CN108769491A - Microscope base, camera module and electronic equipment - Google Patents
Microscope base, camera module and electronic equipment Download PDFInfo
- Publication number
- CN108769491A CN108769491A CN201810825707.4A CN201810825707A CN108769491A CN 108769491 A CN108769491 A CN 108769491A CN 201810825707 A CN201810825707 A CN 201810825707A CN 108769491 A CN108769491 A CN 108769491A
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- China
- Prior art keywords
- hole
- microscope base
- wiring board
- accommodating hole
- electronic component
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
Abstract
The invention discloses microscope base, camera module and electronic equipments.Wherein camera module include wiring board, at least electronic component that is set on wiring board, the sensitive chip, the camera lens on the photosensitive path of sensitive chip and the filter element that are set on wiring board and for filter element to be supported to the microscope base above assist side, microscope base includes end and extends downwardly into the support portion of wiring board from end, filter element is maintained at the top of sensitive chip by end, end has an at least accommodating hole, at least an electronic component is contained in accommodating hole, and support portion height is no more than 0.38mm.The beneficial effects of the present invention are：Under the premise of meeting Shooting Technique requirement, the height of microscope base is reduced, the reduction of camera module integral thickness is realized by way of low cost.
Description
Technical field
The present invention relates to camera module technical field more particularly to microscope base, camera module and electronic equipments.
Background technology
Currently, mobile terminal in the market, such as mobile phone, tend to be lightening, the camera shooting being installed on accordingly on mobile terminal
Module also tends to minimize, and a hot spot of mobile phone camera module research at present is that the height for how reducing camera module.
Fig. 1 is the structural schematic diagram of camera module in the prior art, and camera module includes wiring board 1A, is set to circuit
Multiple electronic component 6A for being electrically connected on plate 1A and with wiring board 1A, it is set on wiring board 1A and is electrically connected with wiring board 1A
Sensitive chip 2A, the camera lens 3A on the photosensitive paths sensitive chip 2A and filter element 4A and for that will filter member
Microscope base 5A above part 4A support assist sides 1A, light is incident on after camera lens 3A and filter element 4A photosensitive successively
On chip 2A.Cavity is formed between microscope base 5A and wiring board 1A to accommodate electronic component 6A.In order to avoid higher-height electricity
Sub- component 6A, the height of microscope base 5A are higher.In addition, when microscope base 5A uses plastic material, due to the limitation of Shooting Technique, mirror
The wall thickness of seat 5A is difficult to do thin, therefore can not reduce the whole height of microscope base 5A by reducing wall thickness.Certainly, there are some microscope bases
5A processes to obtain the microscope base 5A of metal material by techniques such as punching presses, this can be reduced to a certain extent to reduce size
The height of microscope base 5A, but its manufacturing process time and effort consuming, manufacturing cost is high, is unfavorable for promoting.
Invention content
For overcome the deficiencies in the prior art, the purpose of the present invention is to provide a kind of microscope bases, advantageously reduce camera shooting mould
The height of group, realizes the miniaturization of camera module.
The purpose of the present invention adopts the following technical scheme that realization：
A kind of microscope base is suitable for setting in the circuit board for supporting filter element comprising end and from the end
The support portion that portion extends downwardly, the end has at least one accommodating hole for accommodating electronic component on wiring board, described
The height of support portion is no more than 0.38mm.
Further, the height of the support portion is no more than 0.2mm.
Further, the accommodating hole is through-hole, and also there is light hole, filter element to be suitable for being arranged described for the end
At light hole, the microscope base further includes sealing element, and the sealing element is extended downwardly from the end, and the sealing element is by the appearance
Hole is set with the light hole to be isolated.
Further, the light hole is located at the middle part of the end, is provided at left and right sides of the light hole multiple
Accommodating hole, the sealing element include two sealing baffles, and two sealing baffles are separately positioned on the left and right sides of the light hole,
Each accommodating hole to be isolated with the light hole.
Further, the end has an installation through-hole, the inner wall of the installation through-hole integrally introversion extend to form it is outstanding
Arm, the cantilever limit a light hole, and the upper surface of the cantilever is housed inside the electricity of the accommodating hole less than at least one
The upper surface of sub- component.
According to another aspect of the present invention, a kind of camera module is also provided, including wiring board, is set to the wiring board
On an at least electronic component, be set on the wiring board sensitive chip, be set to the photosensitive path of the sensitive chip on
Camera lens and filter element and the microscope base for being supported on the filter element above the wiring board, the microscope base
The support portion of the wiring board is extended downwardly into including end and from the end, the filter element is protected by the end
It holds in the top of the sensitive chip, there is an at least accommodating hole, at least one electronic component to be contained in institute for the end
It states in accommodating hole, the height of the support portion is no more than 0.38mm.
Further, the height of the support portion is no more than 0.2mm.
Further, the accommodating hole is through-hole, and the microscope base further includes for each accommodating hole and the sense to be isolated
The sealing element of optical chip and/or sealing structure for sealing the accommodating hole.
