CN108807295A - A kind of encapsulating structure and packaging method - Google Patents

Abstract

The present invention provides a packaging structure and a packaging method, the packaging structure includes a first metal pad and a second metal pad arranged on the bottom surface of the rewiring layer; a separation layer that separates the bottom surface into at least a first area and a second area; the first The area includes part of the bottom surface of the first metal pad, and the second area includes part or all of the remaining bottom surface of the first metal pad and the bottom surface of the second metal pad; a conductive part arranged in the first area and electrically connected to the first metal pad; In the second area, a power supply module with one end electrically connected to the first metal pad and the other end electrically connected to the second metal pad; and a plastic sealing layer that encapsulates the power supply module and the conductive part. By encapsulating the components in one package, the power supply module is directly electrically connected to the horizontal or vertical power consumption module without winding wires, which effectively reduces the transmission distance and parasitic resistance, thereby improving the power supply efficiency; moreover, the present invention adopts a high aspect ratio The conductive part further improves signal transmission efficiency.

Description

A packaging structure and packaging method

technical field

The invention relates to the technical field of semiconductor packaging, in particular to a packaging structure and a packaging method.

Background technique

In the development of integrated circuits, packaging is the key technology; it provides the chip with an electrical connection to the circuit substrate, while protecting the fragile and sensitive chip, facilitating testing, repairing, standardizing input and output ports, and improving Thermal mismatch between chip and circuit substrate.

In order to increase the flexibility of the signal conduction path of the chip and the integration of the package, one or more chips carrying microelectronic components are usually arranged on an interposer substrate; a rewiring layer is arranged on the interposer substrate. A plurality of power supply rails are arranged in the rewiring layer, and the microelectronic components of the chip are electrically connected to the circuit substrate through the rewiring layer; a power supply module is also arranged on the circuit substrate, and the power supply module includes active modules such as a power supply controller, and Passive modules such as capacitors, inductors and resistors, which convert the external power supply into the voltage and current required by the individual microelectronic components to power the chip.

However, the inventor found through research that during the power supply process of the chip, the current of the external power supply flows into the power supply module through the circuit substrate, and the converted current of the power supply module flows back to the circuit substrate before it can be transmitted to the adapter substrate for power supply, so the transmission path is very long , it is easy to introduce parasitic resistance, thereby reducing the power supply efficiency.

Therefore, how to provide a packaging structure and packaging method to improve power supply efficiency is a technical problem urgently needed to be solved by those skilled in the art.

Contents of the invention

In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a packaging structure and a packaging method for solving the problem of low power supply efficiency in the prior art.

In order to achieve the above object and other related objects, the present invention provides a packaging structure, which includes a rewiring layer, a separation layer, a plastic sealing layer, a power supply module and a conductive part, wherein:

The rewiring layer includes a passivation layer and metal pads separated by the passivation layer, and the top and bottom surfaces of the rewiring layer are respectively used for setting the first power module and the second power module and providing them providing a power supply track; the metal pad disposed on the bottom surface of the redistribution layer includes at least a first metal pad and a second metal pad;

The separation layer is disposed on the bottom surface of the rewiring layer, and separates the bottom surface into at least a first area and a second area; the first area includes part of the bottom surface of the first metal pad, and the second area includes the second area. the remaining bottom surface of a metal pad and part or all of the bottom surface of a second metal pad;

The conductive part is disposed in the first region, is electrically connected to the first metal pad, is used to form a signal transmission structure with a high aspect ratio, and is electrically connected to an external power supply;

The power supply module is arranged in the second area, one end of the power supply module is electrically connected to the first metal pad, and the other end is electrically connected to the second metal pad;

The plastic sealing layer is formed on the power supply module and the conductive part, and is used for fixing and packaging the power supply module and the conductive part.

Optionally, the metal pad includes a sputtered metal layer and an electroplated metal layer distributed sequentially from outside to inside; the electroplated metal layer further includes a first electroplated metal layer and a second electroplated metal layer distributed sequentially from outside to inside .

Optionally, the rewiring layer includes multiple passivation layers, and separate metal pads arranged in each passivation layer, and the metal pads in adjacent passivation layers can be electrically connected through stack holes; The metal pads and stack holes in the top passivation layer include sputtered metal layers and electroplated metal layers distributed sequentially from outside to inside; the metal pads and stack holes in other passivation layers include electroplated metal layers; the electroplating The metal layer also includes a first electroplated metal layer and a second electroplated metal layer distributed sequentially from outside to inside.

Optionally, the bottom of the rewiring layer is also provided with a third metal pad that is separated from both the first metal pad and the second metal pad; the separation layer also separates the bottom surface of the rewiring layer into a third area, The third area includes part or all of the bottom surface of the third metal pad; a second power module electrically connected to the third metal pad is arranged on the third area.

Optionally, the power supply module includes any one or a combination of capacitors, resistors, inductors, controllers and step-down converters.

Optionally, the power supply module, the first power consumption module and the second power consumption module are all electrically connected to corresponding metal pads through solder bumps or UBM layers.

Optionally, the packaging structure also includes:

an insulating layer, located on the bottom surface of the plastic encapsulation layer, the insulating layer has an opening exposing the conductive part;

an under-ball metallization layer formed in the opening and electrically connected to the conductive portion;

The solder ball is located on the metallization layer under the solder ball and is electrically connected to the metallization layer under the solder ball.

Optionally, the conductive part is arranged around the outer periphery of the power supply module.

