface is covered by the sealing structure close to the part of second location hole.
As being further improved for an embodiment of the present invention, step is formed between the copper foil layer and the protective layer
Portion, the sealing structure are located at the stage portion.
As being further improved for an embodiment of the present invention, in the copper foil layer, correspond to the outer of the copper foil layer
It edge and is covered by the sealing structure corresponding to the inner side edge of second location hole.
As being further improved for an embodiment of the present invention, the sealing structure is glue or adhesive tape.
As being further improved for an embodiment of the present invention, the protective layer is aluminium layer.
As being further improved for an embodiment of the present invention, the protective layer is made of heat proof material.
As being further improved for an embodiment of the present invention, the coefficient of thermal expansion of the protective layer is more than or equal to copper foil layer
Coefficient of thermal expansion.
The embodiment of the present invention additionally provides a kind of forming method of wiring board, includes the following steps：
One protective layer is provided；In a copper foil layer is arranged on the protective layer；Form sealing structure, the sealing structure, institute
It states protective layer and the copper foil layer and forms a confined space, and the sealing structure at least covers the protective layer and/or described
The part-skirt of copper foil layer.
As being further improved for an embodiment of the present invention, step " in a copper foil layer is arranged on the protective layer ", tool
Body includes：Copper foil is placed on protective layer, several predeterminated positions in the copper foil layer open up second location hole, described
Several predeterminated positions in protective layer open up first positioning hole, wherein it is fixed that the opening bore of second location hole is more than first
The opening bore in position hole.
As being further improved for an embodiment of the present invention, copper foil " is placed on protective layer " by step, is specifically included：
Copper foil is placed on protective layer, and the copper foil layer outer edge is respectively positioned on the outer peripheral inside of protective layer；Step " is formed
Sealing structure " specifically includes：The glue of first surface and second surface can be covered along the outer edge coating of the copper foil layer
Or adhesive tape, the glue or adhesive tape of first surface and second surface can be covered along the inner side edge coating of second location hole, wherein
First surface is towards the surface of copper foil layer in the protective layer, and second surface is the table away from protective layer in the copper foil layer
Face.
As being further improved for an embodiment of the present invention, the forming method further includes step：In the copper foil layer
Side far from the protective layer at least forms a separation layer；Bond the separation layer, the copper foil layer and the protective layer.
As being further improved for an embodiment of the present invention, step " in the copper foil layer far from the protective layer one
Side at least forms an isolation separation layer " it specifically includes：It is arranged by separation layer in side of the copper foil layer far from the protective layer
And copper foil layer is superimposed several combination layers to be formed.
Compared with the existing technology, the technical effects of the invention are that：An embodiment of the present invention provides a kind of formation wiring boards
Copper foil layer protection structure and wiring board forming method, protection structure include：Protective layer and sealing structure, and the sealing
Structure at least covers the part-skirt of the protective layer and/or the copper foil layer.In the protection structure, it is provided with protective layer,
Due to the gap of copper foil layer and protective layer be sealing space or part confined space, can effectively completely cut off foreign matter
With the surface of foreign substance pollution copper foil layer, meanwhile, protective layer can play cushioning effect, and surface generates recessed when avoiding circuit board pressing
Hole.
Description of the drawings
Fig. 1 is the vertical view of the first construction situation of the protection structure in the embodiment of the present invention；
Fig. 2A-Fig. 2 F are in Fig. 1 along the sectional view of section BB；
Fig. 3 A- Fig. 3 C are in Fig. 1 along the sectional view of section AA；
Fig. 4 is the upward view of the second construction situation of the protection structure in the embodiment of the present invention；
Fig. 5 A- Fig. 5 C are in Fig. 4 along the sectional view of section CC；
Fig. 6 is the explosive view that structure is protected in Fig. 3 A.
Specific implementation mode
Hereinafter, the present invention will be described in detail with reference to various embodiments shown in the accompanying drawings.But these embodiments are not
The limitation present invention, structure that those skilled in the art are made according to these embodiments, method or change functionally
It changes and is included within the scope of protection of the present invention.
The term of the representation space relative position used herein such as "upper", " top ", "lower", " lower section " is for just
A unit as shown in the drawings or feature are described relative to another unit or the relationship of feature in the purpose of explanation.It is empty
Between the term of relative position can be intended to include different direction of the equipment in use or work other than orientation as shown in the figure.
