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CN108768534A - An optical transceiver integrated component - Google Patents

An optical transceiver integrated component Download PDF

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Publication number
CN108768534A
CN108768534A CN201810674371.6A CN201810674371A CN108768534A CN 108768534 A CN108768534 A CN 108768534A CN 201810674371 A CN201810674371 A CN 201810674371A CN 108768534 A CN108768534 A CN 108768534A
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China
Prior art keywords
laser
photodetector
integrated component
cmos asic
optical fiber
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Inventor
陈建威
张衡
姚景怡
冯奎景
邱懿君
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Hubei Free Trade Area East Core Technology Co Ltd
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Hubei Free Trade Area East Core Technology Co Ltd
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B10/00Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/40Transceivers

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Optical Communication System (AREA)

Abstract

本发明实施例提出了一种光收发一体组件,包括:外联光纤的波分复用滤波器、激光器、光电探测器、以及CMOS ASIC芯片;其中,波分复用滤波器、激光器、光电探测器、以及CMOS ASIC芯片共同封装在同一金属腔体内;CMOS ASIC芯片中包括:基座、和固定在基座上的功能模块;其中,功能模块包括:激光器驱动器、限幅放大器、跨阻放大器、微控制器;使用低功耗的CMOS技术,整合在CMOS ASIC芯片,使得整体模块可被统一封装进金属腔体中,以便外接光纤。此方案中的组装模式使得光收发一体组件整体电子器件的功能更完整,高速模块之间的连接在芯片内部实现,减少了由现有技术外接电路板带来的损耗;功能一体化实现,提高了光收发一体组件组装时的便利性及一致性。

The embodiment of the present invention proposes an optical transceiver integrated assembly, including: a wavelength division multiplexing filter of an external optical fiber, a laser, a photodetector, and a CMOS ASIC chip; wherein, the wavelength division multiplexing filter, the laser, the photoelectric detector The device and the CMOS ASIC chip are packaged together in the same metal cavity; the CMOS ASIC chip includes: a base, and a functional module fixed on the base; wherein, the functional module includes: a laser driver, a limiting amplifier, a transimpedance amplifier, Microcontroller; using low-power CMOS technology, integrated in the CMOS ASIC chip, so that the overall module can be packaged in a metal cavity for external optical fiber. The assembly mode in this solution makes the function of the overall electronic device of the optical transceiver assembly more complete, and the connection between high-speed modules is realized inside the chip, which reduces the loss caused by the external circuit board in the prior art; the realization of functional integration improves the It ensures the convenience and consistency of the assembly of optical transceiver components.

Description

一种光收发一体组件An optical transceiver integrated component

技术领域technical field

本发明涉及光通信领域,特别涉及一种光收发一体组件。The invention relates to the field of optical communication, in particular to an integrated optical transceiver component.

背景技术Background technique

随着近年来宽带网络的飞速发展,数字信号的传输速度也逐渐被重视。目前,光纤是宽带网络中多种传输媒介中最理想的一种,它的特点是传输容量大,传输质量好,损耗小,中继距离长等。With the rapid development of broadband networks in recent years, the transmission speed of digital signals has gradually been paid attention to. At present, optical fiber is the most ideal among various transmission media in broadband network. It is characterized by large transmission capacity, good transmission quality, low loss, and long relay distance.

光纤宽带就是把要传送的数据由电信号转换为光信号进行通讯。在光纤的两端分别都装有“光猫”进行信号转换。光调制解调器,光猫也称为单端口光端机,是针对特殊用户环境而研发的一种三件一套的光纤传输设备。光猫是一种类似于基带modem(数字调制解调器)的设备,和基带modem不同的是接入的是光纤专线,是光信号。用于广域网中光电信号的转换和接口协议的转换,接入路由器,是广域网接入。光电收发器是用局域网中光电信号的转换,而仅仅是信号转换,没有接口协议的转换。Optical fiber broadband is to convert the data to be transmitted from electrical signals to optical signals for communication. Both ends of the optical fiber are equipped with "optical cats" for signal conversion. Optical modem, also known as single-port optical transceiver, is a three-piece optical fiber transmission equipment developed for special user environments. An optical modem is a device similar to a baseband modem (digital modem). The difference from a baseband modem is that it is connected to an optical fiber dedicated line and is an optical signal. It is used for the conversion of photoelectric signals and interface protocols in the WAN, and it is connected to the router, which is the WAN access. The photoelectric transceiver is used to convert the photoelectric signal in the local area network, but only the signal conversion, without the conversion of the interface protocol.