Further, the microscope base includes sealing element, and the sealing element extends downwardly into the wiring board from the end,
Each accommodating hole to be isolated with the sensitive chip.
Further, the sensitive chip is arranged at the middle part of the wiring board, and each electronic component is arranged in institute
It states on the wiring board at left and right sides of sensitive chip, also there is light hole, the filter element to be arranged described for the end
At light hole, each accommodating hole is located in the left and right sides of the light hole, and the sealing element includes two sealing baffles, two institutes
State the left and right sides that sealing baffle is separately positioned on the light hole, two sealing baffles are by the light hole and each appearance
Set hole isolation.
Further, the microscope base includes sealing structure, and the sealing structure is film, is attached to the upper table of the end
Face seals the upper end opening of the accommodating hole；Alternatively, the sealing structure is to the accommodating hole encapsulating by forming, with
The accommodating hole is sealed.
Further, the accommodating hole corresponds to an electronic component, to accommodate the electronic component.
Further, the camera module further includes the driving device for driving the lens displacement, the driving dress
It installs above the microscope base, the accommodating hole is through-hole, and the upper surface of the electronic component is upper less than the end
The bottom surface on surface, the driving device has extended downwardly at least positioning piece, and it is described accommodating that the locating piece extends at least one
In hole.
Further, the wiring board sinks to being formed a groove at the position for installing the sensitive chip, described photosensitive
Chip is arranged in the groove.
Further, the end has an installation through-hole, the inner wall of the installation through-hole integrally introversion extend to form it is outstanding
Arm, the cantilever limit a light hole, and the upper surface of the cantilever is less than the upper surface of the end, the filter element setting
In on the cantilever, the upper surface of at least one electronic component is higher than the lower surface of the filter element.
According to another aspect of the present invention, a kind of camera module is also provided, including wiring board, is set to the wiring board
On an at least electronic component, be set on the wiring board sensitive chip, be set to the photosensitive path of the sensitive chip on
Camera lens and filter element and the microscope base for being supported on the filter element above the wiring board, the microscope base
The support portion of the wiring board is extended downwardly into including end and from the end, the filter element is protected by the end
It holds in the top of the sensitive chip, there is an at least accommodating hole, at least one electronic component to be contained in institute for the end
It states in accommodating hole, the upper surface of at least one electronic component is higher than the lower surface of the filter element.
According to another aspect of the present invention, a kind of electronic equipment including camera module of the present invention is also provided.
Compared with prior art, the beneficial effects of the present invention are：Under the premise of meeting Shooting Technique requirement, mirror is reduced
The height of seat realizes the reduction of camera module integral thickness by way of low cost.
Description of the drawings
Fig. 1 is the schematic diagram of camera module in the prior art；
Fig. 2 is the partial enlarged view of Fig. 1, and shows the height of electronic component and microscope base each section；
Fig. 3 is the schematic diagram of first preferred implementation of camera module according to the present invention；
Fig. 4 is first preferred implementation partial schematic diagram of camera module according to the present invention；
Fig. 5 is the schematic diagram of second preferred implementation of camera module according to the present invention；
Fig. 6 is the partial schematic diagram of second preferred implementation of camera module according to the present invention；
Fig. 7 is the schematic diagram that the third of camera module according to the present invention is preferably implemented；
Fig. 8 is the schematic diagram of a preferred embodiment of the wiring board of camera module according to the present invention, and wherein dotted line shows
When microscope base of having anticipated is arranged in the circuit board, the position of sealing baffle；
Fig. 9 is the partial schematic diagram of a preferred embodiment of camera module according to the present invention, it is shown that electronics member device
The height of part and microscope base each section；
Figure 10 is the partial schematic diagram of another preferred embodiment of camera module according to the present invention, it is shown that electronics member
The height of device and microscope base each section；
Figure 11 is the partial schematic diagram of another preferred embodiment of camera module according to the present invention, it is shown that electronics member
The height of device and microscope base each section；
Figure 12 is the partial schematic diagram of another preferred embodiment of camera module according to the present invention, it is shown that electronic component
And the height of microscope base each section；
In figure：1, wiring board；10, groove；2, sensitive chip；3, camera lens；4, filter element；5, microscope base；51, end；
510, light hole；511, accommodating hole；52, support portion；53, sealing element；531, sealing baffle；54, sealing structure；55, cantilever；
50, accommodating chamber；6, electronic component；7, driving device；71, locating piece.
Specific implementation mode
In the following, in conjunction with specific implementation mode, the present invention is described further, it should be noted that is do not collided
Under the premise of, new embodiment can be formed between various embodiments described below or between each technical characteristic in any combination.
In the description of the present invention, it should be noted that " transverse direction ", " vertical if any term "center" for the noun of locality
To ", " length ", " width ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top",
The indicating positions such as "bottom", "inner", "outside", " clockwise ", " counterclockwise " and position relationship are orientation based on ... shown in the drawings or position
Relationship is set, the narration present invention is merely for convenience of and simplifies description, device is not indicated or implied the indicated or element is necessary
It constructs and operates with specific orientation, with particular orientation, should not be understood as the specific protection domain of the limitation present invention.