For example, if the equipment in figure overturn, the unit for being described as being located at other units or feature " below " or " under " will
Positioned at other units or feature " top ".Therefore, exemplary term " lower section " can include above and below both orientation.If
It is standby to be otherwise directed (be rotated by 90 ° or other directions), and be interpreted accordingly used herein with space correlation
Description.
It should be understood that although term first, second etc. can be used to describe herein various elements or structure,
But these are described object and should not be limited by these terms.These terms are only used to these description objects are distinguished from each other
It opens.For example, first surface can be referred to as second surface, and similarly second surface can also be referred to as first surface, this
Without departing from the protection domain of the application.
The embodiment of the present invention one provides a kind of protection structure for the copper foil layer forming wiring board, as shown in Figure 1 and Figure 4,
The protection structure includes：Protective layer 1 and sealing structure 4, the protective layer 1 is for carrying the copper foil layer 2, and the sealing
Structure 4 at least covers the part-skirt of the protective layer 1 and/or the copper foil layer 2.Here, protective layer 1 and copper foil layer 2 are all
One planar structure, therefore, the outer edge of their surroundings belongs to lateral margin, for example, if protective layer 1 and copper foil layer 2 are rectangle,
The four edges of the rectangle belong to lateral margin；If protective layer 1 and copper foil layer 2 are circle, which belongs to lateral margin.?
In production, for the ease of being positioned to wiring board, usually all offered in protective layer 1 and copper foil layer 2 several corresponding
(in this application, which includes the first positioning hole 31 being opened in protective layer 1 and is opened in copper foil layer 1 location hole 3
In second location hole 32), then the inner side edge of the location hole 3 also belongs to lateral margin (i.e. the inner side edge of the first, second location hole also belongs to
In lateral margin).
Here, in Fig. 1 and Fig. 4, sealing structure 4 seals the outer edge of protective layer 1 and copper foil layer 2, and by
The inner side edge of a positioning hole 31 and second location hole 32 also encloses, therefore, gap between protective layer 1 and copper foil layer 2 just at
For a confined space.In practice, sealing structure 4 can also be sealed the outer edge part of protective layer 1 and copper foil layer 2,
And/or the inside sidewall portion of first positioning hole 31 and second location hole 32 is closed, i.e. sky between protective layer 1 and copper foil layer 2
Gap just becomes a part confined space, i.e. the gap is connected to exterior space.
As shown in Figure 2 A, in location hole 3, sealing structure 4 covers the part-skirt of the copper foil layer 2；As shown in Figure 2 B,
In location hole 3, the sealing structure 4 covers the part-skirt of the copper foil layer 2 and protective layer 1；As shown in Figure 2 C, it is positioning
In hole 3, the sealing structure 4 covers the part-skirt of the protective layer 1；As shown in Figure 2 D, in location hole 3, the sealing
Structure 4 covers the part-skirt of the protective layer 1；As shown in Figure 2 E, in location hole 3, the sealing structure 4 covers the copper
The part-skirt of layers of foil 2 and protective layer 1；As shown in Figure 2 F, in location hole 3, sealing structure 4 covers the portion of the copper foil layer 2
Divide lateral margin.
As shown in Figure 3A, in the outer edge of copper foil layer 2, sealing structure 4 covers the part-skirt of the copper foil layer 2；Such as
Shown in Fig. 3 B, in the outer edge of protective layer 1 and copper foil layer 2, the sealing structure 4 covers the copper foil layer 2 and protective layer 1
Part-skirt；As shown in Figure 3 C, in the outer edge of protective layer 1 and copper foil layer 2, the sealing structure 4 covers the protective layer 1
Part-skirt；As shown in Figure 5A, in the outer edge of protective layer 1 and copper foil layer 2, the sealing structure 4 covers the protection
The part-skirt of layer 1；As shown in Figure 5 B, in the outer edge of protective layer 1 and copper foil layer 2, the sealing structure 4 covers the copper
The part-skirt of layers of foil 2 and protective layer 1；As shown in Figure 5 C, in the outer edge of copper foil layer 2, sealing structure 4 covers the copper foil
The part-skirt of layer 2.
