CN108808618A - The manufacturing method and e-machine of e-machine - Google Patents

Abstract

The present invention provides an electronic device capable of reducing manufacturing costs and expanding the selection range of materials for resin parts. An electronic device includes a case, a cable pulled out of the case, a resin-made joint spacer member mounted on the cable, a cylindrical jig for holding the cable, and a sealing resin that fills the internal space defined by the case and the jig department. The cable has a core wire and a resin sheath covering the core wire, and the core wire is exposed without being covered by the sheath at an end portion of the cable. The joining spacer has a cylindrical base that covers the outer peripheral surface of the sheath, and an extension that extends from the base and is joined to the resin sealing part. The splice spacer is secured to the cable by welding the base to the sheath.

Description

Electronic device manufacturing method and electronic device

technical field

The present invention relates to a method for manufacturing an electronic device and the electronic device, and more particularly, to a method for manufacturing an electronic device in which the space inside a case is sealed with resin, and a cable is pulled out from the inside of the case, and the electronic device. .

Background technique

In a specific electronic device, in order to ensure the environment resistance, the space inside the case housing the electronic components is sealed with resin. In this case, how to pull out a power supply cable for supplying electric power, a signal cable for connecting to an external terminal, and the like from the inside of the housing while ensuring environmental resistance becomes a problem.

Generally, cables such as the power supply cable and signal cable are held by elastically deformable clips fitted in openings provided in the case, thereby relieving stress applied to the cables. However, in a configuration in which the cable is held only by clips, the bonding force between the cable and the sealing resin portion sealing the inner space of the housing cannot be secured sufficiently, and peeling occurs at the connection portion, resulting in poor environmental resistance.

Therefore, various methods of improving the bonding force between the cable and the sealing resin portion are being studied, for example, in Japanese Patent Laid-Open No. 2015-177042 (Patent Document 1) or Japanese Patent Laid-Open No. 2009-43429 (Patent Document 1). 2) discloses a method of increasing the joining force between the cable and the sealing resin part included in the proximity sensor for detecting the presence or absence or the position of a metal object using a magnetic field.

In the proximity sensor disclosed in Patent Document 1, a polybutylene terephthalate (Polybutylene terephthalate) cable is formed by insert molding to cover the end of a cable containing polyvinylchloride (PVC) resin. , PBT) resin ring cord (ring cord), and the sealing resin portion is formed in a state where the ring cord is pressed into the jig, whereby the bonding force between the cable and the sealing resin portion is ensured by the ring cord.

In addition, in the proximity sensor disclosed in Patent Document 2, a two-color molded member including polyurethane (Polyurethane, PUR) resin and PBT resin is formed by insert molding so as to cover the end of the cable. The front end of the two-color molding member is provided with an inverted truncated cone-shaped protrusion, and the sealing resin part is formed in a state where the two-color molding member is pressed into the jig, thereby securing the connection between the cable and the cable by the two-color molding member. Bonding force between sealing resin parts.

[Prior art literature]

[Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2015-177042

[Patent Document 2] Japanese Patent Laid-Open No. 2009-43429

Contents of the invention

[Problem to be Solved by the Invention]

However, even in the case of adopting the configurations disclosed in Patent Document 1 and Patent Document 2, the loop wire or the two-color molding member must be formed at the end of the cable by insert molding, so it is necessary to prepare corresponding Various specifications of the mold, or various changes to the molding conditions. Therefore, in recent years, there has been a demand to suppress the manufacturing cost required for insert molding as much as possible.

In addition, even when the configurations disclosed in Patent Document 1 and Patent Document 2 are adopted, sufficient environmental resistance cannot be said to be secured even in a relatively severe environment. For example, in an environment where the temperature changes drastically over time and a large amount of oil such as cutting oil is used, even with the above-mentioned configuration, there is a possibility of damage such as peeling at the connection portion between the case and the cable.

In order to solve this problem, it is conceivable to use a material excellent in oil resistance as the loop wire or the two-color molded member, but generally, such a material is not suitable for insert molding in many cases.

Therefore, the present invention is made to solve the above-mentioned problems, and its object is to provide an electronic device that can reduce manufacturing costs and expand the selection range of materials for various resin parts for improving environmental resistance. Manufacturing method and electronic device.

[Technical means to solve the problem]

According to the manufacturing method of the electronic equipment of the present invention, the following electronic equipment is produced, and the electronic equipment includes: a casing provided with an opening; electronic parts accommodated in the casing; and a cable inserted through the opening, One end is electrically connected to the electronic component, and the other end is pulled out; a resin joint spacer member is mounted on the cable; a cylindrical clamp is fitted in the opening and fitted The joining spacer holds the cable; and the sealing resin part fills an internal space defined by the housing and the clamp. The method of manufacturing an electronic device according to the present invention includes the steps of manufacturing the joining spacer member so as to have a cylindrical base and an extension extending from the base; to cover the base with the base. The outer peripheral surface of the sheath, and the extending portion is extended from the base portion toward the one end side of the cable, and the joint spacer member is mounted on a portion of the one end side of the cable. the step of welding the base to the sheath, thereby fixing the joint spacer member on the cable; The method is a step of filling the internal space defined by the case and the jig with the sealing resin part.

In this way, by welding the joint spacer member to the sheath, the joint spacer member can be easily fixed to the cable, so the manufacturing cost can be reduced, and the materials of various resin parts for improving the environmental resistance can be expanded. Selected range.

In the method of manufacturing an electronic device according to the present invention, it is preferable that a portion of the base portion welded to the sheath has a thickness before welding of not less than 0.3 mm and not more than 0.5 mm.

In this way, by setting the thickness before welding of the part welded to the sheath in the base part of the joining spacer member to be 0.3 mm or more and 0.5 mm or less, welding can be reliably performed on this part, and it is possible to ensure that the part is welded. of tightness.

