CN108712523A - Electronic device and method for manufacturing the same - Google Patents

Abstract

The invention discloses an electronic device and a manufacturing method. The electronic device comprises a display screen; the infrared sensor is arranged below the display screen; and the optical filter is arranged between the display screen and the infrared sensor, the optical filter is used for transmitting infrared light and intercepting visible light, and the infrared sensor transmits and/or receives infrared light through the optical filter and the display screen. According to the electronic device and the manufacturing method provided by the embodiment of the invention, the infrared sensor is arranged below the display screen, so that the traditional hole opening operation is avoided, the reliability of the integral strength of the edge area of the electronic device is ensured, and the screen occupation ratio of the electronic device is further improved. In addition, the optical filter intercepts visible light through infrared light, and can shield the infrared sensor under the condition of not influencing the work of the infrared sensor, so that the consistency of the overall screen appearance is maintained.

Description

Electronic device and manufacturing method thereof

technical field

The invention relates to the field of electronic technology, in particular to an electronic device and a manufacturing method thereof.

Background technique

Generally, an electronic device such as a mobile phone includes components such as a display screen and an infrared sensor, and the infrared sensor can be used to detect the distance between an object outside the display screen and the display screen. With the development of mobile phone technology and the needs of users, full-screen mobile phones have become the development trend of mobile phones, but the current position of sensors such as infrared sensors makes the screen-to-body ratio of mobile phones smaller.

Contents of the invention

Embodiments of the present invention provide an electronic device and a manufacturing method thereof.

An electronic device according to an embodiment of the present invention includes:

display screen; and

an infrared sensor disposed below said display screen; and

an optical filter arranged between the display screen and the infrared sensor, the optical filter is used to transmit infrared light and intercept visible light, and the infrared sensor emits light through the optical filter and the display screen and/or receive infrared light.

The method for manufacturing an electronic device according to an embodiment of the present invention includes the steps of:

providing a display screen and a filter for passing infrared light and blocking visible light;

An infrared sensor is provided, and the infrared sensor is arranged under the display screen;

The optical filter is arranged between the display screen and the infrared sensor so that the infrared sensor transmits and/or receives infrared light through the optical filter and the display screen.

In the electronic device and manufacturing method of the embodiment of the present invention, the infrared sensor is arranged under the display screen, avoiding the traditional opening operation, ensuring the reliability of the overall strength of the edge area of the electronic device, and further improving the screen-to-body ratio of the electronic device . In addition, the filter intercepts visible light through infrared light, which can block the infrared sensor without affecting the work of the infrared sensor, thereby maintaining the consistency of the appearance of the full screen.

Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Description of drawings

The above and/or additional aspects and advantages of the present invention will become apparent and comprehensible from the description of the embodiments in conjunction with the following drawings, wherein:

FIG. 1 is a three-dimensional schematic diagram of an electronic device according to an embodiment of the present invention;

2 is a schematic plan view of an electronic device according to an embodiment of the present invention;

Fig. 3 is a schematic cross-sectional view along the III-III direction of the electronic device of Fig. 2;

4 is a schematic cross-sectional view of an electronic device according to an embodiment of the present invention;

5 is another schematic cross-sectional view of an electronic device according to an embodiment of the present invention;

6-11 are schematic plan views of an electronic device according to an embodiment of the present invention;

12 is a partial cross-sectional schematic view of an electronic device according to an embodiment of the present invention;

FIG. 13 is a schematic flowchart of the manufacturing method of the electronic device of the present invention.

Description of main component symbols:

Cover plate 11, touch panel 12, display screen 13, filter 14, transparent sheet 141, filter coating 142, coating layer 15, infrared sensor 16, light-shielding layer 17, buffer layer 18, metal sheet 19, The casing 20 , the electronic device 100 , the upper surface 131 , the lower surface 132 , the display area 1311 , the non-display area 1312 , the transmitter 161 , and the receiver 162 .