In practice, copper foil layer 2 and protective layer 1 can have several situation：
(1) as shown in Figure 1, Figure 2 shown in D- Fig. 2 F and Fig. 3 A- Fig. 3 C, the size of protective layer 1 is more than the size of copper foil layer 2, protection
31 size of first positioning hole in layer 1 is more than the size of the second location hole 31 in copper foil layer 2；(2) as shown in Figure 1, Figure 2 A- Fig. 2 C and
Shown in Fig. 3 A- Fig. 3 C, the size of protective layer 1 is more than the size of copper foil layer 2, and 31 size of first positioning hole in protective layer 1 is less than
32 size of second location hole in copper foil layer 2；(3) as shown in Fig. 1 and Fig. 3 A- Fig. 3 C, the size of protective layer 1 is more than copper foil layer 2
Size, the size of the first positioning hole 31 of protective layer 1 is equal to 32 size of second location hole (not shown) of copper foil layer 2, positioning
It does not close in hole 3；(4) as shown in Fig. 4, Fig. 2 D- Fig. 2 F and Fig. 5 A- Fig. 5 C, the size of protective layer 1 is less than the size of copper foil layer 2, protects
The size of first positioning hole 31 in sheath 1 is more than the size of the second location hole 32 in copper foil layer 2；(5) such as Fig. 4, Fig. 2A-figure
Shown in 2C and Fig. 5 A- Fig. 5 C, the size of protective layer 1 is less than the size of copper foil layer 2, the ruler of the first positioning hole 31 in protective layer 1
The very little size less than the second location hole 32 in copper foil layer 2；(6) as shown in Fig. 4 and Fig. 5 A- Fig. 5 C, the size of protective layer 1 is less than
The size of copper foil layer 2, the size of the first positioning hole 31 in protective layer 1 are equal to the size of the second location hole 32 in copper foil layer 2
(not shown), location hole 3 are not closed.
Preferably, the sealing structure 4, the protective layer 1 and the copper foil layer 2 form a confined space.In protective layer 1
There is gap between copper foil layer 2, due to the presence of sealing structure 4, which forms a confined space, therefore, can be with
The effectively surface (i.e. copper foil layer 2 towards the surface of protective layer 1) of isolation foreign matter and foreign substance pollution copper foil layer 2, meanwhile, it protects
Layer 1 can play cushioning effect, and pit caused by surface, stringent so as to produce appearance requirement when avoiding circuit board pressing
Product, so as to greatly reduce cost of labor or product rejection rate.
Preferably, the protective layer 1 has at least first positioning hole 31 through the protective layer 1, the copper foil layer 2
With at least second location hole 32 through the copper foil layer 2, first positioning hole 31 is corresponding with the second location hole 32 to be set
It sets, and the sealing structure 4 is located in first positioning hole 31 and/or second location hole 32.Here, first positioning hole 31 and second
Location hole 32 is to be correspondingly arranged, to which the first, second location hole just constitutes the location hole 3 through copper foil layer 2 and protective layer 1, into
And in production, wiring board can be positioned based on the location hole 3；It is understood that because the location hole 3 is through
Protective layer 1 and copper foil layer 2, it needs in the location hole 3 (i.e. the setting in first positioning hole 31 and/or second location hole 32)
It is also equipped with sealing structure 4, just can guarantee the leakproofness of the sealing space.As shown in Figure 2 A, it is fixed to be set to second for sealing structure 4
In the hole 32 of position；As shown in Figure 2 B, sealing structure 4 is set in first positioning hole 31 and second location hole 32；As shown in Figure 2 C, close
Seal structure 4 is set in first positioning hole 31；As shown in Figure 2 D, sealing structure 4 is set in first positioning hole 31；Such as Fig. 2 E institutes
Show, sealing structure 4 is set in first positioning hole 31 and second location hole 32；As shown in Figure 2 F, sealing structure 4 is set to second
In location hole 32.
Preferably, the opening bore of second location hole 32 is more than the opening bore of first positioning hole 31.Here, such as Fig. 2A-
Shown in Fig. 2 C, since the first, second location hole is corresponding setting, and the opening bore of second location hole 32 is more than first
Location hole 31, to which copper foil layer 2 is all sealed in by sealing structure 4 in the sealing space towards the surface of protective layer 1, so as to
The surface of effective isolation foreign matter and foreign substance pollution copper foil layer 2.