In the method of manufacturing an electronic device according to the present invention, it is preferable that the sealing resin portion includes any one of epoxy resin and polyurethane resin, and the joint spacer member includes polybutylene terephthalate. any one of ester resin, polyurethane resin, nylon-based resin, and fluorine-based resin, and the sheath includes any one of polyvinyl chloride resin, polyurethane resin, and fluorine-based resin.

Thus, in the method of manufacturing an electronic device according to the present invention, as the sealing resin portion, the joining spacer member, and the sheath, those containing various resins can be used.

An electronic device according to the present invention includes: a casing provided with an opening; an electronic component accommodated in the casing; a cable inserted through the opening, one end electrically connected to the electronic component, and the other end electrically connected to the electronic component. pulling out toward the outside; a resin-made joint spacer member mounted on the cable; a cylindrical clamp fitted into the opening and fitted into the joint spacer member, thereby holding the cable and a sealing resin portion filling an internal space defined by the housing and the jig. The cable has a core wire including a conductive wire, and a resin sheath covering the core wire, and the core wire is exposed without being covered by the sheath at a portion on the one end side of the cable. . The joint spacer member has a cylindrical base that covers the outer peripheral surface of the sheath, and an extension that extends from the base toward the one end side of the cable and is joined to the resin sealing portion. In the electronic device according to the present invention, the joint spacer member is fixed to the cable by welding the base to the sheath.

In this way, by welding the joint spacer member to the sheath, the joint spacer member can be easily fixed to the cable, so the manufacturing cost can be reduced, and the materials of various resin parts for improving the environmental resistance can be expanded. Selected range.

In the electronic device according to the present invention, it is preferable that the sealing resin portion includes any one of epoxy resin and polyurethane resin, and the joint spacer member includes polybutylene terephthalate resin, Any one of polyurethane resin, nylon-based resin, and fluorine-based resin, and the sheath includes any one of polyvinyl chloride resin, polyurethane resin, and fluorine-based resin.

Thus, in the electronic device according to the present invention, as the sealing resin portion, the joining spacer member, and the sheath, those containing various resins can be used.

[Effect of the invention]

According to the present invention, it is possible to provide a method of manufacturing an electronic device and an electronic device capable of reducing manufacturing costs and expanding the range of selection of materials for various resin parts for improving environmental resistance.

Description of drawings

FIG. 1 is a perspective view of a proximity sensor in Embodiment 1 of the present invention.

FIG. 2 is a sectional view along line II-II shown in FIG. 1 .

FIG. 3 is an enlarged cross-sectional view of a region III shown in FIG. 2 .

Fig. 4 is a schematic perspective view of the cable shown in Fig. 1 and the joint spacer member fixed thereto.

FIG. 5 is a flowchart illustrating a method of manufacturing the proximity sensor in Embodiment 1 of the present invention.

6(A) to 6(E) are assembly diagrams for explaining the method of manufacturing the proximity sensor in Embodiment 1 of the present invention.

7(A) and 7(B) are schematic cross-sectional views for explaining the reason why a high bonding force can be ensured at the connecting portion between the housing and the cable in the proximity sensor according to Embodiment 1 of the present invention, and a fixed Front view of the cables joined to the spacer.

FIG. 8 is an enlarged cross-sectional view of a region VIII shown in FIGS. 7(A) and 7(B).

9 is an enlarged cross-sectional view of a main part of a proximity sensor according to a first modification.

10 is an enlarged sectional view of a main part of a proximity sensor according to a second modification.

11 is an enlarged cross-sectional view of main parts of a proximity sensor according to a third modification.

12 is an enlarged cross-sectional view of main parts of a proximity sensor according to a fourth modification.

13 is an enlarged cross-sectional view of main parts of a proximity sensor according to a fifth modified example.

FIG. 14 is a flowchart illustrating a method of manufacturing the proximity sensor in Embodiment 2 of the present invention.

15(A) and 15(B) are assembly diagrams for explaining the method of manufacturing the proximity sensor in Embodiment 2 of the present invention.

[explanation of the symbol]

1A～1F: proximity sensor

10: shell

20: Detection part assembly

21: core

21a: Support groove

22: Detection coil

23: Coil housing

24: Circuit board

24a: Connection plate

25a～25c: electronic parts

26: The first sealing resin department

30: cable

31: core wire

31a: Conductive thread

32: shielding material

33: sheath

40: Joining spacer members

41: base

41a: welding part

42, 44, 45: extension part

42a: front end

43: Groove

50: Fixture

51: fixed part

52: Keeping Department

53: Connecting part

53a: gate

53b: light guide part

60: 2nd sealing resin department

t1, t2: Thickness

A, B, C, D, E, F, G: Arrows

L: Axial length

W: width

ST11～ST17, ST21～ST28: steps

Detailed ways

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the embodiment shown below, the case where this invention is applied to a proximity sensor and its manufacturing method is illustrated and demonstrated. In addition, in embodiment shown below, the same code|symbol is attached|subjected to the same or common part in a figure, and the description is not repeated.

(Embodiment 1)

FIG. 1 is a perspective view of a proximity sensor according to Embodiment 1 of the present invention, and FIG. 2 is a cross-sectional view along line II-II shown in FIG. 1 . In addition, FIG. 3 is an enlarged cross-sectional view of the region III shown in FIG. 2, and FIG. 4 is a schematic perspective view of the cable shown in FIG. 1 and the joint spacer member fixed thereto. First, the configuration of the proximity sensor 1A in the present embodiment will be described with reference to the aforementioned FIGS. 1 to 4 .

As shown in FIGS. 1 and 2 , a proximity sensor 1A as an electronic device in this embodiment has a substantially cylindrical outer shape, and includes a housing 10 , a detection part assembly 20 including a first sealing resin part 26 , a cable 30 , The spacer member 40 , the jig 50 , and the second sealing resin portion 60 are joined.