光纤收发器一般应用在以太网电缆无法覆盖、必须使用光纤来延长传输距离的实际网络环境中,同时在帮助把光纤最后一公里线路连接到城域网和更外层的网络上也发挥了巨大的作用。有了光纤收发器,也为需要将系统从铜线升级到光纤,为缺少资金、人力或时间的用户提供了一种廉价的方案。光纤收发器的作用是,将我们要发送的电信号转换成光信号,并发送出去,进一步地能将接收到的光信号转换成电信号,输入到我们的接收端。Optical fiber transceivers are generally used in actual network environments where Ethernet cables cannot be covered and optical fibers must be used to extend the transmission distance. At the same time, they also play a huge role in helping to connect the last mile of optical fiber to the metropolitan area network and the outer network. role. With fiber optic transceivers, it also provides an inexpensive solution for users who need to upgrade their systems from copper wires to fiber optics and lack money, manpower, or time. The function of the optical fiber transceiver is to convert the electrical signal we want to send into an optical signal and send it out, and further convert the received optical signal into an electrical signal and input it to our receiving end.

但是目前的光纤收发器采用的是外接组装的方式来生产的,而外接组装方式将带来拼接线路损耗,一致性较低,高速光组件组装时难度较高,良率受到影响。同时,外接组装方式中的电子器件的工作温度难以被精确监控,因而一定程度上影响对电信号转光信号的效率,影响传输距离。However, the current optical fiber transceivers are produced by external assembly, which will cause splicing line loss, low consistency, high-speed optical component assembly is difficult, and the yield rate will be affected. At the same time, it is difficult to accurately monitor the operating temperature of the electronic devices in the external assembly method, which affects the efficiency of converting electrical signals to optical signals to a certain extent and affects the transmission distance.

由此,目前需要一种更优的光纤收发器。Therefore, a better optical fiber transceiver is currently required.

发明内容Contents of the invention

有鉴于此,本发明提出了一种光收发一体组件,用以解决上述问题。In view of this, the present invention proposes an optical transceiver integrated component to solve the above problems.

具体的,本发明提出了以下具体的实施例:Specifically, the present invention proposes the following specific embodiments:

本发明实施例提出了一种光收发一体组件,包括:外联光纤的波分复用滤波器、激光器、光电探测器、以及CMOS ASIC芯片;其中,所述波分复用滤波器、所述激光器、所述光电探测器、以及所述CMOS ASIC芯片共同封装在同一金属腔体内;The embodiment of the present invention proposes an optical transceiver integrated assembly, including: a wavelength division multiplexing filter of an external optical fiber, a laser, a photodetector, and a CMOS ASIC chip; wherein, the wavelength division multiplexing filter, the The laser, the photodetector, and the CMOS ASIC chip are packaged together in the same metal cavity;

所述波分复用滤波器分别连接所述激光器与所述光电探测器;The wavelength division multiplexing filter is respectively connected to the laser and the photodetector;

所述激光器与所述光电探测器均连接所述CMOS ASIC芯片;Both the laser and the photodetector are connected to the CMOS ASIC chip;

所述CMOS ASIC芯片中包括:基座、和固定在所述基座上的功能模块;其中,所述功能模块包括:激光器驱动器、限幅放大器、跨阻放大器、微控制器;其中,所述激光器驱动器在所述微控制器的控制下,驱动所述激光器发射激光经由所述波分复用滤波器发送外联的光纤上;通过所述微控制器的控制,所述跨阻放大器将来自所述光电探测器的电信号进行转换,并将转换后的电信号发送至所述限幅放大器,以使所述限幅放大器将获取到的电信号处理为等幅的数字电压信号后输出。The CMOS ASIC chip includes: a base, and a functional module fixed on the base; wherein, the functional module includes: a laser driver, a limiting amplifier, a transimpedance amplifier, and a microcontroller; wherein, the Under the control of the microcontroller, the laser driver drives the laser to emit laser light and sends it to the external optical fiber through the wavelength division multiplexing filter; through the control of the microcontroller, the transimpedance amplifier will come from The electrical signal of the photodetector is converted, and the converted electrical signal is sent to the limiting amplifier, so that the limiting amplifier processes the obtained electrical signal into a digital voltage signal of equal amplitude and then outputs it.

