CN108754216A - A kind of copper tantnickel evanohm and preparation method thereof - Google Patents
A kind of copper tantnickel evanohm and preparation method thereof Download PDFInfo
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- CN108754216A CN108754216A CN201810731633.8A CN201810731633A CN108754216A CN 108754216 A CN108754216 A CN 108754216A CN 201810731633 A CN201810731633 A CN 201810731633A CN 108754216 A CN108754216 A CN 108754216A
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- Prior art keywords
- copper
- tantnickel
- evanohm
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- temperature
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 39
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 39
- 239000010949 copper Substances 0.000 title claims abstract description 39
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 34
- 238000000137 annealing Methods 0.000 claims abstract description 21
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 17
- 239000011651 chromium Substances 0.000 claims abstract description 17
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 17
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000011812 mixed powder Substances 0.000 claims abstract description 14
- 238000000498 ball milling Methods 0.000 claims abstract description 13
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 13
- 239000010703 silicon Substances 0.000 claims abstract description 13
- 239000012535 impurity Substances 0.000 claims abstract description 11
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims abstract description 10
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 10
- 239000011777 magnesium Substances 0.000 claims abstract description 10
- 239000011701 zinc Substances 0.000 claims abstract description 10
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 10
- 230000032683 aging Effects 0.000 claims abstract description 7
- 229910052786 argon Inorganic materials 0.000 claims abstract description 7
- 238000001816 cooling Methods 0.000 claims abstract description 7
- 238000001125 extrusion Methods 0.000 claims abstract description 7
- 239000007789 gas Substances 0.000 claims abstract description 7
- 238000002156 mixing Methods 0.000 claims abstract description 7
- 238000001291 vacuum drying Methods 0.000 claims abstract description 7
- 238000005245 sintering Methods 0.000 claims 1
- 239000000956 alloy Substances 0.000 abstract description 9
- 229910045601 alloy Inorganic materials 0.000 abstract description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- 229910000906 Bronze Inorganic materials 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910018487 Ni—Cr Inorganic materials 0.000 description 2
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000003723 Smelting Methods 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000004035 construction material Substances 0.000 description 1
- WCCJDBZJUYKDBF-UHFFFAOYSA-N copper silicon Chemical compound [Si].[Cu] WCCJDBZJUYKDBF-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0425—Copper-based alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Catalysts (AREA)
- Silicon Compounds (AREA)
Abstract
It is composed of the following components according to mass percent meter the invention discloses a kind of copper tantnickel evanohm:Silicon accounts for 0.5~2.5%, and nickel and chromium total content account for 2.5~6.8%, and zinc accounts for 0.03~0.05%, and magnesium accounts for 0.04~0.08%, and surplus is copper and inevitable impurity, wherein the ratio between mass percentage of the nickel and the chromium is 1:1.1~2.The invention also discloses preparation methods, including:(1) it requires to carry out dispensing according to mass percent, gained mixed-powder is after vacuum ball mill ball milling mixing is uniform;(2) mixed-powder is packed into mold, extrusion forming is carried out at room temperature, and gained green compact is put into the vacuum drying oven filled with argon gas and is sintered, and 3~5h is sintered at a temperature of 950~1100 DEG C, and in 8~10h of this temperature, furnace cooling is simultaneously squeezed into bar under the conditions of 320~350 DEG C;(3) annealing furnace is used to carry out aging anneal to above-mentioned bar, wherein annealing temperature is 400~500 DEG C, annealing time is 2~4h, obtains copper tantnickel evanohm.The preparation process of the present invention is simple, and alloy obtained has the advantages that intensity is high, friction and wear behavior is good.
Description
Technical field
The present invention relates to technical field of alloy material, more particularly to a kind of copper tantnickel evanohm and preparation method thereof.