As shown in figures 3-8, the present invention provides a kind of camera module, including wiring board 1, is set on wiring board 1 and and line
Road plate 1 be electrically connected an at least electronic component 6, be set on wiring board 1 and be electrically connected with wiring board 1 sensitive chip 2,
Camera lens 3 and filter element 4 on 2 photosensitive path of sensitive chip and for filter element 4 to be supported assist side 1
The microscope base 5 of top, light are incident on after camera lens 3 and filter element 4 on sensitive chip 2 successively.Microscope base 5 includes end 51
And the support portion 52 extended downwardly from end 51, support portion 52 is set on wiring board 1, so that end 51 is in wiring board 1
Top, filter element 4 are maintained at the top of sensitive chip 2 by end 51, have an at least accommodating hole 511 on end 51, until
A few electronic component 6 is contained in accommodating hole 511.
Since the height of electronic component 6 is usually higher, higher-height electronic component 6 is received into microscope base 5
In accommodating hole 511, when reducing the height of support portion 52, end 51 not will produce interference with electronic component 6, therefore can pass through
Reduce the height of support portion 52 to reduce the whole height of camera module.
When the microscope base 5 of the present invention is using injection molding technique, the thickness of end 51 can not reduce, thick when to avoid injection molding
Degree is too thin to be molded, and support portion 52 due to be extend from end 51 and with end 51 it is integrally formed, it is appropriate to drop
There is no thickness too thin the problem of can not being molded for its low height.Namely the present invention microscope base 5 in the case where meeting processing technology,
Height can be further decreased, to obtain thinner camera module.
Support portion 52 is integrally extended downwardly along the edge of end 51.When microscope base 5 is arranged in assist side 1, support portion 52
Around the edge of setting assist side 1, to form an accommodating chamber 50 between end 51, support portion 52 and wiring board 1,
Wiring board 1, sensitive chip 2 and each electronic component 6 are located in the accommodating chamber 50, and microscope base 5 can play protection circuit plate
1, the effect of sensitive chip 2 and each electronic component 6, avoids it by externalities.Preferably, support portion 52 and line
It is tightly connected between road plate 1, accommodating chamber is entered by the gap between microscope base 5 and wiring board 1 so as to avoid impurity such as dusts
In 50.
There is installation through-hole, filter element 4 to be arranged at the installation through-hole for end 51.Preferably, the installation through-hole
Inner wall integrally introversion extends to form cantilever 55, cantilever 55 limits a light hole 510, and filter element 4 is set on cantilever 55,
Sensitive chip 2 is arranged below light hole 510, is suitable for being incident on sensitive chip 2 by the light of light hole 510.Cantilever 55
Upper surface is less than the upper surface of end 51, and the space of 512 top of cantilever is for accommodating filter element 4.In addition, it is contemplated that reducing
The molding difficulty of microscope base 5, it is preferable that the lower surface of cantilever 55 is flushed with the lower surface of end 51.
When processing microscope base 5 using Shooting Technique, the technique that accommodating hole 511 is processed as to through-hole is simpler, and cost is also more
It is low, it is preferred that accommodating hole 511 is the both sides that through-hole namely accommodating hole 511 are connected to end 51.
It is dirty to be easy to enter installation wiring board 1 from 5 outside of microscope base by accommodating hole 511 when accommodating hole 511 is through-hole
Side, and to setting assist side 1 on sensitive chip 2 pollute.To solve this problem, in a preferred embodiment
In, as shown in Figure 3,4, microscope base 5 further comprises that sealing element 53, sealing element 53 are extended downwardly from end 51, by light hole 510 with
Each accommodating hole 511 is isolated.When microscope base 5 is arranged in assist side 1, sealing element 53 is isolated by sensitive chip 2 with each accommodating hole 511,
The dust entered from accommodating hole 511 is avoided to pollute sensitive chip 2.Sealing element 53 can be integrally formed with end 51, can also be
After separately formed, then by be bonded etc. techniques be attached at 51 lower surface of end.In view of reducing the molding difficulty of microscope base 5, preferably
Ground after sealing element 53 is separately formed, then is connect with end 51.
It is noted that when accommodating hole 511 is only one, sealing element 53 can extend to separately from the side of end 51
Side makes accommodating hole 511 be in the both sides of sealing element 53 with light hole 510, thus when microscope base 5 is arranged in assist side 1, it is close
Sealing 53 is isolated by accommodating hole 511 with sensitive chip 2；Sealing element 53 can also be to be extended downwardly around 511 entirety of the accommodating hole
Column, so that accommodating hole 511 and light hole 510 be in the both sides of sealing element 53, to when in the setting assist side 1 of microscope base 5
When, sealing element 53 is isolated by accommodating hole 511 with sensitive chip 2.When accommodating hole 511 is multiple, and it is irregularly distributed in thang-kng
When 510 surrounding of hole, sealing element 53 can be the column integrally extended downwardly around light hole 510, make each accommodating hole 511 with
Light hole 510 is in the both sides of sealing element 53, to which when microscope base 5 is arranged in assist side 1, sealing element 53 is by each accommodating hole
511 are isolated with sensitive chip 2.With the not exclusive list of enumerating of 53 set-up mode of upper seal, when actual setting sealing element 53,
Suitable set-up mode can be selected according to the quantity of accommodating hole 511 and position.