在一个具体的实施例中,所述激光器驱动器为高速电流开关,用于为所述激光器输入调制电流。In a specific embodiment, the laser driver is a high-speed current switch for inputting modulation current to the laser.

在一个具体的实施例中,所述激光器对应有阈值电流;In a specific embodiment, the laser corresponds to a threshold current;

所述CMOS ASIC芯片中还包括功率自动控制器;The CMOS ASIC chip also includes an automatic power controller;

所述激光器驱动器在所述微控制器的控制下,通过所述功率自动控制器为所述激光器提供大于所述阈值电流的直流偏置电流,以使所述激光器在不同温度环境下可稳定平均光功率下输出激光。Under the control of the microcontroller, the laser driver provides the laser with a DC bias current greater than the threshold current through the automatic power controller, so that the laser can stabilize and average Laser output at optical power.

在一个具体的实施例中,所述激光器驱动器用于对直流偏置电流进行监控,以及进行故障告警。In a specific embodiment, the laser driver is used to monitor the DC bias current and give a fault alarm.

在一个具体的实施例中,所述光电探测器用于将经过波分复用滤波器接收的来自光纤的信号转换为模拟电流信号。In a specific embodiment, the photodetector is used to convert the signal from the optical fiber received through the wavelength division multiplexing filter into an analog current signal.

在一个具体的实施例中,所述跨阻放大器将来自所述光电探测器的模拟电流信号进行转换,生成模拟电压信号。In a specific embodiment, the transimpedance amplifier converts the analog current signal from the photodetector to generate an analog voltage signal.

在一个具体的实施例中,所述CMOS ASIC芯片中还包括:对所述激光器的温度进行监控的温度传感器。In a specific embodiment, the CMOS ASIC chip further includes: a temperature sensor for monitoring the temperature of the laser.

在一个具体的实施例中,所述CMOS ASIC芯片中还包括:进行电流控制与电压控制的自动控制增益电路。In a specific embodiment, the CMOS ASIC chip further includes: an automatic gain control circuit for current control and voltage control.

以此,本发明实施例提出了一种光收发一体组件,包括:外联光纤的波分复用滤波器、激光器、光电探测器、以及CMOS ASIC芯片;其中,所述波分复用滤波器、所述激光器、所述光电探测器、以及所述CMOS ASIC芯片共同封装在同一金属腔体内;所述波分复用滤波器分别连接所述激光器与所述光电探测器;所述激光器与所述光电探测器均连接所述CMOSASIC芯片;所述CMOS ASIC芯片中包括:基座、和固定在所述基座上的功能模块;其中,所述功能模块包括:激光器驱动器、限幅放大器、跨阻放大器、微控制器;其中,所述激光器驱动器在所述微控制器的控制下,驱动所述激光器发射激光经由所述波分复用滤波器发送外联的光纤上;通过所述微控制器的控制,所述跨阻放大器将来自所述光电探测器的电信号进行转换,并将转换后的电信号发送至所述限幅放大器,以使所述限幅放大器将获取到的电信号处理为等幅的数字电压信号后输出。使用低功耗的CMOS技术,整合在CMOS ASIC芯片,使得整体模块可被统一封装进金属腔体中,以便外接光纤。此方案中的组装模式使得光收发一体组件整体电子器件的功能更完整,高速模块之间的连接在芯片内部实现,减少了由现有技术外接电路板带来的损耗;功能一体化实现,提高了光收发一体组件组装时的便利性及一致性。Therefore, the embodiment of the present invention proposes an integrated optical transceiver assembly, including: a wavelength division multiplexing filter of an external optical fiber, a laser, a photodetector, and a CMOS ASIC chip; wherein the wavelength division multiplexing filter , the laser, the photodetector, and the CMOS ASIC chip are packaged together in the same metal cavity; the wavelength division multiplexing filter is respectively connected to the laser and the photodetector; the laser and the The photodetectors are all connected to the CMOSASIC chip; the CMOS ASIC chip includes: a base, and a functional module fixed on the base; wherein, the functional module includes: a laser driver, a limiting amplifier, a span Impedance amplifier, microcontroller; wherein, the laser driver is under the control of the microcontroller, drives the laser to emit laser light and sends it to the external optical fiber through the wavelength division multiplexing filter; through the microcontroller The transimpedance amplifier converts the electrical signal from the photodetector, and sends the converted electrical signal to the limiting amplifier, so that the limiting amplifier converts the obtained electrical signal After being processed into a digital voltage signal of equal amplitude, it is output. Using low-power CMOS technology, integrated in the CMOS ASIC chip, so that the whole module can be uniformly packaged into a metal cavity for external optical fiber. The assembly mode in this solution makes the function of the overall electronic device of the optical transceiver assembly more complete, and the connection between the high-speed modules is realized inside the chip, which reduces the loss caused by the external circuit board in the prior art; the functional integration realizes and improves It ensures the convenience and consistency of the assembly of optical transceiver components.

