CN108735677B - Electronic package and method of making the same - Google Patents
Electronic package and method of making the same Download PDFInfo
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- CN108735677B CN108735677B CN201710328822.6A CN201710328822A CN108735677B CN 108735677 B CN108735677 B CN 108735677B CN 201710328822 A CN201710328822 A CN 201710328822A CN 108735677 B CN108735677 B CN 108735677B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 40
- 229910052751 metal Inorganic materials 0.000 claims abstract description 40
- 238000000034 method Methods 0.000 claims description 20
- 239000005022 packaging material Substances 0.000 claims description 12
- 239000008393 encapsulating agent Substances 0.000 claims description 7
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- 239000000758 substrate Substances 0.000 description 10
- 238000004891 communication Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 238000012858 packaging process Methods 0.000 description 7
- 238000013461 design Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000004100 electronic packaging Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
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- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Details Of Aerials (AREA)
Abstract
一种电子封装件及其制法，用以于一承载件上设置电子元件与天线结构，其中，该天线结构包含立设于该承载件上金属架、设于该金属架与该承载件之间的天线增长部、及设于该承载件上且电性连接该金属架与该天线增长部的导线，以利用该天线增长部作为增加布设区域的面积，因而无需于该承载件的表面上增加布设区域，即可增加该天线结构的长度，以达到天线运作的需求。
An electronic package and a manufacturing method thereof are used for arranging electronic components and an antenna structure on a carrier, wherein the antenna structure comprises a metal frame erected on the carrier, a metal frame arranged between the metal frame and the carrier The antenna extension part between the two, and the wire that is arranged on the carrier and electrically connects the metal frame and the antenna extension part, so as to use the antenna extension part as an increase in the area of the layout area, so it is not necessary to install on the surface of the carrier part. By increasing the layout area, the length of the antenna structure can be increased to meet the requirements of the antenna operation.
Description
Technical Field
The present invention relates to an electronic package, and more particularly, to an electronic package with an antenna structure.
Background
With the rapid development of the electronic industry, electronic products are also gradually moving toward multi-function and high-performance. Currently, wireless communication technology is widely applied to various consumer electronic products to receive or transmit various wireless signals. In order to meet the design requirements of consumer electronics, the manufacture and design of wireless communication modules have been developed to be light, thin, short and small, and among them, a planar Antenna (Patch Antenna) has been widely used in wireless communication modules of electronic products such as mobile phones (cell phones), Personal Digital Assistants (PDAs) due to its characteristics of small size, light weight, easy manufacture, and the like.
Fig. 1 is a perspective view of a conventional wireless communication module. As shown in fig. 1, the wireless communication module 1 includes: a substrate 10, a plurality of electronic components 11 disposed on the substrate 10, an antenna structure 12 and a packaging material 13. The substrate 10 is a circuit board and has a rectangular shape. The electronic device 11 is disposed on the substrate 10 and electrically connected to the substrate 10. The antenna structure 12 is planar and has an antenna body 120 and a conductive wire 121, and the antenna body 120 is electrically connected to the electronic component 11 through the conductive wire 121. The encapsulant 13 covers the electronic component 11 and the portion of the conductive traces 121.
However, in the conventional wireless communication module 1, the antenna structure 12 is planar, so based on the electromagnetic radiation characteristic between the antenna structure 12 and the electronic component 11 and the volume limitation of the antenna structure 12, in the manufacturing process, the antenna body 120 is difficult to be integrated with the electronic component 11, that is, the encapsulation material 13 only covers the electronic component 11, but does not cover the antenna body 120, so that the mold of the packaging process needs to correspond to the layout area of the electronic components 11, rather than the size of the substrate 10, thereby being disadvantageous to the packaging process.
In addition, since the antenna structure 12 is planar, when the length of the antenna structure 12 needs to be increased, a layout area (an area where the encapsulant 13 is not formed) needs to be increased on the surface of the substrate 10 to form the antenna body 120, but the length and width of the substrate 10 are fixed, so that it is difficult to increase the area of the layout area, and the length of the antenna structure 12 cannot be increased, thereby failing to meet the requirement of antenna operation.
Therefore, how to overcome the various problems of the prior art has become an issue to be solved.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, the present invention discloses an electronic package and a method for fabricating the same, so as to meet the requirement of antenna operation.