The casing 10 includes a metal elongated cylindrical member with both ends opened, and has a front end and a rear end in the axial direction. The probe unit assembly 20 is assembled to the front end of the housing 10 , and the jig 50 is assembled to the rear end of the housing 10 .

As shown in FIG. 2 , the probe unit assembly 20 mainly includes a core 21 , a probe coil 22 , a coil case 23 , a circuit board 24 , and a first sealing resin part 26 .

The core 21 includes a short cylindrical member containing a magnetic material. The detection coil 22 is formed into a substantially cylindrical shape by, for example, winding a conductive wire, and is accommodated in an annular recess provided on the front end surface of the core 21 . Furthermore, a support groove 21 a for supporting the front end portion of the circuit board 24 is provided on the rear end surface of the core 21 .

The coil case 23 includes a bottomed cylindrical insulating member, and accommodates the core 21 and the search coil 22 therein. The front end surface of the core 21 abuts against the bottom of the coil case 23 . The coil case 23 is press-fitted and fixed in the case 10 so that the bottom thereof is positioned at the front end of the case 10 .

The circuit board 24 is disposed behind the core 21 so as to extend in the axial direction of the housing 10 . The circuit board 24 has conductive patterns formed on the front and back surfaces, and various electronic components 25a to 25c, etc. are mounted at predetermined positions on the front and back surfaces. The detection coil 22 is electrically connected to the circuit board 24 via pins attached to ends of the detection coil 22 .

Here, among various electronic components 25 a to 25 c mounted on the circuit board 24 , the electronic component 25 c mounted on the rear end portion of the circuit board 24 is a light emitting element that emits light when energized. The light emitting element emits light corresponding to the operating state of the proximity sensor 1A, and includes, for example, a light emitting diode (LED).

Various processing circuits are formed on the circuit board 24 . The processing circuit includes an oscillation circuit using the search coil 22 as a resonant circuit element, or a discrimination circuit (discrimination circuit) that performs binarization by comparing the oscillation amplitude of the oscillation circuit with a threshold value. In addition, the circuit board 24 is also provided with an output circuit for converting the output of the discrimination circuit into a voltage output or a current output of a predetermined specification, or a power supply circuit for converting and outputting electric power introduced from the outside into a predetermined power supply specification. In addition, a light-emitting element drive circuit that controls the driving of the electronic component 25 c as the light-emitting element is also provided on the circuit board 24 .

The various circuits include conductive patterns provided on the circuit board 24, the various electronic components 25a to 25c, and the detection coil 22 and the like.

The first sealing resin portion 26 seals the core 21 and the search coil 22 accommodated in the coil case 23 and the front end portion of the circuit board 24 . The first sealing resin portion 26 protects the core 21 , the search coil 22 , and the front end portion of the circuit board 24 , and seals them airtightly and liquidtightly from the outside.

The first sealing resin portion 26 is formed by injecting and curing liquid resin into the coil case 23 . In addition, as a material of this 1st sealing resin part 26, for example, epoxy resin, PUR resin, etc. can be utilized suitably.

At a predetermined position on the rear end portion of the circuit board 24, a land 24a to which a conductive wire 31a included in a core wire 31 of the cable 30 described later is connected is provided. For example, solder (not shown) can be used for the connection between the land 24a and the conductive line 31a.

The cable 30 includes a composite cable including a core wire 31 including a conductive wire 31 a , and a shielding material 32 and a sheath 33 covering the core wire 31 . The cable 30 is arranged so as to be inserted through an opening on the rear end side provided in the case 10, one end is electrically connected to the various circuits by being connected to the circuit board 24, and the other end is pulled outward. out. Furthermore, the sheath 33 is made of resin, and preferably contains any one of PVC resin, PUR resin, and fluorine-based resin.

Here, at the one end of the cable 30, the shielding material 32 and the sheath 33 are peeled off so that the core wire 31 is exposed, and the conductive wire 31a is also exposed at the part of the core wire 31 connected to the land 24a. The covering material of the core wire 31 is peeled off.

As shown in FIGS. 2 to 4 , the joint spacer member 40 is a member for ensuring the joint property between the cable 30 and the second sealing resin portion 60 , and is assembled in the sheath 33 located on the one end side of the cable 30 . on the end.

The joint spacer member 40 has a cylindrical base portion 41 and a cylindrical extension portion 42. The cylindrical base portion 41 covers all parts of the cable 30 in the internal space defined by the housing 10 and the clamp 50. The outer peripheral surface of the end portion of the sheath 33 on the one end side, the cylindrical extension portion 42 is longer than the end portion of the sheath 33 located on the one end side of the cable 30 toward the one end side of the cable 30 . The joint spacer member 40 is attached to the cable 30 so that at least a part of the joint spacer member 40 enters the inner space defined by the housing 10 and the clamp 50 . More specifically, the extension portion 42 is located further on the one end side of the cable 30 than the end portion of the sheath 33 on the one end side of the cable 30 , and protrudes so as to extend along the extending direction of the cable 30 . The cylindrical extension portion 42 includes a relatively thick portion on the base end side and a sufficiently thin portion on the front end side. In addition, the joint spacer member 40 is made of resin, and preferably contains any one of PBT resin, PUR resin, nylon-based resin, and fluorine-based resin.

Here, in this embodiment, when viewed along the extending direction of the cable 30 , the outer shape of the portion on the front end side of the extension portion 42 is smaller than the outer shape of the portion on the proximal side of the extension portion 42 and the outer shape of the base portion 41 . to constitute. With such a configuration, the configuration of the clip 50 described later can be simplified, and with this, the outer shape of the connection portion between the case 10 and the cable 30 can be reduced in size.