Detailed ways

Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

An electronic device, such as a mobile phone or a tablet computer, generally detects a distance between the electronic device and a user by installing an infrared sensor. Taking a mobile phone as an example, an infrared sensor is provided on the upper area of the mobile phone. When the user makes a voice call or related operations, the mobile phone is close to the head, and the infrared sensor feeds back the distance information to the processor, and the processor executes corresponding instructions, such as turning off the lights of the display components. In related technologies, installing infrared sensors on electronic equipment requires opening corresponding holes on the casing for transmitting and receiving infrared light signals. However, with the development of electronic equipment, people have more and more requirements for the appearance and operation experience of mobile phones. higher. Mobile phones have been developing in the direction of full-screen, and full-screen mobile phones form an ultra-narrow bezel between the casing and the display component. Because the width of the ultra-narrow bezel is too small, there may not be enough space to open holes, and even opening holes will cause The strength of the frame as a whole is reduced, thereby lowering the reliability of the electronic device.

Please refer to FIG. 1 and FIG. 2 , an electronic device 100 according to an embodiment of the present invention includes a casing 20 , and the electronic device 100 may be a mobile phone or a tablet computer. The electronic device 100 in the embodiment of the present invention is described by taking a mobile phone as an example. Of course, the specific form of the electronic device 100 may also be other, which is not limited here.

Referring to FIG. 3 , the electronic device 100 includes a display screen 13 , a filter 14 and an infrared sensor 16 , and the infrared sensor 16 is located below the display screen 13 . The optical filter 14 is arranged between the display screen 13 and the infrared sensor 16, the optical filter 14 is used for passing through infrared light and intercepting visible light, and the infrared sensor 16 is used for transmitting and/or receiving through the optical filter 14 and the display screen 13 infrared light.

The optical filter 14 passes through the infrared light, and when the infrared sensor 16 emits infrared light outward for detection, the intensity of the infrared light through the optical filter 14 attenuates less, or the degree of attenuation does not affect the detection process, thereby The normal operation of the infrared sensor 16 is guaranteed. The optical filter 14 intercepts visible light so that the visible light cannot pass through the optical filter 16 and blocks the infrared sensor 16 visually, so that the emitter 161 is invisible when viewing the electronic device 100 from the outside.

To sum up, in the electronic device 100 according to the embodiment of the present invention, the infrared sensor 16 is arranged under the display screen 13, which avoids the traditional opening operation, ensures the reliability of the overall strength of the edge area of the electronic device 100, and further improves The screen-to-body ratio of the electronic device 100 is improved. In addition, since the optical filter 14 intercepts visible light through infrared light, the infrared sensor 16 can be blocked without affecting the operation of the infrared sensor 16, thereby maintaining the consistency of the appearance of the full screen.

Specifically, the infrared sensor 16 includes a transmitter 161 and a receiver 162, the transmitter 161 is used to transmit infrared light through the optical filter 14 and the display screen 13, and the receiver 162 is used to receive the infrared light reflected by the object to generate A signal for detecting the distance between the object and the electronic device 100 . When the emitted infrared light encounters an obstacle in the detection direction, a part of the infrared light will be reflected back and received by the receiver 162. After the processor calculates the time from the emission to the reflection of the infrared light, the electronic device 100 and the obstacle can be determined. distance and adjust accordingly. In one example, when the user is answering or making a call, the electronic device 100 is close to the head, the emitter 161 emits infrared light, the receiver 162 receives the infrared light reflected by the head, and the processor calculates the infrared light emitted from the emitted light. When the reflection time comes, issue a corresponding command to control the screen to turn off the backlight. When the electronic device 100 is away from the head, the processor performs calculations again based on the feedback data and issues an instruction to turn on the screen backlight again. In this way, it not only prevents misoperation of the user, but also saves the power of the mobile phone.

Referring to FIG. 4 , it can be understood that the display screen 13 includes an upper surface 131 and a lower surface 132 , and the display screen 13 is used for displaying light through the upper surface 131 . The display screen 13 is transparent, so that the infrared light emitted by the transmitter 161 can pass through the display screen 13 , and similarly, the reflected infrared light can pass through the display screen 13 and be received by the receiver 162 .

In the electronic device 100 , the receiver 162 is used as an input element of the electronic device 100 , and the receiver 162 can receive an infrared signal and input the signal into the electronic device 100 . The display screen 13 is used as an output element of the electronic device 100 , and the display screen 13 can output display content to the outside of the display screen 13 for the user to obtain corresponding information.