附图说明Description of drawings

为了更清楚地说明本发明实施例的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,应当理解,以下附图仅示出了本发明的某些实施例,因此不应被看作是对范围的限定,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他相关的附图。In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and thus It should be regarded as a limitation on the scope, and those skilled in the art can also obtain other related drawings based on these drawings without creative work.

图1为本发明实施例提出的一种光收发一体组件的结构示意图。FIG. 1 is a schematic structural diagram of an integrated optical transceiver assembly proposed by an embodiment of the present invention.

具体实施方式Detailed ways

在下文中,将更全面地描述本公开的各种实施例。本公开可具有各种实施例,并且可在其中做出调整和改变。然而,应理解:不存在将本公开的各种实施例限于在此公开的特定实施例的意图,而是应将本公开理解为涵盖落入本公开的各种实施例的精神和范围内的所有调整、等同物和/或可选方案。Hereinafter, various embodiments of the present disclosure will be described more fully. The present disclosure is capable of various embodiments, and adaptations and changes are possible therein. It is to be understood, however, that there is no intention to limit the various embodiments of the present disclosure to the particular embodiments disclosed herein, but that the present disclosure be construed to cover those falling within the spirit and scope of various embodiments of the present disclosure. All adjustments, equivalents and/or alternatives.

在本公开的各种实施例中使用的术语仅用于描述特定实施例的目的并且并非意在限制本公开的各种实施例。如在此所使用,单数形式意在也包括复数形式,除非上下文清楚地另有指示。除非另有限定,否则在这里使用的所有术语(包括技术术语和科学术语)具有与本公开的各种实施例所属领域普通技术人员通常理解的含义相同的含义。所述术语(诸如在一般使用的词典中限定的术语)将被解释为具有与在相关技术领域中的语境含义相同的含义并且将不被解释为具有理想化的含义或过于正式的含义,除非在本公开的各种实施例中被清楚地限定。Terms used in various embodiments of the present disclosure are for the purpose of describing specific embodiments only and are not intended to limit the various embodiments of the present disclosure. As used herein, singular forms are intended to include plural forms as well, unless the context clearly dictates otherwise. Unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which various embodiments of the present disclosure belong. The terms (such as those defined in commonly used dictionaries) will be interpreted as having the same meaning as the contextual meaning in the relevant technical field and will not be interpreted as having an idealized meaning or an overly formal meaning, Unless clearly defined in various embodiments of the present disclosure.

实施例Example

本发明实施例公开了一种光收发一体组件,如图1所示,包括:外联光纤的波分复用滤波器、激光器、光电探测器、以及CMOS ASIC芯片;其中,所述波分复用滤波器、所述激光器、所述光电探测器、以及所述CMOSASIC芯片共同封装在同一金属腔体内;The embodiment of the present invention discloses an optical transceiver integrated assembly, as shown in Figure 1, including: a wavelength division multiplexing filter of an external optical fiber, a laser, a photodetector, and a CMOS ASIC chip; wherein, the wavelength division multiplexing The filter, the laser, the photodetector, and the CMOSASIC chip are packaged together in the same metal cavity;

所述波分复用滤波器分别连接所述激光器与所述光电探测器;The wavelength division multiplexing filter is respectively connected to the laser and the photodetector;

所述激光器与所述光电探测器均连接所述CMOS ASIC芯片;Both the laser and the photodetector are connected to the CMOS ASIC chip;

