CN108804762B - Design Method of Microwave High Power Multiple Harmonic Filter and Multiple Harmonic Filter - Google Patents
Design Method of Microwave High Power Multiple Harmonic Filter and Multiple Harmonic Filter Download PDFInfo
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Abstract
本发明公开了一种微波高功率多次谐波滤波器的设计方法及多次谐波滤波器,首先用对称性原理简化成周期性加载的T分支,根据传输线原理,再用等效电路法求出ET分支的等效电路,结合电磁场仿真软件计算得到的散射参数,提取大功率多次谐波滤波器中的单个谐波结构单元阻抗值,进而利用单个谐波结构单元有源阻抗和滤波器特性的关系式求出滤波器的衰减和反射损耗特性;这种方法将大功率多次谐波滤波器的仿真计算,提高工程设计的精度,同时,可大大缩短设计的周期。
The invention discloses a design method of a microwave high-power multiple harmonic filter and the multiple harmonic filter. First, it is simplified into a periodically loaded T branch by the principle of symmetry, and then the equivalent circuit method is used according to the principle of transmission line. The equivalent circuit of the ET branch is obtained, combined with the scattering parameters calculated by the electromagnetic field simulation software, the impedance value of the single harmonic structural element in the high-power multiple harmonic filter is extracted, and then the active impedance and filtering of the single harmonic structural element are used. The attenuation and reflection loss characteristics of the filter can be obtained by the relationship between the characteristics of the filter; this method will simulate the calculation of the high-power multiple harmonic filter, improve the accuracy of engineering design, and at the same time, can greatly shorten the design cycle.
Description
技术领域technical field
本发明涉及微波高功率发射机技术领域,尤其涉及一种微波高功率多次谐波滤波器的设 计方法及多次谐波滤波器。The invention relates to the technical field of microwave high-power transmitters, in particular to a design method of a microwave high-power multiple harmonic filter and a multiple harmonic filter.
背景技术Background technique
随着全球信息化的推进,大量的信息需要通过射频、微波通信设备进行传输,要求其传 输速度更加快,传输带宽更加宽,抗干扰能力更加强,在这些要求中滤波器充当着极其重要 的作用。特别是在深空探测等高功率微波应用领域,滤波器的作用更为突出,同时研制难度 也大为提高。日益增多的通信系统必须在有限的频谱资源中正常工作,须按需求对频谱加以 分配,则对滤波器选择频率的准确性要求更加苛刻。同时随着民用通讯设备和军用通信装备 的发展需求,对滤波器提出更为严格要求。研究高性能、大功率容量的谐波滤波器对当前的 高功率微波通信设备至关重要。With the advancement of global informatization, a large amount of information needs to be transmitted through radio frequency and microwave communication equipment, which requires faster transmission speed, wider transmission bandwidth, and stronger anti-interference ability. In these requirements, the filter plays an extremely important role. effect. Especially in the field of high-power microwave applications such as deep space exploration, the role of the filter is more prominent, and the difficulty of development is also greatly improved. The increasing number of communication systems must work normally in the limited spectrum resources, and the spectrum must be allocated according to the demand, so the requirements on the accuracy of the filter selection frequency are more stringent. At the same time, with the development needs of civil communication equipment and military communication equipment, stricter requirements are put forward for filters. Research on high-performance, high-power-capacity harmonic filters is crucial for current high-power microwave communication equipment.
然而,大功率多次谐波滤波器的结构复杂,设计难度较大,目前虽可用高频场仿真软件分 析,但直接使用软件对滤波器进行整体的仿真,耗时较长,而且计算精度也不不高。However, the high-power multiple harmonic filter has a complex structure and is difficult to design. Although high-frequency field simulation software can be used to analyze it, it takes a long time to directly use the software to simulate the filter as a whole, and the calculation accuracy is also low. Not too high.