Referring to FIG. 5 , the electronic device 100 further includes a casing 20 for accommodating the electronic device 100 to protect the electronic device 100 . The housing 20 encloses the electronic device 100 by arranging the electronic device 100 in the housing 20 , and avoids external factors from directly damaging the internal components of the electronic device 100 . The housing 20 can be formed by machining aluminum alloy with a CNC machine tool, or can be injection-molded with polycarbonate (PC) or PC+ABS material.

Specifically, the electronic device 100 further includes a battery 110 and a main circuit board 120, the battery 110 and the main circuit board 120 are both arranged on the same side of the casing 20, and the battery 110 and the display screen 13 are respectively arranged on two sides of the casing 20 opposite to each other. . The battery 110 is used to provide electric energy for the electronic device 100 , and the main circuit board 120 is configured to control the working state of the electronic device 100 , for example, the main circuit board 120 controls the display screen 13 to play video content.

Referring to Fig. 3, in some embodiments, the optical filter 14 includes a transparent sheet 141 and a filter coating 142 coated on the transparent sheet 141, the filter coating 142 includes an IR ink, and the IR ink is sensitive to infrared light. The transmittance of light is greater than 85%, and the transmittance of visible light is less than 6%. The wavelength of infrared light that IR ink can pass through is 850nm-940nm.

Specifically, since the IR ink has low transmittance to visible light, when the electronic device 100 is viewed from the outside, the infrared sensor 16 cannot be observed based on human vision. At the same time, since the IR ink has the characteristics of high transmittance to infrared light, the infrared sensor 16 can stably emit infrared light, ensuring the normal operation of the infrared sensor 16 .

In some embodiments, the filter 14 is attached to the surface of the infrared sensor 16 facing the display screen 13 and spaced apart from the lower surface 132 of the display screen 13 . In this way, when viewed from the display screen 13 to the infrared sensor 16 , the infrared sensor 16 does not reflect visible light because the optical filter 14 intercepts visible light, so that the infrared sensor 16 is invisible.

In some embodiments, the display screen 13 includes an OLED display screen.

Specifically, an organic light-emitting diode (Organic Light-Emitting Diode, OLED) display screen has good light transmittance, and can transmit visible light and infrared light. Therefore, the OLED display does not affect the emission and reception of infrared light by the infrared sensor when displaying content effects. The display screen 13 may also adopt a Micro LED display screen, which also has good light transmittance to visible light and infrared light. Of course, these display screens are only exemplary and the embodiments of the present invention are not limited thereto.

In some embodiments, the display screen 13 includes a display area 1311 and a non-display area 1312 , and the non-display area 1312 surrounds the display area 1311 . The infrared sensor 16 is disposed under the display area 1311 and/or the non-display area 1312 . In other words, the infrared sensor 16 is located below the display area 1311, as shown in Figure 6; or, the infrared sensor 16 is arranged below the non-display area 1312, as shown in Figure 7; Below the non-display area 1312, as shown in FIG. 9 .

Please refer to FIG. 7 , in some embodiments, the transmitter 161 and the receiver 162 are separate structures.

Specifically, since the transmitter 161 and the receiver 162 have a separate structure, they can be arranged in a compact arrangement or in a dispersed arrangement, which is not only beneficial to the electronic device 100 to fully allocate the spatial position and application of each component Various shapes of the transmitter 161 and the receiver 162 are provided, and it is also advantageous for the transmitter 161 and the receiver 162 to provide possible locations for other components in the electronic device 100 . It should be noted that, when the transmitter 161 and the receiver 162 are separate structures, the surfaces of the transmitter 161 and the receiver 162 are both coated with the first coating 14 .

In one example, both the separate transmitter 161 and the receiver 162 are disposed below the length edge of the non-display area 1312 , as shown in FIG. 7 .

In another example, the separate transmitter 161 and receiver 162 are both disposed below the corresponding corners of the non-display area 1312 , as shown in FIG. 8 .

In yet another example, separate transmitters 161 and receivers 162 are respectively disposed below the two length edges of the non-display area 1312 , as shown in FIG. 9 .

Please refer to FIG. 5 , in some embodiments, the transmitter 161 and the receiver 162 are of an integral structure.

Specifically, the transmitter 161 and the receiver 162 have an integral structure, which can save the line connection between the split structures, which is beneficial to reduce the line process, improve the production efficiency of the product, and reduce the production cost.