The embodiment of the present invention also provides a packaging method, the packaging method at least includes the following steps:

provide a carrier;

forming a rewiring layer on the carrier, the rewiring layer includes a passivation layer, and a metal pad separated by the passivation layer; the metal pad includes at least a first metal pad and a second metal pad that are exposed, The top surface and the bottom surface of the rewiring layer are respectively used to arrange the first power consumption module and the second power consumption module and provide power supply rails for them;

A separation layer is formed on the rewiring layer, and the separation layer separates the surface of the rewiring layer into at least a first area and a second area; the first area includes part of the surface of the first metal pad, and the first The second area includes the remaining surface of the first metal pad and part or all of the surface of the second metal pad;

A conductive part is provided in the first region, and the conductive part is electrically connected to the first metal pad;

A power supply module is provided on the second area, one end of the power supply module is electrically connected to the first metal pad, and the other end is electrically connected to the second metal pad;

Forming a plastic sealing layer on the power supply module and the conductive part for fixing and packaging the power supply module and the conductive part, and electrically connecting the exposed conductive part to the circuit substrate;

The carrier is removed to expose the redistribution layer.

Optionally, a rewiring layer is formed on the carrier, including

forming a passivation layer on the carrier;

forming a metal pad opening on the passivation layer, the metal pad opening at least including a first metal pad opening and a second metal pad opening;

Sputtering to form a sputtered metal layer in the opening of the first metal pad and the opening of the second metal pad respectively;

A first electroplating metal layer is formed by electroplating on the sputtered metal layer, and a second electroplating metal layer is formed by electroplating on the first electroplating metal layer.

Optionally, forming a rewiring layer on the carrier includes forming a multi-layer passivation layer on the carrier, forming a metal pad in each passivation layer and connecting a stack of metal pads in adjacent passivation layers holes, and the first metal pad and the second metal pad are exposed on the surface of the redistribution layer, wherein:

For the passivation layer located on the bottom surface of the rewiring layer, sputtering and electroplating are performed sequentially in the opening of the metal pad and the stacking hole to form a sputtered metal layer and an electroplated metal layer;

For other passivation layers, an electroplated metal layer is formed by electroplating in the corresponding metal pad openings and stack holes;

The electroplated metal layer further includes a first electroplated metal layer and a second electroplated metal layer that are sequentially electroplated.

Optionally, when the rewiring layer includes a third metal pad that is separated from both the first metal pad and the second metal pad, and the separation layer separates the surface of the rewiring layer from the third area, further comprising:

A second power consumption module is arranged on the third area, and the second power consumption module is electrically connected to the third metal pad; the third area includes part or all of the bottom surface of the third metal pad.

Optionally, the method further includes the step of disposing a first power consumption module on the rewiring layer, and the power supply module, the first power consumption module and the second power consumption module are all connected through solder bumps or under-bump metal The layers are electrically connected to corresponding metal pads.

Optionally, before removing the carrier, also include:

forming an insulating layer on the plastic sealing layer, the insulating layer has an opening exposing the conductive part;

forming an under-solder ball metallization layer in the opening, and the under-solder ball metallization layer is electrically connected to the conductive part;

Solder balls are formed on the UBM layer, and the solder balls are electrically connected to the UBM layer.

Optionally, the conductive part is arranged around the outer periphery of the power supply module.

Optionally, before forming the rewiring layer on the carrier, it also includes forming an adhesive layer on the carrier;

Forming a rewiring layer on the carrier includes forming a rewiring layer on the adhesive layer;

Removing the carrier includes removing the carrier and the adhesive layer on the carrier.

As mentioned above, the packaging structure and packaging method of the present invention have the following beneficial effects: the packaging structure includes a rewiring layer, a separation layer, a plastic sealing layer, a power supply module and a conductive part; wherein, the rewiring layer includes a passivation layer , and metal pads separated by the passivation layer, the top surface and the bottom surface of the rewiring layer are respectively used to set the first power module and the second power module and provide power supply tracks for them; The metal pad on the bottom surface of the wiring layer includes at least a first metal pad and a second metal pad; the separation layer is arranged on the bottom surface of the rewiring layer, and at least separates the bottom surface into a first area and a second area; the first A region includes part of the bottom surface of the first metal pad, and the second region includes the remaining bottom surface of the first metal pad and part or all of the bottom surface of the second metal pad; the conductive part is arranged in the first region, and the first The metal pads are electrically connected; the power supply module is arranged in the second area, one end of the power supply module is electrically connected to the first metal pad, and the other end is electrically connected to the second metal pad; the plastic sealing layer is formed between the power supply module and the second metal pad. On the conductive part, it is used to fix the package power supply module and the conductive part. By packaging components such as power supply modules and conductive parts in one package, the power supply module can be directly electrically connected to the power consumption modules in the horizontal and vertical directions without winding wires, effectively reducing the transmission distance between components and reducing parasitic resistance , thereby improving the power supply efficiency; moreover, the present invention adopts a conductive part with a high aspect ratio, which can further improve the signal transmission efficiency.

Description of drawings

FIG. 1 shows a schematic diagram of a packaging structure provided by an embodiment of the present invention.

FIG. 2 shows a schematic structural diagram of a metal pad and stacked holes provided by an embodiment of the present invention.

FIG. 3 shows a partially enlarged schematic diagram of a packaging structure provided by an embodiment of the present invention.

Fig. 4 shows a schematic flowchart of a packaging method provided by an embodiment of the present invention.

5 to 13 are schematic structural diagrams of each step of a packaging method provided by an embodiment of the present invention.

Component designation description

1 redistribution layer

11 First redistribution layer

12 Second redistribution layer

13 The third redistribution layer

14 metal pad

141 first metal pad

142 Second metal pad

143 Third metal pad

15 passivation layer

16 stacked holes

2 dividers

21 First area

22 second area

23 The third area

3 conductive part

4 power supply module

5 plastic layer

6 insulating layer

7 Under-ball metallization

8 solder balls

91 The first power consumption module

92 Second power consumption module

300 sputtered metal layers

301, 3011, 3012 first electroplated metal layer

302 Second electroplated metal layer

S1～S7 steps

Detailed ways

Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

See Figures 1 through 12. It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic idea of the present invention, so that only the components related to the present invention are shown in the diagrams rather than the number, shape and Dimensional drawing, the type, quantity and proportion of each component can be changed arbitrarily during actual implementation, and the component layout type may also be more complicated.