A welding portion 41 a is formed on the base portion 41 . The welding portion 41a is a portion formed by fixing the joint spacer member 40 to the cable 30 by welding. In this manner, by welding the base portion 41 to the sheath 33 , the junction spacer member 40 is immovably fixed to the cable 30 .

A groove portion 43 extending in the circumferential direction is provided at a predetermined position on the outer peripheral surface of the portion on the front end side of the extension portion 42 . The groove portion 43 is a concavo-convex portion provided to increase the joining force between the second sealing resin portion 60 and the joint spacer member 40 described later. By providing the groove portion 43 on the extension portion 42, a so-called The anchoring effect (anchoreeffect) can seek to enhance the bonding force. In addition, the so-called anchoring effect refers to the effect of increasing the joining force by providing unevenness on the joining surface, and the unevenness becomes wedges.

As shown in FIGS. 2 and 3 , the jig 50 has a substantially cylindrical shape, and the cable 30 is inserted therethrough. The clip 50 is fitted into an opening on the rear end side provided in the housing 10 , and the joint spacer member 40 is fitted to the rear end of the clip 50 to hold the cable 30 . The jig 50 includes a resin member to be elastically deformable, and is used to relax the stress applied to the cable 30 and the stress applied to the joining spacer member 40 .

More specifically, the jig 50 includes: a cylindrical fixing portion 51 positioned at the front end, a substantially cylindrical holding portion 52 positioned at the rear end, and an The connection part 53 which connects the fixed part 51 and the holding part 52.

The fixing portion 51 is a portion for fixing the clip 50 to the housing 10 by being press-fitted into an opening provided on the rear end side of the housing 10 . The holding portion 52 is a portion for holding the joint spacer member 40 by pressing the joint spacer member 40 inside. In addition, the connecting portion 53 is used to increase relaxation of the stress applied to the cable 30 and the stress applied to the joint spacer member 40 by securing a predetermined distance between the fixing portion 51 and the holding portion 52 . functional parts.

In addition, in order to fill the second sealing resin part 60 into the internal space defined by the case 10 and the jig 50, a liquid resin used to inject the second sealing resin part 60 is provided at a predetermined position of the connecting part 53. The gate (gate) 53a.

Furthermore, in the present embodiment, the jig 50 is made of a non-light-shielding resin material. This is because the light emitted from the electronic component 25c as the light emitting element is projected to the outside through the jig 50, and therefore, a light guide portion 53b of a predetermined shape is provided on a portion of the fixing portion 51 facing the light emitting element. .

The second sealing resin portion 60 fills the space in the internal space defined by the housing 10 and the jig 50 , except for the space sealed by the first sealing resin portion 26 . Thus, the portion of the circuit board 24 other than the front end portion, the various electronic components 25a to 25c mounted on this portion, and the core wire 31 of the portion not covered by the sheath 33 of the cable 30 are separated from each other. The second sealing resin portion 60 is sealed.

The second sealing resin portion 60 protects the portion of the circuit board 24 other than the front end portion, the various electronic components 25a to 25c mounted on this portion, and the portion not covered by the sheath 33 of the cable 30 . part of the core wire 31, and they are hermetically sealed and liquid-tightly sealed from the outside.

The second sealing resin portion 60 is formed by injecting a liquid resin through the gate 53 a of the jig 50 as described above and hardening it. In addition, as a material of this 2nd sealing resin part 60, for example, epoxy resin, PUR resin, etc. can be utilized suitably.

Here, as shown in FIG. 3 , the extension portion 42 of the joining spacer member 40 is joined to the second sealing resin portion 60 , and the inner peripheral surface and outer peripheral surface of the portion on the front end side of the extension portion 42 and its axial direction are aligned. The top end faces are all covered with the second sealing resin part 60 . Thus, in the proximity sensor 1A of the present embodiment, the bonding force between the cable 30 and the second sealing resin portion 60 is ensured to be higher than that of the conventional proximity sensor, but the detailed mechanism thereof will be described later. .

5 and FIG. 6(A) to FIG. 6(E) are respectively a flow chart and an assembly diagram for explaining the method of manufacturing the proximity sensor in this embodiment. Next, a method of manufacturing the proximity sensor in this embodiment will be described with reference to FIGS. 5 and 6(A) to 6(E) described above.

First, as shown in FIG. 5 , the joint spacer member 40 is fabricated (step ST11 ). More specifically, the joining spacer member 40 is formed to have a cylindrical base portion 41 and a cylindrical extension portion 42 extending from the base portion 41 . Various methods such as injection molding, for example, can be applied to fabricate the joint spacer member 40 .

Next, as shown in FIG. 5 and FIG. 6(A), the joint spacer member 40 is attached to the cable 30 (step ST12). In more detail, the base portion 41 of the joint spacer member 40 is press-fitted into the end portion of the sheath 33 of the cable 30 , whereby the joint spacer member 40 is mounted on the cable 30 . Thereby, the outer peripheral surface of the end portion of the sheath 33 is covered by the base portion 41 , and the extension portion 42 is in place extending from the base portion 41 .

Next, as shown in FIG. 5 and FIG. 6(B), the joint spacer member 40 is welded to the cable 30 (step ST13). In more detail, the base portion 41 of the portion pressed into the sheath 33 is heated from the outside, thereby performing thermal welding on this portion (ie, the portion indicated by arrow A in FIG. 6(B) ). In addition, welding by laser irradiation etc. can also be utilized other than the thermal welding which utilizes heat conduction.

Next, as shown in FIG. 5 and FIG. 6(C), the cable 30 is connected to the probe assembly 20 (step ST14). More specifically, the exposed conductive wires 31 a of the cable 30 are arranged so as to face the lands 24 a of the circuit board 24 , and they are soldered in this state.

Next, as shown in FIG. 5 and FIG. 6(D), the probe assembly 20 is assembled to the case 10 (step ST15). More specifically, the probe assembly 20 is press-fitted into the front end portion of the housing 10 , whereby the probe assembly 20 is assembled to the housing 10 .