Electronic component 6 or wiring board 1 are impacted to avoid dust or steam from entering accommodating hole 511, it is excellent at one
It selects in embodiment, as shown in Figure 5,6, the upper end of accommodating hole 511 is equipped with sealing structure 54, and sealing structure 54 is by accommodating hole 511
Upper end opening seals, and is entered in accommodating chamber 50 by accommodating hole 511 to avoid dust or steam, is realized in accommodating chamber 50
The protection of wiring board 1, sensitive chip 2 and electronic component 6.Sealing structure 54 can be membrane structure, pass through binder
It is attached to the upper surface of end 51, to realize the sealing to 511 upper end opening of accommodating hole.Sealing structure 54 can also be to pass through filling
Adhesive process is formed in the seal film layer of accommodating hole 511, to realize the sealing to 511 upper end opening of accommodating hole.
In order to obtain better seal effect, external environment is reduced to wiring board 1, sensitive chip 2 and electronic component 6
Influence, microscope base 5 can include sealing element 53 and sealing structure 54 simultaneously.Sealing structure 54 be used to prevent extraneous impurity with
And steam enters in accommodating chamber 50.Sealing element 53 has manufactured the space of sealing sensitive chip 2 in accommodating chamber 50, further strengthens
To the sealing effect of sensitive chip 2.
In addition, an accommodating hole 511 can accommodate multiple electronic components 6, an electronic component can also be only accommodated
6.The advantages of one accommodating hole 511 accommodates multiple electronic components 6 is the accommodating hole that the processing of microscope base 5 is relatively easy, needs
511 quantity can be reduced, but inevitably there is interval between multiple electronic components 6, therefore multiple electronic components 6 accommodate
When in an accommodating hole 511, the gap of accommodating hole 511 is more, is unfavorable for realizing sealing.It is accommodated in one accommodating hole 511
The advantages of one electronic component 6 is：The sectional dimension and shape of accommodating hole 511 can be according to the sections of electronic component 6
Dimension and shape is designed, and ensure that the high fit of electronic component 6 and accommodating hole 511, reduces accommodating hole 511
Sealing difficulty.
Electronic component 6 includes but not limited to capacitance, and the height of electronic component 6 is generally not less than 0.38mm, usually not
More than 0.55mm.In the present invention, the height of support portion 52 is no more than 0.38mm.Height is more than the electronic component of support portion 52
6 upper end is accommodated in accommodating hole 511, highly with the upper end of 52 identical electronic component 6 of support portion and 511 phase of accommodating hole
It is right, to ensure that the upper end of electronic component 6 will not be extruded.
In addition, it is contemplated that the height of each electronic component 6 is not necessarily identical on wiring board 1, microscope base 5 is highest with height
Electronic component 6 is designed for standard, when ensureing that microscope base 5 is arranged in assist side 1, the upper table of each electronic component 6
Face is without departing from the upper surface of end 51.
According to a preferred embodiment of the present invention, 1 any height of wiring board is more than that the electronic component 6 of support portion 52 is equal
A corresponding accommodating hole 511, to when microscope base 5 is arranged in assist side 1, highly be more than the electronics member device of 51 lower surface of end
Part 6 is contained in corresponding accommodating hole 511.The internal diameter of accommodating hole 511 is outer less times greater than corresponding electronic component 6
Diameter to ensure that electronic component 6 can be smoothly fit into accommodating hole 511, while also avoiding 511 inner wall of accommodating hole and electronics
Gap is excessive between component 6, and the impurity such as dust are entered in accommodating chamber 50 or are unfavorable for by accommodating hole 511 described in later stage sealing
Accommodating hole 511.
Further, when microscope base 5 is arranged in assist side 1, filter element 4 is arranged when on cantilever 55, an at least electronics
The upper surface of component 6 is higher than the lower surface of filter element 4, can be by the height of reduction cantilever 55, so that the height of filter element 4
Degree declines, but its difficulty of processing is larger.When the height dimension of end 51 is the required minimum dimension of processing, cantilever 55 is reduced
Height can also be realized by reducing the height of support portion 52.Preferably, the height of support portion 52 is no more than 0.2mm,
I.e. the distance between the lower surface of end 51 and wiring board 1 are no more than 0.2mm.