Preferably, as shown in Figure 2 A and 2 B, the protective layer 1 has the first surface 11 towards copper foil layer 2, the copper
There is layers of foil 2 second surface 22 away from protective layer 1, the sealing structure 4 to extend to described first by the second surface 22
Surface 11.Here, the first positioning hole 31 in protective layer 1 has second location hole corresponding with its position in copper foil layer 2
32, and the opening bore of first positioning hole 31 is less than the opening bore of second location hole 32, it is to be understood that second location hole
The location of 32 edge corresponds to the first surface 11 of protective layer 1 namely second location hole 32 is completely covered in protective layer 1
Corresponding first positioning hole 31 can be covered simultaneously to which, sealing structure 4 is when covering the edge of second location hole 32
Lid first surface 11 and second surface 22.
Preferably, as shown in Fig. 2A, Fig. 2 B, Fig. 3 A and 3B, the outer edge of the copper foil layer 2 is respectively positioned on the protective layer 1
Outer peripheral inside；The first surface 11 is close to the outer peripheral part of the copper foil layer 2 and the second surface 22
It is covered by the sealing structure 4 close to the outer peripheral part of the copper foil layer 2；The first surface 11 corresponds to the second positioning
The part in hole 32 and the second surface 22 are covered by the sealing structure 4 close to the part of second location hole 32.This
In, the outer edge of copper foil layer 2 is respectively positioned on the outer peripheral inside of protective layer 1, i.e. the location of outer edge of copper foil layer 2 is corresponding
The first table can be covered simultaneously to which sealing structure 4 is when covering the outer edge of copper foil layer 2 to the first surface 11 of protective layer 1
Face 11 and second surface 22.It is understood that if the first surface 11 and second surface 22 of the outer edge of copper foil layer 2 all
It is sealed by sealing structure 4, and first surface 11 at the inner side edge of location hole 3 and second surface 22 are all close by sealing structure 4
Envelope, then the gap between copper foil layer 2 and protective layer 1 can become confined space.
Preferably, stage portion is formed between the copper foil layer 2 and the protective layer 1, the sealing structure 4 is located at described
Stage portion.Here, as shown in Fig. 2A-Fig. 2 C and Fig. 3 A- Fig. 3 C, in actual production, it is only necessary to be arranged along the stage portion close
Seal structure 4, so that it may to obtain the sealing space.Such as, it is only necessary to along one layer of glue of stage portion brush or one layer tape is pasted,
Sealing structure 4 can be obtained, this is highly convenient for producing.
Preferably, in the copper foil layer 2, correspond to the outer edge of the copper foil layer 2 and correspond to second location hole
32 inner side edge is covered by the sealing structure 4.Here, if the edge corresponding with protective layer 1 of copper foil layer 2 is all sealed
Structure 4 seals, and the edge in copper foil layer 2 and protective layer 1 of location hole 3 is all sealed by sealing structure 4, then can be managed
Solution, this can greatly improve the leakproofness of the sealing space.In figure 6, end face 21 can be the outside of copper foil layer 2
Edge, it is to be understood that the end face 21 it can be appreciated that second location hole 32 inner side edge.
Optionally, as shown in fig. 6, having towards the third surface 23 of first surface 11 on the copper foil layer 2；Third surface
The outer edge close to the copper foil layer 2 in the outer peripheral part of the copper foil layer 2 and third surface 23 in 23
Part do not covered by the sealing structure 4.In actual production, for various reasons, the outer edge meeting of copper foil layer 2
Some is cut away, and if third surface 23 is covered close to the outer peripheral part by sealing structure 4 (for example, glue etc.)
Lid, the part need to cut away, and in the present invention, since the part is not sealed with structure 4 (for example, glue etc.) covering,
Therefore, the area for the part for needing to be cut away can be significantly reduced.
Preferably, the sealing structure 4 is glue or adhesive tape.
Optionally, the location hole 3 is rectangle or circle, i.e. the shape of the first, second location hole is all rectangle or circle；
In practice, the shape of location hole 3 can be configured according to actual needs, in principle, it is possible to be variously-shaped.
Optionally, the thickness of the copper foil layer 2 is 6-105 microns.
Preferably, the protective layer 1 is aluminium layer.
Preferably, the protective layer is made of heat proof material.In general, heat proof material typically refers to be resistant to 200 DEG C or more temperature
The material of degree.
Preferably, the coefficient of thermal expansion of the protective layer 1 is more than or equal to the coefficient of thermal expansion of copper foil layer 2.