Next, as shown in FIG. 5 and FIG. 6(E), the jig 50 is assembled to the case 10 and the joining spacer member 40 (step ST16). In more detail, the fixing portion 51 of the jig 50 is press-fitted into the opening on the rear end side of the housing 10, and the joining spacer member 40 is press-fitted into the rear end portion of the jig 50, thereby assembling the jig 50 On the housing 10 and the joining spacer member 40 .

Next, as shown in FIG. 5 , the liquid resin is injected into the case 10 and the jig 50 and hardened (step ST17 ). More specifically, the proximity sensor 1A having the above configuration is obtained by injecting liquid resin through the gate 53a of the jig 50 from the portion indicated by the arrow B in FIG. 6(E) and curing the liquid resin. .

Furthermore, the above exemplifies the case where the joint spacer member 40 is welded to the cable 30 after the joint spacer member 40 is mounted on the cable 30 and before the cable 30 is connected to the probe assembly 20, but The joint spacer member 40 may be welded to the cable 30 after the cable 30 is connected to the probe assembly 20 or after the probe assembly 20 is assembled to the housing 10 . That is, step ST13 may be carried out between step ST14 and step ST15, and may be carried out between step ST15 and step ST16.

Furthermore, the above exemplifies the case where the probe unit assembly 20 is assembled to the housing 10 after the cable 30 is connected to the probe unit assembly 20 and before the jig 50 is assembled to the housing 10 and the joining spacer member 40 . , but before connecting the cable 30 to the probe assembly 20 , the probe assembly 20 may be assembled to the housing 10 . That is, step ST15 may be performed before step ST14.

As described above, in the method of manufacturing the proximity sensor in this embodiment, the resin-made joint spacer 40 for increasing the joint force between the second sealing resin part 60 and the cable 30 is fixed by welding. In the cable 30 , manufacturing is thus facilitated, thereby reducing manufacturing costs and widening the selection range of materials for various resin parts for improving environmental resistance.

7(A) and 7(B) are schematic cross-sectional views for explaining the reason why a high bonding force can be ensured at the connecting portion between the housing and the cable in the proximity sensor according to this embodiment, and a bonding interposer fixed thereto. Front view of the cables of the spacer. In addition, FIG. 8 is an enlarged cross-sectional view of a region VIII shown in FIG. 7(A). Next, the reason why a high bonding force can be ensured in the proximity sensor 1A in this embodiment will be described with reference to FIGS. 7(A) , 7(B) and 8 . In addition, in FIG. 7(A), the structure of the jig 50 is simplified and drawn for easy understanding.

Referring to FIG. 7(A) and FIG. 7(B), as described above, in the proximity sensor 1A in this embodiment, on the joint spacer member 40 provided so as to cover the end portion of the sheath 33 of the cable 30 A substantially cylindrical extension portion 42 protruding from the end portion of the sheath 33 is provided with a sufficiently thin thickness, and the inner peripheral surface and the outer peripheral surface of the portion on the front end side of the extension portion 42 are , and the end surface on the front end side in the axial direction of the extending portion 42 are covered with the second sealing resin portion 60 .

With such a configuration, firstly, the residual stress generated when the second sealing resin portion 60 is hardened can be reduced. This is because the presence of the extension portion 42 reduces the amount of resin in the second sealing resin portion 60 at the end portion of the second sealing resin portion 60 on the joining spacer member 40 side.

Therefore, the residual stress is low, and accordingly, the joining force can be maintained high, and as a result, a high joining force can be ensured at the connection portion between the housing 10 and the cable 30 .

In addition, secondly, it is possible to ensure followability of the extension portion 42 during expansion and contraction of the second sealing resin portion 60 accompanying changes in ambient temperature. The reason for this is that the thickness of the portion on the front end side of the extension portion 42 is thin, and accordingly, the portion on the front end side of the extension portion 42 is allowed to follow and elastically deform when the second sealing resin portion 60 expands and contracts.

More specifically, when shrinkage occurs in the second sealing resin portion 60, as shown by arrow C in FIG. A large stress is applied, but at this time, in the arrow D direction shown in the figure, the part on the front end side of the extension part 42 follows and elastically deforms, so the stress applied to the end part is greatly relaxed, Generation of peeling at this interface can be suppressed.

Therefore, during the expansion and contraction of the second sealing resin portion 60, the stress applied to the interface between the joint spacer member 40 and the second sealing resin portion 60 is reduced, and accordingly, the bonding force can be maintained high. The connecting portion of the housing 10 and the cable 30 ensures high bonding force.

Since this is also related to the improvement in the room for selection of materials for the joint spacer member 40 and the second sealing resin part 60 by adopting this structure, various advantages in manufacturing can also be obtained by using the proximity sensor 1A in this embodiment. Constraints are mitigated.

In addition, as shown in FIG. 7(A) and FIG. 8 , in the proximity sensor 1A in this embodiment, as described above, on the outer peripheral surface of the portion on the front end side of the extension portion 42 is provided the groove portion 43 . With such a configuration, the so-called anchoring effect can be obtained as described above.

More specifically, as shown in FIG. 8 , when shrinkage occurs in the second sealing resin portion 60 due to a change in ambient temperature, near the outer peripheral surface of the second sealing resin portion 60 that is the contact surface with the jig 50 , Shrinkage occurs in the direction indicated by arrow E in the figure, and along with this, shear stress occurs in the direction indicated by arrow F in the figure at the interface between the joint spacer member 40 and the second sealing resin portion 60, However, the presence of the groove portion 43 on the outer peripheral surface of the extension portion 42 prevents the shear stress from reaching the front end portion 42a of the extension portion 42, and consequently prevents the peeling from occurring at the interface.