发明内容SUMMARY OF THE INVENTION
本发明的目的是提供一种微波高功率多次谐波滤波器的设计方法及多次谐波滤波器,能 够简化大功率多次谐波滤波器的仿真计算,提高工程设计的精度,大大缩短设计的周期。The purpose of the present invention is to provide a design method of a microwave high-power multiple harmonic filter and a multiple harmonic filter, which can simplify the simulation calculation of the high-power multiple harmonic filter, improve the accuracy of engineering design, and greatly shorten the Design cycle.
本发明采用的技术方案为:The technical scheme adopted in the present invention is:
一种微波高功率多次谐波滤波器的设计方法,包括如下步骤:A design method of a microwave high-power multiple harmonic filter, comprising the following steps:
步骤S1;进行理论分析及方案论证,确定大功率多次谐波滤波器中不同频段谐波结构单 元的模块阵列的初步取值,即确定每个频段谐波结构单元中模块阵列的每行柱形模块个数m 和每列柱形模块个数n的具体值、柱形模块高度、径向尺寸以及行与列柱形模块间的距离。Step S1: Carry out theoretical analysis and solution demonstration, and determine the preliminary values of the modular arrays of the harmonic structural units of different frequency bands in the high-power multiple harmonic filter, that is, determine each row of columns of the modular array in the harmonic structural units of each frequency band The specific values of the number m of cylindrical modules and the number n of each column of cylindrical modules, the height of the cylindrical modules, the radial dimension, and the distance between the row and column of cylindrical modules.
步骤S2;在步骤S1的基础上进行不同频段谐波结构单元建模及仿真分析;即进行大功 率多次谐波滤波器整体结构结构建模及S参数和电场强度的电磁场仿真。Step S2; on the basis of step S1, carry out different frequency band harmonic structural unit modeling and simulation analysis; that is, carry out the overall structural structure modeling of the high-power multiple harmonic filter and the electromagnetic field simulation of S parameters and electric field strength.
步骤S3;根据步骤S2得出的各参数结果,结合目前加工精度水平、容易实现方式及对 指标影响最小化的因素进行大功率多次谐波滤波器的具体结构设计。Step S3; carry out the concrete structure design of the high-power multiple harmonic filter according to each parameter result obtained in step S2, in conjunction with the current machining accuracy level, the easy implementation mode and the factor that minimizes the influence of the index.
步骤S4;在步骤S3的基础上进行大功率多次谐波滤波器组装,并进行小信号测试、耐 压试验和高功率试验。Step S4: On the basis of step S3, assemble a high-power multiple harmonic filter, and perform a small-signal test, a withstand voltage test, and a high-power test.
所述步骤S2具体包括如下步骤:The step S2 specifically includes the following steps:
步骤S2.1;根据传输线原理,利用等效电路法求取大功率多次谐波滤波器的不同频段谐 波结构单元的电路模型等效电路图;不同频段谐波结构单元中每行m个柱形模块等效为一个 串联的阻抗Z,柱形模块中心的间距为L,模块阵列结构波导传输常数为β。Step S2.1: According to the transmission line principle, use the equivalent circuit method to obtain the equivalent circuit diagram of the circuit model of the harmonic structure unit of different frequency bands of the high-power multiple harmonic filter; m columns in each row of the harmonic structure unit of different frequency bands The cylindrical module is equivalent to a series impedance Z, the distance between the centers of the cylindrical modules is L, and the waveguide transmission constant of the module array structure is β.