There are many arrangement modes in 6 assist side 1 of each electronic component, since sensitive chip 2 is generally arranged at circuit
The middle part of plate 1, therefore each electronic component 6 is usually arranged to the surrounding of assist side 1 around sensitive chip 2, but electronics is first
The volume of device 6 is larger, if the position that electronic component 6 is distributed excessively disperses, is unfavorable for the reduction of 1 size of wiring board；Together
When with comprehensive screen mobile phone popularization, more need the frame position that module is set to mobile phone, therefore need wiring board by corresponding to
Pole narrow side so that module is as close to mobile phone frame position.A preferred implementation according to the present invention, as shown in figure 8, will
Each electronic component 6 is arranged on the wiring board 1 of 2 left and right sides of sensitive chip, the wiring board of 2 other both sides of such sensitive chip
1 size can be designed narrower, to reducing the size of camera module advantageously.In this embodiment, microscope base 5 includes multiple
Accommodating hole 511, each accommodating hole 511 are distributed in the left and right sides of light hole 510, and sealing element 53 includes two sealing baffles 531, and two is close
Block plate 531 is separately positioned on 510 left and right sides of light hole, it is preferable that the rear and front end of sealing baffle 531 and support portion 52 are close
Envelope connection, each accommodating hole 511 and light hole 510 is completely isolated.When microscope base 5 is arranged in assist side 1, sealing baffle
531 are located at the left and right sides of sensitive chip 2, and sensitive chip 2 is isolated with the electronic component 6 at left and right sides of it, thus
Form sealing space between sealing baffle 531, support portion 52, wiring board 1 and filter element 4, avoid dust pass through it is accommodating
Hole 511 enters sensitive chip 2.It is noted that the lower end of sealing baffle 531 is bonded with the upper surface of wiring board 1, it can also
Glue-line is set between sealing baffle 531 and wiring board 1 to enhance the sealing effect of sealing baffle 531.I.e. in the present embodiment, institute
The both sides that electronic component 6 is designed at the wiring board 1 are stated, two sealing baffle 531 of structure design can be adapted to, so that institute
Electronic component 6 is stated with the sensitive chip 2 to be isolated.
By the way that each electronic component 6 to be arranged on the wiring board 1 of 2 left and right sides of sensitive chip, can obtain with pole
The wiring board 1 of narrow side, can be with when the camera module is applied to mobile phone so as to prepare the camera module with a pole narrow side
Camera module is arranged in the position closer to edge, to allow mobile phone to have higher screen accounting.
The main function of microscope base 5 is filter element 4 being maintained at the top of sensitive chip 2, make filter element 4 with it is photosensitive
Maintained a certain distance between chip 2, thus consider reduce 5 size of microscope base while, need ensure filter element 4 with it is photosensitive
There is distance between chip 2.During reducing by 5 height of microscope base, the height of filter element 4 can be caused to decline, in some cases
The distance between sensitive chip 2 and filter element 4 may be made to be unsatisfactory for requirement, in order to solve this problem, in the present invention
A preferred embodiment in, as shown in Figure 5,6, wiring board 1 installation sensitive chip 2 position at sink to forming a groove
10, sensitive chip 2 is arranged in groove 10, to reduce module size.Ensureing between sensitive chip 2 and filter element 4
In the case that distance is met the requirements, by reducing the height of sensitive chip 2, microscope base 5 is allowed to further decrease height to obtain more
The camera module of small size.
The camera module of the present invention can be fixed-focus module, can also be dynamic burnt module.When the camera module is
When dynamic coke module, as shown in Figure 7 comprising the driving device 7 for driving camera lens 3 to move realizes camera lens using driving device 7
3 focusing.Driving device 7 includes but not limited to motor.Driving device 7 is arranged above microscope base 5, the bottom surface of driving device 7 to
Under be extended at least positioning piece 71, locating piece 71 extends in an at least accommodating hole 511, to pass through locating piece 71 with hold
The cooperation for setting hole 511 realizes that the accurate positionin to driving device 7 is also beneficial to simultaneously to improve the installation accuracy of driving device 7
Improve the reliability and stability of driving device 7.That is, the accommodating hole 511 on microscope base 5 provided by the invention not only facilitates mirror
The reduction of 5 sizes of seat, is also used as the structure of positioning drive unit 7, kills two birds with one stone.
In some embodiments, accommodating hole corresponding with locating piece 71 511 is accommodating electronic component 6 and to carry out encapsulating close
After envelope forms sealing structure 54, the upper surface of sealing structure 54 is less than the upper surface of end 51, therefore the lower end of locating piece 71 can
To be inserted into accommodating hole 511, by the cooperation of accommodating hole 511 and locating piece 71, the positioning to driving device 7 is realized.
In further embodiments, can also be after locating piece 71 be installed to accommodating hole 511, then carry out sealant pouring and sealing shape
At sealing structure 54.
