CN108738232A - A kind of Double-layer flexible circuit board - Google Patents
A kind of Double-layer flexible circuit board Download PDFInfo
- Publication number
- CN108738232A CN108738232A CN201810593674.5A CN201810593674A CN108738232A CN 108738232 A CN108738232 A CN 108738232A CN 201810593674 A CN201810593674 A CN 201810593674A CN 108738232 A CN108738232 A CN 108738232A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- circuit board
- double
- line
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000005452 bending Methods 0.000 claims abstract description 16
- 230000005540 biological transmission Effects 0.000 claims abstract description 5
- 238000003780 insertion Methods 0.000 claims abstract description 4
- 230000037431 insertion Effects 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 14
- 230000001681 protective effect Effects 0.000 claims description 14
- 239000011889 copper foil Substances 0.000 claims description 12
- 239000004642 Polyimide Substances 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 8
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 239000011551 heat transfer agent Substances 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 230000002452 interceptive effect Effects 0.000 abstract description 4
- 230000008602 contraction Effects 0.000 abstract description 2
- 230000008054 signal transmission Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention provides a kind of Double-layer flexible circuit boards,Including wiring board slot and golden finger,The wiring board slot is set to the end portion of each structure,And it is symmetrical arranged in the other end,Each layer structure for fixing circuit board,The golden finger is set to the top of wiring board slot,And in golden finger one end insertion assist side slot,The other end is exposed outside,For with read the interactive information such as equipment,Wiring board can shrink projection portion when being bent,And using projection portion contraction reduce wiring board bending when on the outside of plate face stretching generate stress,Wiring board is set to be unlikely to damage because of the variation of itself stress,Improve service life,This wiring board can be carried out by wiring board slot and golden finger and various equipment signal exchange and transmission,And it is fixed in various configurations by rivet hole,With the wider scope of application.Suitable for the production and use in flexible printed circuit board field, there is good development prospect.
Description
Technical field
The present invention relates to flexible printed circuit board field, specially a kind of flexible circuit board.
Background technology
Flexible printed circuit board, also known as flexible circuit board are a kind of special printed circuit boards.Its feature is weight
Gently, thickness is thin, soft, flexible.It is many to be mainly used for mobile phone, laptop, PDA, digital camera, liquid crystal display etc.
Product.
Existing flexible circuit board needs the shape that wiring board bending can be adapted to installation position to make in connection
The connection terminal device that wiring board can be stablized, but wiring board itself is easy stress after bending and cannot exclude resolution, and
There is bursting apart and fractureing for structure, makes wiring board damage that can not use.
Invention content
The main object of the present invention is to provide a kind of Double-layer flexible circuit board, can carry out larger angle using bulge-structure
Bending, and the stress that synchronous resolution wiring board internal structure is generated because squeezing mutually makes foil section and base material will not be because
Bending and burst apart.
To achieve the above object, the present invention provides a kind of Double-layer flexible circuit board, including rivet hole, wiring board slot and
Golden finger, the rivet hole be set to wiring board slot both ends, the wiring board slot be set to each structure end portion, and
The other end is symmetrical arranged, and is used for each layer structure of fixing circuit board, and the golden finger is set to the top of wiring board slot, and described
Golden finger one end is embedded in assist side slot, and the other end is exposed outside, is used for and is read the interactive information such as equipment.
Further, the middle section of the wiring board slot, which is fixed, is inserted into flexible separate layer, for reducing wiring board
It is influenced caused by stress compressing when bending.
Further, the top and bottom of the flexible separate layer is both provided with ground plane copper foil, is used for transmission line plate
The surface of interior extra electromagnetic interference, the ground plane copper foil is installed with polyimide base material.
Further, the surface of the polyimide base material is bonded with signal wire, power cord, and the power cord only exists
The middle section of wiring board is placed with three, remaining copper wire is signal wire, for transmitting heat transfer agent and control information.
Further, the top of the signal wire and power cord is uniformly coated with top and protects glue-line, the top protection
Bondline thickness is 50 microns, the copper foil winding displacement for protecting upper layer circuit plate.
Further, top PI protective films are pasted at the top of the top protection glue-line, for the surface to wiring board
Structural defence and insulation.
Further, the underclad portion bottom of the signal wire and power cord is uniformly coated with bottom and protects glue-line, described
It is 40 microns that the thickness of glue-line is protected in bottom, is pasted with bottom PI protective films below the bottom protection glue-line, and described
Bottom protects the centre of glue-line and bottom PI protective films to be uniformly placed with three protrusions, is generated when wiring board bending for reducing
Stress.
The present invention provides a kind of Double-layer flexible circuit boards, have the advantages that:The embodiment of the present invention is by being equipped with
Wiring board slot and golden finger, the wiring board slot is set to the end portion of each structure, and is symmetrical arranged in the other end, is used for
Each layer structure of fixing circuit board, the golden finger is set to the top of wiring board slot, and the insertion of described golden finger one end is online
In the plate slot of road, the other end is exposed outside, for that can be shunk with interactive information, wiring boards such as reading equipment when being bent
Projection portion, and using projection portion contraction reduce wiring board bending when on the outside of plate face stretching generate stress, make line
Road plate is unlikely to damage because of the variation of itself stress, improves service life.