步骤S2.2;对于不同频段谐波结构单元中的每排柱形模块,,进行矩阵归一化;归一化矩 阵Ai为:Step S2.2; for each row of columnar modules in the harmonic structural units of different frequency bands, perform matrix normalization; the normalized matrix A i is:
其中,in,
步骤S2.3;根据级联网络的传递乘积原理,计算得到大功率多次谐波滤波器等效电路模型 总的归一化A矩阵为:Step S2.3; According to the transfer product principle of the cascade network, the equivalent circuit model of the high-power multiple harmonic filter is calculated. The total normalized A matrix is:
步骤S2.4;计算大功率多次谐波滤波器的插入损耗特性和反射损耗特性;大功率多次谐 波滤波器的插入损耗特性和反射损耗特性的计算公式为:Step S2.4; Calculate the insertion loss characteristic and the reflection loss characteristic of the high-power multiple harmonic filter; The calculation formula of the insertion loss characteristic and the reflection loss characteristic of the high-power multiple harmonic filter is:
步骤S2.5;通过电磁场仿真软件计算单个频段谐波结构单元仿真模型得到的S参数,S 参数将代入式(2),得到每列柱形模块的等效阻抗Z;由式(4)和式(5)可以看出,只要求得每列柱 形模块的等效阻抗Z,就可以求出大功率多次谐波滤波器的不同频段谐波结构单元的N次谐 波衰减特性。Step S2.5: Calculate the S-parameter obtained by the simulation model of the single-frequency harmonic structural unit through the electromagnetic field simulation software, and the S-parameter will be substituted into the formula (2) to obtain the equivalent impedance Z of each column of cylindrical modules; by the formula (4) and It can be seen from formula (5) that only the equivalent impedance Z of each column of cylindrical modules can be obtained, and the N-th harmonic attenuation characteristics of the harmonic structural units of different frequency bands of the high-power multiple harmonic filter can be obtained.
步骤S2.6;对不同频段谐波结构单元的等效电路之间进行阻抗匹配,实现滤波器多频段 谐波滤波功能。Step S2.6: Impedance matching is performed between the equivalent circuits of the harmonic structural units of different frequency bands, so as to realize the multi-frequency band harmonic filtering function of the filter.
使用上述权利要求所述的微波高功率多次谐波滤波器的设计方法设计的多次谐波滤波器, 其特征在于:包括顶部组件、底部组件、前部组件和后部组件,顶部组件、底部组件、前部 组件和后部组件均为板状,顶部组件、底部组件、前部组件和后部组件的两端均向外垂直延 伸,形成矩形波导接口的一部分,所述顶部组件和底部组件完全相同,前部组件和后部组件 完全相同,顶部组件、底部组件、前部组件及后部组件共同围合形成筒状。The multiple harmonic filter designed using the method for designing a microwave high-power multiple harmonic filter according to the above claim is characterized in that: it includes a top assembly, a bottom assembly, a front assembly and a rear assembly, and the top assembly, The bottom component, the front component, and the rear component are all plate-shaped, and both ends of the top component, the bottom component, the front component, and the rear component extend vertically outward to form a part of the rectangular waveguide interface, and the top component and the bottom component The components are exactly the same, the front component and the rear component are exactly the same, and the top component, the bottom component, the front component and the rear component are enclosed together to form a cylindrical shape.
所述顶部组件和底部组件的内端面上均依次分布着多个互不连接的谐波结构单元,且顶 部组件和底部组件的内端面上设置的谐波结构单元互相对应,所述谐波结构单元均为模块阵 列,所述模块阵列均包括多个依次排列的柱形模块。A plurality of unconnected harmonic structure units are distributed on the inner end surfaces of the top component and the bottom component in sequence, and the harmonic structure units arranged on the inner end surfaces of the top component and the bottom component correspond to each other, and the harmonic structure units correspond to each other. The units are all module arrays, and the module arrays all include a plurality of columnar modules arranged in sequence.