Referring to FIG. 1 , it is a schematic diagram of a packaging structure provided by an embodiment of the present invention. As shown in FIG. 1 , the packaging structure at least includes a rewiring layer 1 , a separation layer 2 , a plastic sealing layer 5 , a power supply module 4 and a conductive part 3 .

Wherein, the redistribution layer 1 includes a passivation layer 15 and a metal pad 14 covered by the passivation layer 15 . In specific implementation, the rewiring layer 1 may include any multilayer structure, for example, the rewiring layer 1 may include a passivation layer and metal pads 14 buried and separated by the passivation layer 15; or the The rewiring layer 1 may include 2-3 layers of passivation layers 15 , and metal pads 14 buried and separated by the passivation layers 15 in each passivation layer 15 . Of course, it should be noted that those skilled in the art can set any number of redistribution layers 1 according to the complexity of actual wiring, which is not limited in this embodiment of the present invention. In order to clearly illustrate the packaging structure of the present invention, in the embodiment of the present invention, the rewiring layer 1 including a 3-layer structure will be taken as an example for detailed description.

In an exemplary embodiment, the rewiring layer 1 includes a three-layer structure, which is a first rewiring layer 11, a second rewiring layer 12, and a third rewiring layer 13 from top to bottom; the first rewiring layer The wiring layer 11, the second rewiring layer 12, and the third rewiring layer 13 each include a corresponding passivation layer 15, and metal pads 14 buried and separated by the passivation layer 15; For example, between the first rewiring layer 11 and the second rewiring layer 12, and between the second rewiring layer 12 and the third rewiring layer 13, they are electrically connected through corresponding stacking holes 16, thereby forming different conductive path. In this way, in actual use, the first power module 91 can be arranged on the top surface of the rewiring layer 1 and be in electrical contact with the stacking hole 16 of the first rewiring layer 11, so that the package structure is the first power module 91 Multiple power supply rails are provided, and the first power consumption module 91 can be understood as an integrated power consumption chip with specific functions or a discrete power consumption device. Moreover, the third redistribution layer 13 is located at the bottom of the redistribution layer 1, and at least a first metal pad 141 and a second metal pad 142 are disposed in the third redistribution layer 13; it must be noted that, During specific implementation, any number of metal pads 14 may be provided in the third redistribution layer 13 , for example, 3, 4, etc., which are not limited in this embodiment of the present invention. In this embodiment of the present invention, the package structure will be described in detail in the case of setting at least three metal pads, that is, in the embodiment of the present invention, the third redistribution layer 13 includes a first metal pad 141, a second metal pad 142 and The third metal pad 143 .

In the embodiment of the present invention, the metal pad 14 and the stacking hole 16 in each rewiring layer 1 can have a multi-layer metal structure. See FIG. 2 , which is a schematic structural diagram of a metal pad and stacking hole provided by the embodiment of the present invention. , as shown in Figure 2, in each rewiring layer 1, the shape of the corresponding metal pad 14 and the stack hole 16 can be defined by photolithography, and then the multi-layer metal structure can be realized by sputtering and electroplating processes, as shown in Figure 2 Among them, the metal pad 14 and the stack hole 16 may be sequentially distributed with a sputtered metal layer 300 and an electroplated metal layer from outside to inside, wherein the electroplated metal layer further includes a first electroplated metal layer distributed sequentially from outside to inside layer 301 and a second electroplated metal layer 302; in a specific implementation, the sputtered metal layer 300 can be a sputtered Cu metal layer; the first electroplated metal layer 301 can include an Au metal layer and/or Ni Metal layer, in the structure shown in Figure 2, the first electroplated metal layer 301 may further include a first electroplated metal layer 3011 and a first electroplated metal layer 3012 from outside to inside, specifically, the first electroplated The metal layer 3011 may be an Au metal layer, the first electroplated metal layer 3012 may be a Ni metal layer; the second electroplated metal layer includes an electroplated Cu metal layer. Since the packaging structure is formed on a carrier in the manufacturing process, that is, the top surface of the rewiring layer 1 is in contact with the carrier, the carrier can effectively suppress metal diffusion, so there is no need to form a metal barrier before forming the sputtered metal layer 300 layers, reducing process steps; moreover, after the formation of the first rewiring layer 11, there is no need to redefine the electrical contact with the first power module 91 on the top of the first rewiring layer 11 by photolithography, thereby reducing the complexity of the process ; In addition, since only the sputtered metal layer 300 is used without the metal barrier layer, the undercut can be reduced when forming the rewiring layer, thereby facilitating the manufacture of the rewiring layer with small line width and line spacing. In the case of , it is possible to realize a stable electrical connection and ensure power supply efficiency. Of course, it should be noted that the implementation of the sputtered metal layer 300, the first electroplated metal layer 301 and the second electroplated metal layer 302 is only an exemplary embodiment, and in specific implementation, the sputtered metal layer 300 and the second electroplated metal layer 302 can be made of the same or different materials, and the sputtered metal layer 300, the first electroplated metal layer 301 and the second electroplated metal layer 302 can also be metal layers of other single materials or alloy materials , which is not limited in this embodiment of the present invention.