As described above, by using the proximity sensor 1A in this embodiment, a high bonding force can be ensured at the connection portion between the housing 10 and the cable 30, and the occurrence of damage such as peeling at this portion can be greatly suppressed, resulting in Proximity sensor with excellent environmental resistance.

Furthermore, referring to FIG. 8 , it is preferable that the thickness t1 at the thinnest portion of the cylindrical extension portion 42 is not less than 0.3 mm and not more than 0.5 mm. More specifically, it is preferable to include a portion having a thickness t1 of not less than 0.3 mm and not more than 0.5 mm in the circumferential direction of the cylindrical extension portion 42 . With such a configuration, the elasticity and rigidity of the extension portion 42 can be appropriately adjusted, and the followability can be more reliably obtained. However, the thickness of the extended portion 42 is not particularly limited thereto.

In addition, it is preferable to set the axial length L of the portion on the front end side where the extension portion 42 is thinner to 0.5 mm or more. By setting the length L in the axial direction to 0.5 mm or more, the elasticity and rigidity of the extension portion 42 can be appropriately adjusted, and the followability can be more reliably obtained. However, the axial length of the portion on the front end side where the extension portion 42 is thin is not particularly limited thereto.

Furthermore, it is preferable to set the width W of the groove part 43 to 0.5 mm or more. By setting the width W to 0.5 mm or more, the elasticity and rigidity of the extension portion 42 can be appropriately adjusted, and the followability can be more reliably obtained. However, the width of the groove portion 43 is not particularly limited thereto.

In addition, as described above, in the proximity sensor 1A in this embodiment, the case where the groove portion 43 extending in the circumferential direction is provided on the outer peripheral surface of the portion on the front end side of the extension portion 42 is exemplified. Concave-convex portions different from this shape are provided on either or both of the outer peripheral surface and the inner peripheral surface of the extension portion 42, and holes or various cutouts penetrating along the diameter direction of the extension portion 42 may also be provided. etc. are set on the extension part 42. Even with such a configuration, the so-called anchoring effect described above can be obtained.

In addition, as described above, in the proximity sensor 1A in this embodiment, the case where the extended portion 42 is substantially cylindrical is exemplified, but the extended portion 42 does not necessarily have to be cylindrical. When the part 42 is cylindrical, its outer shape does not need to be cylindrical, for example, its outer shape may be a polygonal cylindrical shape, or its outer shape may be an elliptical cylindrical shape.

In addition, as described above, in the proximity sensor 1A according to the present embodiment, it is preferable that the material of the second sealing resin portion 60 is selected from any one of epoxy resin and PUR resin, and that the material of the joining spacer member 40 is selected from PBT resin. , PUR resin, nylon-based resin, and fluorine-based resin, and the material of the sheath 33 is selected from any one of PVC resin, PUR resin, and fluorine-based resin.

In addition, when a fluorine-based resin is selected as the material of the joining spacer member 40 and a fluorine-based resin is also selected as the material of the sheath 33 , very high oil resistance can be ensured. Therefore, in a proximity sensor used in an environment where a large amount of oil such as cutting oil is used, it is preferable to utilize this combination of materials.

Here, fluorine-based resin is a material that is not suitable for insert molding. If the material of the joint spacer member 40 is a fluorine-based resin, the joint spacer member 40 cannot be easily produced by insert molding. Therefore, in the method of manufacturing the proximity sensor in this embodiment, the joint spacer member 40 is produced as another part in advance, and then it is mounted on the cable 30 and fixed by welding, so the joint spacer member 40 can be relatively easily assembled. The spacer 40 becomes a joint spacer made of fluorine-based resin.

Here, welding can be easily performed when the difference in melting point between members to be joined is generally in the range of 50° C. or less. Therefore, when selecting the material, it is necessary to consider this point and select the material.

Furthermore, referring to Fig. 7(A) and Fig. 7(B), the thickness t2 of the welded portion 41a of the joint spacer member 40 formed by welding the joint spacer member 40 on the sheath 33 must take into account the thickness at this part. Sealing to set. Therefore, it is preferable that the thickness before welding of the part of the base part 41 which becomes the welding part 41a be 0.3 mm or more and 0.5 mm or less.

In addition, as mentioned above, in this embodiment, the case where the base portion 41 of the joint spacer member 40 is fixed to the end portion of the sheath 33 located on the one end side of the cable 30 has been exemplified and described, but this is not necessarily necessary. With such a configuration, it may also be fixed to the sheath 33 at a position away from the end portion of the sheath 33 . That is, the joint spacer member only needs to have a cylindrical base portion covering the outer peripheral surface of the sheath, and an extension portion extending from the base portion toward the one end side of the cable and joined to the resin sealing portion. The positional relationship between the end portion and the base portion, and the positional relationship between the end portion of the sheath and the extension portion can be changed in various ways.

(1st modified example)

FIG. 9 is an enlarged cross-sectional view of a main part of a proximity sensor according to a first modified example of the present embodiment. Hereinafter, a proximity sensor 1B according to a first modified example will be described with reference to this FIG. 9 .

As shown in FIG. 9 , when compared with the proximity sensor 1A in Embodiment 1, the proximity sensor 1B of the first modified example does not have the cylindrical extension 42 of the joining spacer member 40 , but is covered with The end surfaces of the sheath 33 and the shielding material 32 are provided with a cover-shaped extension 44 . Here, as in the case of the first embodiment, the joint spacer member 40 including the cover-shaped extension portion 44 is fixed to the cable 30 by welding.

When compared with the proximity sensor 1A in Embodiment 1, the proximity sensor 1B configured in this way reduces the residual stress generated when the second sealing resin part 60 is hardened, and the second sealing effect caused by the change of the ambient temperature. The extension part 44 is not good at the point of following the expansion and contraction of the resin part 60, but similarly to the case of the above-mentioned first embodiment, the manufacturing cost can be reduced by making the manufacturing easier, and the increase In terms of the degree of freedom of material selection, it becomes more advantageous than before.