所述顶部组件和底部组件的内端面上设置的谐波结构单元均为三个,分别为谐波结构单 元一、谐波结构单元二和谐波结构单元三;所述谐波结构单元一为9行5列模块阵列,包含 45个顶端圆角处理过的圆柱形模块;谐波结构单元二为9行11列模块阵列,包含99个顶端 圆角处理过的圆柱形模块;谐波结构单元三为7行16列模块阵列,包含112个顶端圆角处理 过的圆柱形模块。There are three harmonic structural units provided on the inner end faces of the top assembly and the bottom assembly, which are respectively the first harmonic structural unit, the second harmonic structural unit and the third harmonic structural unit; the first harmonic structural unit is Module array with 9 rows and 5 columns, including 45 cylindrical modules with rounded top corners;
本发明通过在大功率多次谐波滤波器的设计过程中采用了一种比较简便的方法,首先用 对称性原理简化成周期性加载的T分支,根据传输线原理,再用等效电路法求出ET分支的等 效电路,结合电磁场仿真软件计算得到的散射参数,提取大功率多次谐波滤波器中的单个谐波 结构单元阻抗值,进而利用单个谐波结构单元有源阻抗和滤波器特性的关系式求出滤波器的 衰减和反射损耗特性;这种方法将大功率多次谐波滤波器的仿真计算,提高工程设计的精度, 同时,可大大缩短设计的周期。In the present invention, a relatively simple method is adopted in the design process of the high-power multiple harmonic filter. First, the symmetry principle is used to simplify the T branch with periodic loading. According to the transmission line principle, the equivalent circuit method is used to obtain the The equivalent circuit of the ET branch is derived, combined with the scattering parameters calculated by the electromagnetic field simulation software, the impedance value of a single harmonic structural element in the high-power multiple harmonic filter is extracted, and then the active impedance of the single harmonic structural element and the filter are used. The attenuation and reflection loss characteristics of the filter can be obtained by using the relationship between the characteristics of the filter; this method will simulate the calculation of the high-power multiple harmonic filter, improve the accuracy of engineering design, and at the same time, can greatly shorten the design cycle.
附图说明Description of drawings
图1为本发明的流程图;Fig. 1 is the flow chart of the present invention;
图2为本发明所述的大功率多次谐波滤波器中单个宽面上单个谐波结构单元的模块阵列 示意图;Fig. 2 is the module array schematic diagram of single harmonic structural unit on single wide surface in the high-power multiple harmonic filter of the present invention;
图3为本发明所述的大功率多次谐波滤波器中单个谐波结构单元的等效电路图;3 is an equivalent circuit diagram of a single harmonic structural unit in the high-power multiple harmonic filter of the present invention;
图4为本发明所述的大功率多次谐波滤波器中不同谐波结构单元的阻抗匹配示意图;4 is a schematic diagram of impedance matching of different harmonic structural units in the high-power multiple harmonic filter according to the present invention;
图5为本发明所述的大功率多次谐波滤波器的设计生产流程图;Fig. 5 is the design and production flow chart of the high-power multiple harmonic filter of the present invention;
图6为本发明所述的大功率多次谐波滤波器的结构示意图;6 is a schematic structural diagram of the high-power multiple harmonic filter according to the present invention;
图7为本发明所述的大功率多次谐波滤波器中的底部组件上的多个谐波结构单元的结构 示意图;Fig. 7 is the structural representation of multiple harmonic structural units on the bottom assembly in the high-power multiple harmonic filter of the present invention;
图8为图7中a处的放大图;Fig. 8 is an enlarged view at a place in Fig. 7;
图9为图7中b处的放大图;Fig. 9 is an enlarged view at b in Fig. 7;
图10为图7中c处的放大图。FIG. 10 is an enlarged view of c in FIG. 7 .
具体实施方式Detailed ways
如图1和图5所示,一种微波高功率多次谐波滤波器(多频段谐波滤波器)的设计方法, 包括如下步骤:As shown in FIG. 1 and FIG. 5 , a design method of a microwave high-power multiple harmonic filter (multi-band harmonic filter) includes the following steps:
步骤S1;进行理论分析及方案论证,确定大功率多次谐波滤波器中不同频段谐波结构单 元的模块阵列的初步取值,即确定每个频段谐波结构单元中模块阵列的每行柱形模块个数m 和每列柱形模块个数n的具体值、柱形模块高度、径向尺寸以及行与列柱形模块间的距离。Step S1: Carry out theoretical analysis and solution demonstration, and determine the preliminary values of the modular arrays of the harmonic structural units of different frequency bands in the high-power multiple harmonic filter, that is, determine each row of columns of the modular array in the harmonic structural units of each frequency band The specific values of the number m of cylindrical modules and the number n of each column of cylindrical modules, the height of the cylindrical modules, the radial dimension, and the distance between the row and column of cylindrical modules.