Usually the rewiring layer 1 has a multi-layer structure. In order to further reduce the process complexity, in an exemplary embodiment, the first rewiring layer 11 is located on the top of the rewiring layer 1, and the first rewiring layer 11 The inner metal pad 14 and the stack hole 16 may both include a sputtered metal layer 300 and an electroplated metal layer distributed sequentially from outside to inside, and the electroplated metal layer includes a first electroplated metal layer 301 and a first electroplated metal layer distributed sequentially from outside to inside. The second electroplated metal layer 302 is made of the same material as the sputtered metal layer 300 . The second redistribution layer 12 and the third redistribution layer 13 are located inside the redistribution layer 1, since the metal layer at the bottom of the metal pad 14 in the first redistribution layer 11 is the second electroplated metal layer 302, The second electroplated metal layer 302 is made of the same material as the sputtered metal layer 300. Therefore, when preparing the metal pad 14 and the stack hole 16 of the second rewiring layer 12, only the electroplating process can be used to form the electroplated metal layer. The structure of the metal layer is the same as that in the first rewiring layer 11; similarly, for the third rewiring layer 13, an electroplating metal layer is also formed by electroplating. For the structures of the sputtered metal layer and the electroplated metal layer in the embodiment of the present invention, reference may be made to the detailed description of the above embodiments, and details are not repeated here.

The separation layer 2 is disposed on the bottom surface of the rewiring layer 1, and separates the bottom surface into at least a first area 21 and a second area 22; wherein, the first area 21 includes part of the first metal pad 141 The second region 22 includes the remaining bottom surface of the first metal pad 141 and part or all of the bottom surface of the second metal pad 142 . In the embodiment of the present invention, the separation layer 2 is further provided with a third region 23 at a position corresponding to the third metal pad 143 , and the third region 23 includes part or all of the bottom surface of the third metal pad 143 . Of course, in actual implementation, the separation layer 2 can be used to set any number of mutually separated areas on the bottom surface of the rewiring layer 1 according to the position of the power supply module and the leads, which is not limited in this embodiment of the present invention.

The conductive portion 3 is disposed in the first region 21 , and the conductive portion 3 is electrically connected to the first metal pad 141 . In a specific implementation, the conductive part 3 can be understood as a lead wire, or other structures for conducting electricity such as conductive pillars, etc., which are not limited in the embodiment of the present invention. Any number of conductive parts 3 can be arranged in the first region 21 , and in the exemplary embodiment shown in FIG. 1 , three conductive parts 3 are arranged in the first region. The conductive part 3 may be soldered to the first metal pad 141 by using a solder bump, or may also be electrically connected to the first metal pad 141 by using an under bump metal layer.

Of course, it should be noted that, according to actual packaging requirements, any number of conductive parts 3 can be provided, and the conductive parts 3 can also be distributed in other areas, for example, more areas are defined by using a separation layer, and the corresponding The conductive part 3 is formed in the region, and the conductive part 3 can be electrically connected with the metal pad 14 in the corresponding region. In a preferred embodiment, the conductive part 3 is in the form of wires, which can form a signal transmission structure with a high aspect ratio; especially for multi-chip packaging, the chip height range is relatively large, and the wire bonding method can easily pull out a wire with a height greater than or equal to 700 μm. The leads meet the needs of chip packaging and effectively reduce costs.

The power supply module 4 is disposed in the second area 22 , and one end of the power supply module 4 is electrically connected to the first metal pad 141 , and the other end of the power supply module 4 is electrically connected to the second metal pad 142 . The second power consumption module 92 is disposed in the third region 23 , and the second power consumption module 92 is electrically connected to the third metal pad 143 . The power supply module 4 and the second power consumption module 92 can both be packaged modules, and the power supply module 4 can be understood as a passive power supply module, such as a capacitor, an inductor, and a resistor, etc., or an active power supply module, such as a controller and step-down converters, etc., the second power module 92 can be understood as a power chip with specific functions or a discrete power device that integrates active modules and passive modules; in the embodiment of the present invention, an example Specifically, the power supply module 4 is a capacitor, of course, according to the actual power supply needs, any number of the power supply modules 4 can be provided, and the power supply module 4 can be selected from the same type of power supply module or a different type of power supply module, for example The second power consumption module 92 is powered by a combination of a capacitor and a controller, which is not limited in the present invention. In order to realize the electrical connection between the power supply module and the metal pad, between the power supply module 4 and the first metal pad 141 and the second metal pad 142, and between the second power module 92 and the third metal pad 143 , can be connected through solder bumps or UBM layers; and the power supply module 4 and the second power consumption module 92 are laterally distributed on the bottom surface of the redistribution layer 2 .

In this way, the power supply module 4 and the conductive part 3 are simultaneously connected to a metal pad, that is, the first metal pad 141, and the second power module 92 and the conductive part 3 are simultaneously connected to a metal pad, that is, the third metal pad 143. The conductive part 3 is directly electrically connected to the power supply module; when the external power is introduced through the conductive part 3, it can be quickly transmitted to the power supply module 4, and the power supply module 4 is further connected to the first power supply module distributed in the horizontal direction through the rewiring layer 2. The electrical module 91 is electrically connected to the first electrical modules 91 distributed in the vertical direction, thereby effectively reducing transmission paths and improving power supply efficiency.

Moreover, referring to FIG. 3 , it is a partially enlarged schematic diagram of a packaging structure provided by an embodiment of the present invention. As a preferred embodiment, the conductive part 3 can also be arranged in the first area 21 in a manner surrounding the power supply module 4 The outer periphery of the power supply module 4 makes the conductive part 3 closer to the power supply module 4 , further reduces the transmission path, and reduces the secondary resistance at the same time.

In order to protect the power supply module and the conductive part, in the embodiment of the present invention, the packaging structure further includes a plastic sealing layer 5, and the plastic sealing layer 5 is formed on the power supply module 4, the conductive part 3 and the second power module 92, so that The plastic sealing is completed; after the plastic sealing, the plastic sealing layer 5 is polished and smoothed to expose the conductive part 3 .