(Second modified example)

10 is an enlarged cross-sectional view of a main part of a proximity sensor according to a second modified example of the present embodiment. Hereinafter, a proximity sensor 1C according to a second modified example will be described with reference to this FIG. 10 .

As shown in FIG. 10 , when compared with the proximity sensor 1A in the first embodiment, the proximity sensor 1C of the second modified example differs only in that the joining spacer member 40 has a base 41 and a barrel In addition to the extended portion 42 in the shape of a cap, it further has a cap-shaped extended portion 44 covering the end faces of the sheath 33 and the shielding material 32 . Here, as in the case of the first embodiment, the joint spacer member 40 including the cylindrical extending portion 42 and the cover-shaped extending portion 44 is fixed to the cable 30 by welding.

Similar to the case of the first embodiment, the proximity sensor 1C configured in this way reduces the residual stress generated when the second sealing resin portion 60 is hardened and the expansion of the second sealing resin portion 60 due to changes in ambient temperature. It is excellent in the followability of the extended portion 42 during shrinkage, and it is also more advantageous than before in terms of reducing the manufacturing cost and increasing the freedom of material selection by making the manufacturing easier. .

(3rd modified example)

11 is an enlarged cross-sectional view of a main part of a proximity sensor according to a third modified example of the present embodiment. Hereinafter, a proximity sensor 1D according to a third modified example will be described with reference to this FIG. 11 .

As shown in FIG. 11 , when compared with the proximity sensor 1A in the first embodiment, the proximity sensor 1D of the third modified example differs only in the following point: No groove portion 43 is provided on the outlet portion 42 . Here, as in the first embodiment, the joint spacer member 40 including the cylindrical extension portion 42 is fixed to the cable 30 by welding.

As in the first embodiment, the proximity sensor 1D configured in this way reduces the residual stress generated when the second sealing resin portion 60 is hardened and the expansion of the second sealing resin portion 60 due to changes in ambient temperature. It is excellent in the followability of the extended portion 42 during shrinkage, and it is also more advantageous than before in terms of reducing the manufacturing cost and increasing the freedom of material selection by making the manufacturing easier. .

(4th modified example)

12 is an enlarged cross-sectional view of main parts of a proximity sensor according to a fourth modification of the present embodiment. Hereinafter, a proximity sensor 1E according to a fourth modified example will be described with reference to this FIG. 12 .

As shown in FIG. 12 , when compared with the proximity sensor 1D of the third modified example, the proximity sensor 1E of the fourth modified example differs only in the following point: A welded portion 41a is provided on the rear end portion, and not all of the base portion 41 becomes the welded portion 41a. Here, as in the first embodiment, the joint spacer member 40 including the cylindrical extension portion 42 is fixed to the cable 30 by welding.

As in the case of the first embodiment, the proximity sensor 1E configured in this way reduces the residual stress generated when the second sealing resin portion 60 is hardened and the expansion of the second sealing resin portion 60 due to changes in ambient temperature. It is excellent in the followability of the extended portion 42 during shrinkage, and it is also more advantageous than before in terms of reducing the manufacturing cost and increasing the freedom of material selection by making the manufacturing easier. .

(fifth modified example)

13 is an enlarged cross-sectional view of main parts of a proximity sensor according to a fifth modification of the present embodiment. Hereinafter, a proximity sensor 1F according to a fifth modified example will be described with reference to this FIG. 13 .

As shown in FIG. 13 , when compared with the proximity sensor 1E of the fourth modification example, the proximity sensor 1F of the fifth modification example has a substantially The difference is that the outer shape of the same size is different, and accordingly, the inner diameter of the jig 50 corresponding to the cylindrical extension 42 is larger than the inner diameter of the jig 50 corresponding to the base 41 . .

As in the case of the first embodiment, the proximity sensor 1F configured in this way reduces the residual stress generated when the second sealing resin portion 60 is hardened and the expansion of the second sealing resin portion 60 due to changes in ambient temperature. It is excellent in the followability of the extended portion 42 during shrinkage, and it is also more advantageous than before in terms of reducing the manufacturing cost and increasing the freedom of material selection by making the manufacturing easier. .

(Embodiment 2)

14 and 15(A) and 15(B) are a flowchart and an assembly diagram for explaining a method of manufacturing the proximity sensor in Embodiment 2 of the present invention, respectively. Hereinafter, a method of manufacturing the proximity sensor in this embodiment will be described with reference to FIGS. 14 , 15(A) and 15(B).

Furthermore, as will be described later, the method of manufacturing the proximity sensor in this embodiment is slightly different from the method of manufacturing the proximity sensor 1A in the first embodiment, and accordingly, its shape is also slightly different. It is generally clear in the assembly diagrams of FIG. 15(A) and FIG. 15(B), so its illustration is omitted here.

First, as shown in FIG. 14 , make the joint spacer member 40 (step ST21), secondly, install the joint spacer member 40 on the cable 30 (step ST22), and then weld the joint spacer member 40 on the cable 30. (Step ST23 ), and then, connect the cable 30 to the probe assembly 20 (Step ST24 ), and then assemble the probe assembly 20 to the case 10 (Step ST25 ). Furthermore, the details of the steps ST21 to ST25 are the same as the steps ST11 to ST15 shown in FIG. 5 respectively, so the description thereof will not be repeated here.

Next, as shown in FIG. 14 and FIG. 15(A), the jig 50 is assembled to the case 10 (step ST26). More specifically, the fixing portion 51 of the jig 50 is press-fitted into the opening on the rear end side of the case 10 .