所述CMOS ASIC芯片中包括:基座、和固定在所述基座上的功能模块;其中,所述功能模块包括:激光器驱动器、限幅放大器、跨阻放大器、微控制器;其中,所述激光器驱动器在所述微控制器的控制下,驱动所述激光器发射激光经由所述波分复用滤波器发送外联的光纤上;通过所述微控制器的控制,所述跨阻放大器将来自所述光电探测器的电信号进行转换,并将转换后的电信号发送至所述限幅放大器,以使所述限幅放大器将获取到的电信号处理为等幅的数字电压信号后输出。The CMOS ASIC chip includes: a base, and a functional module fixed on the base; wherein, the functional module includes: a laser driver, a limiting amplifier, a transimpedance amplifier, and a microcontroller; wherein, the Under the control of the microcontroller, the laser driver drives the laser to emit laser light and sends it to the external optical fiber through the wavelength division multiplexing filter; through the control of the microcontroller, the transimpedance amplifier will come from The electrical signal of the photodetector is converted, and the converted electrical signal is sent to the limiting amplifier, so that the limiting amplifier processes the obtained electrical signal into a digital voltage signal of equal amplitude and then outputs it.

具体的,本方案提供了一种使用CMOS(Complementary MetalOxideSemiconductor,互补金属氧化物半导体)技术,基于多功能ASIC(一种为专门目的而设计的集成电路)专用芯片实现的光收发一体组件(Bi-directional Optical SubAssembly,简称BOSA)。本发明的光收发一体组件包括:激光器(Laser diode,简称LD)、光电探测器(Photodetector,简称PD),以及一个CMOS ASIC专用芯片。上述模块均在同一基底上组装,使用ASIC技术实现小型化,可将其与波分复用滤波器(Wavelength DivisionMultiplexing,简称WDM)共同封装在同一金属腔体中,并外接光纤。Specifically, this solution provides an optical transceiver integrated component (Bi- directional Optical SubAssembly, referred to as BOSA). The optical transceiver integrated assembly of the present invention includes: a laser diode (LD for short), a photodetector (PD for short), and a dedicated CMOS ASIC chip. The above-mentioned modules are all assembled on the same substrate, using ASIC technology to achieve miniaturization, and can be packaged together with a wavelength division multiplexing filter (Wavelength Division Multiplexing, referred to as WDM) in the same metal cavity, and externally connected to an optical fiber.

以此,此方案中使得BOSA整体电子器件的功能更完整,高速模块之间的连接在CMOS ASIC芯片内部实现,减少了由现有技术外接电路板带来的损耗;功能一体化实现,提高了光收发一体组件组装时的便利性及一致性;同时LD的工作温度可被精确的检测到。Therefore, this solution makes the functions of BOSA's overall electronic devices more complete, and the connection between high-speed modules is realized inside the CMOS ASIC chip, which reduces the loss caused by the external circuit board in the prior art; the realization of functional integration improves the Convenience and consistency in the assembly of optical transceiver components; at the same time, the working temperature of LD can be accurately detected.

具体的,CMOS ASIC芯片中包含了:激光器驱动器(Laser Driver,简称LDD)、限幅放大器(Limiting Amplifier,简称LA)、跨阻放大器(Tran impedance Amplifier,简称TIA)、功率自动控制器APC(auto power controller)、和微控制器(Control Block)。Specifically, the CMOS ASIC chip includes: Laser Driver (Laser Driver, referred to as LDD), limiting amplifier (Limiting Amplifier, referred to as LA), transimpedance amplifier (Tran impedance Amplifier, referred to as TIA), automatic power controller APC (auto power controller), and microcontroller (Control Block).

使用CMOS ASIC专用芯片技术,实现小型化,可将其与波分复用滤波器(Wavelength Division Multiplexing,简称WDM)共同封装在同一金属腔体中,并外接光纤。Using CMOS ASIC special chip technology to achieve miniaturization, it can be packaged together with the wavelength division multiplexing filter (Wavelength Division Multiplexing, referred to as WDM) in the same metal cavity, and externally connected to the optical fiber.

在一个具体的实施例中,所述激光器驱动器为高速电流开关,用于为所述激光器输入调制电流。In a specific embodiment, the laser driver is a high-speed current switch for inputting modulation current to the laser.

在一个具体的实施例中,所述激光器对应有阈值电流;In a specific embodiment, the laser corresponds to a threshold current;

所述CMOS ASIC芯片中还包括功率自动控制器;The CMOS ASIC chip also includes an automatic power controller;

所述激光器驱动器在所述微控制器的控制下,通过所述功率自动控制器为所述激光器提供大于所述阈值电流的直流偏置电流,以使所述激光器在不同温度环境下可稳定平均光功率下输出激光。Under the control of the microcontroller, the laser driver provides the laser with a DC bias current greater than the threshold current through the automatic power controller, so that the laser can stabilize and average Laser output at optical power.