如图2所示,大功率多次谐波滤波器中的不同频段谐波结构单元分布在波导的上下两个 宽面上,且设置在波导的上下两个宽面上的不同频段的谐波结构单元相同,谐波结构单元均 为模块阵列,每个模块阵列中,每列有n个柱形模块,n的取值根据抑制谐波次数选定,每 行有m个柱形模块,m的取值根据谐波抑制度选定,根据m及n不同的取值组合,该谐波结 构单元能够实现不同频段谐波的不同抑制度要求。As shown in Figure 2, the harmonic structural units of different frequency bands in the high-power multiple harmonic filter are distributed on the upper and lower broad surfaces of the waveguide, and the harmonics of different frequency bands are arranged on the upper and lower broad surfaces of the waveguide. The structural units are the same, and the harmonic structural units are all modular arrays. In each modular array, there are n columnar modules in each column. The value of n is selected according to the harmonic suppression order. There are m columnar modules in each row, and m The value of is selected according to the harmonic suppression degree, and according to the different value combinations of m and n, the harmonic structure unit can achieve different requirements for the harmonic suppression degree in different frequency bands.
步骤S2;在步骤S1的基础上进行不同频段谐波结构单元建模及仿真分析;即进行大功 率多次谐波滤波器整体结构建模及S参数和电场强度的电磁场仿真;具体包括步骤S2.1-步 骤S2.6。Step S2; on the basis of step S1, carry out the modeling and simulation analysis of harmonic structural units in different frequency bands; namely, carry out the overall structure modeling of the high-power multiple harmonic filter and the electromagnetic field simulation of S parameters and electric field strength; specifically including step S2 .1 - Step S2.6.
步骤S2.1;根据传输线原理,利用等效电路法求取大功率多次谐波滤波器的不同频段谐 波结构单元的电路模型等效电路图;如图3所示,不同频段谐波结构单元中每行m个柱形模 块等效为一个串联的阻抗Z,柱形模块中心的间距为L,模块阵列结构波导传输常数为β。Step S2.1: According to the transmission line principle, use the equivalent circuit method to obtain the equivalent circuit diagram of the circuit model of the harmonic structure units of different frequency bands of the high-power multiple harmonic filter; as shown in FIG. 3, the harmonic structure units of different frequency bands are obtained. Each row of m cylindrical modules is equivalent to a series impedance Z, the distance between the centers of the cylindrical modules is L, and the waveguide transmission constant of the module array structure is β.