The electronic package of the present invention includes: a carrier; at least one electronic element arranged on the bearing piece; and the antenna structure is arranged on the bearing piece and electrically connected with the bearing piece, wherein the antenna structure comprises a metal frame vertically arranged on the bearing piece, an antenna increasing part positioned between the metal frame and the bearing piece and a conducting wire arranged on the bearing piece and electrically connected with the metal frame and the antenna increasing part.
The invention also discloses a manufacturing method of the electronic packaging piece, which comprises the following steps: providing a bearing piece provided with at least one electronic element; and an antenna structure disposed on the carrier and electrically connected to the carrier, wherein the antenna structure comprises a metal frame vertically disposed on the carrier, an antenna extension portion disposed between the metal frame and the carrier, and a wire disposed on the carrier and electrically connected to the metal frame and the antenna extension portion.
In the electronic package and the method for manufacturing the same, the electronic element is electrically connected to the carrier.
In the electronic package and the method for fabricating the same, the electronic device is an active device.
In the electronic package and the manufacturing method thereof, the antenna structure is electrically connected to the carrier by a wire thereof.
In the electronic package and the method for fabricating the same, the metal frame has an extending portion and at least one supporting portion, and the extending portion is mounted on the carrier through the supporting portion. For example, the extension is an antenna body.
In the electronic package and the method for manufacturing the same, the antenna extension portion is a passive element.
In the electronic package and the method for manufacturing the same, a package material is formed on the carrier to encapsulate the electronic element and the antenna structure.
In the electronic package and the method for manufacturing the same, a shielding structure is formed on the carrier to cover the electronic component. Furthermore, the shielding structure does not cover the antenna structure, and the shielding structure is located above the packaging material or is coated by the packaging material.
In view of the above, in the electronic package and the manufacturing method thereof of the present invention, through the design of the metal frame, in the manufacturing process, the package material can cover the electronic component and the antenna structure, so that the mold of the packaging process can correspond to the size of the carrier, thereby facilitating the packaging process.
Moreover, because the metal is arranged on the bearing piece and the antenna lengthening part is used for increasing the area of the layout area, the layout area does not need to be increased on the surface of the bearing piece, so compared with the prior art, the invention can increase the length of the antenna structure under the preset size of the bearing piece, thereby meeting the requirement of antenna operation and enabling the electronic packaging piece to meet the requirement of miniaturization.
Drawings
Fig. 1 is a perspective view of a conventional wireless communication module; and
fig. 2A to 2C are schematic perspective views illustrating a method for manufacturing an electronic package according to the present invention; fig. 2C' is a schematic cross-sectional view corresponding to fig. 2C.
Description of the symbols:
1 Wireless communication module
10 base plate
11. 21 electronic component
12. 22 antenna structure
120 antenna body
121. 22c conductor
13. 23 packaging material
2 electronic package
20 load bearing member
20c side surface
200 circuit layer
22a metal frame
22b antenna extension
220 extension part
221 supporting part
24 shield structure
A first region
B a second region.
Detailed Description
The following description of the embodiments of the present invention is provided by way of specific examples, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein.
It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for understanding and reading the contents disclosed in the specification, and are not used for limiting the conditions under which the present invention can be implemented, so that the present invention has no technical significance, and any structural modifications, ratio relationship changes or size adjustments should still fall within the scope of the technical contents disclosed in the present invention without affecting the efficacy and the achievable purpose of the present invention. In addition, the terms "above", "two" and "one" are used in the present specification for the sake of clarity only, and are not intended to limit the scope of the present invention, and the relative relationship between the terms and the terms is not to be construed as the scope of the present invention.
Fig. 2A to 2C are schematic perspective views illustrating a method for manufacturing an electronic package 2 according to the present invention. In the present embodiment, the electronic package 2 is, for example, a System In Package (SiP) wireless communication module.
As shown in fig. 2A, a carrier 20 having at least one electronic component 21 is provided, and an antenna structure 22 electrically connected to the carrier 20 is disposed on the carrier 20.
The supporting member 20 is, for example, rectangular, and defines a first area a and a second area B adjacent to each other. In the present embodiment, the carrier 20 is, for example, a package substrate (substrate) having a core layer and a circuit structure or a coreless (circuit) circuit structure, and a plurality of circuit layers 200, such as fan-out (fan out) Redistribution (RDL) layers, are formed on a dielectric material. It should be understood that the carrier 20 may also be other carrier units for carrying electronic devices such as chips, such as lead frame (leadframe), and the leads thereof can be regarded as circuit structures, but not limited to the above.