在一个具体的实施例中,所述激光器驱动器用于对直流偏置电流进行监控,以及进行故障告警。In a specific embodiment, the laser driver is used to monitor the DC bias current and give a fault alarm.

在一个具体的实施例中,所述光电探测器用于将经过波分复用滤波器接收的来自光纤的信号转换为模拟电流信号。In a specific embodiment, the photodetector is used to convert the signal from the optical fiber received through the wavelength division multiplexing filter into an analog current signal.

在一个具体的实施例中,所述跨阻放大器将来自所述光电探测器的模拟电流信号进行转换,生成模拟电压信号。In a specific embodiment, the transimpedance amplifier converts the analog current signal from the photodetector to generate an analog voltage signal.

在一个具体的实施例中,所述CMOS ASIC芯片中还包括:对所述激光器的温度进行监控的温度传感器。In a specific embodiment, the CMOS ASIC chip further includes: a temperature sensor for monitoring the temperature of the laser.

在一个具体的实施例中,所述CMOS ASIC芯片中还包括:进行电流控制与电压控制的自动控制增益电路。In a specific embodiment, the CMOS ASIC chip further includes: an automatic gain control circuit for current control and voltage control.

此外,具体的,如图1所示,具体本方案的装置的可以包括光发射链路与光接收链路In addition, specifically, as shown in Figure 1, the specific device of this solution may include an optical transmission link and an optical reception link

其中,光发射链路的功能由以下功能模块组成:激光器驱动器与激光器相连,同时与微控制器相连。光发射链路工作原理为,将其所接受的带有信息的电信号,通过光电原理转换为光信号,由激光器,具体的例如可以为激光二极管通过波分复用滤波器(WDM)发送入光纤。其中,激光器驱动器可以为一个高速电流开关,可为激光器输入调制电流。微控制器与激光器驱动器相连,通过功率自动控制器(APC)可为激光器提供略大于阈值电流(ITH)的直流偏置电流(IBIAS),使其在不同的温度环境下可稳定平均光功率(PAVG)下输出相应激光。Among them, the function of the optical transmission link is composed of the following functional modules: the laser driver is connected with the laser, and at the same time connected with the microcontroller. The working principle of the optical transmission link is to convert the received electrical signal with information into an optical signal through the photoelectric principle, and the laser, for example, can be a laser diode through a wavelength division multiplexing filter (WDM). optical fiber. Wherein, the laser driver can be a high-speed current switch, which can input modulation current for the laser. The microcontroller is connected to the laser driver, and the laser can be provided with a DC bias current (IBIAS) slightly greater than the threshold current (ITH) through the automatic power controller (APC), so that it can stabilize the average optical power ( PAVG) to output the corresponding laser.

此外,激光器驱动器还拥有故障警告、偏置电流监控等功能。In addition, the laser driver also has functions such as fault warning and bias current monitoring.

至于光接收链路,则由以下功能模块组成:光电探测器、跨阻放大器与限幅放大器相连,同时跨阻放大器、限幅放大器与控制器相连。光接收链路工作原理为由光电探测器(PD)将经波分复用滤波器(WDM)接收到的来自光纤的信号转换成电信号,由跨阻放大器(TIA)与限幅放大器将(LA)转换后的电信号处理为可处理的电信号。其中跨阻放大器接收的的是模拟电流信号,要把它转换成模拟电压信号才能被信号处理电路识别。在控制器的控制下,限幅放大器把跨阻放大器输出的幅度不同的信号处理成等幅的数字电压信号,以便进一步处理。同时,控制器通过光电探测器PD偏置电路控制电压范围,达到上述温度控制的最优误码率效果。As for the optical receiving link, it consists of the following functional modules: a photodetector, a transimpedance amplifier and a limiting amplifier are connected, and a transimpedance amplifier and a limiting amplifier are connected to a controller. The working principle of the optical receiving link is that the photodetector (PD) converts the signal from the optical fiber received by the wavelength division multiplexing filter (WDM) into an electrical signal, and the transimpedance amplifier (TIA) and limiting amplifier ( LA) The converted electrical signal is processed into a processable electrical signal. The transimpedance amplifier receives an analog current signal, which must be converted into an analog voltage signal to be recognized by the signal processing circuit. Under the control of the controller, the limiting amplifier processes the signals with different amplitudes output by the transimpedance amplifier into digital voltage signals of equal amplitude for further processing. At the same time, the controller controls the voltage range through the photodetector PD bias circuit to achieve the above-mentioned optimal bit error rate effect of temperature control.