步骤S2.2;对于不同频段谐波结构单元中的每排柱形模块,进行矩阵归一化;归一化矩 阵Ai为:Step S2.2: For each row of columnar modules in the harmonic structural units of different frequency bands, perform matrix normalization; the normalized matrix A i is:
其中,in,
步骤S2.3;根据级联网络的传递乘积原理,计算得到大功率多次谐波滤波器等效电路模 型总的归一化A矩阵为:Step S2.3; According to the transfer product principle of the cascade network, the total normalized A matrix obtained by calculating the equivalent circuit model of the high-power multiple harmonic filter is:
步骤S2.4;计算大功率多次谐波滤波器的插入损耗特性和反射损耗特性;大功率多次谐 波滤波器的插入损耗特性和反射损耗特性的计算公式为:Step S2.4; Calculate the insertion loss characteristic and the reflection loss characteristic of the high-power multiple harmonic filter; The calculation formula of the insertion loss characteristic and the reflection loss characteristic of the high-power multiple harmonic filter is:
步骤S2.5;通过电磁场仿真软件计算单个频段谐波结构单元仿真模型,得到S参数,将 S参数将代入式(2),得到每列柱形模块的等效阻抗Z;由式(4)和式(5)可以看出,只要求得每列 柱形模块的等效阻抗Z,就可以求出大功率多次谐波滤波器的不同频段谐波结构单元的N次 谐波衰减特性。Step S2.5: Calculate the single frequency band harmonic structural unit simulation model by electromagnetic field simulation software to obtain the S parameter, and the S parameter will be substituted into the formula (2) to obtain the equivalent impedance Z of each column of cylindrical modules; by the formula (4) It can be seen from formula (5) that only the equivalent impedance Z of each column of cylindrical modules can be obtained, and the N-th harmonic attenuation characteristics of the harmonic structural units of different frequency bands of the high-power multiple harmonic filter can be obtained.
步骤S2.6;如图4所示,对不同频段谐波结构单元的等效电路之间进行阻抗匹配,实现 滤波器多频段谐波滤波功能。Step S2.6: As shown in Figure 4, impedance matching is performed between the equivalent circuits of the harmonic structural units of different frequency bands, so as to realize the multi-frequency band harmonic filtering function of the filter.
步骤S3;根据步骤S2得出的各参数结果,结合目前加工精度水平、容易实现方式及对 指标影响最小化的因素进行大功率多次谐波滤波器的具体结构设计。Step S3; carry out the concrete structure design of the high-power multiple harmonic filter according to each parameter result obtained in step S2, in conjunction with the current machining accuracy level, the easy implementation mode and the factor that minimizes the influence of the index.
下面以X频段连续波25kW大功率多次谐波滤波器进行说明,由于不同的结构工艺对加工 材料的要求、机械加工的复杂程度及滤波器自身电性能都会有不同的影响,考虑材料应力及 散热特性,采用紫铜作为滤波器主体结构材料;为保证加工精度,将X频段连续波25kW大功 率多次谐波滤波器整体结构分成顶部组件1、底部组件2、前部组件3及后部组件4四部分进 行加工,如图6所示,顶部组件1、底部组件2、前部组件3及后部组件4均为板状,顶部组 件1、底部组件2、前部组件3及后部组件4的两端均向外垂直延伸,形成矩形波导接口的一 部分,顶部组件1及底部组件2完全相同,前部组件3与后部组件4完全相同,顶部组件1、 底部组件2、前部组件3及后部组件4共同围合形成波导的筒状。The following is an explanation of the X-band continuous wave 25kW high-power multiple harmonic filter. Due to different structural processes, the requirements for processing materials, the complexity of machining and the electrical properties of the filter itself will have different effects. Considering material stress and For heat dissipation characteristics, red copper is used as the main structural material of the filter; in order to ensure the processing accuracy, the overall structure of the X-band continuous wave 25kW high-power multiple harmonic filter is divided into