Next, as shown in FIG. 14 and FIG. 15(B), the joining spacer member 40 is assembled to the jig 50 (step ST27). In more detail, the base portion 41 of the joint spacer member 40 is press-fitted into the rear end portion of the jig 50 , thereby assembling the jig 50 on the joint spacer member 40 .

Next, as shown in FIG. 14 , the liquid resin is injected into the case 10 and the jig 50 and hardened (step ST28 ). In addition, the details of this step ST28 are the same as those of the step ST17 shown in FIG. 5 , so the description thereof will not be repeated here. In the above manner, the proximity sensor in this embodiment can be obtained based on the configuration of the proximity sensor 1A in the first embodiment.

Furthermore, the above exemplifies the case where the joint spacer member 40 is welded to the cable 30 after the joint spacer member 40 is mounted on the cable 30 and before the cable 30 is connected to the probe assembly 20, but The joint spacer member 40 may be welded to the cable 30 at any time from connecting the cable 30 to the probe assembly 20 to completing the proximity sensor. That is, as long as it is after step ST24, step ST23 may be implemented after any one of step ST24 to step ST28.

Furthermore, the above exemplifies the case where the probe unit assembly 20 is assembled to the housing 10 after the cable 30 is connected to the probe unit assembly 20 and before the jig 50 is assembled to the housing 10 , but it is also possible to attach the probe unit assembly 20 to the housing 10 Before the cable 30 is connected to the probe assembly 20 , the probe assembly 20 is assembled to the case 10 . That is, step ST25 may be performed before step ST24.

Even in the case of the proximity sensor in the present embodiment described above, similar to the case of the first embodiment, the reduction of the residual stress generated when the second sealing resin portion 60 is hardened, and The expansion and contraction of the second encapsulating resin portion 60 accompanied by changes in the ambient temperature is excellent in followability of the extension portion 42, and the manufacturing cost can be reduced and the material can be increased by simplifying the manufacturing. The degree of freedom of choice has also become more favorable than before.

In the above-mentioned Embodiment 1 and Embodiment 2 of the present invention and their modified examples, the case where a composite cable provided with a shielding material is used as an example and described as a cable pulled out from a casing has been described. However, various types of cable can be used as the cable. For cables, for example, the present invention can also be applied to composite cables not including the shielding material, or cables including only conductive wires and a sheath covering them (so-called lead wires, etc.).

In addition, in the above-mentioned first and second embodiments of the present invention and their modified examples, the case where the internal space defined by the case and the jig is filled with the first sealing resin part and the second sealing resin part is exemplified and performed. However, this configuration is not necessarily required, and it may be filled with only a single sealing resin portion.

In addition, in the above-mentioned Embodiment 1 and Embodiment 2 of the present invention and their modified examples, the case where the joint spacer member includes a single part was exemplified and described, but it may include a plurality of parts, and may also be It is a two-color molded product.

In addition, in the above-mentioned Embodiment 1 and Embodiment 2 of the present invention and their modified examples, the case where the present invention is applied to the proximity sensor has been illustrated and described, but the present invention can of course be applied to sensors other than the proximity sensor or Various electronic devices other than sensors.

In this way, the above-mentioned embodiment disclosed this time and its modifications are illustrative in all points and not restrictive. The technical scope of the present invention is defined by the claims, and all modifications within the meaning and scope equivalent to the description in the claims are included.

Claims (5)

1. A manufacturing method of an electronic appliance, which manufactures the following electronic appliance, the electronic appliance comprising: The shell is provided with an opening; electronic components housed in said housing; the cable is inserted through the opening, one end is electrically connected to the electronic component, and the other end is pulled out; a joint spacer member made of resin mounted on the cable; a cylindrical clamp fitted into the opening and fitted into the joining spacer, thereby holding the cable; and a sealing resin part filling an internal space defined by the case and the jig; The manufacturing method of the electronic machine includes: the step of fabricating the joining spacer member to have a cylindrical base and an extension extending from the base; The joint spacer member is attached to the cable in such a manner that the outer peripheral surface of the sheath is covered by the base and the extending portion is extended from the base toward the one end side of the cable. steps on the part of said one end side; the step of welding the base to the sheath, thereby securing the splice spacer to the cable; and A step of filling an internal space defined by the case and the jig with the sealing resin portion so as to be joined to the extension portion of the joint spacer member. 2 . The method of manufacturing an electronic device according to claim 1 , wherein a thickness before welding of a portion of the base portion welded to the sheath is 0.3 mm to 0.5 mm. 3. The manufacturing method of an electronic device according to claim 1 or 2, wherein the sealing resin portion includes any one of epoxy resin and polyurethane resin, The joining spacer includes any one of polybutylene terephthalate resin, polyurethane resin, nylon-based resin, and fluorine-based resin, The sheath includes any one of polyvinyl chloride resin, polyurethane resin, and fluorine-based resin. 4. An electronic machine comprising: The shell is provided with an opening; electronic components housed in said housing; the cable is inserted through the opening, one end is electrically connected to the electronic component, and the other end is pulled out; a joint spacer member made of resin mounted on the cable; a cylindrical clamp fitted into the opening and fitted into the joining spacer, thereby holding the cable; and a sealing resin part filling an internal space defined by the case and the jig; The cable has a core wire including a conductive wire, and a resin sheath covering the core wire, In a portion on the one end side of the cable, the core wire is exposed without being covered by the sheath, The joint spacer has a cylindrical base covering the outer peripheral surface of the sheath, and an extension extending from the base toward the one end side of the cable and joined to the resin sealing portion, The splice spacer is secured to the cable by welding the base to the sheath. 5. The electronic device according to claim 4, wherein the sealing resin portion includes any one of epoxy resin and polyurethane resin, The joining spacer includes any one of polybutylene terephthalate resin, polyurethane resin, nylon-based resin, and fluorine-based resin, The sheath includes any one of polyvinyl chloride resin, polyurethane resin, and fluorine-based resin.