进一步的,微控制器除温度控制、电压控制等功能外,还可实现数据控制。Further, besides functions such as temperature control and voltage control, the microcontroller can also realize data control.

本申请的方案中,由波分复用滤波器与光电探测器、以及激光器相连,使得光电探测器、以及激光器可检测到它们各自相对应的波段。其中微控制器实现的温度检测、电流控制、信号模式转换、电压控制由温度传感器、模数转换(ADC)、自动控制增益(AGC)电路实现。其中,由于此方案的一体化特点,光电探测器工作环境温度检测精度提升,使得温度控制效果可以达到最佳。同时,此方案的一体化特征使得信号不会在过长的连接电路中被损耗,并减少了信号在传输路程中参杂的噪音。In the solution of the present application, a wavelength division multiplexing filter is connected to the photodetector and the laser, so that the photodetector and the laser can detect their respective corresponding wavebands. Among them, the temperature detection, current control, signal mode conversion, and voltage control realized by the microcontroller are realized by a temperature sensor, an analog-to-digital conversion (ADC), and an automatic gain control (AGC) circuit. Among them, due to the integrated feature of this solution, the temperature detection accuracy of the working environment of the photodetector is improved, so that the temperature control effect can be optimized. At the same time, the integrated feature of this solution prevents the signal from being lost in the long connection circuit, and reduces the noise mixed in the signal transmission path.

以此,本发明实施例提出了一种光收发一体组件,包括:外联光纤的波分复用滤波器、激光器、光电探测器、以及CMOS ASIC芯片;其中,所述波分复用滤波器、所述激光器、所述光电探测器、以及所述CMOS ASIC芯片共同封装在同一金属腔体内;所述波分复用滤波器分别连接所述激光器与所述光电探测器;所述激光器与所述光电探测器均连接所述CMOSASIC芯片;所述CMOS ASIC芯片中包括:基座、和固定在所述基座上的功能模块;其中,所述功能模块包括:激光器驱动器、限幅放大器、跨阻放大器、微控制器;其中,所述激光器驱动器在所述微控制器的控制下,驱动所述激光器发射激光经由所述波分复用滤波器发送外联的光纤上;通过所述微控制器的控制,所述跨阻放大器将来自所述光电探测器的电信号进行转换,并将转换后的电信号发送至所述限幅放大器,以使所述限幅放大器将获取到的电信号处理为等幅的数字电压信号后输出。使用低功耗的CMOS技术,整合在CMOS ASIC芯片,使得整体模块可被统一封装进金属腔体中,以便外接光纤。此方案中的组装模式使得光收发一体组件整体电子器件的功能更完整,高速模块之间的连接在芯片内部实现,减少了由现有技术外接电路板带来的损耗;功能一体化实现,提高了光收发一体组件组装时的便利性及一致性。Therefore, the embodiment of the present invention proposes an integrated optical transceiver assembly, including: a wavelength division multiplexing filter of an external optical fiber, a laser, a photodetector, and a CMOS ASIC chip; wherein the wavelength division multiplexing filter , the laser, the photodetector, and the CMOS ASIC chip are packaged together in the same metal cavity; the wavelength division multiplexing filter is respectively connected to the laser and the photodetector; the laser and the The photodetectors are all connected to the CMOSASIC chip; the CMOS ASIC chip includes: a base, and a functional module fixed on the base; wherein, the functional module includes: a laser driver, a limiting amplifier, a span Impedance amplifier, microcontroller; wherein, the laser driver is under the control of the microcontroller, drives the laser to emit laser light and sends it to the external optical fiber through the wavelength division multiplexing filter; through the microcontroller The transimpedance amplifier converts the electrical signal from the photodetector, and sends the converted electrical signal to the limiting amplifier, so that the limiting amplifier converts the obtained electrical signal After being processed into a digital voltage signal of equal amplitude, it is output. Using low-power CMOS technology, integrated in the CMOS ASIC chip, so that the whole module can be uniformly packaged into a metal cavity for external optical fiber. The assembly mode in this solution makes the function of the overall electronic device of the optical transceiver assembly more complete, and the connection between the high-speed modules is realized inside the chip, which reduces the loss caused by the external circuit board in the prior art; the functional integration realizes and improves It ensures the convenience and consistency of the assembly of optical transceiver components.