Description of the drawings
Fig. 1 is a kind of overall structure diagram of Double-layer flexible circuit board one embodiment of the present invention；
Fig. 2 is a kind of vertical view of Double-layer flexible circuit board one embodiment of the present invention.
In figure：1- rivet holes, 2- wiring board slots, 3- golden fingers, the tops 4- PI protective films, 5- protect glue-line, 6- in top
Signal wire, 7- polyimide base materials, 8- ground plane copper foils, 9- flexibility separate layers, 10- protrusions, the bottoms 11- PI protective films, 12- electricity
Glue-line is protected in source line, the bottoms 13-.
Specific implementation mode
It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not intended to limit the present invention.
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear
Chu is fully described by, it is clear that described embodiment is only a part of the embodiment of the present invention, rather than whole implementation
Example.Based on the embodiments of the present invention, those of ordinary skill in the art are obtained without creative efforts
Every other embodiment, shall fall within the protection scope of the present invention.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute is only in the embodiment of the present invention
For explaining relative position relation, motion conditions etc. under a certain particular pose (as shown in the picture) between each component, if
When the particular pose changes, then directionality instruction also correspondingly changes correspondingly, and the connection can be directly connected to,
Can also be to be indirectly connected with.
Please refer to Fig.1 to 2, be a kind of Double-layer flexible circuit board decomposition texture schematic diagram in one embodiment of the invention and
Dimensional structure diagram.
Glue-line 5, signal wire are protected in rivet hole 1 in invention, wiring board slot 2, golden finger 3, top PI protective films 4, top
6, polyimide base material 7, ground plane copper foil 8, flexible separate layer 9, protrusion 10, bottom PI protective films 11, power cord 12 and bottom
Protecting glue-line 13 can be bought by market or private customization obtains.
The present invention provides a kind of Double-layer flexible circuit board, including rivet hole 1, wiring board slot 2 and golden finger 3, rivet hole 1
Set on the both ends of wiring board slot 2, wiring board slot 2 is set to the end portion of each structure, and is symmetrical arranged in the other end, is used for
Each layer structure of fixing circuit board, golden finger 3 is set to the top of wiring board slot 2, and 3 one end of golden finger insertion assist side is inserted
In slot 2, the other end is exposed outside, for that can pass through wiring board slot 2 and gold with interactive information, this wiring boards such as reading equipment
Finger 3 and various equipment carry out signal exchange and transmission, and fixed in various configurations, had wider by rivet hole 1
The scope of application.
In the present embodiment, the middle section of wiring board slot 2, which is fixed, is inserted into flexible separate layer 9, for reducing circuit
It is influenced caused by stress compressing when plate bending, stress will not transmit mutually between making the upper layer and lower layer of wiring board, reduce circuit
The loss of plate and fatigue of materials.
In the present embodiment, the top and bottom of flexible separate layer 9 is both provided with ground plane copper foil 8, is used for transmission line
The surface of extra electromagnetic interference in plate, ground plane copper foil 8 is installed with polyimide base material 7, passes through isolation material
Base material so that the transmission of signal in copper foil is not interfered, and by ground plane copper foil 8 by interference electric current signal and entanglement
Absorption of electromagnetic radiation is simultaneously grounded discharge from zero curve, makes stable signal transmission and strong antijamming capability in wiring board.
In the present embodiment, the surface of polyimide base material 7 is bonded with signal wire 6, and power cord 12, power cord 12 is only online
The middle section of road plate is placed with three, remaining copper wire is signal wire 6, for transmitting heat transfer agent and control information.
In the present embodiment, the top of signal wire 6 and power cord 12 is uniformly coated with top and protects glue-line 5, top protection
5 thickness of glue-line is 50 microns, the copper foil winding displacement for protecting upper layer circuit plate.
In the present embodiment, the top of top protection glue-line 5 is pasted with top PI protective films 4, for the table to wiring board
Face structural defence and insulation.
In the present embodiment, the underclad portion bottom of signal wire 6 and power cord 12 is uniformly coated with bottom and protects glue-line 13,
It is 40 microns that the thickness of glue-line 13 is protected in bottom, and the lower section of bottom protection glue-line 13 is pasted with bottom PI protective films 11, and bottom
Portion protects the centre of glue-line 13 and bottom PI protective films 11 to be uniformly placed with three protrusions 10, is produced when for reducing wiring board bending
Raw stress, relatively thin bottom protection glue-line 13 and bottom PI protective films 11 can reduce wiring board bending when material outside by
The extruding arrived, and material is reduced by the stretching of raised 10 parts, god is drawn to squeeze the stress generated, make the bending of wiring board more
Easily.