【Comparative example 1】
Using mirror-seat structure as shown in Figure 1 and Figure 2, microscope base 5A includes end 51A and is extended downwardly from end 51A
Support portion 52A.The height of electronic component 6A is 0.38mm, when in order to avoid on microscope base 5A installation assist sides 1A, with electronics
Component 6A generates interference, and the distance between the lower surface of end 51A and wiring board 1A are set as 0.4mm namely support portion 52A
Height be 0.4mm.End 51A includes the cantilever 55A for limiting light hole, and filter element 4A is placed on cantilever 55A, cantilever
The lower surface of 55A is flushed with the lower surface of end 51A, and cantilever 55A thickness is 0.15mm, the upper surface of cantilever 55A to microscope base 5A
The distance of upper surface is 0.25mm, and the space above cantilever 55A is mainly used for accommodating the height of filter element 4A namely end 51A
Degree is 0.4mm.
The whole height of microscope base 5A is the sum of the height of end 51A and support portion 52A, i.e. 0.8mm.
It is noted that the distance between the lower surface of end 51A and wiring board 1A will be slightly higher than electronic component
The height of 6A namely the height of support portion 52A should avoid end 51A's more than 0.38mm to allow certain installation error
Extruding is generated between lower surface and electronic component 6A.
【Embodiment 1】
Using mirror-seat structure shown in Fig. 9, the height of electronic component 6 is 0.38mm.The height of 5 end 51 of microscope base is
0.4mm, the wherein thickness of cantilever 55 are 0.15mm, and the lower surface of cantilever 55 flushes with the lower surface of end 51, cantilever 55 it is upper
The distance of surface to 51 upper surface of end is 0.25mm.The height of support portion 52 be 0.38mm, the upper end of electronic component 6 with
Accommodating hole 511 is opposite, is not in that 6 upper end of electronic component is extruded since the upper end of electronic component 6 is cavity
The case where.
The whole height of microscope base 5 is the sum of the height of end 51 and support portion 52, i.e. 0.78mm.
【Embodiment 2】
Using mirror-seat structure shown in Fig. 10.The height of electronic component 6 is 0.38mm.The height of 5 end 51 of microscope base is
0.4mm, the wherein height of cantilever 55 are 0.15mm, and the lower surface of cantilever 55 flushes with the lower surface of end 51, cantilever 55 it is upper
The distance of surface to 51 upper surface of end is 0.25mm.The height of support portion 52 is 0.3mm.The upper end of electronic component 6 is located at
In accommodating hole 511, the distance apart from 51 upper surface of end is 0.32mm.
The whole height of microscope base 5 is the sum of the height of end 51 and support portion 52, i.e. 0.7mm.
【Embodiment 3】
Using mirror-seat structure shown in Figure 11.The height of electronic component 6 is 0.38mm.The height of 5 end 51 of microscope base is
0.4mm, the wherein thickness of cantilever 55 are 0.15mm, and the lower surface of cantilever 55 flushes with the lower surface of end 51, cantilever 55 it is upper
The distance of surface to 51 upper surface of end is 0.25mm.The height of support portion 52 is 0.2mm.Electronic component 6 is located at accommodating hole
In 511, the distance of the upper surface apart from end 51 is 0.22mm.
The whole height of microscope base 5 is the sum of the height of end 51 and support portion 52, i.e. 0.6mm.
【Embodiment 4】
Using mirror-seat structure shown in Figure 12, the height of electronic component 6 is 0.38mm.The height of 5 end 51 of microscope base is
0.4mm, the wherein thickness of cantilever 55 are 0.15mm, and the lower surface of cantilever 55 flushes with the lower surface of end 51, cantilever 55 it is upper
The distance of surface to 51 upper surface of end is 0.25mm.The height of support portion 52 is 0.1mm.Electronic component 6 is located at accommodating hole
In 511, the distance of the upper surface apart from end 51 is 0.15mm.
The whole height of microscope base 5 is the sum of the height of end 51 and support portion 52, i.e. 0.5mm.
Pass through comparative example 1 and embodiment 1,2,3, it can be seen that the height of electronic component is identical, height of microscope base end
Spend it is identical in the case of, mirror-seat structure using the present invention, the whole height of microscope base can be accomplished lower.In addition, embodiment 1,
2, the thickness of 3 microscope base end does not reduce, and can meet the requirement of Shooting Technique, therefore its processing cost is low, be conducive to push away
It is wide to use.It is worth noting that, the present invention does not generate limitation to the thickness of microscope base end, i.e., in the case of technique meets, microscope base
The thickness of end can also reduce.
The camera module of the present invention can be applied to various electronic, such as smart mobile phone, palm PC electronics
Equipment.Due to lower than the camera module of the prior art in the camera module its height of the present invention, be conducive to electronic equipment
It is lightening.
The above embodiment is only the preferred embodiment of the present invention, and the scope of protection of the present invention is not limited thereto,
The variation and replacement for any unsubstantiality that those skilled in the art is done on the basis of the present invention belong to institute of the present invention
Claimed range.
Claims (18)
1. a kind of microscope base, be suitable for setting in the circuit board for supporting filter element, which is characterized in that it include end and
The support portion extended downwardly from the end, the end have at least one for accommodating the accommodating of electronic component on wiring board
The height in hole, the support portion is no more than 0.38mm.
2. microscope base according to claim 1, which is characterized in that the height of the support portion is no more than 0.2mm.