本领域技术人员可以理解附图只是一个优选实施场景的示意图,附图中的模块或流程并不一定是实施本发明所必须的。Those skilled in the art can understand that the accompanying drawing is only a schematic diagram of a preferred implementation scenario, and the modules or processes in the accompanying drawings are not necessarily necessary for implementing the present invention.

本领域技术人员可以理解实施场景中的装置中的模块可以按照实施场景描述进行分布于实施场景的装置中,也可以进行相应变化位于不同于本实施场景的一个或多个装置中。上述实施场景的模块可以合并为一个模块,也可以进一步拆分成多个子模块。Those skilled in the art can understand that the modules in the devices in the implementation scenario can be distributed among the devices in the implementation scenario according to the description of the implementation scenario, or can be located in one or more devices different from the implementation scenario according to corresponding changes. The modules of the above implementation scenarios can be combined into one module, or can be further split into multiple sub-modules.

上述本发明序号仅仅为了描述,不代表实施场景的优劣。The above serial numbers of the present invention are for description only, and do not represent the pros and cons of the implementation scenarios.

以上公开的仅为本发明的几个具体实施场景,但是,本发明并非局限于此,任何本领域的技术人员能思之的变化都应落入本发明的保护范围。The above disclosures are only some specific implementation scenarios of the present invention, however, the present invention is not limited thereto, and any changes conceivable by those skilled in the art shall fall within the protection scope of the present invention.

Claims (8)

1. a kind of light transmit-receive integrated component, which is characterized in that including:Wave-division multiplexer filter, laser, the photoelectricity of external connection optical fiber Detector and CMOS asic chips;Wherein, the wave-division multiplexer filter, the laser, the photodetector, with And the CMOS asic chips are mutually encapsulated into same metal cavity;
The wave-division multiplexer filter is separately connected the laser and the photodetector;
The laser is all connected with the CMOS asic chips with the photodetector;
The CMOS asic chips include:Pedestal and the function module being fixed on the pedestal;Wherein, the function mould Block includes:Laser driver, limiting amplifier, trans-impedance amplifier, microcontroller;Wherein, the laser driver is in institute Under the control for stating microcontroller, the laser transmitting laser is driven to send the optical fiber of external connection via the wave-division multiplexer filter On;By the control of the microcontroller, the trans-impedance amplifier converts the electric signal from the photodetector, And transformed electric signal is sent to the limiting amplifier, so that the Electric signal processing that the limiting amplifier will be got To be exported after the digital voltage signal of constant amplitude.
2. a kind of light transmit-receive integrated component as described in claim 1, which is characterized in that the laser driver is high speed electricity Stream switch, for inputting modulation electric current for the laser.
3. a kind of light transmit-receive integrated component as described in claim 1, which is characterized in that the laser is corresponding with threshold value electricity Stream;
Further include power automatic controller in the CMOS asic chips;
The laser driver is the laser by the power automatic controller under the control of the microcontroller The DC bias current more than the threshold current is provided, so that the laser can stablize average light under different temperatures environment Laser is exported under power.
4. a kind of light transmit-receive integrated component as described in claim 1, which is characterized in that the laser driver is used for straight Stream bias current is monitored, and carries out fault warning.
5. a kind of light transmit-receive integrated component as described in claim 1, which is characterized in that the photodetector will be for that will pass through The signal from optical fiber that wave-division multiplexer filter receives is converted to analog current signal.
6. a kind of light transmit-receive integrated component as claimed in claim 5, which is characterized in that the trans-impedance amplifier will come from described The analog current signal of photodetector is converted, and analog voltage signal is generated.
7. a kind of light transmit-receive integrated component as described in claim 1, which is characterized in that also wrapped in the CMOSASIC chips It includes:The temperature sensor that the temperature of the laser is monitored.
8. a kind of light transmit-receive integrated component as described in claim 1, which is characterized in that also wrapped in the CMOSASIC chips It includes:It carries out current control and automatically controls gain circuitry with voltage-controlled.
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