In addition, in order to facilitate the electrical connection of the package structure, in an exemplary embodiment, the package structure may further include an insulating layer 6 , an UBM layer 7 and a solder ball 8 . Wherein, the insulating layer 6 is located on the bottom surface of the plastic sealing layer 5, and an opening exposing the conductive part 3 is formed on the insulating layer 6 by means of photolithography, etching, etc.; the metallization layer 7 under the solder ball is formed In the opening and electrically connected to the conductive part 3; the solder ball 8 is located on the UBM layer 7 and electrically connected to the UBM layer 7. In this way, the package structure can be electrically connected to the circuit substrate through the solder balls 8, and an external power supply can be introduced into the package structure.

It can be seen from the description of the above embodiments that a packaging structure provided by the embodiment of the present invention includes a rewiring layer 1, a separation layer 2, a plastic sealing layer 5, a power supply module 4, and a conductive part 3; wherein, the rewiring layer 1 includes The passivation layer 15, and the metal pad 14 separated by the passivation layer 15, the top surface of the rewiring layer 1 is used to set the first power module 91 and provide a power supply track for it; The metal pad 14 on the bottom surface of the layer 1 includes at least a first metal pad 141 and a second metal pad 142; the separation layer 2 is arranged on the bottom surface of the rewiring layer 1, and separates the bottom surface into at least the first region 21 and the second region 21. Two regions 22; the first region 21 includes part of the bottom surface of the first metal pad 141, and the second region 22 includes part or all of the remaining bottom surface of the first metal pad 141 and the bottom surface of the second metal pad 142; the conductive The part 3 is disposed in the first area 21 and is electrically connected to the first metal pad 141; the power supply module 4 is disposed in the second area 22, and one end of the power supply module 4 is electrically connected to the first metal pad 141, The other end is electrically connected to the second metal pad 142 ; the plastic sealing layer 5 is formed on the power supply module 4 and the conductive part 3 for fixing and packaging the power supply module 4 and the conductive part 3 . By encapsulating components such as the power supply module and conductive parts in one package, the power supply module 4 can be directly electrically connected to the first power module 91 in the horizontal direction and the second power module 92 in the vertical direction without needing to wire. , effectively reduce transmission distance, reduce parasitic resistance, and improve power supply efficiency; moreover, the metal pad structure formed in the order of fixed metal layers can reduce process complexity and reduce undercut, which is conducive to the manufacture of small line width and line spacing rewiring layers .

Corresponding to the device embodiment of the packaging structure provided in the embodiment of the present invention, the embodiment of the present invention also provides a packaging method.

Referring to FIG. 4, it is a schematic flowchart of a packaging method provided by an embodiment of the present invention. As shown in FIG. 4, the method includes the following steps:

Step S1: providing a carrier;

Step S2: forming a rewiring layer 1 on the carrier, the rewiring layer 1 includes a passivation layer 15, and a metal pad 14 separated by the passivation layer 15; the metal pad 14 includes at least the exposed first a metal pad 141 and a second metal pad 142;

Step S3: forming a separation layer 2 on the rewiring layer 1, the separation layer 2 at least separates the surface of the rewiring layer 1 into a first region 21 and a second region 22; the first region 21 includes a part The surface of the first metal pad 141, the second region 22 includes part or all of the remaining surface of the first metal pad 141 and the surface 142 of the second metal pad;

Step S4: disposing a conductive part 3 in the first region 21, and the conductive part 3 is electrically connected to the first metal pad 141;

Step S5: setting a power supply module 4 on the second area 22, one end of the power supply module 4 is electrically connected to the first metal pad 141, and the other end is electrically connected to the second metal pad 142;

Step S6: forming a plastic sealing layer 5 on the power supply module 4 and the conductive part 3, for fixing and packaging the power supply module 4 and the conductive part 3, and electrically connecting the exposed conductive part 3 to the circuit substrate;

Step S7: removing the carrier 100 to expose the rewiring layer 1 .

The above encapsulation method will be described in detail below through specific examples.

In step S1, as shown in FIG. 5, a carrier 100 is provided, and the material of the carrier 100 can be selected from one or more combinations of glass, stainless steel, silicon, silicon oxide, metal or ceramics, or other similar ; The carrier 100 may be a flat plate, for example, the carrier 100 may be a glass circular plate with a certain thickness. In order to facilitate the adhesion of the rewiring layer 1 in subsequent steps, in this embodiment, an adhesive layer 200 is formed on the surface of the carrier 100 , and the adhesive layer 200 is also removed when the carrier 100 is subsequently removed. For example, the adhesive layer 200 can be a double-sided adhesive tape that uses heating or UV debonding, or the adhesive layer 200 can also be a sacrificial layer that is laser debonded. After forming this layer of sacrificial layer, glue can be applied on the sacrificial layer A fixed redistribution layer 1 is attached. When peeling off, the sacrificial layer can be removed by laser, and then the glue can be removed. The sacrificial layer can be deposited on the carrier 100 by CVD, or coated with LTHC (light to heat) material, and the glue can be removed by chemical reagents.

In step S2, the rewiring layer 1 is adhered on the carrier 100 through the adhesive layer 200, and the rewiring layer 1 may include any multi-layer structure, that is, a multilayer passivation layer 15 is formed and a passivation layer 15 is formed on each layer. One or more metal pads 14 within the metallization layer 15.

In the first implementation, the rewiring layer 1 may include a passivation layer 15 and the metal pads 14 buried and separated by the passivation layer 15, and step S2 may further include the following steps:

Step S21: forming a passivation layer 15: on the carrier.