Background technology
There is acid bronze alloy excellent mechanical, anti-corrosion, wear-resisting property to be commonly used to as ideal machine construction material
Manufacture valve, gear, worm gear, axle sleeve and the propeller etc. under complex working condition.The rapid development of science and technology, there is an urgent need into one
Step improves intensity, hardness and the wear-resisting property of acid bronze alloy.The performance of acid bronze alloy is influenced by many conditions.The performance of material
It is to be determined by its internal heterogeneous microstructure.All the time, influence of the chemical composition of alloy to its structure property is standby
Favored by domestic and international researcher, domestic and foreign scholars are explored by alloying component optimization design between its microstructure and performance
Relationship, to for raising the alloy performance provide new resolving ideas.The difference of various elements ingredient in alloy
There is direct influence to the structure property of alloy.
Nickel chromium triangle element, which is added, in metallurgical industry, in copper alloy can improve the institutional framework, mechanical performance and electric conductivity of copper.
The hardness and tensile strength of alloy increase with the increase of nickel chromium triangle constituent content, while the plasticity of alloy also reaches good effect
Fruit.Acid bronze alloy is high with intensity, wear-resisting property is good, casting character is excellent, smelting technology is simple, consumes energy less, is pollution-free and former
Series of advantages such as material cost is low, thus by the most attention of domestic and international expert, therefore, copper alloy there is very strong market
Competitiveness.Based on this, the present invention develops a kind of copper tantnickel evanohm that can improve friction and wear behavior.
For this reason, it is necessary in view of the above-mentioned problems, propose a kind of copper tantnickel evanohm and preparation method thereof, can solve existing
There is the problem of technology.
Invention content
The purpose of the present invention is to provide a kind of copper tantnickel evanohm and preparation method thereof, with overcome it is in the prior art not
Foot.
To achieve the above object, the present invention provides the following technical solutions:
A kind of copper tantnickel evanohm, it is composed of the following components according to mass percent meter:Silicon accounts for 0.5~2.5%, nickel and chromium
Total content accounts for 2.5~6.8%, and zinc accounts for 0.03~0.05%, and magnesium accounts for 0.04~0.08%, and surplus is copper and inevitably miscellaneous
Matter, wherein the ratio between mass percentage of the nickel and the chromium is 1:1.1~2.
Preferably, the mass percentage of the silicon is up to 2.0%.
Preferably, composed of the following components according to mass percent meter:Silicon accounts for 2.0%, and nickel and chromium total content account for 6.0%,
Zinc accounts for 0.04%, and magnesium accounts for 0.06%, and surplus is copper and inevitable impurity.
Preferably, the ratio between mass percent of the nickel and the chromium is 1:1.5.
Preferably, the content of the inevitable impurity is not more than 0.25%.
The present invention also provides a kind of preparation methods of copper tantnickel evanohm, include the following steps:
(1) it requires to carry out dispensing according to mass percent, gained mixed-powder is after vacuum ball mill ball milling mixing is uniform;
(2) mixed-powder after ball milling in step (1) is packed into mold, carries out extrusion forming at room temperature, gained green compact is put
Enter and be sintered in the vacuum drying oven filled with argon gas, 3~5h is sintered at a temperature of 950~1100 DEG C, and in 8~10h of this temperature,
Furnace cooling is simultaneously squeezed into bar under the conditions of 320~350 DEG C;
(3) use annealing furnace to above-mentioned bar carry out aging anneal, wherein annealing temperature be 400~500 DEG C, annealing when
Between be 2~4h, obtain copper tantnickel evanohm.
Compared with the prior art, the advantages of the present invention are as follows:The preparation process of the present invention is simple, and alloy obtained has strong
The advantage that degree is high, friction and wear behavior is good.
Specific implementation mode
The present invention is described further by the following example:According to following embodiments, the present invention may be better understood.
However, as it will be easily appreciated by one skilled in the art that specific material ratio, process conditions and its result described in embodiment are only used
In illustrating the present invention, without the present invention described in detail in claims should will not be limited.
The present invention discloses a kind of copper tantnickel evanohm, composed of the following components according to mass percent meter:Silicon accounts for 0.5~
2.5%, nickel and chromium total content account for 2.5~6.8%, and zinc accounts for 0.03~0.05%, and magnesium accounts for 0.04~0.08%, and surplus is for copper and not
Evitable impurity, wherein the ratio between mass percentage of the nickel and the chromium is 1:1.1~2.