The electronic component 21 is an active component, such as a semiconductor chip, and is disposed on the first region a of the carrier 20. In the present embodiment, the electronic device is electrically connected to the circuit layer 200 by a plurality of bonding wires in a wire bonding manner; alternatively, the electronic component 21 can be disposed on the circuit layer 200 in a flip-chip manner by a plurality of conductive bumps (not shown) such as solder material and electrically connected to the circuit layer 200; alternatively, the electronic component 21 may directly contact the wiring layer 200. It should be understood that the manner of electrically connecting the electronic component 21 to the carrier 20 is various and is not limited to the above.
The antenna structure 22 is disposed on the second area B of the carrier 20 and includes a metal frame 22a, at least one antenna extension 22B, and at least one conductive wire 22c electrically connecting the metal frame 22a and the antenna extension 22B.
In this embodiment, the metal frame 22a is an iron frame or other materials, and has an extending portion 220 and a supporting portion 221, the supporting portion 221 is erected on the carrier 20, and the extending portion 220 is erected on the carrier 20 through the supporting portion 221, so that the position of the extending portion 220 is higher than the positions of the electronic component 21 and the antenna extending portion 22B, and the extending portion 220 extends along the edge of the second region B of the carrier 20 correspondingly. Specifically, the extension portion 220 is used as an antenna main body, and is bent or bent, for example, in a shape of a notched ring (e.g., a snap ring or a reverse ring), an L shape, or a continuous ring (e.g., a cross), and the supporting portion 221 is electrically connected to the conductive wire 22c, and is a single cylinder, but may be designed in other shapes (e.g., a wall) or a plurality of shapes as required.
In addition, the antenna extension portion 22b is, for example, a passive element, such as a resistor, a capacitor, and an inductor, which is disposed on the carrier 20 and electrically connected to the conductive wire 22 c. Specifically, the metal frame 22a is erected on the carrier 20, and an accommodating space is formed between the extension portion 220 and the carrier 20, so that the antenna extension portion 22b can be disposed in the accommodating space.
The conductive wire 22c is disposed on the carrier 20 and electrically connected to the circuit layer 200, and one end thereof is connected to the supporting portion 221, and the other end thereof is connected to the antenna extension portion 22 b. For example, the conductive line 22c is fabricated together with the circuit layer 200, such as in an RDL process. It should be understood that the conductive wire 22c can also be divided into two unconnected segments, one segment is connected to the supporting portion 221, and the other segment is connected to the antenna increasing portion 22 b.
In addition, the supporting portion 221 serves as a signal input terminal or a ground terminal, so that the electronic device 21 can be electrically connected to the extending portion 220 through at least one bonding wire (not shown) as required, and both the extending portion 220 and the conductive wire 22c can serve as an antenna emission source, but the extending portion 220 is elevated by the supporting portion 221 to reinforce the emission source, so in terms of strength, the extending portion 220 is larger than the conductive wire 22 c.
As shown in fig. 2B, an encapsulant 23 is formed on the carrier 20, such that the electronic element 21, the antenna structure 22 and the antenna extension 22B are encapsulated by the encapsulant 23.
In the present embodiment, the sealing material 23 is Polyimide (PI), dry film (dry film), epoxy resin (epoxy), or sealing compound, but is not limited thereto.
As shown in fig. 2C, a shielding structure 24 is formed on the encapsulant 23 to cover the electronic component 21.
In the present embodiment, the shielding structure 24 covers a portion of the surface of the package 23 and a portion of the side surface of the carrier 20, that is, only corresponds to the first region a formed on the carrier 20, so that the shielding structure 24 does not overlap with the antenna structure 22, that is, the shielding structure 24 does not cover the antenna structure 22.
In addition, the shielding structure 24 can be formed on the packaging material 23 by a processing method of coating a metal layer (e.g., copper material), such as sputtering (sputtering), evaporation (evaporation), electroplating, electroless plating or electroless plating; alternatively, the shielding structure 24 is formed on the packaging material 23 by covering a metal frame, a metal cover, or a film (foil); alternatively, a shielding structure such as a metal frame or a metal cover may be disposed on the carrier 20, and then the packaging material 23 is used to cover the shielding structure, so as to make the appearance as shown in fig. 2B.