As shown in the example of FIG. 10 , in the infrared sensor 16 , the emitter 161 is located below the NAND display area 1312 , and the receiver 162 is located below the NAND display area 1311 .

In the example of FIG. 11 , both the transmitter 161 and the receiver 162 of the integral structure are disposed below the width edge of the non-display area 1312 .

Referring to FIG. 5 , in some implementations, when the emitter 161 is located below the non-display area 1312, the electronic device 100 includes a light blocking element 30, and the light blocking element 30 is arranged between the emitter 161 and the display area 1311, and the light blocking element 30 is arranged between the emitter 161 and the display area 1311 to block the light. The light element 30 is used to block the infrared light emitted by the emitter 161 from entering the display area 1311 .

In this way, the light blocking element 30 blocks the infrared light from entering the display area 1311, so that the infrared light emitted by the emitter 161 can be prevented from affecting the working stability of the TFT in the display area 1311, so that the display screen 13 and the infrared sensor 16 can be separated from each other. To achieve their respective functions without interference.

Since the emitter 161 has a certain emission angle, even if the emitter 161 is located outside the display area 1311 , it cannot be guaranteed that the infrared light emitted by the emitter 161 cannot enter the display area 1311 . Therefore, the light blocking element 30 blocks the infrared light emitted by the emitter 161 from entering the display area 1311 , so as to prevent the infrared light from adversely affecting the photoelectric elements in the display area 1311 . In one example, the light blocking element 30 is foam. Of course, the light blocking element 30 can be made of other non-light-transmitting materials such as plastic.

Please refer to FIG. 12 , in some embodiments, the light blocking element 30 is pasted and fixed at the junction of the display area 1311 and the non-display area 1312 . In this way, the fixing method of the light blocking element 30 is easy to realize, so that the electronic device 100 is easy to manufacture. In one example, when the light blocking element 30 is fixed on the lower surface 132 of the display screen 13, a double-sided adhesive tape can be pasted on one surface of the light blocking element 30 first, and then the light blocking element 30 can be attached to the surface of the light blocking element 30 by the double-sided adhesive tape. Paste and fix at the junction of the display area 1311 and the non-display area 1312 .

Please refer to FIG. 4 , in some embodiments, the electronic device 100 further includes a light-shielding layer 17 disposed below the display screen 13 and surrounding the infrared sensor 16 .

Specifically, the light-shielding layer 17 surrounding the infrared sensor 16 can block the surrounding infrared sensor 16 from entering the infrared sensor 16 and reduce the accuracy of the infrared sensor 16 . The light-shielding layer 17 can be foam made of black material, or other black foam plastics or rubber. Of course, these materials are only exemplary and the embodiments of the present invention are not limited thereto.

Referring to FIG. 4 , in some embodiments, the electronic device 1000 further includes a coating layer 15 coated on the lower surface 132 , and the coating layer 15 is formed with a light-transmitting area corresponding to the infrared sensor 16 .

In this way, the coating layer 15 can block visible light from entering the electronic device 100 from the display screen 15 , so as to hide the internal components of the electronic device 100 .

In some embodiments, the coating layer 15 includes black ink, and the transmittance of the black ink to visible light and infrared light is both less than 3%.

Specifically, on the one hand, black ink has a lower transmittance to visible light than IR ink, and the blocking effect is more obvious, which is more in line with the process requirements. On the other hand, the cost of black ink is lower than that of IR ink, which is beneficial to reduce production costs.

Please refer to FIG. 4 , in some embodiments, the electronic device 100 further includes a touch layer 12 and a cover 11 . The cover plate 11 is formed on the touch layer 12, the touch layer 12 is arranged on the display screen 13, the upper surface 131 of the display screen 13 faces the touch layer 12, the transmittance of the touch layer 12 and the cover plate 11 to visible light and The transmittance of infrared light is greater than 90%.