Invention additionally discloses a kind of preparation methods of copper tantnickel evanohm, include the following steps:
(1) it requires to carry out dispensing according to mass percent, gained mixed-powder is after vacuum ball mill ball milling mixing is uniform;
(2) mixed-powder after ball milling in step (1) is packed into mold, carries out extrusion forming at room temperature, gained green compact is put
Enter and be sintered in the vacuum drying oven filled with argon gas, 3~5h is sintered at a temperature of 950~1100 DEG C, and in 8~10h of this temperature,
Furnace cooling is simultaneously squeezed into bar under the conditions of 320~350 DEG C;
(3) use annealing furnace to above-mentioned bar carry out aging anneal, wherein annealing temperature be 400~500 DEG C, annealing when
Between be 2~4h, obtain copper tantnickel evanohm.
Wherein, the mass percentage of the silicon is up to 2.0%.
Wherein, composed of the following components according to mass percent meter:Silicon accounts for 2.0%, and nickel and chromium total content account for 6.0%, zinc
0.04% is accounted for, magnesium accounts for 0.06%, and surplus is copper and inevitable impurity.
Wherein, the ratio between mass percent of the nickel and the chromium is 1:1.5.
Wherein, the content of the inevitable impurity is not more than 0.25%.
It is following to be illustrated with specifically embodiment, to prepare the copper tantnickel evanohm in the present invention.
Embodiment 1
(1) according to mass percent require carry out dispensing, gained mixed-powder after vacuum ball mill ball milling mixing is uniform,
Wherein, silicon accounts for 0.5%, and nickel and chromium total content account for 2.5%, and zinc accounts for 0.03%, and magnesium accounts for 0.04%, and surplus is for copper and inevitably
Impurity;
(2) mixed-powder after ball milling in step (1) is packed into mold, carries out extrusion forming at room temperature, gained green compact is put
Enter and be sintered in the vacuum drying oven filled with argon gas, be sintered 3h at a temperature of 950 DEG C, and this temperature 8h, furnace cooling and in
It is squeezed into bar under the conditions of 320 DEG C;
(3) annealing furnace is used to carry out aging anneal to above-mentioned bar, wherein annealing temperature is 400 DEG C, annealing time is
2h obtains copper tantnickel evanohm.
Embodiment 2
(1) according to mass percent require carry out dispensing, gained mixed-powder after vacuum ball mill ball milling mixing is uniform,
Wherein, silicon accounts for 2.0%, and nickel and chromium total content account for 6.0%, and zinc accounts for 0.04%, and magnesium accounts for 0.06%, and surplus is for copper and inevitably
Impurity;
(2) mixed-powder after ball milling in step (1) is packed into mold, carries out extrusion forming at room temperature, gained green compact is put
Enter and be sintered in the vacuum drying oven filled with argon gas, be sintered 4h at a temperature of 1050 DEG C, and this temperature 9h, furnace cooling and in
It is squeezed into bar under the conditions of 330 DEG C;
(3) annealing furnace is used to carry out aging anneal to above-mentioned bar, wherein annealing temperature is 450 DEG C, annealing time is
3h obtains copper tantnickel evanohm.
Embodiment 3
(1) according to mass percent require carry out dispensing, gained mixed-powder after vacuum ball mill ball milling mixing is uniform,
Wherein, silicon accounts for 2.5%, and nickel and chromium total content account for 6.8%, and zinc accounts for 0.05%, and magnesium accounts for 0.08%, and surplus is for copper and inevitably
Impurity;
(2) mixed-powder after ball milling in step (1) is packed into mold, carries out extrusion forming at room temperature, gained green compact is put
Enter and be sintered in the vacuum drying oven filled with argon gas, 5h is sintered at a temperature of 1100 DEG C, and in this temperature 10h, furnace cooling is simultaneously
It is squeezed into bar under the conditions of 350 DEG C;
(3) annealing furnace is used to carry out aging anneal to above-mentioned bar, wherein annealing temperature is 500 DEG C, annealing time is
4h obtains copper tantnickel evanohm.