Moreover, the shielding structure 24 can cover the vertical projection range of the first area a of the supporting member 20, such as all, 1/2 or 1/3, or even cover part of the side 20c or all of the side 20c of the first area a of the supporting member 20.
In addition, the electronic component 21 is not interfered by external electromagnetic interference due to the design of the shielding structure 24.
In the manufacturing method of the present invention, the metal sheet is folded into the three-dimensional metal frame 22a, and then the extending portion 220 is mounted on the carrier 20, so that the extending portion 220 extends corresponding to the edge of the second region B, and in the manufacturing process, the extending portion 220 can be integrated with the electronic component 21, i.e. packaged together, so that the packaging material 23 can cover the electronic component 21 and the antenna structure 22, and therefore, the mold used in the packaging process can correspond to the size of the carrier 20, thereby facilitating the packaging process.
In addition, the metal frame 22a is erected on the carrier 20 to form a three-dimensional antenna body, and the antenna extension portion 22b is used to increase the area of the layout area, so that the layout area does not need to be increased on the surface of the carrier 20, and compared with the prior art, the manufacturing method of the present invention can increase the length of the antenna structure 22 under the predetermined size of the carrier 20, thereby achieving the requirement of antenna operation and enabling the electronic package 2 to meet the requirement of miniaturization.
The packaging material 23 can be used to fix the metal frame 22a, so that the extension portion 220 is located at a fixed height to ensure the stability of the antenna, and the dielectric coefficient of the packaging material 23 can be used to reduce the electrical length required by the antenna.
The present invention also provides an electronic package 2 comprising: a carrier 20, an electronic component 21 disposed on the carrier 20, and an antenna structure 22 disposed on the carrier 20.
The carrier 20 has a plurality of circuit layers 200 for electrically connecting the electronic components 21.
The electronic component 21 is an active component and is electrically connected to the circuit layer 200 of the carrier 20.
The antenna structure 22 is disposed on the carrier 20 and electrically connected to the carrier 20, wherein the antenna structure 22 includes a metal frame 22a, at least one antenna extension 22b, and at least one conductive wire 22c electrically connecting the metal frame 22a and the antenna extension 22 b.
In one embodiment, the antenna structure 22 is electrically connected to the carrier 20 through the conducting wires 22 c.
In one embodiment, the metal frame 22a has an extending portion 220 and at least one supporting portion 221, and the extending portion 220 is mounted on the supporting member 20 through the supporting portions 221. For example, the extension 220 is an antenna body.
In one embodiment, the antenna extension is a passive element.
In an embodiment, the package structure further includes a package material 23 formed on the carrier 20 to encapsulate the electronic element 21 and the antenna structure 22.
In one embodiment, the electronic device further includes a shielding structure 24 formed on the carrier 20, which covers the electronic element 21 but does not cover the antenna structure 22.
In summary, in the electronic package and the method for fabricating the same of the present invention, the three-dimensional antenna structure is used to replace the conventional planar antenna structure, so that the antenna structure can be erected on the formation region of the package material, thereby facilitating the packaging process.
In addition, through the design of the antenna lengthening part, the length of the antenna structure can be increased without increasing a layout area on the surface of the bearing piece, and the requirement of antenna operation is met.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Modifications to the above would be obvious to those of ordinary skill in the art, but would not bring the invention so modified beyond the spirit and scope of the present invention. Therefore, the scope of the invention should be determined from the following claims.
Claims (18)
1. An electronic package, characterized in that the electronic package comprises:
a carrier;
at least one electronic element arranged on the bearing piece; and
the antenna structure is arranged on the bearing piece and electrically connected with the bearing piece, wherein the antenna structure comprises a metal frame vertically arranged on the bearing piece, an antenna lengthening part positioned between the metal frame and the bearing piece and a conducting wire arranged on the bearing piece and electrically connected with the metal frame and the antenna lengthening part, the antenna lengthening part is a passive element, the conducting wire is used as an antenna emission source and is divided into two unconnected line segments, one line segment is connected with the metal frame, and the other line segment is connected with the antenna lengthening part.