Specifically, the touch layer 12 is disposed between the cover plate 11 and the display screen 13 , or embedded in the display screen 13 , or embedded in the cover plate 11 . The touch layer 12 is mainly used to receive the input signal generated when the user touches the touch layer 12 and transmit it to the circuit board for data processing, so as to obtain the specific position where the user touches the touch layer 12 . Wherein, the touch layer 12 and the display screen 13 can be bonded by using In-Cell or On-Cell bonding technology, which can effectively reduce the weight of the display screen and reduce the overall thickness of the display screen. In addition, disposing the cover plate 11 on the touch layer 12 can effectively protect the touch layer 12 and its internal structure, and avoid damage to the touch layer 12 and the display screen 13 by external forces. The light transmittance of the cover plate 11 and the touch layer 12 to visible light and infrared light is greater than 90%, which not only helps the display screen 13 to better display the content effect, but also facilitates the stability of the infrared sensor 16 arranged under the display screen 13. The infrared light is emitted and received efficiently, which ensures the normal operation of the infrared sensor 16.

In some embodiments, the display screen 13 is used for displaying light through the display area 1311 , and the area ratio of the display area 1311 to the cover plate 11 is greater than 90%. For example, the area ratio of the display area 1311 to the cover plate 11 is 95%, 96%, etc. ratio.

Specifically, by setting the ratio between the display area 1311 and the cover plate 11, after the display screen 13 is pasted by the cover plate 11, the display area 1311 can display the content effect with a larger size area, which not only improves a good user experience, Moreover, the screen-to-body ratio of the electronic device 100 is effectively increased to achieve a full-screen effect. The non-display area 1312 can also be used to cover other components and metal lines under the display screen 13, so that the appearance of the product remains consistent. The non-display area 1312 can enhance the optical density of the display screen 13 by printing ink, which can create a good visual effect while ensuring the light-shielding effect.

In some embodiments, the electronic device 100 further includes a buffer layer 18 attached to the lower surface 132 and avoiding the infrared sensor 16 .

Specifically, the buffer layer 18 is used to reduce impact force and shockproof to protect the touch layer 12, the display screen 13 and their internal structures, and prevent the display screen from being damaged by external impact. The buffer layer 18 can be made of foam or foam plastic or rubber or other soft materials. Of course, these cushioning materials are only exemplary and the embodiments of the present invention are not limited thereto. In addition, avoiding the infrared sensor 16 during the process of setting the buffer layer 18 is to prevent the buffer layer 18 from blocking the infrared sensor 16 from receiving signals, so as to prevent the infrared sensor 16 from being affected during the process of receiving infrared light.

In some embodiments, the electronic device 100 further includes a metal sheet 19 attached to the buffer layer 18 and avoiding the infrared sensor 16 .

Specifically, the metal sheet 19 is used for shielding electromagnetic interference and grounding, and has the effect of diffusing temperature rise. The metal sheet 19 can be cut from metal materials such as copper foil and aluminum foil. Of course, these metal materials are only exemplary and the embodiments of the present invention are not limited thereto. In addition, avoiding the infrared sensor 16 during the process of setting the metal sheet 19 is to prevent the metal sheet 19 from blocking the infrared sensor 16 from receiving signals, so as to prevent the infrared sensor 16 from being affected during the process of receiving infrared light.

Referring to FIG. 3 and FIG. 13 , an embodiment of the present invention provides a method for manufacturing an electronic device 100, which includes the following steps:

S301, providing a display screen 13 and a filter 14, the filter 14 is used to transmit infrared light and intercept visible light;

S302, providing an infrared sensor 16, and setting the infrared sensor 16 under the display screen 13

S303 , disposing the optical filter 14 between the display screen 13 and the infrared sensor 16 so that the infrared sensor 16 transmits and/or receives infrared light through the optical filter 14 and the display screen 13 .

In the manufacturing method of the electronic device 100 in the embodiment of the present invention, the infrared sensor 16 is arranged under the display screen 13, avoiding the traditional opening operation, ensuring the reliability of the overall strength of the edge area of the electronic device 100, and further improving The screen-to-body ratio of the electronic device 100 . In addition, since the optical filter 14 intercepts visible light through infrared light, the infrared sensor 16 can be blocked without affecting the operation of the infrared sensor 16, thereby maintaining the consistency of the appearance of the full screen.

In some embodiments, the manufacturing method of the electronic device 100 further includes the steps of:

The touch layer 12 is arranged on the display screen 13 . and

The cover plate 11 is disposed on the touch layer 12 .