Second embodiment of the present invention provides a kind of forming methods of wiring board, include the following steps：
Step 1：One protective layer 1 is provided；
Step 2：In a copper foil layer 2 is arranged on the protective layer 1；
Step 3：Sealing structure 4 is formed, it is closed that the sealing structure 4, the protective layer 1 and the copper foil layer 2 form one
Space, and the sealing structure 4 at least covers the part-skirt of the protective layer 1 and/or the copper foil layer 2.
Preferably, step " in a copper foil layer 2 is arranged on the protective layer 1 ", specifically includes：Copper foil layer 2 is placed in protection
On layer 1, several predeterminated positions in the copper foil layer 2 open up second location hole 32, described several in the protective layer 1
Predeterminated position opens up first positioning hole 31, wherein the opening bore of second location hole 32 is more than first positioning hole 31.
Preferably, step " copper foil layer 2 is placed on protective layer 1 ", specifically includes：Copper foil layer 2 is placed on protective layer 1,
And 2 outer edge of the copper foil layer is respectively positioned on the outer peripheral inside of protective layer 1；
Step " forms sealing structure 4 ", specifically includes：First can be covered along the outer edge coating of the copper foil layer 2
The glue or adhesive tape on surface 11 and second surface 22 can cover first surface 11 along the inner side edge coating of second location hole 32
With the glue or adhesive tape of second surface 22, wherein first surface 11 is in the protective layer 1 towards the surface of copper foil layer 2, second
Surface 22 is in the copper foil layer 2 away from the surface of protective layer 1.
Preferably, the forming method further includes step：Step 4：In the copper foil layer 2 far from the protective layer 1 one
Side at least forms a separation layer；Step 5：Bond the separation layer, the copper foil layer 2 and the protective layer 1.
Preferably, step 4 specifically includes：In side setting of the copper foil layer 2 far from the protective layer 1 by separation layer and
Several combination layers that the superposition of copper foil layer 2 is formed.
It should be appreciated that although this specification is described in terms of embodiments, but not each embodiment only includes one
A independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should will say
As a whole, the technical solution in each embodiment may also be suitably combined to form those skilled in the art can for bright book
With the other embodiment of understanding.
The series of detailed descriptions listed above only for the present invention feasible embodiment specifically
Bright, they are all without departing from equivalent implementations made by technical spirit of the present invention not to limit the scope of the invention
Or change should all be included in the protection scope of the present invention.
Claims (17)
1. a kind of protection structure for the copper foil layer forming wiring board, which is characterized in that the protection structure includes：
Protective layer and sealing structure, it is described protective layer used in carrying the copper foil layer, and described in the sealing structure at least covers
The part-skirt of protective layer and/or the copper foil layer.
2. protection structure according to claim 1, it is characterised in that：
The sealing structure, the protective layer and the copper foil layer form a confined space.
3. protection structure according to claim 1, it is characterised in that：
The protective layer has at least first positioning hole through the protective layer, and the copper foil layer, which has, runs through the copper foil
An at least second location hole for layer, first positioning hole is correspondingly arranged with the second location hole, and the sealing structure is positioned at the
In a positioning hole and/or second location hole.
4. protection structure according to claim 2, it is characterised in that：
The opening bore of second location hole is more than the opening bore of first positioning hole.
5. protection structure according to claim 4, it is characterised in that：
There is the protective layer first surface towards copper foil layer, the copper foil layer to have the second surface away from protective layer, institute
It states sealing structure and the first surface is extended to by the second surface.
6. protection structure according to claim 5, it is characterised in that：
The outer edge of the copper foil layer is respectively positioned on the outer peripheral inside of the protective layer；The first surface is close to the copper foil
Layer outer peripheral part and the second surface close to the outer peripheral part of the copper foil layer by the sealing structure
Covering；The first surface correspond to second location hole part and the second surface it is equal close to the part of second location hole
It is covered by the sealing structure.
7. protection structure according to claim 1, it is characterised in that：
Stage portion is formed between the copper foil layer and the protective layer, the sealing structure is located at the stage portion.
8. protection structure according to claim 2, it is characterised in that：
In the copper foil layer, correspond to the outer edge of the copper foil layer and the inner side edge quilt corresponding to second location hole
The sealing structure covering.
9. protection structure according to claim 1, it is characterised in that：The sealing structure is glue or adhesive tape.
10. protection structure according to claim 1, it is characterised in that：The protective layer is aluminium layer.