The operation principle and practical approach of a kind of Double-layer flexible circuit board of the present invention are as follows：
When this wiring board comes into operation, it is necessary first to which the wiring board slot 2 at wiring board both ends is connected the double of wiring board
Layer structure, and ensure golden finger 3 and 12 stable connection of signal wire 6 and power cord, then, need to lead to 2 structure of wiring board slot
It crosses rivet hole 1 to be fixedly mounted in connection structure, makes wiring board and signal transmission structure stable connection, it then, can be by wiring board
It carries out bending and overlays designated position, its occupied space is made to reduce, improve space availability ratio, it, can be by preset in bending
Raised 10 structure directions are bent, and so that wiring board is bent using protrusion 10, wiring board is avoided to be generated because of folding
The overall structure of larger stress rupture wiring board causes signal transmission open circuit and the damage of circuit board structure to scrap, when outer
Boundary's equipment sends out electric signal, and signal is received and is transmitted in signal wire 6 by golden finger 3, keeps electric signal another to wiring board
The golden finger 3 at end circulates, and achievees the purpose that quickly transmitting for signal.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
Understanding without departing from the principles and spirit of the present invention can carry out these embodiments a variety of variations, modification, replace
And modification, the scope of the present invention is defined by the appended.
Claims (7)
1. a kind of Double-layer flexible circuit board, including rivet hole (1), wiring board slot (2) and golden finger (3), which is characterized in that institute
State rivet hole (1) be set to wiring board slot (2) both ends, the wiring board slot (2) be set to each structure end portion, and
The other end is symmetrical arranged, and is used for each layer structure of fixing circuit board, and the golden finger (3) is set to the top of wiring board slot (2),
And in described golden finger (3) one end insertion assist side slot (2), the other end is exposed outside, for read equipment etc. and interact
Information.
2. a kind of Double-layer flexible circuit board according to claim 1, which is characterized in that in the wiring board slot (2)
Between it is partly fixed be inserted into flexible separate layer (9), influenced caused by stress compressing when for reducing wiring board bending.
3. a kind of Double-layer flexible circuit board according to claim 2, which is characterized in that the top of the flexibility separate layer (9)
Portion is both provided with ground plane copper foil (8) with bottom, for electromagnetic interference extra in transmission line plate, the ground plane copper
The surface of foil (8) is installed with polyimide base material (7).
4. a kind of Double-layer flexible circuit board according to claim 3, which is characterized in that the polyimide base material
(7) surface is bonded with signal wire (6), and the middle section of power cord (12), power cord (12) the only assist side is placed with
Three, remaining copper wire is signal wire (6), for transmitting heat transfer agent and control information.
5. a kind of Double-layer flexible circuit board according to claim 4, which is characterized in that the signal wire (6) and power cord
(12) top is uniformly coated with top protection glue-line (5), and described top protection glue-line (5) thickness is 50 microns, for protecting
Protect the copper foil winding displacement of upper layer circuit plate.
6. a kind of Double-layer flexible circuit board according to claim 1, which is characterized in that the top protection glue-line (6)
Top is pasted with top PI protective films (4), protects and insulate for the surface texture to wiring board.
7. a kind of Double-layer flexible circuit board according to claim 1, which is characterized in that the signal wire (5) and power cord
(12) underclad portion bottom is uniformly coated with bottom protection glue-line (13), and the thickness of the bottom protection glue-line (13) is 40
Micron, the bottom is protected and is pasted with bottom PI protective films (11) below glue-line (13), and bottom protection glue-line (13)
Three protrusions (10) are uniformly placed with the centre of bottom PI protective films (11), for reducing answering of being generated when wiring board bending
Power.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810593674.5A CN108738232A (en) | 2018-06-11 | 2018-06-11 | A kind of Double-layer flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810593674.5A CN108738232A (en) | 2018-06-11 | 2018-06-11 | A kind of Double-layer flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108738232A true CN108738232A (en) | 2018-11-02 |
Family
ID=63932703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810593674.5A Withdrawn CN108738232A (en) | 2018-06-11 | 2018-06-11 | A kind of Double-layer flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108738232A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110896587A (en) * | 2019-12-30 | 2020-03-20 | 深圳市昌逸电子有限公司 | A double-layer flexible circuit board |
| CN111556663A (en) * | 2020-05-21 | 2020-08-18 | 长园启华智能科技(珠海)有限公司 | Multi-station flexible circuit board curing device |
| WO2021051670A1 (en) * | 2019-09-16 | 2021-03-25 | 叶志行 | Multi-layer flexible printed circuit board |
-
2018
- 2018-06-11 CN CN201810593674.5A patent/CN108738232A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021051670A1 (en) * | 2019-09-16 | 2021-03-25 | 叶志行 | Multi-layer flexible printed circuit board |
| CN110896587A (en) * | 2019-12-30 | 2020-03-20 | 深圳市昌逸电子有限公司 | A double-layer flexible circuit board |
| CN111556663A (en) * | 2020-05-21 | 2020-08-18 | 长园启华智能科技(珠海)有限公司 | Multi-station flexible circuit board curing device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181102 |
|
| WW01 | Invention patent application withdrawn after publication |