3. microscope base according to claim 1, which is characterized in that the accommodating hole is through-hole, and the end also has thang-kng
Hole, filter element be suitable for be arranged at the light hole, the microscope base further includes sealing element, the sealing element from the end to
The accommodating hole is isolated with the light hole for lower extension, the sealing element.
4. microscope base according to claim 3, which is characterized in that the light hole is located at the middle part of the end, described logical
Multiple accommodating holes are provided at left and right sides of unthreaded hole, the sealing element includes two sealing baffles, and two sealing baffles are set respectively
It sets in the left and right sides of the light hole, each accommodating hole is isolated with the light hole.
5. according to any microscope bases of claim 1-4, which is characterized in that the end has installation through-hole, the installation
Integrally introversion extends to form cantilever to the inner wall of through-hole, and the cantilever limits a light hole, and the upper surface of the cantilever is less than extremely
Few one is housed inside the upper surface of the electronic component of the accommodating hole.
6. a kind of camera module, including wiring board, be set on the wiring board an at least electronic component, be set to it is described
Sensitive chip on wiring board, the camera lens on the photosensitive path of the sensitive chip and filter element and for by institute
State the microscope base that filter element is supported on above the wiring board, which is characterized in that the microscope base includes end and from the end
Portion extends downwardly into the support portion of the wiring board, and the filter element is maintained at the upper of the sensitive chip by the end
There is an at least accommodating hole, at least one electronic component to be contained in the accommodating hole for side, the end, the support portion
Height be no more than 0.38mm.
7. camera module according to claim 6, which is characterized in that the height of the support portion is no more than 0.2mm.
8. camera module according to claim 6, which is characterized in that the accommodating hole is through-hole, and the microscope base further includes
Sealing element for each accommodating hole and the sensitive chip to be isolated and/or the sealing structure for sealing the accommodating hole.
9. camera module according to claim 8, which is characterized in that the microscope base includes sealing element, the sealing element from
The end extends downwardly into the wiring board, and each accommodating hole is isolated with the sensitive chip.
10. camera module according to claim 9, which is characterized in that the sensitive chip is arranged in the wiring board
Middle part, each electronic component are arranged on the wiring board at left and right sides of the sensitive chip, and the end also has
Light hole, the filter element are arranged at the light hole, and each accommodating hole is located in the left and right sides of the light hole,
The sealing element includes two sealing baffles, and two sealing baffles are separately positioned on the left and right sides of the light hole, described in two
Sealing baffle is isolated by the light hole with each accommodating hole.
11. camera module according to claim 8, which is characterized in that the microscope base includes sealing structure, the sealing knot
Structure is film, is attached to the upper surface of the end, and the upper end opening of the accommodating hole is sealed；Alternatively, the sealing knot
Structure is sealed the accommodating hole by being formed to the accommodating hole encapsulating.
12. according to any camera modules of claim 6-11, which is characterized in that the accommodating hole corresponds to an electronics
Component, to accommodate the electronic component.
13. according to any camera modules of claim 6-11, which is characterized in that further include for driving the camera lens position
The driving device of shifting, the driving device are arranged above the microscope base, and the accommodating hole is through-hole, the electronic component
Upper surface is less than the upper surface of the end, and the bottom surface of the driving device has extended downwardly at least positioning piece, the positioning
Part extends at least one accommodating hole.
14. according to any camera modules of claim 6-11, which is characterized in that the wiring board is described photosensitive in installation
Sink to forming a groove at the position of chip, the sensitive chip is arranged in the groove.
15. according to any camera modules of claim 6-11, which is characterized in that the end has installation through-hole, institute
Stating the inner wall of installation through-hole, integrally introversion extends to form cantilever, and the cantilever limits a light hole, the upper surface of the cantilever
Less than the upper surface of the end, the filter element is set on the cantilever, the upper table of at least one electronic component
Face is higher than the lower surface of the filter element.
16. a kind of camera module, including wiring board, be set on the wiring board an at least electronic component, be set to institute
State the sensitive chip on wiring board, the camera lens on the photosensitive path of the sensitive chip and filter element and for inciting somebody to action
The filter element is supported on the microscope base above the wiring board, which is characterized in that the microscope base includes end and from described
End extends downwardly into the support portion of the wiring board, and the filter element is maintained at the sensitive chip by the end
There is an at least accommodating hole, at least one electronic component to be contained in the accommodating hole for top, the end, at least one institute
The upper surface for stating electronic component is higher than the lower surface of the filter element.
17. camera module according to claim 16, which is characterized in that the accommodating hole is through-hole, and the microscope base also wraps
Include the sealing element for each accommodating hole and the sensitive chip to be isolated and/or the sealing knot for sealing the accommodating hole
Structure.