A passivation layer 15 is formed on the carrier 100 , and the passivation layer 15 can be fixedly adhered to the carrier 100 through the adhesive layer 200 .

Step S22 : forming a metal pad opening on the passivation layer 15 , the metal pad opening at least including a first metal pad opening and a second metal pad opening.

Metal pad openings are formed on the passivation layer 15 by means of photolithography, and the metal pad openings at least include a first metal pad opening and a second metal pad opening. According to wiring requirements, any number of metal pad openings can be set to define corresponding metal pads in the multiple metal pad openings. For example, in the embodiment of the present invention, a third metal pad can also be formed on the passivation layer 15. Pad opening. Meanwhile, in order to facilitate the external connection of the metal pads 14 , corresponding stacking holes 16 are defined in the first metal pad opening, the second metal pad opening and the third metal pad opening by photolithography.

Step S23: Sputtering to form a sputtered metal layer 300 in the first metal pad opening and the second metal pad opening respectively.

In the embodiment of the present invention, the sputtered metal layer 300 is formed by sputtering, and the sputtered metal layer 300 covers the first metal pad opening, the second metal pad opening, the third metal pad opening and the corresponding stack holes 16 Inside; the sputtered metal layer 300 may be a sputtered Cu metal layer.

Step S24 : electroplating on the sputtered metal layer 300 to form a first electroplating metal layer 301 , and electroplating on the first electroplating metal layer 301 to form a second electroplating metal layer 302 .

A first electroplating metal layer 301 is sequentially formed by electroplating on the sputtered metal layer 300 , and a second electroplating metal layer 302 is formed by electroplating on the first electroplating metal layer 301 . In a specific embodiment, the first electroplated metal layer 301 may include an Au metal layer and/or a Ni metal layer, and the second electroplated metal layer 302 includes an electroplated Cu metal layer.

In the second implementation, the rewiring layer 1 may include a multi-layer passivation layer 15 and a metal pad 14 buried and separated by each layer of the passivation layer 15. In the embodiment of the present invention, three layers The structure is described in detail as an example. As shown in FIG. 6, the first rewiring layer 11 is first formed, and according to the description of the above-mentioned embodiment, a passivation layer 15 and a plurality of metal pads 14 and a plurality of stack holes 16 separated by the passivation layer 15 are formed; 7, the second redistribution layer 12 is formed on the first redistribution layer 11 in the same manner as described in the above embodiment; as shown in FIG. 8, the second redistribution layer 12 is also described in the above embodiment. The third rewiring layer 13 is formed in a manner, wherein the third rewiring layer 13 includes at least a first metal pad 141 and a second metal pad 142. In the embodiment of the present invention, the third rewiring layer 13 also A third metal pad 143 may be included.

In the third implementation, the rewiring layer 1 includes multiple passivation layers 15 and metal pads 14 buried and separated by each layer of the passivation layer 15. For the first rewiring layer 11, the metal pads The sputtered metal layer 300 and the electroplated metal layer are formed by sputtering and electroplating in the opening and the stack hole 16, and the electroplated metal layer also includes a first electroplated metal layer 301 and a second electroplated metal layer 302 electroplated in sequence; The second redistribution layer 12 and the third redistribution layer 13 can form electroplated metal layers in corresponding metal pad openings and stacking holes 16 by electroplating. The process of this embodiment reduces the sputtering process during the formation of the second rewiring layer 12 and the third rewiring layer 13, thereby reducing the complexity of the process. For the similarities between this embodiment and the above embodiment, please refer to the above implementation The description of the example is omitted here.

In step S3, as shown in FIG. 9, a spacer layer 2 is formed on the rewiring layer 1. The spacer layer 2 can be a polymer layer, and the spacer layer 2 can be formed on the spacer layer 2 by photolithography. a plurality of openings, so that the separation layer 2 can at least separate the surface of the rewiring layer 1 into a first region 21 and a second region 22. In the embodiment of the present invention, the separation layer 2 can further separate a third region. Area 23. Wherein, the first region 21 includes part of the surface of the first metal pad 141, the second region 22 includes the remaining surface of the first metal pad 141 and part or all of the surface of the second metal pad 142, and the third region 23 includes part or all of the surface of the third metal pad 143 .

In step S4, as shown in FIG. 10 , a power supply module 4 is set in the second area 22, one end of the power supply module 4 is connected to the first metal pad 141, and the other end is electrically connected to the second metal pad 142; The second power consumption module 92 is arranged in the third region 23 , and the second power consumption module 92 is electrically connected to the third metal pad 143 . Wherein, the power supply module 4 may include passive modules such as capacitors, inductors and resistors, and may also include active modules such as controllers and step-down converters; of course, in actual implementation, the actual packaging structure may also include a Or more power supply modules to meet the power supply requirements, the power supply module 4 can be the same type of power supply module or a combination of different types of power supply modules; the second power module 92 can be an integrated active module and passive module An integrated circuit chip with specific functions, or a stand-alone device including active and/or passive modules. The power supply module 4 , the first power consumption module 91 and the second power consumption module 92 may be electrically connected to corresponding metal pads 14 through solder bumps or UBM layers.

In step S5, as shown in FIG. 11 , a conductive part 3 is formed in the first region 21, the conductive part 3 can be formed by wire gold bonding, and the conductive part 3 is electrically connected to the first metal pad 141, The conductive portion 3 may include multiple strips; in addition, the conductive portion 3 may also be distributed in other areas, for example, use a separation layer to define more areas, and form the conductive portion 3 in the corresponding area, the conductive portion 3 It can be electrically connected with the metal pad 14 in the corresponding area. In order to reduce the transmission path, thereby reducing the secondary resistance, in the embodiment of the present invention, the conductive part 3 in the first area 21 can be arranged around the power supply module 4; in this way, the external power introduced through the conductive part 3 can quickly reach the same metal The power supply module 4 on the pad, thereby effectively reducing the transmission path.