2. The electronic package of claim 1, wherein the electronic component is an active component.
3. The electronic package of claim 1, wherein the antenna structure is electrically connected to the carrier by the conductive wire.
4. The electronic package of claim 1, wherein the metal frame has an extension portion and at least one support portion, the extension portion being supported on the conductive line by the support portion.
5. The electronic package of claim 4, wherein the extension is an antenna body.
6. The electronic package according to claim 1, wherein the electronic package further comprises a packaging material formed on the carrier to encapsulate the electronic element and the antenna structure.
7. The electronic package according to claim 6, further comprising a shielding structure formed on the carrier and covering the electronic component.
8. The electronic package of claim 7, wherein the shielding structure does not cover the antenna structure.
9. The electronic package of claim 7, wherein the shielding structure is located above or encapsulated by the encapsulant.
10. A method of fabricating an electronic package, the method comprising:
providing a bearing piece provided with at least one electronic element; and
the antenna structure comprises a metal frame vertically arranged on the bearing piece, an antenna increasing part arranged between the metal frame and the bearing piece and a conducting wire arranged on the bearing piece and electrically connected with the metal frame and the antenna increasing part, wherein the antenna increasing part is a passive element, the conducting wire is used as an antenna emission source and is divided into two unconnected line segments, one line segment is connected with the metal frame, and the other line segment is connected with the antenna increasing part.
11. The method of claim 10, wherein the electronic component is an active component.
12. The method of claim 10, wherein the antenna structure is electrically connected to the carrier by the conductive wire.
13. The method of claim 10, wherein the metal frame has an extending portion and at least one supporting portion, the extending portion is mounted on the conductive wire through the supporting portion.
14. The method of claim 13, wherein the extension is an antenna body.
15. The method of claim 10, further comprising forming a packaging material on the carrier to encapsulate the electronic element and the antenna structure.
16. The method of claim 15, further comprising forming a shielding structure on the carrier to cover the electronic component.
17. The method of claim 16, wherein the shielding structure does not cover the antenna structure.
18. The method of claim 16, wherein the shielding structure is disposed on or covered by the encapsulant.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106113768A TWI613767B (en) | 2017-04-25 | 2017-04-25 | Electronic package and method for fabricating the same |
| TW106113768 | 2017-04-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108735677A CN108735677A (en) | 2018-11-02 |
| CN108735677B true CN108735677B (en) | 2021-07-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710328822.6A Active CN108735677B (en) | 2017-04-25 | 2017-05-11 | Electronic package and method of making the same |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108735677B (en) |
| TW (1) | TWI613767B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI698046B (en) * | 2019-01-17 | 2020-07-01 | 矽品精密工業股份有限公司 | Electronic package and manufacturing method thereof |
| TWI741360B (en) * | 2019-09-03 | 2021-10-01 | 矽品精密工業股份有限公司 | Automated antenna testing device |
| CN113161327A (en) * | 2021-04-14 | 2021-07-23 | 长沙新雷半导体科技有限公司 | Packaged antenna structure, electronic equipment and manufacturing method of packaged antenna structure |
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| CN103311213A (en) * | 2012-05-04 | 2013-09-18 | 日月光半导体制造股份有限公司 | Semiconductor package integrating shielding film and antenna |
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| CN104936395A (en) * | 2014-03-17 | 2015-09-23 | 矽品精密工业股份有限公司 | Electronic package and manufacturing method thereof |
| CN105789819A (en) * | 2014-12-10 | 2016-07-20 | 矽品精密工业股份有限公司 | Electronic assembly |
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| US8199518B1 (en) * | 2010-02-18 | 2012-06-12 | Amkor Technology, Inc. | Top feature package and method |
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| CN103311213A (en) * | 2012-05-04 | 2013-09-18 | 日月光半导体制造股份有限公司 | Semiconductor package integrating shielding film and antenna |
| CN103972183A (en) * | 2013-01-25 | 2014-08-06 | 矽品精密工业股份有限公司 | electronic package |
| CN104936395A (en) * | 2014-03-17 | 2015-09-23 | 矽品精密工业股份有限公司 | Electronic package and manufacturing method thereof |
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| TW201839920A (en) | 2018-11-01 |
| TWI613767B (en) | 2018-02-01 |
| CN108735677A (en) | 2018-11-02 |
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