18. a kind of electronic equipment, which is characterized in that include the camera module as described in claim 6-17 is any.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810825707.4A CN108769491A (en) | 2018-07-25 | 2018-07-25 | Microscope base, camera module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810825707.4A CN108769491A (en) | 2018-07-25 | 2018-07-25 | Microscope base, camera module and electronic equipment |
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| CN108769491A true CN108769491A (en) | 2018-11-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810825707.4A Pending CN108769491A (en) | 2018-07-25 | 2018-07-25 | Microscope base, camera module and electronic equipment |
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| CN (1) | CN108769491A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109407443A (en) * | 2018-12-20 | 2019-03-01 | 宁波舜宇光电信息有限公司 | A kind of camera module |
| CN109491181A (en) * | 2019-01-02 | 2019-03-19 | 昆山丘钛微电子科技有限公司 | Camera mould group and its manufacturing method |
| CN109743482A (en) * | 2019-01-21 | 2019-05-10 | 宁波舜宇光电信息有限公司 | The assemble method and electronic equipment of camera module, camera module |
| CN112995436A (en) * | 2019-12-02 | 2021-06-18 | 晋城三赢精密电子有限公司 | Lens module and electronic device |
| CN113676634A (en) * | 2021-08-11 | 2021-11-19 | 余姚舜宇智能光学技术有限公司 | Lens module and manufacturing method thereof |
| CN114338963A (en) * | 2020-09-30 | 2022-04-12 | 宁波舜宇光电信息有限公司 | Camera module, camera lens of camera module and lens base of camera module |
| CN116156301A (en) * | 2021-11-22 | 2023-05-23 | 余姚舜宇智能光学技术有限公司 | Lens base, lens assembly and camera module |
| CN116170674A (en) * | 2021-11-22 | 2023-05-26 | 余姚舜宇智能光学技术有限公司 | Mirror mounts, lens components and camera modules |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206865578U (en) * | 2017-04-28 | 2018-01-09 | 南昌欧菲光电技术有限公司 | Camera module and its photosensory assembly |
| CN206948444U (en) * | 2016-10-14 | 2018-01-30 | 宁波舜宇光电信息有限公司 | Camera module based on integral packaging technique |
| CN108111720A (en) * | 2017-12-19 | 2018-06-01 | 广东欧珀移动通信有限公司 | The camera of electronic equipment and with its electronic equipment |
| CN108323034A (en) * | 2017-12-25 | 2018-07-24 | 华为技术有限公司 | Production method, PCB, CCD camera assembly and the terminal of PCB |
| CN208739217U (en) * | 2018-07-25 | 2019-04-12 | 宁波舜宇光电信息有限公司 | Microscope base, camera module and electronic equipment |
-
2018
- 2018-07-25 CN CN201810825707.4A patent/CN108769491A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206948444U (en) * | 2016-10-14 | 2018-01-30 | 宁波舜宇光电信息有限公司 | Camera module based on integral packaging technique |
| CN206865578U (en) * | 2017-04-28 | 2018-01-09 | 南昌欧菲光电技术有限公司 | Camera module and its photosensory assembly |
| CN108111720A (en) * | 2017-12-19 | 2018-06-01 | 广东欧珀移动通信有限公司 | The camera of electronic equipment and with its electronic equipment |
| CN108323034A (en) * | 2017-12-25 | 2018-07-24 | 华为技术有限公司 | Production method, PCB, CCD camera assembly and the terminal of PCB |
| CN208739217U (en) * | 2018-07-25 | 2019-04-12 | 宁波舜宇光电信息有限公司 | Microscope base, camera module and electronic equipment |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109407443A (en) * | 2018-12-20 | 2019-03-01 | 宁波舜宇光电信息有限公司 | A kind of camera module |
| CN109491181A (en) * | 2019-01-02 | 2019-03-19 | 昆山丘钛微电子科技有限公司 | Camera mould group and its manufacturing method |
| CN109491181B (en) * | 2019-01-02 | 2024-03-19 | 昆山丘钛微电子科技股份有限公司 | Camera module and manufacturing method thereof |
| CN109743482A (en) * | 2019-01-21 | 2019-05-10 | 宁波舜宇光电信息有限公司 | The assemble method and electronic equipment of camera module, camera module |
| CN112995436A (en) * | 2019-12-02 | 2021-06-18 | 晋城三赢精密电子有限公司 | Lens module and electronic device |
| US11470723B2 (en) | 2019-12-02 | 2022-10-11 | Triple Win Technology (Shenzhen) Co. Ltd. | Lens module and electronic device having the same |
| CN114338963A (en) * | 2020-09-30 | 2022-04-12 | 宁波舜宇光电信息有限公司 | Camera module, camera lens of camera module and lens base of camera module |
| CN113676634A (en) * | 2021-08-11 | 2021-11-19 | 余姚舜宇智能光学技术有限公司 | Lens module and manufacturing method thereof |
| CN116156301A (en) * | 2021-11-22 | 2023-05-23 | 余姚舜宇智能光学技术有限公司 | Lens base, lens assembly and camera module |
| CN116170674A (en) * | 2021-11-22 | 2023-05-26 | 余姚舜宇智能光学技术有限公司 | Mirror mounts, lens components and camera modules |
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