Specifically, the touch layer 12 is mainly used to receive the input signal generated when the user touches the touch layer 12 and transmit it to the circuit board for data processing, so as to obtain the specific position where the user touches the touch layer 12 . Wherein, In-Cell or On-Cell bonding technology can be used to bond the touch layer 12 and the display screen 13 , which can effectively reduce the weight of the display screen and reduce the overall thickness of the display screen. In addition, disposing the cover plate 11 on the touch layer 12 can protect the touch layer 12 and its internal structure, and avoid direct damage to the touch layer 12 by external forces.

In the present invention, unless otherwise clearly specified and limited, a first feature being "on" or "under" a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below", "beneath" and "under" the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.

The above disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described above. Of course, they are only examples and are not intended to limit the invention. Furthermore, the present disclosure may repeat reference numerals and/or reference letters in different instances, such repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, various specific process and material examples are provided herein, but one of ordinary skill in the art may recognize the use of other processes and/or the use of other materials.

In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as limiting the invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of said features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined. It should also be understood that the term "and/or" as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. connected, or integrally connected. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two elements or the interaction relationship between two elements. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples", or "some examples" etc. mean that the embodiments are combined A specific feature, structure, material, or characteristic described or exemplified is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the invention is defined by the claims and their equivalents.

Claims (15)

1. An electronic device, characterized in that, comprising: display screen; and an infrared sensor disposed below said display screen; and an optical filter arranged between the display screen and the infrared sensor, the optical filter is used to transmit infrared light and intercept visible light, and the infrared sensor emits light through the optical filter and the display screen and/or receive infrared light. 2 . The electronic device according to claim 1 , wherein the optical filter is attached to the surface of the infrared sensor facing the display screen and spaced apart from the lower surface of the display screen. 3 . 3. The electronic device according to claim 1, further comprising a light-shielding layer disposed under the display screen and surrounding the infrared sensor. 4. The electronic device according to claim 1, wherein the optical filter comprises a transparent sheet and a filter coating coated on the transparent sheet, and the filter coating comprises an IR ink The transmittance of the IR ink to infrared light is greater than 85%, the transmittance of the IR ink to visible light is less than 6%, and the wavelength of infrared light that the IR ink can transmit is 850nm-940nm. 5. The electronic device according to claim 1, wherein the infrared sensor comprises a proximity sensor, the proximity sensor comprises a transmitter and a receiver, and the transmitter is used to transmit through the filter and the The display screen emits infrared light, and the receiver is used for receiving the infrared light reflected by the object to generate a signal for detecting the distance between the object and the electronic device. 6. The electronic device according to claim 1, further comprising a coating layer coated on the lower surface of the display screen, the coating layer is formed with the translucent area. 7. The electronic device according to claim 6, wherein the coating layer comprises black ink, and the transmittance of the black ink to visible light and to infrared light is both less than 3%. 8. The electronic device according to claim 1, wherein the display screen comprises an OLED display screen. 9. The electronic device according to claim 1, wherein the electronic device further comprises a touch panel and a cover plate formed on the touch panel, the touch panel is arranged on the display screen, The upper surface faces the touch panel, and the transmittance of the cover plate and the touch panel to visible light and infrared light are both greater than 90%. 10. The electronic device according to claim 9, wherein the display screen comprises a display area and a non-display area surrounding the display area, and the ratio of the area of the display area to the cover plate is greater than 90%. . 11. The electronic device according to claim 10, wherein the infrared sensor is disposed under the display area and/or the non-display area. 12 . The electronic device according to claim 1 , further comprising a buffer layer attached to the lower surface of the display screen and avoiding the infrared sensor. 13 . 13. The electronic device according to claim 12, further comprising a metal sheet attached to the buffer layer and avoiding the infrared sensor. 14. A method of manufacturing an electronic device, comprising the steps of: providing a display screen and a filter for passing infrared light and blocking visible light; An infrared sensor is provided, and the infrared sensor is arranged under the display screen; The optical filter is arranged between the display screen and the infrared sensor so that the infrared sensor transmits and/or receives infrared light through the optical filter and the display screen. 15. manufacturing method as claimed in claim 14, is characterized in that, described manufacturing method also comprises the step: providing a touch panel on said display screen; and A cover plate is arranged on the transparent touch panel panel.