Copper tantnickel evanohm in above-described embodiment 1~3 has the advantages that intensity is high, friction and wear behavior is good.To above-mentioned
Copper tantnickel evanohm in Examples 1 to 3 carries out the experiment of mechanical property, the results showed that, tensile strength is up to 525MPa.It is right
Copper tantnickel evanohm in above-described embodiment 1~3 carries out wearability experiment, and under 20N contact loads, Ceramic Balls rotating speed is
450r/min, after 8000 turns, copper silicon nichrome surface is not worn yet.
Finally, it is to be noted that, the terms "include", "comprise" or its any other variant be intended to it is non-exclusive
Property include so that including a series of elements process, method, article or equipment not only include those elements, but also
Further include other elements that are not explicitly listed, or further include for this process, method, article or equipment it is intrinsic
Element.
Claims (6)
1. a kind of copper tantnickel evanohm, which is characterized in that composed of the following components according to mass percent meter:Silicon accounts for 0.5~
2.5%, nickel and chromium total content account for 2.5~6.8%, and zinc accounts for 0.03~0.05%, and magnesium accounts for 0.04~0.08%, and surplus is for copper and not
Evitable impurity, wherein the ratio between mass percentage of the nickel and the chromium is 1:1.1~2.
2. copper tantnickel evanohm according to claim 1, which is characterized in that the mass percentage of the silicon is up to
2.0%.
3. copper tantnickel evanohm according to claim 2, which is characterized in that according to mass percent meter by following components group
At:Silicon accounts for 2.0%, and nickel and chromium total content account for 6.0%, and zinc accounts for 0.04%, and magnesium accounts for 0.06%, and surplus is copper and inevitably miscellaneous
Matter.
4. copper tantnickel evanohm according to claim 3, which is characterized in that the mass percent of the nickel and the chromium it
Than being 1:1.5.
5. copper tantnickel evanohm according to claim 1, which is characterized in that the content of the inevitable impurity is little
In 0.25%.
6. a kind of preparation method of copper tantnickel evanohm according to claim 1, which is characterized in that include the following steps:
(1) it requires to carry out dispensing according to mass percent, gained mixed-powder is after vacuum ball mill ball milling mixing is uniform;
(2) mixed-powder after ball milling in step (1) is packed into mold, carries out extrusion forming at room temperature, gained green compact, which is put into, to be filled
There is sintering in the vacuum drying oven of argon gas, 3~5h is sintered at a temperature of 950~1100 DEG C, and in 8~10h of this temperature, with stove
Cooling is simultaneously squeezed into bar under the conditions of 320~350 DEG C;
(3) annealing furnace is used to carry out aging anneal to above-mentioned bar, wherein annealing temperature is 400~500 DEG C, annealing time 2
~4h obtains copper tantnickel evanohm.
Priority Applications (1)
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115198140A (en) * | 2021-04-13 | 2022-10-18 | 美的集团股份有限公司 | Copper alloy and application thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1577037A1 (en) * | 2004-03-15 | 2005-09-21 | The University Of Queensland | Infiltrated aluminium preforms |
CN101613816A (en) * | 2009-07-20 | 2009-12-30 | 温州宏丰电工合金有限公司 | Multiple dispersion strengthening copper-base composite material prepared in situ and preparation method thereof |
CN102418004A (en) * | 2011-11-24 | 2012-04-18 | 中铝洛阳铜业有限公司 | Nickel-chromium-silicon-bronze alloy material |
-
2018
- 2018-07-05 CN CN201810731633.8A patent/CN108754216A/en not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1577037A1 (en) * | 2004-03-15 | 2005-09-21 | The University Of Queensland | Infiltrated aluminium preforms |
CN101613816A (en) * | 2009-07-20 | 2009-12-30 | 温州宏丰电工合金有限公司 | Multiple dispersion strengthening copper-base composite material prepared in situ and preparation method thereof |
CN102418004A (en) * | 2011-11-24 | 2012-04-18 | 中铝洛阳铜业有限公司 | Nickel-chromium-silicon-bronze alloy material |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115198140A (en) * | 2021-04-13 | 2022-10-18 | 美的集团股份有限公司 | Copper alloy and application thereof |
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