所述顶部组件1和底部组件2上的内端面上均依次分布着谐波结构单元一5、谐波结构 单元二6和谐波结构单元三7,谐波结构单元一5、谐波结构单元二6和谐波结构单元三7互 不连接,谐波结构单元一5、谐波结构单元二6和谐波结构单元三7均为模块阵列;如图7所示,每个谐波结构单元的柱形模块均为依次排列的圆柱形模块(不局限于圆柱形模块,也可为其它结构模块,比如长方体模块、锥形模块等),每个柱形模块棱角均圆角处理,可极大提高滤波器整体功率容量。On the inner end surfaces of the
如图8、图9和图10所示,所述谐波结构单元一5为一个9行5列模块阵列,包含45 个顶端圆角处理过的圆柱形模块,圆柱形模块间的行间距和列间距分别为a1和b1,圆柱形 模块高度为h1,该单元可实二次谐波抑制;谐波结构单元二6为一个9行11列模块阵列, 包含99个顶端圆角处理过的圆柱形模块,圆柱形模块间的行间距和列间距分别为a2和b2, 圆柱形模块高度为h2,该单元可实三次谐波抑制;谐波结构单元三7为一个7行16列模块 阵列,包含112个顶端圆角处理过的圆柱形模块,圆柱形模块间的行间距和列间距分别为a3 和b3,圆柱形模块高度为h3,该单元可实四次谐波抑制。As shown in Figure 8, Figure 9 and Figure 10, the
组装时,顶部组件1和底部组件2的谐波结构单元一5、谐波结构单元二6和谐波结构 单元三7相向扣在前部组件3和后部组件4上,用螺钉将各部分进行组装紧固,便形成高功 率X频段连续波25kW大功率多次谐波滤波器结构形式;考虑到微波高功率泄露辐射及高功率 容量问题等问题,经调试达到预期指标后,需要对个部件接触面边缘进行真空焊接;高功率 X频段连续波25kW大功率多次谐波滤波器的最终尺寸为:246mm×68.3mm×49.2mm。During assembly, the
经过前期的论证、大量的理论计算与电磁场仿真,目前该X频段连续波25kW大功率多次 谐波滤波器已加工、组装、调试、焊接完毕,经过测试,连续波功率容量可达25KW以上,各 种指标完全满足工程应用要求,并已经成功应用于我国某型号大功率发射机设备,为我国微 波超高功率深空探测解决了一项重要技术瓶颈,并为后续相关工作的进行奠定了一项技术基 础。After preliminary demonstration, a large number of theoretical calculations and electromagnetic field simulation, the current X-band continuous wave 25kW high-power multiple harmonic filter has been processed, assembled, debugged, and welded. After testing, the continuous wave power capacity can reach more than 25KW. Various indicators fully meet the engineering application requirements, and have been successfully applied to a certain type of high-power transmitter equipment in my country, solving an important technical bottleneck for my country's microwave ultra-high-power deep space exploration, and laying a foundation for the follow-up related work. technical basis.
利用本方法设计的X频段连续波25kW大功率多次谐波滤波器具有如下优点:The X-band continuous wave 25kW high-power multiple harmonic filter designed by this method has the following advantages:
功率容量高,连续波功率容量可达25kW以上;体积相对小,重量轻、长宽高仅246mm×68.3mm×49.2mm,对于超大功率发射机系统小型化有重要意义;端口采用标准BJ70矩形 波导接口,便于安装;性能指标良好,可同时对二、三及四次谐波进行抑制,二次谐波抑制 度大于60dB,三次谐波抑制度大于40dB,四次谐波抑制度大于30dB,极大降低了发射机对接 收信道的干扰;采用三个模块阵列结构单元,单元之间阻抗匹配,滤波器通带插入损耗小于 0.15dB,通带驻波小于1.1,大大提高了滤波器功率容量;结构简单、新颖,安装紧凑,工艺 难度小,加工方便,可靠性高,可广泛应用于各种高功率微波领域。High power capacity, continuous wave power capacity can reach more than 25kW; relatively small size, light weight, length, width and height are only 246mm × 68.3mm × 49.2mm, which is of great significance for the miniaturization of super-power transmitter systems; the port adopts standard BJ70 rectangular waveguide Interface, easy to install; good performance indicators, can suppress the second, third and fourth harmonics at the same time, the second harmonic suppression degree is greater than 60dB, the third harmonic suppression degree is greater than 40dB, the fourth harmonic suppression degree is greater than 30dB, extremely The interference of the transmitter to the receiving channel is greatly reduced; three modular array structural units are used, and the impedances between the units are matched, the filter passband insertion loss is less than 0.15dB, and the passband standing wave is less than 1.1, which greatly improves the power capacity of the filter; The structure is simple and novel, the installation is compact, the process difficulty is small, the processing is convenient, and the reliability is high, and it can be widely used in various high-power microwave fields.