11. protection structure according to claim 1, which is characterized in that the protective layer is made of heat proof material.
12. protection structure according to claim 1, it is characterised in that：The coefficient of thermal expansion of the protective layer is more than or equal to
The coefficient of thermal expansion of copper foil layer.
13. a kind of forming method of wiring board, which is characterized in that include the following steps：
One protective layer is provided；
In a copper foil layer is arranged on the protective layer；
Sealing structure is formed, the sealing structure, the protective layer and the copper foil layer form a confined space, and the sealing
Structure at least covers the part-skirt of the protective layer and/or the copper foil layer.
14. the forming method of wiring board according to claim 13, which is characterized in that
Step " in a copper foil layer is arranged on the protective layer ", specifically includes：Copper foil is placed on protective layer, in the copper foil
Several predeterminated positions in layer open up second location hole, and several predeterminated positions in the protective layer open up the first positioning
Hole, wherein the opening bore of second location hole is more than the opening bore of first positioning hole.
15. the forming method of wiring board according to claim 14, which is characterized in that
Copper foil " is placed on protective layer " by step, is specifically included：Copper foil is placed on protective layer, and outside the copper foil layer
Edge is respectively positioned on the outer peripheral inside of protective layer；
Step " forms sealing structure ", specifically includes：Along the copper foil layer outer edge coating can cover first surface and
The glue or adhesive tape of second surface can cover the glue of first surface and second surface along the inner side edge coating of second location hole
Water or adhesive tape, wherein first surface is towards the surface of copper foil layer in the protective layer, and second surface is in the copper foil layer
Away from the surface of protective layer.
16. the forming method of wiring board according to claim 13, which is characterized in that the forming method further includes step
Suddenly：
A separation layer is at least formed in side of the copper foil layer far from the protective layer；
Bond the separation layer, the copper foil layer and the protective layer.
17. the forming method of wiring board according to claim 16, which is characterized in that step is " separate in the copper foil layer
The side of the protective layer at least forms a separation layer " it specifically includes：
Several combination layers formed are superimposed by separation layer and copper foil layer in side setting of the copper foil layer far from the protective layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811023645.1A CN108811310A (en) | 2018-09-04 | 2018-09-04 | Form the forming method of the protection structure and wiring board of the copper foil layer of wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811023645.1A CN108811310A (en) | 2018-09-04 | 2018-09-04 | Form the forming method of the protection structure and wiring board of the copper foil layer of wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108811310A true CN108811310A (en) | 2018-11-13 |
Family
ID=64081957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811023645.1A Withdrawn CN108811310A (en) | 2018-09-04 | 2018-09-04 | Form the forming method of the protection structure and wiring board of the copper foil layer of wiring board |
Country Status (1)
| Country | Link |
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| CN (1) | CN108811310A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116828737A (en) * | 2023-08-30 | 2023-09-29 | 圆周率半导体(南通)有限公司 | PCB processing method capable of reducing press fit sagging |
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| US20080073025A1 (en) * | 2006-09-21 | 2008-03-27 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing copper-clad laminate for VOP application |
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| CN106658952A (en) * | 2017-03-01 | 2017-05-10 | 苏州思诺林电子有限公司 | Copper foil surface protection structure of circuit board |
| CN106715118A (en) * | 2014-10-30 | 2017-05-24 | 三井金属矿业株式会社 | Copper foil with carrier and method of manufacturing printed wiring board by using same |
| CN207201076U (en) * | 2017-09-30 | 2018-04-06 | 惠州世一软式线路板有限公司 | Anti-fracture fpc golden finger structures |
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| US20080073025A1 (en) * | 2006-09-21 | 2008-03-27 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing copper-clad laminate for VOP application |
| CN106715118A (en) * | 2014-10-30 | 2017-05-24 | 三井金属矿业株式会社 | Copper foil with carrier and method of manufacturing printed wiring board by using same |
| CN105228371A (en) * | 2015-08-31 | 2016-01-06 | 珠海方正科技多层电路板有限公司 | A kind of method making ladder golden finger circuit board |
| CN106658952A (en) * | 2017-03-01 | 2017-05-10 | 苏州思诺林电子有限公司 | Copper foil surface protection structure of circuit board |
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| CN116828737A (en) * | 2023-08-30 | 2023-09-29 | 圆周率半导体(南通)有限公司 | PCB processing method capable of reducing press fit sagging |
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