In step S6, as shown in FIG. 12, a plastic seal layer 5 is formed on the power supply module 4, the second power consumption module 92, and the conductive part 3 for encapsulation; then the excess plastic seal layer 5 is removed by grinding, and the conductive part is exposed. 3. The encapsulation molding method may be compression molding, transfer molding, liquid seal molding, vacuum lamination, spin coating or other suitable methods. The molding material may be epoxy resin, liquid thermosetting epoxy resin, plastic molding compound or the like. The grinding method may include one or more of mechanical grinding, chemical polishing, and etching.

After plastic molding, the embodiment of the present invention also forms solder balls 8 on the conductive part 3 to facilitate the electrical connection between the packaging structure and the circuit substrate. As shown in FIG. 13 , the process of forming solder balls 8 specifically includes: An insulating layer 6 is formed on the layer 5, and the insulating layer 6 has an opening exposing the conductive portion 3; an under-solder ball metallization layer 7 is formed in the opening, and the under-solder ball metallization layer 7 and the conductive portion 3 Electrical connection: forming solder balls 8 on the UBM layer 7 , and electrically connecting the solder balls 8 to the UBM layer 7 .

In step S7, the carrier 100 and the adhesive layer 200 are removed; removing the carrier 100 may include one or more of mechanical grinding, chemical polishing, etching, ultraviolet stripping, mechanical stripping, or other suitable methods; The adhesive layer 200 can be removed by degumming, so as to remove the carrier 100 . After the carrier 100 and the adhesive layer 200 are removed, the surface of the rewiring layer 1 can be exposed, and the first power module 91 is installed on the exposed surface of the rewiring layer 1. The first power module 91 and the rewiring layer 1 provide a The power supply rails are in electrical contact, so that the packaging structure supplies power to the first power consumption module 91 .

The embodiment of the encapsulation method of the present invention corresponds to the embodiment of the device with the above-mentioned encapsulation structure. For the similarities, please refer to the description of the device embodiment above, which will not be repeated here.

It can be seen from the description of the above embodiments that a packaging method provided by the embodiment of the present invention provides a carrier; forming a rewiring layer 1 on the carrier, the rewiring layer 1 includes a passivation layer 15, and is described The metal pad 14 separated by the passivation layer 15; the metal pad 14 includes at least the exposed first metal pad 141 and the second metal pad 142; a separation layer 2 is formed on the rewiring layer 1, and the separation layer 2 will The surface of the rewiring layer 1 is at least divided into a first area 21 and a second area 22; the first area 21 includes part of the surface of the first metal pad 141, and the second area 22 includes the rest of the first metal pad 141. Part or all of the surface and the surface of the second metal pad 142; a conductive part 3 is set in the first area 21, and the conductive part 3 is connected to the first metal pad 141; a power supply module is set on the second area 22 4. One end of the power supply module 4 is connected to the first metal pad 141, and the other end is connected to the second metal pad 142; a plastic sealing layer 5 is formed on the power supply module 4 and the conductive part 3 for fixing and packaging the power supply The module 4 and the conductive part 3 are electrically connected to the circuit substrate through the exposed conductive part 3 ; the carrier 100 is removed to expose the rewiring layer 1 . By encapsulating components such as the power supply module in one package, the power supply module 4 can be directly electrically connected to the power consumption modules in the horizontal and vertical directions without winding wires, and since the conductive part 3 and the power supply module are arranged on the same metal pad, And the conductive part 3 surrounds the periphery of the power supply module, so that the external power introduced through the conductive part 3 can be quickly transmitted to the corresponding power supply module through a short path, effectively reducing parasitic resistance and improving power supply efficiency; By controlling the order of the metal layers in the wiring layer 1, the process steps can be reduced, the process complexity can be reduced, and undercut can be effectively suppressed, which is conducive to the realization of stable power supply under the condition of small line width and line spacing.

To sum up, the present invention provides a packaging structure and packaging method. The conductive part and the power supply module are electrically connected on the same metal pad, and the conductive part is arranged around the power supply module, so that a short transmission path is used for power supply, and the power supply is suppressed. The parasitic resistance improves the power supply efficiency; in the formation process of the wiring layer, the formation sequence of the metal layer is controlled, which avoids the formation process of the metal barrier layer and reduces the photolithography on the surface of the wiring layer after the carrier is removed, reducing the complexity of the process, and Effective suppression of undercutting is conducive to the realization of stable power supply under the condition of small line width and line spacing. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has high industrial application value.

The above-mentioned embodiments only illustrate the principles and effects of the present invention, but are not intended to limit the present invention. Anyone skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical ideas disclosed in the present invention should still be covered by the claims of the present invention.

Claims (16)