利用本方法设计的X频段连续波25kW大功率多次谐波滤波器使某型号深空探测微波高功 放在进行微波功率输出时,通对多频段谐波及接收频带信号寄生输出抑制,实现消除对接收 设备的干扰,从而保证了发射机高功率工作时,而不干扰接收设备工作。The X-band continuous wave 25kW high-power multiple harmonic filter designed by this method enables a certain type of deep space exploration microwave high-power amplifier to output microwave power, through the suppression of multi-band harmonics and the spurious output of the receiving frequency band signal to achieve elimination. Interference to the receiving equipment, thus ensuring that the transmitter does not interfere with the working of the receiving equipment when the transmitter is working with high power.
步骤S4;在步骤S3的基础上进行大功率多次谐波滤波器组装,并进行小信号测试、耐 压试验和高功率试验。Step S4: On the basis of step S3, assemble a high-power multiple harmonic filter, and perform a small-signal test, a withstand voltage test, and a high-power test.
在经小信号测试后,如果指标不合格,有返修价值则可再次进行加工处理,否则报废处 理。After the small signal test, if the index is unqualified, it can be processed again if it has repair value, otherwise it will be scrapped.
在耐压试验后,如果出现不合格现象,需进行评估是否具有回炉价值,否则报废处理。After the withstand voltage test, if there is any unqualified phenomenon, it is necessary to evaluate whether it has the value of returning to the furnace, otherwise it will be scrapped.
在高功率试验后,如果出现电场击穿现象,需进一步评估,有返修价值,则通过机械加 工进行表面处理,否则报废处理。After the high-power test, if the electric field breakdown phenomenon occurs, further evaluation is required, and if there is a repair value, the surface treatment shall be carried out by mechanical processing, otherwise it shall be scrapped.
综上所述,本专利在大功率多次谐波滤波器的设计过程中采用了一种比较简便的方法, 首先用对称性原理简化成周期性加载的T分支,可将整个滤波器简化成多个ET分支串联结构, 根据传输线原理,再用等效电路法求出ET分支(ET分支:波导包括H面,E面,ET结构就是 指波导E面上T型分支,是个行业术语)的等效电路,结合电磁场仿真软件计算得到的散射参 数,提取大功率多次谐波滤波器中的单个谐波结构单元阻抗值,进而利用单个谐波结构单元有 源阻抗和滤波器特性的关系式求出滤波器的衰减和反射损耗特性;这种方法将大功率多次谐 波滤波器的仿真计算,提高工程设计的精度,同时,可大大缩短设计的周期。To sum up, this patent adopts a relatively simple method in the design process of the high-power multiple harmonic filter. First, it is simplified into a periodically loaded T branch by the principle of symmetry, and the entire filter can be simplified into a Multiple ET branches are connected in series. According to the transmission line principle, the equivalent circuit method is used to obtain the ET branch (ET branch: the waveguide includes the H surface and the E surface, and the ET structure refers to the T-shaped branch on the E surface of the waveguide, which is an industry term). The equivalent circuit, combined with the scattering parameters calculated by the electromagnetic field simulation software, extracts the impedance value of a single harmonic structural element in the high-power multiple harmonic filter, and then uses the relationship between the active impedance of a single harmonic structural element and the filter characteristics. Calculate the attenuation and reflection loss characteristics of the filter; this method will simulate the calculation of high-power multiple harmonic filters, improve the accuracy of engineering design, and at the same time, can greatly shorten the design cycle.
最后应说明的是:以上实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照 前述各实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对 前述实施例所记载的技术方案进行修改,或者对其中部分或者全部技术特征进行等同替换; 而这些修改或者替换,并不使相应技术方案的本质脱离本发明实施例技术方案的范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it is still The technical solutions described in the foregoing embodiments can be modified, or some or all of the technical features thereof can be equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.
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