1. A packaging structure, characterized in that the packaging structure includes a rewiring layer, a separation layer, a plastic sealing layer, a power supply module and a conductive part, wherein: The rewiring layer includes a passivation layer and metal pads separated by the passivation layer, and the top and bottom surfaces of the rewiring layer are respectively used for setting the first power module and the second power module and providing them providing a power supply track; the metal pad disposed on the bottom surface of the redistribution layer includes at least a first metal pad and a second metal pad; The separation layer is disposed on the bottom surface of the rewiring layer, and separates the bottom surface into at least a first area and a second area; the first area includes part of the bottom surface of the first metal pad, and the second area includes the second area. the remaining bottom surface of a metal pad and part or all of the bottom surface of a second metal pad; The conductive part is disposed in the first region, is electrically connected to the first metal pad, is used to form a signal transmission structure with a high aspect ratio, and is electrically connected to an external power supply; The power supply module is arranged in the second area, one end of the power supply module is electrically connected to the first metal pad, and the other end is electrically connected to the second metal pad; The plastic sealing layer is formed on the power supply module and the conductive part, and is used for fixing and packaging the power supply module and the conductive part. 2. The package structure according to claim 1, wherein the metal pad comprises a sputtered metal layer and an electroplated metal layer distributed sequentially from outside to inside; the electroplated metal layer further includes The first electroplated metal layer and the second electroplated metal layer. 3. The packaging structure according to claim 1, characterized in that, The rewiring layer includes a multi-layer passivation layer, and separate metal pads arranged in each passivation layer, and the metal pads in adjacent passivation layers can be electrically connected through stacking holes; The metal pads and the stack holes located in the passivation layer on the top surface of the rewiring layer both include a sputtered metal layer and an electroplated metal layer distributed sequentially from the outside to the inside; Metal pads and stack holes in other passivation layers include plated metal layers; The electroplated metal layer further includes a first electroplated metal layer and a second electroplated metal layer distributed sequentially from outside to inside. 4. The package structure according to any one of claims 1 to 3, characterized in that, The bottom of the redistribution layer is also provided with a third metal pad that is separated from both the first metal pad and the second metal pad; The separation layer also separates the bottom surface of the rewiring layer from a third area, and the third area includes part or all of the bottom surface of the third metal pad; A second power consumption module electrically connected to the third metal pad is arranged on the third area. 5. The packaging structure according to claim 4, wherein the power supply module comprises any one or a combination of capacitors, resistors, inductors, controllers and step-down converters. 6. The package structure according to claim 5, wherein the power supply module, the first power module and the second power module are all electrically connected to corresponding metal pads through solder bumps or UBM layers . 7. The package structure according to claim 1, wherein the package structure further comprises: an insulating layer, located on the bottom surface of the plastic encapsulation layer, the insulating layer has an opening exposing the conductive part; an under-ball metallization layer formed in the opening and electrically connected to the conductive portion; The solder ball is located on the metallization layer under the solder ball and is electrically connected to the metallization layer under the solder ball. 8 . The package structure according to claim 1 , wherein the conductive part is arranged around the outer periphery of the power supply module. 9. A packaging method, characterized in that the packaging method at least comprises the following steps: provide a carrier; forming a rewiring layer on the carrier, the rewiring layer includes a passivation layer, and a metal pad separated by the passivation layer; the metal pad includes at least a first metal pad and a second metal pad that are exposed, The top surface and the bottom surface of the rewiring layer are respectively used to arrange the first power consumption module and the second power consumption module and provide power supply rails for them; A separation layer is formed on the rewiring layer, and the separation layer separates the surface of the rewiring layer into at least a first area and a second area; the first area includes part of the surface of the first metal pad, and the first The second area includes the remaining surface of the first metal pad and part or all of the surface of the second metal pad; A conductive part is provided in the first region, and the conductive part is electrically connected to the first metal pad; A power supply module is provided on the second area, one end of the power supply module is electrically connected to the first metal pad, and the other end is electrically connected to the second metal pad; Forming a plastic sealing layer on the power supply module and the conductive part for fixing and packaging the power supply module and the conductive part, and electrically connecting the exposed conductive part to the circuit substrate; The carrier is removed to expose the rewiring layer. 10. The packaging method according to claim 9, wherein forming a rewiring layer on the carrier comprises forming a passivation layer on the carrier; forming a metal pad opening on the passivation layer, the metal pad opening at least including a first metal pad opening and a second metal pad opening; Sputtering to form a sputtered metal layer in the opening of the first metal pad and the opening of the second metal pad respectively; A first electroplating metal layer is formed by electroplating on the sputtered metal layer. 11. The packaging method according to claim 9, wherein forming a rewiring layer on the carrier includes forming a multi-layer passivation layer on the carrier, and forming a metal pad in each passivation layer and stack holes connecting metal pads in adjacent passivation layers, and the first metal pad and the second metal pad are exposed on the surface of the rewiring layer, wherein: For the passivation layer located on the bottom surface of the rewiring layer, sputtering and electroplating are performed sequentially in the opening of the metal pad and the stacking hole to form a sputtered metal layer and an electroplated metal layer; For other passivation layers, an electroplated metal layer is formed by electroplating in the corresponding metal pad openings and stack holes; The electroplated metal layer further includes a first electroplated metal layer and a second electroplated metal layer that are sequentially electroplated. 12. The packaging method according to any one of claims 9 to 11, wherein when the rewiring layer includes a third metal pad that is separated from the first metal pad and the second metal pad, and the separation layer will rewiring When the surface of the layer separates the third area, it also includes: A second power consumption module is arranged on the third area, and the second power consumption module is electrically connected to the third metal pad; the third area includes part or all of the bottom surface of the third metal pad. 13. The packaging method according to claim 12, further comprising the step of setting a first power consumption module on the rewiring layer, the power supply module, the first power consumption module and the second power consumption module are all It is electrically connected to the corresponding metal pad through the solder bump or the metal layer under the bump. 14. The packaging method according to claim 9, further comprising: forming an insulating layer on the plastic sealing layer, the insulating layer has an opening exposing the conductive portion; forming an under-solder ball metallization layer in the opening, and the under-solder ball metallization layer is electrically connected to the conductive part; Solder balls are formed on the UBM layer, and the solder balls are electrically connected to the UBM layer. 15 . The packaging method according to claim 9 , wherein the conductive part is arranged around the outer periphery of the power supply module. 16 . 16. The packaging method according to claim 9, characterized in that: Before forming the rewiring layer on the carrier, it also includes forming an adhesive layer on the carrier; Forming a rewiring layer on the carrier includes forming a rewiring layer on the adhesive layer; Removing the carrier includes removing the carrier and the adhesive layer on the carrier.